Flower basket device for cleaning silicon wafers
By designing a flower basket device for cleaning silicon wafers, using the combination of support, flower basket rod and positioning members, the problem of cleaning blind spots in the prior art is solved, and a more efficient and thorough cleaning effect is achieved, and the production efficiency of solar cells is improved.
Patent Information
- Application Number
- CN202422083742.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The existing flower basket devices are prone to cleaning blind spots when cleaning silicon wafers, resulting in unclean or incomplete cleaning, affecting the conversion efficiency and yield of solar cells.
A flower basket device is designed, and accommodating space is formed with a plurality of flower basket rods through the first support member and the second support member, and a positioning member is provided along the length direction of the flower basket rod. The silicon wafer is placed between adjacent positioning members. The design of the positioning member makes the contact range between the silicon wafer and the positioning member small, increasing the working area of the cleaning liquid.
It improves the cleaning effect and efficiency, reduces the hindrance of the cleaning liquid on the silicon wafer, achieves a more thorough cleaning, reduces the risk of residual liquids and pollutants, and improves the cleaning quality and production efficiency of the silicon wafer.
Smart Images
Figure CN223023239U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of solar cells, and particularly to a carrier device for cleaning silicon wafers. Background Art
[0002] In the production and manufacturing process of solar cells, the cleaning process is a very important process, including texturing that generates a lot of pyramid-shaped textures on the surface, and alkaline polishing for polishing the back of the silicon wafer. Currently, two main cleaning modes are used. One is the "floating on water" mode, that is, the chemicals are brought into contact with the side of the silicon wafer to be cleaned through the way of roller transmission, and the other side is protected by a water film. The other is to load the silicon wafers in a carrier and perform overall cleaning in a tank. However, there is a problem with the existing carriers. The silicon wafers are placed between the carrier teeth, and the contact between the carrier teeth and the silicon wafers is a surface contact. Therefore, there are likely to be cleaning blind spots in the cleaning area corresponding to the contact surface between the carrier teeth and the silicon wafers, resulting in incomplete or insufficient cleaning, which in turn affects the conversion efficiency and yield of the finally produced solar cells. Utility Model Content
[0003] This application discloses a carrier device for cleaning silicon wafers, which can enable the silicon wafers to have a smaller contact range with the positioning members, so that a larger area of the silicon wafer surface can be directly exposed to the cleaning liquid, improving the cleaning effect and efficiency. At the same time, the positioning members have little hindrance to the flow of the cleaning liquid, and the cleaning liquid can flow more smoothly around the silicon wafers, thereby achieving a more thorough cleaning purpose. Moreover, there is relatively less liquid and contaminants remaining on the silicon wafers, which helps to improve the cleaning quality and production efficiency of the silicon wafers.
[0004] To achieve the above object, this application discloses a carrier device for cleaning silicon wafers, including:
[0005] A first support member and a second support member arranged oppositely;
[0006] A plurality of carrier rods, the plurality of carrier rods are arranged between the first support member and the second support member, and the plurality of carrier rods and the first support member and the second support member form a receiving space for receiving silicon wafers;
[0007] A plurality of positioning members, the plurality of positioning members are arranged along the length direction of the carrier rods on the side of the carrier rods facing the receiving space, and silicon wafers are placed between adjacent positioning members. The positioning member includes a first positioning piece, the first positioning piece includes a first bottom edge and a first side edge and a second side edge respectively connected to the first bottom edge. The first bottom edge is used to be fixed on the carrier rod, and the first side edge and the second side edge are used to abut against the silicon wafer.
[0008] In a possible implementation manner, the first bottom edge is arranged along the length direction of the carrier rod.
[0009] In a possible implementation manner, the first side is inclined with respect to the first base.
[0010] In a possible implementation manner, the second side is inclined with respect to the first base.
[0011] In a possible implementation manner, the first side and the second side are symmetrically arranged with respect to the perpendicular bisector of the first base.
[0012] In a possible implementation manner, the angle between the first side and the first base is less than 90°, and the angle between the second side and the first base is less than 90°.
[0013] In a possible implementation manner, the positioning member further includes a second positioning piece, the second positioning piece has the same shape as the first positioning piece, the first base is arranged along the length direction of the flower basket rod, the flower basket rod is a cylindrical structure, and the second positioning piece and the first positioning piece are symmetrically arranged with respect to the generatrix of the flower basket rod.
[0014] In a possible implementation manner, the distance between the first positioning piece and the second positioning piece gradually decreases from the end close to the flower basket rod to the end far from the flower basket rod.
[0015] In a possible implementation manner, a plurality of the positioning members are evenly distributed along the length direction of the flower basket rod.
[0016] In a possible implementation manner, the plurality of flower basket rods include a first flower basket rod and a second flower basket rod, the first flower basket rod and the second flower basket rod are arranged in parallel, and the plurality of positioning members on the first flower basket rod and the plurality of positioning members on the second flower basket rod correspond to each other in a direction perpendicular to the flower basket rod.
[0017] Compared with the prior art, the beneficial effects of the present application are as follows:
[0018] In this application, a receiving space for accommodating silicon wafers is formed by a first support member, a second support member, and a plurality of flower basket rods. Then, a plurality of positioning members are arranged along the length direction of the flower basket rods, and the plurality of positioning members are arranged on the side facing the receiving space. In this way, the silicon wafers are placed between adjacent positioning members to achieve the positioning of the silicon wafers. The positioning member includes a first positioning piece. The first bottom edge of the first positioning piece is fixed on the flower basket rod, and the first side edge and the second side edge connected to the first bottom edge are in contact with the silicon wafer. In this way, the silicon wafer and the positioning member have a smaller contact range, which means that a larger area of the silicon wafer surface can be directly exposed to the cleaning liquid, and the cleaning liquid can act on the silicon wafer surface more fully and directly, improving the cleaning effect and efficiency. At the same time, the part of the first positioning piece in contact with the silicon wafer has little hindrance to the flow of the cleaning liquid, and the cleaning liquid can flow more smoothly around the silicon wafer, driving impurities and pollutants, so as to achieve a more thorough cleaning purpose. Moreover, with a small contact range, after the cleaning is completed, the remaining liquid and pollutants are relatively less, which helps to improve the cleaning quality and production efficiency of the silicon wafer. Brief Description of the Drawings
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0020] Figure 1 Structural schematic diagram of a flower basket device for cleaning silicon wafers provided by an embodiment of the present invention;
[0021] Figure 2 Structural schematic diagram one of the flower basket rod and the positioning member of a flower basket device for cleaning silicon wafers provided by an embodiment of the present invention;
[0022] Figure 3 Structural schematic diagram two of the flower basket rod and the positioning member of a flower basket device for cleaning silicon wafers provided by an embodiment of the present invention.
[0023] Description of the reference numerals:
[0024] 10 - First support member; 20 - Second support member; 30 - Flower basket rod; 31 - First flower basket rod; 32 - Second flower basket rod; 40 - Positioning member; 41 - First positioning piece; 411 - First bottom edge; 412 - First side edge; 413 - Second side edge; 42 - Second positioning piece; 50 - First support rod, 60 - Second support rod. Detailed Description of the Embodiment
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.
[0026] In the present application, the terms "install", "set", "provided with", "connected", "linked" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or there may be internal communication between two devices, components or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0027] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, components or parts (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, components or parts. Unless otherwise specified, the meaning of "a plurality" is two or more.
[0028] In the production and manufacturing process of solar cells, the cleaning process is a very important process, including texturing to generate a lot of pyramid-shaped textured surfaces on the surface, and alkaline polishing to polish the back of the silicon wafer, etc. Currently, two main cleaning modes are used. One is the "floating on water" mode, that is, the chemical is brought into contact with the side to be cleaned through roller transmission, and the other side is protected by a water film. The other is tank cleaning, which is a common cleaning method. In tank cleaning, the silicon wafers are placed in a tank filled with chemical solution by a basket. The basket rod of the basket has a plurality of basket teeth, and one silicon wafer is placed between every two adjacent basket teeth, and the whole cleaning is carried out in the tank.
[0029] However, there is a problem with the existing basket. The silicon wafers are placed between two adjacent basket teeth, and the contact between the basket teeth and the silicon wafers is surface contact. Therefore, there are likely to be cleaning blind spots in the cleaning areas corresponding to the contact surfaces between the basket teeth and the silicon wafers, resulting in incomplete or insufficient cleaning, which in turn affects the conversion efficiency and yield of the finally produced solar cells.
[0030] In view of this, some embodiments of the present application provide a carrier device for cleaning silicon wafers, which can enable the silicon wafers to have a smaller contact range with the positioning members, so that a larger area of the silicon wafer surface can be directly exposed to the cleaning liquid, improving the cleaning effect and efficiency. At the same time, the positioning members have little obstruction to the flow of the cleaning liquid, and the cleaning liquid can flow more smoothly around the silicon wafers, so as to achieve a more thorough cleaning purpose. Moreover, the liquid and contaminants remaining on the silicon wafers are relatively less, which helps to improve the cleaning quality and production efficiency of the silicon wafers.
[0031] The present application will be described in detail through specific embodiments as follows:
[0032] The carrier device for cleaning silicon wafers according to the embodiments of the present application, as Figure 1-2 shown, the carrier device for cleaning silicon wafers includes a first support member 10, a second support member 20, a plurality of carrier rods 30 and a plurality of positioning members 40. The first support member 10 and the second support member 20 are arranged oppositely. The plurality of carrier rods 30 are disposed between the first support member 10 and the second support member 20. The plurality of carrier rods 30 and the first support member 10 and the second support member 20 form a receiving space for accommodating silicon wafers. The plurality of positioning members 40 are arranged along the length direction of the carrier rods 30 on the side of the carrier rods 30 facing the receiving space. Silicon wafers are placed between adjacent positioning members 40. The positioning member 40 includes a first positioning piece 41. The first positioning piece 41 includes a first bottom edge 411, a first side edge 412 and a second side edge 413 respectively connected to the first bottom edge 411. The first bottom edge 411 is used to be fixed on the carrier rod 30, and the first side edge 412 and the second side edge 413 are used to abut against the silicon wafers.
[0033] In this embodiment, the first support member 10 and the second support member 20 are plate-like structures. A first support rod 50 and a second support rod 60 are further provided at the bottom of the receiving space. In other embodiments, the first support member 10 and the second support member 20 may also be frame structures, which are not limited herein.
[0034] The carrier device for cleaning silicon wafers provided by the embodiments of the present application forms a receiving space for accommodating silicon wafers through a first support member 10, a second support member 20, and a plurality of carrier rods 30. Then, a plurality of positioning members 40 are arranged along the length direction of the carrier rods 30, and the plurality of positioning members 40 are arranged on the side facing the receiving space. In this way, the silicon wafers are placed between adjacent positioning members 40 to achieve the positioning of the silicon wafers. Since the positioning member 40 includes a first positioning piece 41, the first bottom edge 411 of the first positioning piece 41 is fixed on the carrier rod 30, so that the first side edge 412 and the second side edge 413 connected to the first bottom edge 411 are in contact with the silicon wafer. The silicon wafer has a smaller contact range with the positioning member 40, which means that a larger area of the silicon wafer surface can be directly exposed to the cleaning liquid. The cleaning liquid can act on the silicon wafer surface more fully and directly, improving the cleaning effect and efficiency. At the same time, the contact part between the positioning member 40 and the silicon wafer reduces the obstruction to the flow of the cleaning liquid, and the cleaning liquid can flow more smoothly around the silicon wafer, driving impurities and contaminants and making them easier to be carried away, so as to achieve a more thorough cleaning purpose. Moreover, the small contact range reduces the risk of secondary pollution caused by the residual cleaning liquid or impurities in the contact part. After the cleaning is completed, the contact area is small, and the residual liquid and contaminants are relatively few, reducing the re-pollution of the already cleaned surface of the silicon wafer, which helps to improve the cleaning quality and production efficiency of the silicon wafer.
[0035] In this embodiment, the first bottom edge 411 is arranged along the length direction of the carrier rod 30. In this way, after the silicon wafer is placed, the silicon wafer is perpendicular to the first positioning piece 41, which can make the forces on each silicon wafer in the same direction, providing stable support and positioning for the silicon wafer, effectively preventing the silicon wafer from moving and shaking in this direction, ensuring the accuracy and stability of the silicon wafer position. Moreover, this arrangement makes the arrangement of the positioning members 40 on the carrier rod 30 regular and neat, making it more intuitive and clear when placing the silicon wafers, and improving the production efficiency. Finally, during the cleaning process, the first bottom edge 411 is arranged along the length direction of the carrier rod 30, and the perpendicularity of the silicon wafer to the first positioning piece 41 is conducive to the uniform flow and coverage of the cleaning liquid, improving the cleaning effect and efficiency.
[0036] In an implementation manner, the first side edge 412 is inclined with respect to the first bottom edge 411. In this way, since the first side edge 412 is inclined, only a part of the first side edge 412 is in contact with the silicon wafer when contacting the silicon wafer, thereby further reducing the contact area between the silicon wafer and the positioning member 40. In this way, more areas of the silicon wafer surface can be directly exposed to the cleaning liquid, improving the contact degree between the cleaning liquid and the silicon wafer surface, enhancing the cleaning effect and efficiency. In this way, the cleaning liquid can also flow more smoothly around the silicon wafer, helping to improve the cleaning quality and production efficiency of the silicon wafer.
[0037] In another embodiment, the first side 412 can also be disposed perpendicular to the first base 411. In this way, the silicon wafer contacts the entire first side 412, achieving a good positioning effect. Moreover, since the silicon wafer is in line contact with the first side 412, a better cleaning effect can also be achieved.
[0038] Further, the second side 413 is also inclined with respect to the first base 411. In this way, when the second side 413 contacts the silicon wafer, only a part of the second side 413 is in contact. This reduces the contact area between the silicon wafer and the positioning member 40 on both sides of the first positioning piece 41, allowing more areas on both surfaces of the silicon wafer to be directly exposed to the cleaning liquid, increasing the contact degree between the cleaning liquid and the silicon wafer surface, and enhancing the cleaning effect and efficiency. In another embodiment, the second side 413 can also be disposed perpendicular to the first base 411.
[0039] Specifically, to further make the structure of the first positioning piece 41 more stable, the first side 412 and the second side 413 are symmetrically disposed with respect to the perpendicular bisector of the first base 411. Then their positions and directions on the bottom plate are symmetric to each other, making the force exerted on the bottom plate by the silicon wafer more uniform after placement, which helps improve the balance and stability of the silicon wafer. The silicon wafer can provide uniform acting forces from two opposite directions, better maintaining the position or state of the object. At the same time, the symmetric design usually makes the first positioning piece 41 more aesthetically pleasing and coordinated visually. Similar processes and methods can be used during manufacturing and installation, improving efficiency and reducing costs.
[0040] In one embodiment, the angle between the first side 412 and the first base 411 is less than 90°, and the angle between the second side 413 and the first base 411 is less than 90°. In this way, the position of the first side 412 close to the first base 411 contacts the silicon wafer, and the position of the second side 413 close to the first base 411 contacts the silicon wafer, making the positioning effect of the silicon wafer on the flower basket rod 30 more stable. At the same time, the first side 412 and the second side 413 can also play a guiding role during the placement of the silicon wafer, causing the silicon wafer to move along the first side 412 and the second side 413 towards the flower basket rod 30 direction, which helps place the silicon wafer more accurately at a specific position between adjacent positioning members 40. In addition, with the first positioning piece 41 having this structure and the first base 411 having the same size, it saves more space. While ensuring good fixing effect, it realizes specific functions within a limited space, and at the same time, it has less resistance to the flow of the cleaning liquid, facilitating a better cleaning effect on the silicon wafer.
[0041] In another embodiment, the angle between the first side 412 and the first base 411 can also be greater than 90°, and the angle between the second side 413 and the first base 411 can also be greater than 90°. At this time, the position of the first side 412 away from the first base 411 contacts the silicon wafer, and the position of the second side 413 away from the first base 411 contacts the silicon wafer.
[0042] In this embodiment, in order to further achieve a good positioning effect on the silicon wafer, as Figure 3 shown, the positioning member 40 further includes a second positioning piece 42. The second positioning piece 42 is set to have the same shape as the first positioning piece 41. At the same time, the first base 411 is arranged along the length direction of the flower basket rod 30. The flower basket rod 30 is a cylindrical structure. The second positioning piece 42 and the first positioning piece 41 are symmetrically arranged with respect to the generatrix of the flower basket rod 30. The first positioning piece 41 and the second positioning piece 42 have the same shape and are symmetrically arranged. When the silicon wafer is placed between the positioning members 40, both the first positioning piece 41 and the second positioning piece 42 can position the silicon wafer, reducing the deviation of the silicon wafer during the positioning process, and can ensure the accuracy of the position of the silicon wafer to the greatest extent. At the same time, the first positioning piece 41 and the second positioning piece 42 can provide better support and restraint force for the silicon wafer, making its position on the flower basket rod 30 more stable, which helps to prevent the silicon wafer from shifting due to external force or vibration during transportation, processing or machining. Moreover, this symmetric structure is relatively simple to install, and when maintaining and replacing the positioning piece, the operation can also be carried out quickly, reducing the complexity of the operation and the possibility of errors.
[0043] Specifically, the distance between the first positioning piece 41 and the second positioning piece 42 gradually decreases from the end close to the flower basket rod 30 to the end away from the flower basket rod 30. Since the flower basket rod 30 is a cylindrical structure, such a design makes the first positioning piece 41 and the second positioning piece 42 inclined on the flower basket rod 30, thereby improving the structural strength of the positioning member 40. When an external force acts on the positioning member 40, the position of the positioning member 40 on the flower basket rod 30 is more stable. At the same time, there is a spacing between the end of the first positioning piece 41 and the second positioning piece 42 close to the flower basket rod 30. After the positioning member 40 contacts the silicon wafer, the cleaning liquid can flow smoothly between the first positioning piece 41 and the second positioning piece 42, and thus flow around the silicon wafer without hindering the flow of the cleaning liquid, so as to achieve a more thorough cleaning purpose.
[0044] In one embodiment, the distance between the first positioning piece 41 and the second positioning piece 42 can also gradually increase from the end close to the flower basket rod 30 to the end away from the flower basket rod 30, or in another embodiment, the distance between the first positioning piece 41 and the second positioning piece 42 can also be the same from the end close to the flower basket rod 30 to the end away from the flower basket rod 30.
[0045] In this embodiment, the first positioning piece 41 and the second positioning piece 42 are set to an isosceles trapezoidal structure, and the upper base or the lower base of the isosceles trapezoidal structure is fixed on the flower basket rod 30. The diameter of the flower basket rod 30 is 18-22 mm, the upper base of the isosceles trapezoidal structure is 1-3 mm, and the lower base is 2-6 mm. The distance between the first positioning piece 41 and the second positioning piece 42 is set to 8-12 mm at the end close to the flower basket rod 30, and the distance between the first positioning piece 41 and the second positioning piece 42 is set to 0-8 mm at the end close to the flower basket rod 30, which is not specifically limited here.
[0046] In this embodiment, a plurality of positioning members 40 are evenly distributed along the length direction of the flower basket rod 30. The even distribution can provide even support and positioning for the silicon wafers, so that the silicon wafers are neatly arranged on the flower basket rod 30. During the cleaning process, each silicon wafer can contact the cleaning liquid under the same conditions, thereby achieving a more even and consistent cleaning effect and reducing the cleaning difference caused by uneven positioning. The evenly distributed positioning members 40 allow multiple silicon wafers to be placed on the flower basket rod 30 in the same manner and spacing, which is conducive to batch cleaning or other processing processes and improves production efficiency. The even distribution helps to reduce collision and friction between silicon wafers and reduce the risk of damage to silicon wafers during placement and processing.
[0047] In this embodiment, the plurality of flower basket rods 30 include a first flower basket rod 31 and a second flower basket rod 32, and the first flower basket rod 31 and the second flower basket rod 32 are arranged in parallel. The plurality of positioning pieces 40 on the first flower basket rod 31 and the plurality of positioning pieces 40 on the second flower basket rod 32 correspond one to one along a direction perpendicular to the flower basket rod 30. In this way, the silicon wafers are placed along a direction perpendicular to the flower basket rod 30 during the placement process, which is more convenient for accurate positioning. At the same time, the silicon wafers are uniformly supported and fixed after arrangement, avoiding the situation of local uneven force and reducing the risk of deformation or damage of the silicon wafers during the processing. In addition, the silicon wafers arranged in this way are more neat, which helps to ensure the consistency of silicon wafer processing. The plurality of flower basket rods 30 arranged in parallel and corresponding to the positioning pieces 40 can stably fix the plurality of silicon wafers for cleaning operations, thereby ensuring the processing quality and production efficiency of the silicon wafers.
[0048] When the carrier device for cleaning wafers provided by the embodiments of the present application is in use, the wafers are placed between adjacent positioning members 40 along a direction perpendicular to the carrier rod 30 to achieve the positioning of the wafers. The wafers are supported by the first support rod 50 and the second support rod 60. The two ends of the wafers are respectively abutted against the first carrier rod 31 and the second carrier rod 32. The wafers are in contact with the sides of the first positioning piece 41 and the second positioning piece 42, so that the wafers have a smaller contact range with the positioning members 40, and a larger area of the wafer surface can be directly exposed to the cleaning liquid. The cleaning liquid can act on the wafer surface more fully and directly, improving the cleaning effect and efficiency. At the same time, the obstruction of the cleaning liquid flow caused by the contact part between the positioning member 40 and the wafer is reduced, and the cleaning liquid can flow more smoothly around the wafer, driving impurities and contaminants and making them easier to be carried away, so as to achieve a more thorough cleaning purpose. Moreover, the small contact range reduces the risk of secondary contamination caused by the residual cleaning liquid or impurities in the contact part. After the cleaning is completed, the contact area is small, and the residual liquid and contaminants are relatively few, reducing the recontamination of the already cleaned surface of the wafer, which helps to improve the cleaning quality and production efficiency of the wafer.
[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A basket device for cleaning silicon wafers, characterized in that: include: A first support member and a second support member arranged opposite to each other; A plurality of flower basket rods, wherein the plurality of flower basket rods are disposed between the first support member and the second support member, and the plurality of flower basket rods, the first support member and the second support member form a receiving space for receiving a silicon wafer; A plurality of positioning members are provided along the length direction of the flower basket rod on a side of the flower basket rod facing the accommodating space, and silicon wafers are placed between adjacent positioning members. The positioning members include a first positioning piece, and the first positioning piece includes a first bottom edge and a first side edge and a second side edge respectively connected to the first bottom edge. The first bottom edge is used to be fixed on the flower basket rod, and the first side edge and the second side edge are used to abut against the silicon wafer.
2. The basket device for cleaning silicon wafers according to claim 1, characterized in that: The first bottom edge is arranged along the length direction of the flower basket rod.
3. The basket device for cleaning silicon wafers according to claim 1, characterized in that: The first side edge is arranged obliquely to the first bottom edge.
4. The basket device for cleaning silicon wafers according to claim 3, characterized in that: The second side edge is arranged obliquely to the first bottom edge.
5. The basket device for cleaning silicon wafers according to claim 4, characterized in that: The first side edge and the second side edge are symmetrically arranged relative to a perpendicular midline of the first bottom edge.
6. The basket device for cleaning silicon wafers according to claim 4, characterized in that: The included angle between the first side edge and the first bottom edge is less than 90°, and the included angle between the second side edge and the first bottom edge is less than 90°.
7. The basket device for cleaning silicon wafers according to any one of claims 1 to 6, characterized in that: The positioning member also includes a second positioning piece, which has the same shape as the first positioning piece. The first bottom edge is arranged along the length direction of the flower basket rod. The flower basket rod is a cylindrical structure. The second positioning piece and the first positioning piece are symmetrically arranged relative to the generatrix of the flower basket rod.
8. The basket device for cleaning silicon wafers according to claim 7, characterized in that: The distance between the first positioning piece and the second positioning piece gradually decreases from an end close to the flower basket rod to an end away from the flower basket rod.
9. The basket device for cleaning silicon wafers according to claim 7, characterized in that: The plurality of positioning members are evenly distributed along the length direction of the flower basket rod.
10. The basket device for cleaning silicon wafers according to claim 7, characterized in that: The plurality of flower basket rods include a first flower basket rod and a second flower basket rod, the first flower basket rod and the second flower basket rod are arranged in parallel, and the plurality of positioning members on the first flower basket rod and the plurality of positioning members on the second flower basket rod correspond one to one along a direction perpendicular to the flower basket rods.