Partition plate for chip integration

Abstract

The utility model discloses a partition plate for chip integration, which comprises a plate body and a clamping block arranged on the plate body, a scale groove is arranged on the plate surface of the plate body, limiting blocks are arranged on two sides of the plate body, scales are arranged on the surface of the clamping block contacted with the plate body, an open groove communicated with a limiting hole is arranged on the abutting surface of the clamping block, the clamping block is moved on the plate surface, and the wide surface is tightly attached to the side surface of the plate body. When the plate body and the clamping blocks are assembled, the scale-shaped structures of the clamping blocks can be naturally embedded into the corresponding notches of the plate body, meanwhile, the preset limiting blocks slide into the positioning holes along the elaborately designed channels, and the limiting blocks can slide into the positioning holes along the elaborately designed channels. By means of the technical scheme, the position accuracy is guaranteed, in the whole process, the wide part of the clamping block is firmly attached to the edge of the plate body all the time, the operation process of workers is greatly simplified through the design, the installation accuracy is guaranteed, the high-quality rate of products is increased, and meanwhile the assembling efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip accessories, in particular to a partition for chip integration. Background Art

[0002] The chip integration partition is a key accessory, whose functions not only lie in isolating and connecting chips, but also have a beautifying effect. The partition usually consists of a housing and a hard board embedded therein and fixed by adhesives. The hard board is designed with multiple special grooves to adapt to the shape of the chip for precise connection. However, during the manufacturing process, if the position of the hard board is not accurately fixed during adhesion or welding, it may cause the partition to be unable to be used normally, resulting in a low yield rate. Summary of the Utility Model

[0003] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and the title of the specification of this application, to avoid obscuring the purpose of this part, the abstract, and the title of the utility model. However, such simplifications or omissions shall not be used to limit the scope of the utility model.

[0004] To solve the above-mentioned problems, the utility model provides the following technical solution: A partition for chip integration includes a plate body and a clamping block arranged on the plate body, and is characterized in that: scale grooves are formed on the plate surface of the plate body, and limiting blocks are arranged on both sides; scales are arranged on the surface of the clamping block in contact with the plate body; a slot and a limiting hole are formed through the contact surface of the clamping block; when the clamping block is moved on the plate surface, the wide surface closely adheres to the side surface of the plate body, the scales are embedded in the scale grooves, and the slot is aligned with the limiting block and slides into the limiting hole, and the contact surface of the clamping block fits on the side surface of the plate body.

[0005] Based on the above technical solution, the utility model can be further improved as follows.

[0006] As a preferred scheme of the partition for chip integration of the utility model, wherein: the scale grooves are arranged at equal intervals and are mirror-symmetrical about the central axis of the plate body on the plate surface of the plate body, and the thickness thereof does not exceed half of the plate body.

[0007] As a preferred scheme of the partition for chip integration of the utility model, wherein: the size of the scale grooves is slightly larger than that of the scales, and the two have the same shape.

[0008] As a preferred scheme of the partition for chip integration of the utility model, wherein: the width of the slot gradually increases from the limiting hole to the contact surface.

[0009] As a preferred scheme of the partition for chip integration of the utility model, wherein: a plurality of clamping grooves with different shapes are formed on the clamping block, and a concave surface is formed by the clamping block intersecting with the clamping grooves.

[0010] As a preferred solution of the partition board for chip integration described in the present utility model, the following is provided: a first groove is formed in the middle part of the side surface of the board body, and a second groove is formed between the first groove and the wide surface of the clamping block. Both the second groove and the first groove are arched.

[0011] The beneficial effects of the present utility model are as follows: When assembling the board body and the clamping block, the scaly structure of the clamping block will naturally embed into the corresponding slot of the board body. At the same time, the preset limiting block slides into the positioning hole along the carefully designed channel, ensuring the accuracy of the position. Throughout the process, the wide part of the clamping block always firmly adheres to the edge of the board body. This design greatly simplifies the operation process of workers, ensures the accuracy of installation, thereby improving the quality rate of products and enhancing the assembly efficiency. Description of the Drawings

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. Among them:

[0013] Figure 1 It is a three-dimensional view of the board body of this embodiment.

[0014] Figure 2 For this embodiment Figure 2 is a plan view.

[0015] Figure 3 It is a plan view of the clamping block of this embodiment.

[0016] Figure 4 It is a three-dimensional view of the board body of this embodiment installed on the chip integration.

[0017] In the figure: board body 100, side surface 101, first groove 102, second groove 103, scale groove 104, board surface 105, limiting block 106;

[0018] Clamping block 200, wide surface 201, contact surface 202, slot 203, limiting hole 204, card slot 205, scale 206;

[0019] Chip integration 300. Detailed Embodiment

[0020] In order to make the above objects, features, and advantages of the present utility model more obvious and understandable, the following will make a detailed description of the specific embodiments of the present utility model in conjunction with the drawings of the specification.

[0021] In the following description, numerous specific details are set forth to provide a thorough understanding of the present utility model. However, the present utility model may also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0022] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation manner of the present utility model. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0023] Embodiment

[0024] Referring to Figures 1 to 4 , which is an embodiment of the present utility model. This embodiment provides a partition for chip integration, including a plate body 100 and a clamping block 200 provided on the plate body 100. A scale groove 104 is formed on the plate surface 105 of the plate body 100, and limiting blocks 106 are provided on both sides. The surface of the clamping block 200 in contact with the plate body 100 is provided with scales 206. A slot 203 and a limiting hole 204 are formed through the abutting surface 202 of the clamping block 200. When the clamping block 200 is moved on the plate surface 105, the wide surface 201 closely adheres to the side surface 101 of the plate body 100, the scales 206 are embedded in the scale groove 104, and the slot 203 is aligned with the limiting block 106 and slides into the limiting hole 204, and the abutting surface 202 of the clamping block 200 fits against the side surface 101 of the plate body 100.

[0025] Specifically, the plate body 100 and the clamping block 200 provided on the plate body 100 are installed on the top of the chip integration 300, dividing the chip integration 300 into left and right parts. The plate body 100 and the clamping block 200 provided on the plate body 100 play a role in fixing and beautifying the chip integration 300. When assembling the plate body 100 and the clamping block 200, the scales 206 of the clamping block 200 are embedded in the scale groove 104, and at the same time, the limiting block 106 is clamped into the limiting hole 204 along the slot 203 at this time. During the whole process, the wide surface 201 of the clamping block 200 is always closely attached to the side surface of the plate body 100. Therefore, when workers assemble, the process is very simple and easy to start, and the positioning is accurate, thus ensuring the yield rate of this accessory and improving the assembly efficiency at the same time;

[0026] It is worth mentioning that a first groove 102 is provided in the middle part of the side surface 101 of the plate body 100, and a second groove 103 is provided between the first groove 102 and the wide surface 201 of the clamping block 200. Both the second groove 103 and the first groove 102 are arched. Since the chip is cooled by a built-in fan during operation, the scale grooves 104 equally spaced on the plate surface 105 of the plate body 100 have the same effect as heat dissipation fins, which is beneficial to the heat dissipation of the plate body and the overall heat dissipation of the chip integration. At the same time, it prevents the plate body from deforming due to thermal expansion and contraction. The setting of the grooves is also for the same consideration;

[0027] Further, as Figures 1 - 3 shown, the scale grooves 104 are equally spaced and symmetrically arranged about the central axis of the plate body 100 on the plate surface 105 of the plate body 100, and their thickness does not exceed half of the plate body 100 to ensure the overall strength of the plate body. The size of the scale grooves 104 is slightly larger than that of the scales 206, and the two have the same shape. When assembling the plate body 100 and the clamping block 200, the adhesive form is mostly used. In this way, the size of the scale grooves 104 is slightly larger than that of the scales 206, which can allow the glue to stick the two together, and the gap between the two can retain the glue;

[0028] Further, as Figure 2 shown, the width of the slot 203 gradually increases from the limit hole 204 to the contact surface 202, so that the limit block can slide into the limit hole 204 more accurately and quickly;

[0029] Further, as Figure 3 shown, a plurality of clamping grooves 205 with different shapes are provided on the clamping block 200, and concave surfaces formed by the clamping block 200 intersecting with the clamping grooves 205 are provided. A plurality of special grooves are designed on the clamping block 200 to adapt to the shape of the chip and achieve precise connection.

[0030] Importantly, it should be noted that the construction and arrangement of the present application shown in multiple different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who refer to this disclosure should easily understand that many modifications are possible without materially departing from the novel teachings and advantages of the subject matter described in this application (e.g., changes in the dimensions, scales, structures, shapes and proportions of various elements, as well as parameter values (such as temperature, pressure, etc.), installation arrangements, use of materials, colors, orientations, etc.). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature, number or position of discrete elements may be altered or changed. Accordingly, all such modifications are intended to be included within the scope of the present utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means-plus-function" clause is intended to cover the structures that perform the recited function herein, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present utility model. Therefore, the present utility model is not limited to a particular embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0031] In addition, to provide a concise description of the exemplary embodiments, all features of the actual embodiments may not be described (i.e., those features that are not relevant to the currently contemplated best mode of carrying out the present utility model or those features that are not relevant to the implementation of the present utility model).

[0032] It should be understood that in the development of any actual implementation, as in any engineering or design project, numerous specific implementation decisions may be made. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, without undue experimentation, such development efforts will be a routine task of design, manufacturing and production.

[0033] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and not to limit them. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present utility model, and all of them should be covered within the scope of the claims of the present utility model.

Claims

1. A chip integration partition, comprising a plate body (100) and a card block (200) arranged on the plate body (100), characterized in that: The plate surface (105) of the plate body (100) is provided with a scale groove (104), and limiting blocks (106) are provided on both sides. The surface of the block (200) in contact with the plate body (100) is provided with a scale (206), and the contact surface (202) of the block (200) is provided with a groove (203) and a limiting hole (204) that intersect each other. When the block (200) is moved on the plate surface (105), the wide surface (201) is closely attached to the side surface (101) of the plate body (100), the scale (206) is embedded in the scale groove (104), and the groove (203) is aligned with the limiting block (106) and slides into the limiting hole (204), and the contact surface (202) of the block (200) is attached to the side surface (101) of the plate body (100).

2. The chip integration spacer according to claim 1, characterized in that: The scale grooves (104) are arranged at equal intervals and are formed on the plate surface (105) of the plate body (100) in a mirror-symmetrical manner with respect to the central axis of the plate body (100), and their thickness does not exceed half of the plate body (100).

3. The chip integration spacer according to claim 2, characterized in that: The size of the scale groove (104) is slightly larger than the scale (206), and the two have the same shape.

4. The chip integration spacer according to claim 1, characterized in that: The width of the slot (203) gradually increases from the limiting hole (204) to the contact surface (202).

5. The chip integration spacer according to claim 1, characterized in that: The card block (200) is provided with a plurality of card slots (205) of different shapes, and a concave surface formed by the card block (200) intersecting with the card slots (205).

6. The chip integration spacer according to claim 1 or 2, characterized in that: A first groove (102) is provided in the middle portion of the side surface (101) of the plate body (100), and a second groove (103) is provided between the first groove (102) and the wide surface (201) of the clamping block (200), wherein the second groove (103) and the first groove (102) are both arched.

Images