Multi-color high-voltage hierarchical control LED lamp bead

Abstract

The utility model provides a multicolor high-voltage hierarchical control LED lamp bead, and belongs to the technical field of LEDs. The cup comprises a support, the support is provided with an inner cup and an outer cup, and the inner cup and the outer cup are arranged in a cup-in-cup shape; the hierarchical bonding pad is arranged on the substrate of the bracket; the white light area or the warm white light area is made to be adjacent and is arranged in the inner cup to form 360-degree circular light emitting. The grading type bonding pads are arranged on the substrate, grading control can be achieved, the support is arranged to be in a cup-in-cup mode, white light or warm white light areas are made to be adjacent and are arranged in an inner cup, 360-degree circular light emitting is formed, the problem that yin and yang light spots and left and right light spots are inconsistent can be effectively solved, the light spots are made to be located in the middle of the lens to emit light, and the light emitting efficiency is improved. And a condensation effect is formed. Therefore, the emitted light spots are uniform, and the utilization of light energy is maximized.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and particularly relates to an LED lamp bead with multi-color high-voltage hierarchical control. Background Art

[0002] There are different types of lamp beads according to different application scenarios, which are actually different LED types caused by different LED bracket types. The specific classifications are: straight plug-in brackets, surface mount brackets, high-power brackets, flat brackets, and COB brackets.

[0003] Since the LED bracket needs to conduct electricity and dissipate heat, metal is used as the conductive connection material.

[0004] At the same time, insulation treatment needs to be carried out in some areas, which requires engineering plastics. Therefore, a general LED bracket is formed by metal stamping and then injection molding. The bracket materials used for various different power LEDs are also different. Small power generally uses PPA, medium power generally uses PCT, and currently some high-power ones use EMC or ceramic substrate materials for production.

[0005] The RGB lamp beads on the market are generally electroplated with copper, stamped into the required size, and then injection molded to form a bracket. The RGB chips are fixedly welded in the bracket bowl cup to make RGB lamp beads.

[0006] Existing related technologies:

[0007] (1) The existing multi-color (three-color, four-color, five-color, six-color and above) LED lamp beads on the market are generally square. The RGB color chips are placed in the middle, and white light or warm white light is made on both sides to form five-color or four-color lamp beads. (As Figure 1 shown).

[0008] (2) The existing multi-color LED lamp beads are first made by stamping hardware, silver plating, and then injection molding with plastic materials such as PPA and PCT. Due to the particularity of this process, in the existing technology, RGB is placed in the middle of the cup of the bracket, and bowl cups are made on both sides to make white light or warm white light, so as to form multi-color lamp beads with four colors, five colors and above. As Figures 2-3 shown.

[0009] In the above existing technologies, RGB is placed in the middle of the cup of the bracket, and bowl cups are made on both sides to make white light or warm white light, so as to form multi-color lamp beads with four colors, five colors and above. As Figure 2 shown, because the white light or warm white light is on both sides of the bowl cup, when a secondary optical lens is installed, since the white light is on one side of the bowl cup and the bracket is a rectangular cup body, it will cause inconsistent left and right light spots and inconsistent brightness, resulting in the so-called "yin-yang" light spots, one side is bright, one side is dark, one side is bluish, and one side is yellowish. The original traditional bracket will cause such optical defects. And asFigure 2 As shown, the lamp beads are square and the chips are concentrated on the same heat sink. Therefore, it is impossible to achieve hierarchical lighting through external control, and only the control method of full-color on or full-color off can be designed. In this way, the advantage of the multi-chip structure inside the lamp beads cannot be utilized to the greatest extent. SUMMARY OF THE UTILITY MODEL

[0010] In view of this, to solve the defects of "yin-yang" light spots and inability to achieve external hierarchical control in the prior art, the present utility model provides an LED lamp bead with multi-color high-voltage hierarchical control. By setting a hierarchical pad on the substrate, hierarchical control can be achieved. The bracket is set in the form of a cup-in-cup, and the white light or warm white light area is made adjacent and arranged in the inner cup to form a 360° circular light emission, which can effectively solve the problems of yin-yang light spots and inconsistent left and right light spots, making it emit light in the middle of the lens to form a light concentration effect. In this way, the light spot produced is uniform, and the utilization of light energy is maximized.

[0011] To achieve the above object, the present utility model provides the following technical solutions:

[0012] An LED lamp bead with multi-color high-voltage hierarchical control, comprising:

[0013] A bracket having an inner cup and an outer cup, wherein the inner cup and the outer cup are arranged in the shape of a cup-in-cup;

[0014] A hierarchical pad disposed on the substrate of the bracket;

[0015] The white light or warm white light area is made adjacent and arranged in the inner cup to form a 360° circular light emission.

[0016] Preferably, the RGB chips disposed on the substrate of the bracket are arranged in a circular array, and the RGB chips at adjacent circular arrays are arranged in a cross pattern.

[0017] Preferably, the substrate is made of BT material.

[0018] Compared with the prior art, the present utility model has the following beneficial effects:

[0019] The LED lamp bead with multi-color high-voltage hierarchical control provided by the present utility model can achieve hierarchical control by setting a hierarchical pad on the substrate, the bracket is set in the form of a cup-in-cup, and the white light or warm white light area is made adjacent and arranged in the inner cup to form a 360° circular light emission, which can effectively solve the problems of yin-yang light spots and inconsistent left and right light spots, making it emit light in the middle of the lens to form a light concentration effect. In this way, the light spot produced is uniform, and the utilization of light energy is maximized.

[0020] Furthermore, the RGB chips of the present utility model are designed in a circular array arrangement, and the RGB chips in adjacent circular arrays are arranged in a cross pattern, which can effectively solve the problem of uneven light spots and impure light mixing.

[0021] By providing a hierarchical pad on the substrate, the present utility model can change the number of lit chips inside the LED through an external single-chip microcomputer or control program, so as to cooperate with the secondary optical lens to change the light emission pattern of the lamp. This mainly solves the problem that the light emission pattern of the previous lamps had to be changed by modifying the hardware. For the present utility model, as long as the number of lit chips inside the LED is changed, the hierarchical lighting area can cooperate with the design of the secondary optical lens to change the light pattern of the entire lamp. In practical applications, the light pattern of the lamp can be adjusted through software, thereby eliminating aesthetic fatigue and increasing the customization of personalized light patterns.

[0022] The LED lamp beads provided by the present utility model can be integrated into lighting devices and display devices, bringing considerable economic benefits.

[0023] In summary, the LED lamp beads provided by the present utility model adopt an integrated chip circular arrangement design. The white light or warm white light area is placed in the inner cup, and the RGB chips are arranged in a circular cross pattern around the white light, solving the difficulty of optical uniform design of the secondary optical lens. The polycrystals are in series and the internal RGB chips are hierarchically controlled. All the chips in the series circuit can be lit together or separately, and different color chips can be lit together or separately by changing the power supply of the external BIN pins. It is conducive to control. The substrate of the entire bracket adopts a double-cup design of inner cup and outer cup. The RGB chips are arranged in a cross pattern in the outer cup, and the inner cup adopts a double-cup design to hold the white light or warm white light area, or other color chips to be expanded later. Description of the Drawings

[0024] Figure 1 is the first prior art;

[0025] Figure 2 is the second prior art;

[0026] Figure 3 is the third prior art;

[0027] Figure 4 is the three-dimensional view of the present utility model;

[0028] Figure 5 is the top view of the present utility model;

[0029] Figure 6 is the effect diagram of light spot uniformity;

[0030] Figure 7It is a front view of the substrate;

[0031] Figure 8 It is a back view of the substrate;

[0032] Figure 9 It is a distribution diagram of the hierarchical control chips;

[0033] Figure 10 It is a single light-emitting area;

[0034] In the figure, 1 is the bracket; 11 is the inner cup; 12 is the outer cup; 13 is the substrate; 14 is the hierarchical pad; 15 is the RGB chip. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0037] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "provided with", "sheathed / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0038] In view of the content described in the background art, the present invention has been redesigned for the above defects, as Figures 4-5 shown. In the first aspect, the present invention provides an LED lamp bead with multi-color high-voltage hierarchical control, including:

[0039] A bracket 1, which has an inner cup 11 and an outer cup 12, wherein the inner cup 11 and the outer cup 12 are arranged in a shape of a cup within a cup;

[0040] The hierarchical pad 14 is disposed on the substrate 13 of the bracket 1;

[0041] The white light or warm white light areas are made adjacent and are disposed in the inner cup 11 to form a 360° circular light emission. Preferably, a partition is provided at the middle position of the inner cup 11, and two adjacent areas are formed on both sides of the partition for placing white light or warm white light, or white light on one side and warm white on the other side.

[0042] Among them, the cup-in-cup means that an inner cup 11 is further provided inside the outer cup 12, and the white light or warm white light areas are disposed in the inner cup 11, and two adjacent areas are formed (as Figure 4 shown) to achieve a 360° circular light emission, so as to solve the problems of yin-yang light spots and inconsistent left and right light spots, make it emit light in the middle of the lens, form a light concentration effect, ensure that the light spots produced are uniform, and the utilization of light energy is maximized.

[0043] In the present utility model, the RGB chips 15 disposed on the substrate 13 of the bracket 1 are arranged in a circular array, and the RGB chips 15 at adjacent circular arrays are arranged in a cross pattern to further solve the phenomenon of uneven light spots and the problem of impure light mixing. An extension is designed on the horizontal plane on the other side of the power supply input BIN pin. Through the setting of the hierarchical pad 14, hierarchical control can be achieved. The number of bright cores of the RGB chips 15 inside the LED can be changed by means of an external single-chip microcomputer or a control program, so as to cooperate with the secondary optical lens to change the light emission pattern of the lamp. In this way, it mainly solves the traditional way that the light emission pattern of the previous lamps needs to be changed by modifying the hardware. As long as the number of light-emitting chips inside the LED is changed, the hierarchical lighting area can cooperate with the design of the secondary optical lens to change the light pattern of the entire lamp. In practical applications, the light pattern of the lamp can be adjusted by software, so as to eliminate aesthetic fatigue and increase the customization of personalized light patterns.

[0044] Among them, the RGB chips 15 are located between the inner cup 11 and the outer cup 12, as Figures 4-5 shown.

[0045] In the present utility model, the material of the substrate 13 is BT material. The BT material is a high-performance substrate 13 material, and its full name is BT resin substrate 13 material, which is mainly composed of bismaleimide (BMI) and triazine resin. The BT resin is a resin obtained by copolymerizing a cyanate resin with -OCN and BMI at 170~240°C, and contains a heat-resistant triazine ring structure. 12

[0046] The BT material has the following performance characteristics:

[0047] ‌High glass transition temperature (Tg)‌: BT resin has a relatively high glass transition temperature, enabling it to maintain stable performance in high-temperature environments.

[0048] ‌Excellent dielectric properties‌: BT resin has good dielectric properties and is suitable for high-frequency signal transmission.

[0049] ‌Low coefficient of thermal expansion‌: BT resin has a low coefficient of thermal expansion, which can reduce material deformation caused by temperature changes.

[0050] ‌Good mechanical characteristics‌: BT resin has excellent mechanical properties and can withstand large external forces.

[0051] ‌The application fields of BT materials are very extensive, mainly including:

[0052] ‌‌Chip packaging‌: BT resin is widely used in the field of chip packaging and can provide good electrical and mechanical properties.

[0053] ‌‌High-frequency and high-speed copper clad laminates‌: In the high-frequency and high-speed copper clad laminate market, BT resin stands out due to its stability and heat resistance.

[0054] ‌‌Multilayer printed boards‌: BT resin substrate materials perform well in multilayer printed boards and meet the requirements of high-density interconnection.

[0055] As Figures 7-9 shown, the present utility model provides a hierarchical control design scheme, which is specifically as follows:

[0056] By changing the series-parallel connection method of chips with different pad BIN pins, the input voltage is changed to achieve different control effects. In this way, the utilization rate of the chips can be maximized, meeting the requirements of diversified design and no longer being limited to the traditional single-color full-bright or all lights on.

[0057] As Figures 7-9 shown, there are a total of 13 control BIN pins, and different functions are controlled by the 13 BIN pins to achieve different functional effects. Each BIN pin of RGB controls different chips (as Figure 6 shown).

[0058] Figure 7 In

[0059] R+(12V) and R-(12V) control chips R8, R9, R10, R11, R12, R13;

[0060] G+(12V) and G-(12V) control chips G6, G7, G8, G9;

[0061] B+(12V) and B-(12V) control chips B6, B7, B8, B9;

[0062] R+(15V) and R-(15V) control chips R1, R2, R3, R4, R5, R6, R7;

[0063] G+(15V) and G-(15V) control chips G1, G2, G3, G4, G5;

[0064] B+(15V) and B-(15V) control chips B1, B2, B3, B4, B5;

[0065] R+(27V) and R-(27V) control chips R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13;

[0066] G+(27V) and G-(27V) control chips G1, G2, G3, G4, G5, G6, G7, G8, G9;

[0067] B+(27V) and B-(27V) control chips B1, B2, B3, B4, B5, B6, B7, B8, B9;

[0068] CW+(27V) and CW-(27V) control chips CW1, CW2, CW3;

[0069] WW+(27V) and WW-(27V) control chips WW1, WW2, WW3;

[0070] For the control of different BIN pins, the lighting effects and areas are also different. Dozens of different effects can be achieved through different combination methods. For example, Figure 10 As shown, there are a total of 8 single lighting areas (WW, CW, R1, R2, G1, G2, B1, B2). When controlling the R1 area to light up, the chips of R8, R9, R10, R11, R12, and R13 will light up. When controlling the G2 area to light up, the chips of G1, G2, G3, G4, and G5 will light up. And so on. When they light up different areas, the chips they light up are also different. Through different combination methods among them, different effects can also be achieved. For example, when B1 and G1 are combined, cyan light will be emitted. When R2 and G2 are combined, yellow light will be emitted. Therefore, through such different combination methods, a very large number of effects can be achieved.

[0071] Finally, different combinations are used to achieve different effects. By simply changing the input definition of the control terminal BIN pin, the bright core area and color area can be changed. In combination with an external secondary optical lens, the function of a single device to transform different light patterns and colors can be realized, thus meeting the diverse market demands.

[0072] In a second aspect, the present invention provides a method for manufacturing the above multi-color high-voltage hierarchical control LED lamp beads, including the following steps:

[0073] Step (1): Design the substrate 13 into a circular shape. Preferably, the substrate 13 is made of BT material.

[0074] Step (2): Design a hierarchical pad 14 on the substrate 13 and conduct it with the bottom pad (preferably, the hierarchical pad 14 is designed to be conducted with the bottom pad by drilling and filling, which directly reduces the need for multiple controls of different chips on the same carrier board). Preferably, the hierarchical pad 14 is designed by electroplating (as Figure 5 shown).

[0075] Step (3): Arrange RGB chips 15 on the substrate 13. The RGB chips 15 are arranged in a circular array, and the RGB chips 15 at adjacent circular arrays are arranged in a cross pattern, so that the mixed white light spot effect when the RGB is lit simultaneously reaches the best, thus upgrading the uneven mixed white light spot of the traditional square RGB.

[0076] Step (4): Set an inner cup 11 in the outer cup 12, and arrange adjacent white light or warm white light areas in the inner cup 11. The design of the 360° round cup with an inner cup is used to improve the original traditional square bracket 1 to produce a yin-yang light spot, so as to achieve the best light concentration effect and the highest light spot uniformity (as Figure 6 shown).

[0077] Finally, through the method of potting and encapsulation, the multi-color high-voltage hierarchical control LED lamp beads are realized.

[0078] In a third aspect, the present invention provides a lighting device including the above multi-color high-voltage hierarchical control LED lamp beads.

[0079] Among them, the lighting device includes but is not limited to the following lighting devices, specifically as follows:

[0080] Indoor lighting: Such as LED ceiling lights, LED downlights and other products, used for lighting in shopping malls, hotels, office buildings, families and other places.

[0081] Road lighting: In the field of road lighting, LED lamp beads gradually replace traditional street lights due to their advantages of high efficiency, energy saving and long life, to improve the efficiency of road lighting and reduce maintenance costs.

[0082] Outdoor landscape lighting: LED lamp beads are used for outdoor landscape lighting, such as building outline lighting, square decoration, etc. With their high brightness and diverse color changes, they enhance the visual effect and the beauty of the city night view.

[0083] Automobile lighting: In automobile lighting, LED lamp beads are used for vehicle lights, interior lighting, etc., providing better visibility and comfort, and also contributing to improving driving safety.

[0084] Fourthly, the present utility model provides a display device, including the above-mentioned multi-color high-voltage hierarchical control LED lamp beads.

[0085] The display device includes but is not limited to the following display devices, specifically as follows:

[0086] Electronic display technology: In electronic display devices such as televisions, mobile phones, tablets, e-sports monitors, etc., LED backlights achieve energy-saving, environmentally friendly, and high-brightness lighting effects through different layout methods, such as direct-lit, edge-lit, and full-array, improving the display quality.

[0087] Smart home: LED lamp beads are also applied in the smart home system, realizing functions such as light adjustment and timed switching through intelligent control, improving the convenience and comfort of living.

[0088] Fifthly, the present utility model provides the application of multi-color high-voltage hierarchical control LED lamp beads in lighting and display devices.

[0089] The above is only a preferred specific embodiment of the present utility model; however, the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its improved concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present utility model.

Claims

1. A multi-color high-voltage graded controlled LED lamp bead, characterized in that: include: A bracket having an inner cup and an outer cup, wherein the inner cup and the outer cup are arranged in a cup-in-cup shape; A graded solder pad is disposed on a substrate of the bracket; The white light or warm white light areas are made adjacent and arranged in the inner cup to form a 360° circular light emission.

2. The multi-color high-voltage graded controlled LED lamp bead according to claim 1, characterized in that: The RGB chips disposed on the substrate of the bracket are arranged in a circular array, and the RGB chips at adjacent circular arrays are arranged crosswise.

3. The multi-color high-voltage graded controlled LED lamp bead according to claim 1, characterized in that: The substrate is made of BT material.

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