Camera digital assembly and camera with same

Abstract

The utility model provides a camera digital assembly, which comprises a shooting control button, a digital back and a digital base, and is characterized in that the shooting control button is arranged at the position of a camera upper cover; the camera digital assembly further comprises an SoC chip, a photosensitive chip and a power supply module, the photosensitive chip is arranged on the digital back position, and at least one of the SoC chip and the power supply module is arranged on the digital base position. According to the digital assembly provided by the utility model, the photosensitive chip is arranged on the digital back and can be used as an imaging negative film instead of a film, and the SoC chip and other components are arranged on the digital base or the digital back, so that the digital use of a film camera is realized. The invention also provides a camera with the digital assembly.

Description

Technical Field

[0001] The present application relates to the field of cameras, and in particular to a digital component applicable to a film camera and a camera having the digital component. Background Art

[0002] Traditional film cameras use film for photosensitization, and then go through a series of work in the darkroom, such as washing, film selection, enlargement, magnification, and film retouching. The process is complicated and expensive, and there is also the problem of environmental pollution. Moreover, film cameras cannot be processed online, and the image cannot be presented immediately, which will cause some regrets in shooting. However, traditional film cameras also have their unique advantages. They can set the shutter speed according to the actual scene, manually adjust the aperture, focal length and sensitivity, and replace different lenses to meet the shooting needs based on the professional skills of the photographer. For professional photographers, it has greater shooting fun, and film imaging has a higher sense of hierarchy and can obtain good image quality. Therefore, there are still many traditional film cameras on the market, such as the Leica M series, Nikon F2 / F3 and Canon's early film cameras, which are still widely collected by photography enthusiasts.

[0003] Digital cameras use photosensitive chips, so you can see the picture immediately after taking it, and you can process, store and transmit the image. If you are not satisfied with the work, you can retake it immediately. Digital cameras use automatic exposure and automatic focus, which makes shooting simple, and can improve image resolution by increasing the total number of pixels. Therefore, they are deeply loved by consumers and gradually replace traditional film cameras to become the mainstream in the market. However, the intelligence of digital cameras reduces the fun of mechanical operation, and it is impossible to make more personalized adjustments according to the photographer's photography skills to achieve better imaging effects.

[0004] Therefore, in the digital age, if these traditional film cameras can be made capable of taking digital photos, turning waste into treasure, while taking into account both the personalized advantages of manual adjustment of film cameras and the shooting convenience and continuously improved imaging performance of digital cameras, there will be a huge market demand. Summary of the invention

[0005] The present application therefore provides a digital component with a complete structure and functional configuration and a camera having the digital component, which can enable film cameras to be used digitally.

[0006] The present application provides a camera digital assembly, including a shooting control button, a digital back and a digital base, wherein the shooting control button is arranged on the camera cover; the camera digital assembly further includes a SoC chip, a photosensitive chip and a power module, wherein the photosensitive chip is arranged on the digital back, and at least one of the SoC chip and the power module is arranged in the digital base; wherein,

[0007] The shooting control button is used to trigger the generation of a shooting start signal when pressed, and is also used to trigger the generation of a shooting end signal when released;

[0008] The SoC chip is connected to the shooting control button in a wireless or wired manner. The SoC chip is used to send a shooting start signal to the photosensitive chip to start the photosensitive chip for shooting after receiving the shooting start signal, send a shooting stop signal to the photosensitive chip when receiving the shooting end signal, and is used to perform image processing on the images sent by the photosensitive chip;

[0009] The photosensitive chip is connected to the SoC chip and is used to start shooting after receiving the shooting start signal, and send the captured image to the SoC chip after receiving the shooting stop signal; and

[0010] The power supply module is connected to the photosensitive chip and the SoC chip and is used to provide working power for the photosensitive chip and the SoC chip.

[0011] This application also provides a camera, including the camera digital component as described above.

[0012] As described above, the digital component provided by this application and the camera with this digital component, by setting a photosensitive chip at the position of the digital back, can replace the film as the imaging negative. The components such as the SoC chip are set at the position of the digital back or the digital base, realizing the digital use of the film camera, avoiding the characteristics of complex operation and high cost of the film camera; at the same time, due to the use of the digital base, more and larger-sized devices can be respectively configured on the digital back and the digital base, the system function is more perfect, the structural configuration is more flexible, and it can avoid overheating during work and reduce the signal interference between components. Brief Description of the Drawings

[0013] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing the embodiments consistent with this application, and are used together with the specification to explain the principles of this application. In order to more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0014] Figure 1 It is a schematic front view structure diagram of a film camera in an embodiment of this application.

[0015] Figure 2 It is a schematic back view structure diagram of a film camera in an embodiment of this application.

[0016] FIG. 3(a) is a schematic diagram of the first embodiment of the shooting control button of the present application.

[0017] FIG. 3(b) is a schematic diagram of the second embodiment of the shooting control button of the present application.

[0018] FIG. 4(a) is a schematic diagram of the internal structure of the digital back in an embodiment of the present application.

[0019] FIG. 4(b) is a schematic diagram of the internal structure of the digital base in an embodiment of the present application.

[0020] Figure 5 is a schematic diagram of the circuit structure of the digital component in an embodiment of the present application.

[0021] Figure 6 is a flowchart of the steps of the shooting method of the camera with the above digital component in an embodiment of the present application.

[0022] The realization of the purpose of the present application, functional features and advantages will be further described in conjunction with the embodiments with reference to the accompanying drawings. Through the above accompanying drawings, the clear embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed Embodiments

[0023] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0024] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanations in the specific embodiments or further in combination with the context of the specific embodiments.

[0025] It should be noted that in this text, step codes such as S111 and S112 are used. The purpose is to more clearly and briefly express the corresponding content, and it does not constitute a substantial limitation in terms of sequence. Those skilled in the art may execute S112 first and then S111 during specific implementation, etc., but these should all be within the protection scope of this application.

[0026] It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0027] The following will describe in detail the content proposed in this application in conjunction with each drawing.

[0028] Please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 is an embodiment in which the camera digital component of this application is applied in a film camera to realize the digitalization of the film camera. In other embodiments, the camera digital component of this application can also be used as an accessory for a digital camera. The camera digital component of this application includes a shooting control button, a digital back, and a digital base.

[0029] Figure 1 is a front structural schematic diagram of the digital component applied in the film camera 100 in this embodiment, Figure 2 is a back structural schematic diagram of the digital component applied in the film camera 100 in this embodiment. The shooting control button 112 is arranged at the position of the upper cover 110 of the film camera 100. The digital back 140 replaces the original back of the film camera 100. The digital base 120 can be tightly connected to the lower cover (not shown in the figure) of the film camera 100 through connecting components such as a tripod hole. The digital back 140 is also provided with a power switch 142, a display screen 144, and a number of operation buttons 146.

[0030] The film camera 100 has the general structure and functions of a conventional film camera. For example, the film camera is equipped with a lens assembly 132 on the front cover 130, a shutter adjustment button 114 is also arranged on the upper cover 110, and a flash, a film card inserter, a film card retractor, a film card release button, a lens release button, an ISO indicator disk, a film chamber, and a film spool spindle and other structures are arranged at other corresponding positions. These structures and operation methods are no different from those of a conventional film camera and will not be elaborated here. After the digitalization of the film camera 100, the shutter speed, aperture, focal length, etc. can still be manually adjusted according to actual needs, but some components will lose their functions after digitalization, such as the film card inserter, film card retractor, film card release button, film chamber, and film spool spindle related to film use.

[0031] Please refer to FIG. 3(a). FIG. 3(a) is a schematic diagram of the first embodiment of the shooting control button 112 in the present application. The shooting control button 112 includes a shutter button 1121. The shutter button 1121 is disposed on the upper cover 110 of the film camera. A contact 1122 is disposed below it. The shutter button 1121 is vertically disposed with the contact 1122 and can be connected together through a screw hole. When the shutter button 1121 is pressed halfway, the contact 1122 is triggered to generate a shooting start signal. When the shutter button 1121 is pressed fully, the shutter of the film camera opens for exposure. After the shutter button 1121 is released, the contact 1122 is triggered to generate a shooting end signal. It can be understood that in other embodiments, the vertical positions of the shutter button 1121 and the contact 1122 can be interchanged as long as the contact 1122 can be preferentially triggered to generate the shooting start signal. In this embodiment, the shooting control button 112 includes the shutter button 1121 and the contact 1122 that are vertically disposed up and down. The position of the shutter button of the film camera can be directly utilized for transformation, which is convenient to operate and does not affect the appearance of the film camera.

[0032] Please refer to FIG. 3(b). FIG. 3(b) is a schematic diagram of the second embodiment of the shooting control button 112 in the present application. The shooting control button 112 is independently disposed from the shutter button 114 of the film camera, and the shooting control button 112 and the shutter button 114 of the film camera are horizontally arranged side by side on the upper cover of the film camera. The shooting control button 112 is disposed at a position outside the central axis of the camera such that the finger can press the shooting control button 112 first during shooting. When the shooting control button 112 is pressed, it is triggered to generate a shooting start signal. When the shutter button 114 is pressed, the shutter of the film camera opens for exposure. After the shooting control button 112 is released, it is triggered to generate a shooting end signal. It can be understood that in other embodiments, the horizontal positions of the shutter button 1121 and the contact 1122 can be interchanged as long as the contact 1122 can be preferentially triggered to generate the shooting start signal. In this embodiment, the shooting control button 112 and the shutter button 114 are horizontally arranged side by side. There is no need to change the structure of the shutter button 114 of the film camera. Only the shooting control button 112 needs to be newly disposed at a position on the upper cover of the film camera close to the shutter button 114.

[0033] Please refer to FIGS. 4(a) and 4(b). FIG. 4(a) is a schematic internal structure diagram of the digital back 140 in an embodiment of the present application, and FIG. 4(b) is a schematic internal structure diagram of the digital base 120 in an embodiment of the present application. In this embodiment, the photosensitive chip 1401, the temperature adjustment device 1402, and the peripheral circuit 1403 are arranged at the inner side position of the digital back 140. The photosensitive chip 1401 corresponds to the lens of the camera front cover and is located at the center of the lens. The base 120 is provided with an SoC chip 1201, a power module 1202, and the storage module 1203. The back 140 and the base 120 are respectively provided with connection interfaces 1404 and 1204, and the back 140 and the base 120 are connected through the interfaces 1404 and 1204 for signal transmission.

[0034] In other embodiments, the SoC chip 1201, the power module 1202, and the storage module 1203 can be selectively arranged on the digital back 140 or the digital base 120, that is, at least one of the SoC chip 1201, the power module 1202, and the storage module 1203 is arranged in the digital base 120. For example, the SoC chip 1201 is arranged on the digital back 140, and the power module 1202 and the storage module 1203 are arranged on the digital base 120; or, the SoC chip 1201 and the storage module 1203 are arranged on the digital back 140, and the power module 1202 is arranged on the digital base 120; or, the power module 1202 is arranged on the digital back 140, and the SoC chip 1201 and the storage module 1203 are arranged on the digital base 120. Of course, the SoC chip 1201, the power module 1202, and the storage module 1203 can also be arranged together with the photosensitive chip 1401 on the back 140 of the film camera. However, this method requires restricting the device size, thereby reducing the system performance, and the space setting is not flexible enough and there may be signal interference.

[0035] Please refer to Figure 5 , Figure 5 is a schematic internal circuit structure diagram of the camera digital component 500 in an embodiment of the present application. In this embodiment, the digital component 500 includes a shooting control button 510, an SoC chip 520, a photosensitive chip 530, and a power module 540. In addition, in this embodiment, the digital component 500 further includes a storage module 550, a display screen 560, a plurality of operation buttons 570, a temperature adjustment device 580, and a peripheral circuit 590. In other embodiments, the storage module 550, the display screen 560, the plurality of operation buttons 570, the temperature adjustment device 580, and the peripheral circuit 590 can be selectively configured as needed.

[0036] Among them, when the shooting control button 510 is touched and pressed, a shooting start signal is triggered and generated. When the shooting control button 510 is released, a shooting end signal is triggered and generated. The SoC chip 520 is connected to the shooting control button 510 in a wireless or wired manner. After receiving the shooting start signal, the SoC chip 520 sends a shooting start signal to the photosensitive chip 530 to start the photosensitive chip 530 for shooting, and sends a shooting stop signal to the photosensitive chip 530 when receiving the shooting end signal. The photosensitive chip 530 is connected to the SoC chip 520, starts shooting after receiving the shooting start signal, and sends the captured image to the SoC chip 520 for image processing after receiving the shooting stop signal. The power supply module 540 is connected to the photosensitive chip 530 and the SoC chip 520, and is used to provide working power for the photosensitive chip 530 and the SoC chip 520 in the power switch on state.

[0037] In this embodiment, the photosensitive chip 530 is a CMOS (Complementary Metal Oxide Semiconductor) image sensor. Compared with a CCD (Charge-coupled Device) image sensor, the CMOS image sensor has lower cost, lower power consumption, and faster response speed. In one embodiment, the photosensitive chip 530 is a full-frame CMOS image sensor, that is, the size of the photosensitive chip 530 is 36mm x 24mm to adapt to corresponding camera models, such as Leica M series film cameras, Nikon's early F2, F3, FM2 and other manual cameras, and other brands' early film cameras, such as Pentax, Canon, Olympus, etc. It should be noted that the size of the film format determines the photosensitive ability of the camera. The larger the film format, the larger the photosensitive area, the more light information received, and the more delicate and rich the imaging. The film format also affects the imaging field and depth of field. The larger the film format, the larger the imaging field and the shallower the depth of field. At the same time, a large film format can also bring high-pixel fine resolution. In other embodiments, the photosensitive chip 530 can also be extended to the medium format size to adapt to the models of film cameras 10, such as Hasselblad V series, Pentax 67, Mamiya RB67, etc.

[0038] In this embodiment, the storage module 550 is connected to the SoC chip 520 and is used to store the images captured by the photosensitive chip 530. In this embodiment, the storage module 550 is an SD card. In other embodiments, it can also be other storage devices, such as a CF card, an SM card, a Memory Stick, an MMC (Multimedia Card), etc. In other embodiments, the storage module 550 can also be omitted, and the SoC chip 520 can wirelessly transmit the processed images to a computer device.

[0039] In this embodiment, the SoC chip 520 includes a processor 522, a controller 524, and the memory 526. The processor 522 is used to process the images. The controller 524 is used to generate control instructions according to the received shooting start signal and shooting end signal. The control instructions include the shooting start signal and the shooting stop signal sent to the photosensitive chip 530. The memory 526 is used to store the images to be processed sent by the photosensitive chip 530.

[0040] Please continue to refer to Figure 5 , the display screen 560 is connected to the SoC chip 520 and the storage module 550 and is used to display the images processed by the SoC chip 520 and / or the images in the storage module 550. In one embodiment, the display screen 560 is a liquid crystal display screen. More specifically, the display screen 560 is a touch liquid crystal display screen. In some embodiments, the several operation buttons 570 at least include a delete button and a restore button, which are used to delete or restore the images in the SoC chip 520 and the storage module 550. In some embodiments, the several operation buttons 570 further include a confirmation button, which is used to confirm the executed delete or restore action.

[0041] In this embodiment, the temperature adjustment device 580 is connected to the photosensitive chip 530 and is used to adjust the temperature of the photosensitive chip 530 to enable it to work properly. In some embodiments, the temperature adjustment device 580 includes a radiator, which is used to reduce the temperature of the photosensitive chip 530 at high temperatures. In one embodiment, the radiator is a heat sink and is disposed on the back of the photosensitive chip 530. In some embodiments, the temperature adjustment device 580 includes a heating circuit, which is used to increase the temperature of the photosensitive chip 530 at low temperatures. Among them, the temperature adjustment device 580 can be configured with both the radiator and the heating circuit, or can be selectively configured, and it is preferred to configure the radiator to solve the problem of heat generation during chip operation. In other embodiments, the temperature adjustment device 580 can also be provided with a temperature detection circuit and a control circuit, so as to automatically detect the operating temperature of the chip and control the operating states of the radiator and / or the heating circuit through the control circuit to ensure that the chip operates within a normal operating range.

[0042] In this embodiment, the peripheral circuit 590 is connected to the photosensitive chip 530. The peripheral circuit 590 includes a number of capacitors and resistors and is used to perform functions such as filtering, decoupling, and stabilizing current.

[0043] This application also provides a camera having the above digital components for taking pictures.

[0044] Please refer to Figure 6 , Figure 6 which is a shooting method of a camera having the above digital components in an embodiment of this application. The method includes the following steps:

[0045] Step S610: Turn on the power switch of the digital back. It can be understood that the power switch does not need to be turned on again every time a picture is taken. Even when power consumption is not considered, the power switch can be not provided, and continuous power supply can be achieved as long as power is plugged in, such as when a battery is installed.

[0046] Step S611: Generate the shooting initial signal by touching and pressing the shooting control button.

[0047] Step S612: After receiving the shooting initial signal, the SoC chip sends the shooting start signal to start the photosensitive chip.

[0048] Step S613: Generate a shutter signal by touching the camera shutter button, and the camera shutter opens for exposure.

[0049] Step S614: Generate the shooting end signal by releasing the shooting control button.

[0050] Step S615: After receiving the shooting end signal, the SoC chip sends the shooting stop signal to the photosensitive chip.

[0051] Step S616: After receiving the shooting stop signal, the photosensitive chip transmits the acquired image to the SoC chip.

[0052] Step S617: The SoC chip completes image processing.

[0053] Step S618: The SoC chip stores the processed image in the SD card. It can be understood that in some embodiments, the SoC chip may not store the image in the SD card, but directly send it to an online computer device.

[0054] Therefore, for the digital component and camera provided in this application, by setting a photosensitive chip at the position of the digital back, it can replace the film as the imaging negative. At the same time, components such as the SoC chip are set at the back or the digital base position, realizing the digital use of the film camera, avoiding the complex operation and high cost of the film camera. At the same time, by utilizing the space of the digital base, it is avoided to set all components at the position of the digital back, making the structural configuration more flexible, avoiding overheating during operation, and reducing the signal interference between components.

[0055] The above are only the preferred embodiments of this application, and do not limit the patent scope of this application accordingly. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be included in the patent protection scope of this application by the same token.

Claims

1. A camera digital component, characterized in that: The camera comprises a shooting control button, a digital back and a digital base, wherein the shooting control button is arranged on the upper cover of the camera; the camera digital component further comprises a SoC chip, a photosensitive chip and a power module, wherein the photosensitive chip is arranged on the digital back, and at least one of the SoC chip and the power module is arranged in the digital base; wherein, The shooting control button is used to trigger the generation of a shooting start signal when it is pressed, and the shooting control button is also used to trigger the generation of a shooting end signal when it is released; The SoC chip is connected to the shooting control button wirelessly or by wire. The SoC chip is used to send a shooting start signal to the photosensitive chip after receiving the shooting initial signal to start the photosensitive chip to shoot, send a shooting stop signal to the photosensitive chip when receiving the shooting end signal, and perform image processing on the image sent by the photosensitive chip; The photosensitive chip is connected to the SoC chip, and is used to start shooting after receiving the shooting start signal, and send the shot image to the SoC chip after receiving the shooting stop signal; and The power module is connected to the photosensitive chip and the SoC chip, and is used to provide working power for the photosensitive chip and the SoC chip.

2. The digital component according to claim 1, characterized in that: The camera digital component is applied in a film camera.

3. The digital component according to claim 1, characterized in that: It also includes a storage module, which is connected to the SoC chip and is used to store images processed by the SoC chip. The storage module is arranged in the digital back or the digital base.

4. The digital component according to claim 3, characterized in that: The storage module is an SD card.

5. The digital component according to claim 1, characterized in that: The shooting control button includes a shutter button of the camera and a contact, wherein the shutter button and the contact are vertically arranged up and down, and when the shooting control button is half-pressed, the contact is triggered to generate the shooting initial signal, and when the shooting control button is fully pressed, the shutter of the camera opens for exposure, and when the shooting control button is released, the contact is triggered to generate the shooting end signal.

6. The digital component according to claim 1, characterized in that: The shooting control button is arranged horizontally in parallel with the shutter button of the camera. When the shooting control button is pressed, it triggers the generation of the shooting initial signal. When the shutter button is pressed, the camera shutter opens for exposure. When the shooting control button is released, it triggers the generation of the shooting end signal.

7. The digital component according to claim 1, characterized in that: The photosensitive chip is a CMOS image sensor.

8. The digital component according to claim 1, characterized in that: The SoC chip and the power module are both arranged on the digital base.

9. The digital component according to claim 1, wherein: The SoC chip includes a memory, a processor and a controller. The memory is used to store the image to be processed sent by the photosensitive chip, the processor is used to process the image, and the controller is used to generate control instructions based on the received shooting initial signal and the shooting end signal. The control instructions include the shooting start signal and the shooting stop signal sent to the photosensitive chip.

10. The digital component according to claim 3, characterized in that: It also includes a display screen connected to the SoC chip and the storage module, and is used to display the images processed by the SoC chip and / or the images in the storage module.

11. The digital component according to claim 10, characterized in that: It also includes a plurality of operation buttons, including a delete button and a restore button, wherein the delete button is used to delete the image in the SoC chip or the storage module, and the restore button is used to restore the image in the SoC chip or the storage module.

12. The digital component according to claim 11, characterized in that: The plurality of operation buttons also include a confirmation button, and the confirmation button is used to confirm the executed deletion or restoration action.

13. The digital component according to claim 10, characterized in that: The display screen is a touch liquid crystal display screen.

14. The digital component according to claim 1, wherein: It also includes a temperature regulating device, which is connected to the photosensitive chip and is used to regulate the temperature of the photosensitive chip to enable it to work normally.

15. The digital component according to claim 14, characterized in that: The temperature regulating device includes a heat sink and / or a heating circuit. The heat sink is used to reduce the temperature of the photosensitive chip at a high temperature, and the heating circuit is used to increase the temperature of the photosensitive chip at a low temperature.

16. The digital component according to claim 1, characterized in that: The digital back and the digital base are provided with a connection interface, and the digital back and the digital base are connected via the connection interface for signal transmission.

17. A camera, characterized in that: Comprising the digital component as claimed in any one of claims 1 to 16.

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