Semiconductor silicon wafer heating disc with temperature compensation function

Abstract

The utility model discloses a semiconductor silicon wafer heating plate with a temperature compensation function, which belongs to the technical field of semiconductors, solves the problem that the existing device can only heat the bottom of a semiconductor silicon wafer and is low in heating efficiency, and comprises a mounting plate, and a mounting groove is formed in the middle of the top surface of the mounting plate. A top cover is arranged above the mounting disc, a heating assembly is arranged between the mounting disc and the top cover, a threaded groove is formed in the cambered surface of the mounting disc, the bottom of a semiconductor silicon wafer placed in the heating cylinder can be heated through a heating wire, and heat generated by the heating wire can be conducted into a connecting ring through a heat conduction column; and then heat in the connecting ring is dissipated into the heating cylinder through the heat uniformizing holes, the purpose of heating the top of the semiconductor silicon wafer is achieved, heat generated by the heating wire can be prevented from being conducted into the mounting disc through the heat insulation plate, uniform heating of the semiconductor silicon wafer is facilitated, and the heating rate of the semiconductor silicon wafer can be increased.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and specifically relates to a semiconductor silicon wafer heating plate with a temperature compensation function. Background Technique

[0002] Semiconductors are special materials whose electrical conductivity is neither the same as that of conductors nor that of insulators. Due to this characteristic of semiconductors, they play an important role in the electronics industry and are widely used in the production of various electronic components and integrated circuits. During the production and processing of semiconductor silicon wafers, heating plates are required to heat them for subsequent processing.

[0003] After retrieval, in the application with the patent application number 202322573319.0, a new type of semiconductor heater is disclosed, which includes a heating plate upper cover. An upper installation cavity is opened at the upper end of the heating plate upper cover, and a lower installation cavity is opened at the lower end of the heating plate upper cover. An embedded plate is embedded in the upper installation cavity, and a heating plate lower cover is embedded in the lower installation cavity. An installation cavity is opened at the upper end of the heating plate lower cover, and a cooling pipe is embedded in the installation cavity. A heat insulation cover plate is embedded in the installation cavity, and the heat insulation cover plate is arranged above the cooling pipe. A heating wire is embedded in the heat insulation cover plate, and the heating wire is placed in the lower installation cavity. A pair of wiring terminals are arranged at both ends of the heating wire;

[0004] Although the local resistance is increased by arranging the heating wire in a wave shape in this new type of semiconductor heater, and more heat is generated locally under the same current, this new type of semiconductor heater can only heat the bottom of the semiconductor silicon wafer, resulting in low heating efficiency.

[0005] Therefore, we propose a semiconductor silicon wafer heating plate with a temperature compensation function. Content of the Utility Model

[0006] Aiming at the deficiencies of the prior art, the utility model provides a semiconductor silicon wafer heating plate with a temperature compensation function, which solves the problem that the existing device can only heat the bottom of the semiconductor silicon wafer, resulting in low heating efficiency.

[0007] To achieve the above objectives, the utility model is realized through the following technical solutions: A semiconductor silicon wafer heating plate with a temperature compensation function includes an installation plate, and an installation groove is opened in the middle of the top surface of the installation plate;

[0008] A top cover is arranged above the installation plate, a heating component is arranged between the installation plate and the top cover, and a threaded groove is opened on the arc surface of the installation plate;

[0009] The top cover includes a heating cylinder, heat - equalizing holes, and an annular connecting plate. The arc surface of the heating cylinder is provided with uniformly distributed heat - equalizing holes. The cross - section of the annular connecting plate is in an "L" shape. One end of the annular connecting plate is fixedly installed on the top end of the outer surface of the heating cylinder. The side wall at the bottom end of the annular connecting plate is provided with thread protrusions matching the thread grooves, and the annular connecting plate is thread - sleeved on the outer wall of the mounting plate.

[0010] Preferably, the heating component includes a heat - insulating plate, a heating wire, a heat - conducting column, and a connecting ring. The heat - insulating plate is movably sleeved inside the mounting groove. The diameter of the heat - insulating plate is the same as the diameter of the mounting groove. In the middle of the top surface of the heat - insulating plate, a heating wire electrically connected to a power source through a wire is fixedly installed. The heating wire is in a spiral shape. When the heating wire is energized, heat is generated. The heat - insulating plate can prevent the heat generated by the heating wire from being conducted to the mounting plate.

[0011] Preferably, the top surface of the heat - insulating plate is fixedly installed with heat - conducting columns distributed in an annular array. The top ends of the heat - conducting columns are fixedly installed with a connecting ring. Through the heat - conducting columns, the heat generated by the heating wire can be conducted to the connecting ring.

[0012] Preferably, both the heat - conducting columns and the connecting ring are made of pure copper. The heat - conducting columns and the connecting ring are both movably sleeved between the annular connecting plate and the heating cylinder. The bottom surface of the heating cylinder is in contact with the top end of the heating wire. Pure copper has extremely strong heat conductivity. The heat in the connecting ring can be dissipated through the heat - equalizing holes, and then the top end of the semiconductor silicon wafer placed inside the heating cylinder is heated. The heating cylinder can limit the heating wire, and then the heating component is limited and fixed inside the mounting groove.

[0013] Preferably, the bottom surface of the mounting plate is fixedly installed with a bottom plate. The top surface of the bottom plate is provided with fixing holes distributed in an annular array. The bottom surface of the bottom plate is bonded with an anti - slip pad. By using bolts to pass through the fixing holes, the bottom plate can be fixed at a specific position, which is convenient for fixing this heating plate.

[0014] The utility model provides a semiconductor silicon wafer heating plate with a temperature compensation function, having the following beneficial effects:

[0015] 1. The semiconductor silicon wafer heating plate with temperature compensation function can heat the bottom of the semiconductor silicon wafer placed inside the heating cylinder through the heating wire, and the heat generated by the heating wire will be conducted to the connecting ring by the heat conducting column. Then, the heat in the connecting ring is dissipated into the inside of the heating cylinder through the heat equalizing holes, achieving the purpose of heating the top of the semiconductor silicon wafer. The heat insulating plate can prevent the heat generated by the heating wire from being conducted to the mounting plate, avoiding waste of heat, facilitating uniform heating of the semiconductor silicon wafer, and also improving the heating rate of the semiconductor silicon wafer. Through the threaded sleeve setting of the annular connecting plate and the mounting plate, it is convenient to disassemble the top cover for replacing or repairing the heating component. Through the setting that the heating cylinder is in contact with the top end of the heating wire, the heating cylinder can limit and fix the heating component inside the mounting groove, solving the problem that the existing device can only heat the bottom of the semiconductor silicon wafer with low heating efficiency;

[0016] 2. For the semiconductor silicon wafer heating plate with temperature compensation function, the bottom plate can be fixed at a specific position by passing bolts through the fixing holes, facilitating the fixing of this heating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a structural schematic diagram of the present utility model;

[0018] Figure 2 is a sectional structural schematic diagram of the present utility model;

[0019] Figure 3 is a disassembled structural schematic diagram of the present utility model;

[0020] Figure 4 is a structural schematic diagram of the top cover of the present utility model.

[0021] In the figure: 1. Mounting plate; 11. Mounting groove; 12. Threaded groove; 13. Bottom plate; 14. Fixing hole; 2. Heating component; 21. Heat insulating plate; 22. Heating wire; 23. Heat conducting column; 24. Connecting ring; 3. Top cover; 31. Heating cylinder; 32. Heat equalizing hole; 33. Annular connecting plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Embodiment 1:

[0024] As Figures 1-4As shown in the figure: It includes an installation disk 1. In the middle of the top surface of the installation disk 1, there is an installation groove 11. Above the installation disk 1, there is a top cover 3. Between the installation disk 1 and the top cover 3, there is a heating component 2. On the arc surface of the installation disk 1, there are threaded grooves 12. The top cover 3 includes a heating cylinder 31, heat - equalizing holes 32, and an annular connecting plate 33. On the arc surface of the heating cylinder 31, there are evenly - distributed heat - equalizing holes 32. The cross - section of the annular connecting plate 33 is in an "L" shape. One end of the annular connecting plate 33 is fixedly installed at the top end of the outer surface of the heating cylinder 31. On the side wall of the bottom end of the annular connecting plate 33, there are threaded protrusions matching the threaded grooves 12. The annular connecting plate 33 is threadedly sleeved on the outer wall of the installation disk 1. The heating component 2 includes a heat - insulating plate 21, a heating wire 22, a heat - conducting column 23, and a connecting ring 24. The heat - insulating plate 21 is movably sleeved inside the installation groove 11. The diameter of the heat - insulating plate 21 is the same as the diameter of the installation groove 11. In the middle of the top surface of the heat - insulating plate 21, there is a heating wire 22 electrically connected to a power source through a wire. The heating wire 22 is in a spiral shape. On the top surface of the heat - insulating plate 21, there are heat - conducting columns 23 arranged in an annular array. The top ends of the heat - conducting columns 23 are fixedly installed with a connecting ring 24. Both the heat - conducting columns 23 and the connecting ring 24 are made of pure copper. Both the heat - conducting columns 23 and the connecting ring 24 are movably sleeved between the annular connecting plate 33 and the heating cylinder 31. The bottom surface of the heating cylinder 31 is in contact with the top end of the heating wire 22. Through the heating wire 22, the bottom of the semiconductor silicon wafer placed inside the heating cylinder 31 can be heated. And the heat generated by the heating wire 22 will be conducted by the heat - conducting columns 23 to the connecting ring 24. Then the heat in the connecting ring 24 is dissipated into the interior of the heating cylinder 31 through the heat - equalizing holes 32, achieving the purpose of heating the top of the semiconductor silicon wafer. Through the heat - insulating plate 21, the heat generated by the heating wire 22 can be prevented from being conducted into the installation disk 1, avoiding waste of heat, being beneficial to making the semiconductor silicon wafer evenly heated, and also improving the heating rate of the semiconductor silicon wafer. Through the threaded - sleeved setting of the annular connecting plate 33 and the installation disk 1, it is convenient to disassemble the top cover 3, so as to replace or repair the heating component 2. Through the setting that the heating cylinder 31 is in contact with the top end of the heating wire 22, the heating cylinder 31 can limit and fix the heating component 2 inside the installation groove 11;

[0025] Embodiment 2:

[0026] As Figures 1-3 shown: On the bottom surface of the installation disk 1, there is a bottom plate 13 fixedly installed. On the top surface of the bottom plate 13, there are fixing holes 14 arranged in an annular array. On the bottom surface of the bottom plate 13, there is an anti - slip pad adhered. By passing bolts through the fixing holes 14, the bottom plate 13 can be fixed at a specific position, facilitating the fixation of this heating disk.

[0027] Working principle and usage process of the present utility model: For this semiconductor silicon wafer heating plate with temperature compensation function, during use, the heating wire 22 is electrified, and then the semiconductor silicon wafer is placed into the heating cylinder 31. Then, the bottom of the semiconductor silicon wafer inside the heating cylinder 31 can be heated through the heating wire 22. During this process, the heat generated by the heating wire 22 will be conducted by the heat conducting column 23 to the connecting ring 24. Subsequently, the heat in the connecting ring 24 is dissipated into the interior of the heating cylinder 31 through the heat equalizing holes 32, and then the top of the semiconductor silicon wafer is heated. Through the threaded sleeve arrangement of the annular connecting plate 33 and the mounting plate 1, it is convenient to disassemble the top cover 3, so as to replace or repair the heating component 2. Moreover, the heating cylinder 31 is in contact with the top end of the heating wire 22, and the heating component 2 can be limited and fixed inside the mounting groove 11 through the heating cylinder 31.

[0028] The above shows and describes the basic principles, main features and advantages of the present utility model. For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0029] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor silicon wafer heating plate with a temperature compensation function, comprising a mounting plate (1), wherein a mounting groove (11) is provided in the middle of the top surface of the mounting plate (1); Features: A top cover (3) is arranged above the mounting plate (1), a heating component (2) is arranged between the mounting plate (1) and the top cover (3), and a threaded groove (12) is provided on the arc surface of the mounting plate (1); The top cover (3) comprises a heating tube (31), uniformly distributed uniformly distributed holes (32) and an annular connecting plate (33); the arc surface of the heating tube (31) is provided with uniformly distributed holes (32); the cross section of the annular connecting plate (33) is in an "L" shape; one end of the annular connecting plate (33) is fixedly mounted on the top end of the outer surface of the heating tube (31); a threaded protrusion matching the threaded groove (12) is disposed on the side wall of the bottom end of the annular connecting plate (33); and the annular connecting plate (33) is threadedly mounted on the outer wall of the mounting plate (1).

2. The semiconductor silicon wafer heating plate with temperature compensation function according to claim 1, characterized in that: The heating assembly (2) comprises a heat insulation board (21), a heating wire (22), a heat-conducting column (23) and a connecting ring (24); the heat insulation board (21) is movably mounted inside the mounting groove (11); the diameter of the heat insulation board (21) is the same as the diameter of the mounting groove (11); a heating wire (22) connected to a power source via a wire is fixedly mounted in the middle of the top surface of the heat insulation board (21); the heating wire (22) is in a spiral shape.

3. The semiconductor silicon wafer heating plate with temperature compensation function according to claim 2, characterized in that: Heat-conducting columns (23) distributed in a ring array are fixedly mounted on the top surface of the heat-insulating plate (21), and a connecting ring (24) is fixedly mounted on the top end of the heat-conducting columns (23).

4. The semiconductor silicon wafer heating plate with temperature compensation function according to claim 3, characterized in that: The heat-conducting column (23) and the connecting ring (24) are both made of pure copper. The heat-conducting column (23) and the connecting ring (24) are movably mounted between the annular connecting plate (33) and the heating tube (31). The bottom surface of the heating tube (31) is in contact with the top of the heating wire (22).

5. The semiconductor silicon wafer heating plate with temperature compensation function according to claim 1, characterized in that: A bottom plate (13) is fixedly mounted on the bottom surface of the mounting plate (1), fixing holes (14) distributed in a circular array are provided on the top surface of the bottom plate (13), and an anti-slip pad is bonded to the bottom surface of the bottom plate (13).

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