Etching device for manufacturing super-thick copper circuit board
By introducing rotating components and mechanical vibration structures into the etching device, the problems of uneven concentration of etching liquid and poor etching effect in traditional etching devices are solved, and a more uniform and efficient etching process is achieved, reducing costs.
Patent Information
- Application Number
- CN202422018735.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-19
AI Technical Summary
In traditional etching devices, the uneven concentration distribution of the etching liquid leads to inconsistent etching speed and depth, affecting the performance and reliability of the circuit board; at the same time, the etching liquid in the stationary state does not contact the circuit board sufficiently, resulting in poor etching effect.
An etching device made of an ultra-thick copper circuit board is designed. The device drives the stirring plate to rotate by rotating components to prevent the etching liquid from precipitating, and the circuit board is vibrating and etched through a mechanical structure to improve the etching effect.
The uniform mixing of the etching liquid is achieved, the uniformity and efficiency of etching are improved, the use of power plants is reduced, and the production cost is reduced.
Smart Images
Figure CN223024685U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of circuit board manufacturing, and specifically relates to an etching device for manufacturing ultra-thick copper circuit boards. Background Art
[0002] Printed circuit boards, abbreviated as PCBs and also known as printed boards, are one of the important components of electronic products. In today's highly informationized society, electronic devices are everywhere, and as a key component of electronic devices, the performance and quality of circuit boards directly affect the overall performance of electronic devices. Due to their unique advantages, such as excellent electrical conductivity, good heat dissipation ability, and strong load-bearing strength, the demand for ultra-thick copper circuit boards is increasing day by day in fields such as high-performance computers, communication base stations, and industrial control.
[0003] However, the production of ultra-thick copper circuit boards is not easy. Among them, the etching process is a crucial link but faces many problems. In traditional etching devices, during long-term use, due to their chemical and physical properties, the etching liquid is prone to precipitation. This precipitation will cause uneven concentration distribution of the etching liquid. The concentration of the etching liquid near the precipitation area is relatively high, while the concentration of the etching liquid far from the precipitation area is relatively low. When the circuit board comes into contact with such uneven etching liquid, it will result in inconsistent etching speed and etching depth. Some areas may be damaged due to over-etching of the circuit structure, affecting the performance and reliability of the circuit board; while other areas may have insufficient etching and excessive copper material residues, leading to poor circuit conduction and seriously reducing the quality and qualification rate of the product.
[0004] At the same time, in traditional etching devices, the circuit board is usually in a relatively static state during the etching process, which makes the contact between the etching liquid and the surface of the circuit board insufficient and uneven. The etching liquid cannot effectively penetrate into all corners of the circuit board, resulting in poor etching effects. Moreover, due to the lack of dynamic interaction, the rate of the etching reaction is also limited, prolonging the production cycle and increasing production costs.
[0005] Secondly, in the prior art, by adding a power assembly such as a vibration motor to drive the circuit board to vibrate, but this way of adding a power device not only increases the cost but also makes subsequent maintenance inconvenient.
[0006] Therefore, we have proposed an etching device for manufacturing ultra-thick copper circuit boards. This device can not only make the etching liquid mix evenly, but also vibrate and etch the circuit board through a mechanical structure, improve the quality of the circuit board, and at the same time reduce the use of power devices and save costs. Content of the Utility Model
[0007] The purpose of this utility model is to provide an etching device for manufacturing ultra-thick copper circuit boards. This device can not only make the etching solution mix evenly, but also vibrate and etch the circuit board through a mechanical structure, improving the quality of the circuit board while reducing the use of power devices and saving costs.
[0008] The technical solution adopted by this utility model is as follows:
[0009] An etching device for manufacturing ultra-thick copper circuit boards includes support legs and a bearing cylinder arranged on the top of the support legs for carrying etching liquid. A rotating component is arranged on the bearing cylinder, and eight stirring plates are arranged on the rotating component. A first magnetic surface is arranged on one of the stirring plates;
[0010] Eight through holes are opened on the bearing cylinder. A moving component is arranged inside each through hole. A connecting rod is arranged on the moving component. A connecting disk is installed at the top of the connecting rod. A connecting plate is arranged on the connecting rod. Four moving holes are opened on the connecting plate. An elastic component is movably arranged inside each moving hole. A bearing housing for carrying the circuit board is arranged on the elastic component. A magnetic plate that repels the first magnetic surface is arranged at the bottom of the bearing housing;
[0011] A support is arranged outside the bearing cylinder. A telescopic component connected to the connecting disk is arranged on the support.
[0012] Furthermore, a liquid inlet pipe and a liquid discharge pipe are arranged on the bearing cylinder.
[0013] Furthermore, the moving component includes a first spring arranged inside the through hole. A piston disk is arranged at the top of the first spring. The top of the piston disk is connected to the connecting rod.
[0014] Furthermore, the rotating component includes a stepping motor arranged at the bottom of the bearing cylinder. The output end of the stepping motor is provided with a rotating shaft located inside the bearing cylinder. The stirring plates are arranged on the outside of the rotating shaft.
[0015] Furthermore, the elastic component includes a movable rod movably arranged inside the moving hole. A limiting disk is arranged at the top of the movable rod. The bottom of the movable rod is connected to the bearing housing. A second spring is sleeved on the movable rod between the limiting disk and the connecting plate.
[0016] Furthermore, the telescopic component includes an electric telescopic rod arranged on the support. The telescopic end of the electric telescopic rod is connected to the connecting disk.
[0017] The technical effects achieved by this utility model are:
[0018] When the circuit board needs to be etched, first, the etching liquid is put into the inside of the carrier cylinder, and then the circuit boards to be etched are respectively put into eight carrier shells. Then, the telescopic assembly drives the connecting plate to move downward. When the connecting plate moves, it drives eight connecting rods, and the eight connecting plates drive the carrier shells into the inside of the carrier cylinder, so as to etch the circuit board. When etching, in order to prevent the etching liquid from precipitating, the rotating assembly drives eight stirring plates to rotate, so as to effectively prevent the etching liquid from precipitating. At the same time, when the stirring plates rotate, the first magnetic surface on one of the stirring plates respectively corresponds to the magnetic plates at the bottoms of the eight carrier shells to generate repulsive forces. These repulsive forces cause the carrier shells to move through the elastic assembly, and then the elastic potential energy of the elastic assembly makes the carrier shells vibrate up and down, so as to improve the etching effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a schematic structural diagram of the whole of the present utility model;
[0020] Figure 2 is a schematic structural diagram when the present utility model is etching;
[0021] Figure 3 is an exploded view of the present utility model;
[0022] Figure 4 is a schematic structural diagram of the carrier shell of the present utility model.
[0023] In the drawings, the list of components represented by each reference numeral is as follows:
[0024] 1, support leg; 2, carrier cylinder; 3, stirring plate; 4, through hole; 5, connecting rod; 6, connecting plate; 7, connecting plate; 8, carrier shell; 9, magnetic plate; 10, bracket; 11, first spring; 12, piston disk; 13, stepping motor; 14, movable rod; 15, second spring; 16, electric telescopic rod. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0025] In order to make the purpose and advantages of the present utility model more clear, the following specifically describes the present utility model in conjunction with embodiments. It should be understood that the following text only describes one or several specific implementation manners of the present utility model, and does not strictly limit the scope of protection specifically claimed by the present utility model.
[0026] As Figures 1-4 shown, the technical solution adopted by the present utility model is specifically as follows: An etching device for manufacturing a super-thick copper circuit board includes a support leg 1 and a carrier cylinder 2 provided on the top of the support leg 1 for carrying the etching liquid. A rotating assembly is provided on the carrier cylinder 2, and eight stirring plates 3 are provided on the rotating assembly. A first magnetic surface is provided on one of the stirring plates 3;
[0027] Eight through holes 4 are provided on the carrier cylinder 2, a moving component is arranged inside each through hole 4, a connecting rod 5 is arranged on the moving component, a connecting plate 6 is installed at the top of the connecting rod 5, and a connecting plate 7 is arranged on the connecting rod 5. Four moving holes are provided on the connecting plate 7, and an elastic component is movably arranged inside each moving hole. A carrier housing 8 for carrying a circuit board is arranged on the elastic component, and a magnetic plate 9 that repels the first magnetic surface is arranged at the bottom of the carrier housing 8;
[0028] A bracket 10 is arranged on the outside of the carrier cylinder 2, and a telescopic component connected to the connecting plate 6 is arranged on the bracket 10.
[0029] The working principle is as follows: When etching a circuit board, first put the etching liquid into the carrier cylinder 2, then put the circuit boards to be etched into the eight carrier housings 8 respectively, and then drive the connecting plate 6 to move downward through the telescopic component. The movement of the connecting plate 6 drives the eight connecting rods 5 to drive the eight connecting plates 7 to drive the carrier housings 8 into the carrier cylinder 2, so as to etch the circuit board. In order to prevent the etching liquid from precipitating during etching, the eight stirring plates 3 are driven to rotate through the rotating component, so as to effectively prevent the etching liquid from precipitating. At the same time, when the stirring plate 3 rotates, the first magnetic surface on one of the stirring plates 3 respectively corresponds to the magnetic plates 9 at the bottoms of the eight carrier housings 8 to generate repulsive forces. These repulsive forces cause the carrier housings 8 to move through the elastic components, and then the elastic potential energy of the elastic components makes the carrier housings 8 vibrate up and down, so as to improve the etching effect.
[0030] Among them, a liquid inlet pipe and a liquid discharge pipe (not marked in the figure) are arranged on the carrier cylinder 2. The etching liquid enters the carrier cylinder 2 through the liquid inlet pipe, and the waste liquid is discharged through the liquid discharge pipe.
[0031] At the same time, the moving component includes a first spring 11 arranged inside the through hole 4. A piston disc 12 is arranged at the top of the first spring 11, and the top of the piston disc 12 is connected to the connecting rod 5. When the connecting rod 5 moves, it drives the piston disc 12 to squeeze the first spring 11 inside the through hole 4, so that the carrier housing 8 enters the carrier cylinder 2 for etching.
[0032] The rotating component includes a stepping motor 13 arranged at the bottom of the carrier cylinder 2. The output end of the stepping motor 13 is provided with a rotating shaft located inside the carrier cylinder 2. Stirring plates 3 are arranged on the outside of the rotating shaft. The stepping motor 13 drives the rotating shaft to make the stirring plates 3 rotate, so as to effectively prevent the etching liquid from precipitating.
[0033] The elastic component includes a movable rod 14 movably arranged inside the moving hole. A limit disc is arranged at the top of the movable rod 14, the bottom of the movable rod 14 is connected to the carrier housing 8, and a second spring 15 located between the limit disc and the connecting plate 7 is sleeved on the movable rod 14.
[0034] When a repulsive force is generated between the first magnetic surface and the magnetic block (i.e., the magnetic plate 9 at the bottom of the carrier housing 8), the carrier housing 8 is subjected to an upward thrust, driving the movable rod 14 to move on the movable hole. During this process, the second spring 15 is stretched, storing elastic potential energy. As the stirring plate 3 rotates, the relative position between the first magnetic surface and the magnetic block changes, and the repulsive force gradually decreases until it disappears. At this time, the carrier housing 8 begins to move downward under the action of gravity, while compressing the second spring 15. When the second spring 15 is compressed to a certain extent, the elastic potential energy stored in it begins to be released, generating vibrations. The vibrations of the second spring 15 are transmitted to the carrier housing 8 through the movable rod 14, causing the carrier housing 8 to vibrate up and down in the etching liquid. This kind of vibration helps the etchant to be more evenly distributed on the surface of the circuit board, improving the etching effect. As the stirring plate 3 continues to rotate, the repulsive force between the first magnetic surface and the magnetic block will periodically generate and disappear, thereby driving the carrier housing 8 to vibrate in a cyclic manner. This dynamic etching method helps to overcome the deficiencies in traditional static etching methods and improve the uniformity and efficiency of etching.
[0035] Each surface of the carrier housing 8 is provided with a through hole, through which the etching liquid can enter the interior of the carrier housing 8.
[0036] The telescopic assembly includes an electric telescopic rod 16 arranged on the bracket 10. The telescopic end of the electric telescopic rod 16 is connected to the connecting disc 6, and the connecting disc 6 is driven to move downward by the electric telescopic rod 16.
[0037] The working principle of this utility model is as follows: When etching a circuit board is required, first put the etching liquid into the carrier cylinder 2, then place the circuit boards to be etched into the eight carrier housings 8 respectively, and then drive the connecting disc 6 to move downward through the telescopic assembly. The movement of the connecting disc 6 drives the eight connecting rods 5, and the eight connecting plates 7 drive the carrier housings 8 into the carrier cylinder 2, thereby etching the circuit board. When etching, in order to prevent the etching liquid from precipitating, the eight stirring plates 3 are driven to rotate through the rotating assembly, effectively preventing the etching liquid from precipitating. At the same time, when the stirring plate 3 rotates, a repulsive force is generated between the first magnetic surface on one of the stirring plates 3 and the magnetic plates 9 at the bottoms of the eight carrier housings 8 respectively. This repulsive force causes the carrier housing 8 to move through the elastic assembly, and then the elastic potential energy of the elastic assembly makes the carrier housing 8 vibrate up and down, thereby improving the etching effect.
[0038] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present utility model. The structures, devices, and operation methods not specifically described and explained in the present utility model are implemented according to the conventional means in the art without special description and limitation.
Claims
1. An etching device for manufacturing an ultra-thick copper circuit board, comprising a support leg (1) and a carrying cylinder (2) arranged on the top of the support leg (1) for carrying etching liquid, characterized in that: The bearing cylinder (2) is provided with a rotating assembly, and the rotating assembly is provided with eight stirring plates (3), and one of the stirring plates (3) is provided with a first magnetic surface; The bearing cylinder (2) is provided with eight through holes (4), each of the through holes (4) is provided with a moving component, the moving component is provided with a connecting rod (5), a connecting plate (6) is installed on the top of the connecting rod (5), and a connecting plate (7) is provided on the connecting rod (5), the connecting plate (7) is provided with four movable holes, each of the movable holes is provided with an elastic component movably, a bearing shell (8) for bearing the circuit board is provided on the elastic component, and a magnetic plate (9) that repels the first magnetic surface is provided at the bottom of the bearing shell (8); A bracket (10) is arranged outside the bearing tube (2), and a telescopic component connected to the connecting plate (6) is arranged on the bracket (10).
2. The etching device for manufacturing an ultra-thick copper circuit board according to claim 1, characterized in that: The supporting cylinder (2) is provided with a liquid inlet pipe and a liquid outlet pipe.
3. The etching device for manufacturing an ultra-thick copper circuit board according to claim 1, characterized in that: The moving assembly comprises a first spring (11) arranged inside the through hole (4), a piston disc (12) is arranged on the top of the first spring (11), and the top of the piston disc (12) is connected to the connecting rod (5).
4. The etching device for manufacturing an ultra-thick copper circuit board according to claim 1, characterized in that: The rotating assembly comprises a stepper motor (13) arranged at the bottom of the supporting cylinder (2), the output end of the stepper motor (13) is provided with a rotating shaft located inside the supporting cylinder (2), and the stirring plate (3) is arranged outside the rotating shaft.
5. The etching device for manufacturing an ultra-thick copper circuit board according to claim 1, characterized in that: The elastic component comprises a movable rod (14) movably arranged inside the movable hole, a limiting plate is arranged on the top of the movable rod (14), the bottom of the movable rod (14) is connected to the bearing shell (8), and a second spring (15) is sleeved on the movable rod (14) and located between the limiting plate and the connecting plate (7).
6. The etching device for manufacturing an ultra-thick copper circuit board according to claim 1, characterized in that: The telescopic assembly comprises an electric telescopic rod (16) arranged on the bracket (10), and the telescopic end of the electric telescopic rod (16) is connected to the connecting plate (6).