Secure connection device for network equipment
By setting a partition in the housing of the network equipment and using a semiconductor refrigeration sheet, the problems of low heat dissipation efficiency and dust in the prior art are solved, and more efficient heat dissipation and more stable network connection are achieved.
Patent Information
- Application Number
- CN202421431602.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-06-21
AI Technical Summary
The existing network equipment security connection devices have weak heat dissipation methods, poor heat dissipation efficiency, and are easy to introduce dust, affecting the working efficiency and stability of the components.
By setting a partition in the housing to separate it into a working chamber and a heat dissipation chamber, a semiconductor refrigeration sheet is used to dissipate heat under the chip, and heat convection heat dissipation is performed in the heat dissipation chamber through a heat dissipation assembly, combining thermal conductivity and sealing gasket to improve heat conduction and heat insulation.
It effectively improves the heat dissipation efficiency of the chip, avoids dust entering, extends the working life of the components, and improves the stability of network connections.
Smart Images
Figure CN223024698U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of network device connection, in particular to a network device secure connection device. Background Art
[0002] Common network interconnection devices include repeaters, hubs, bridges, network switches, routers and gateways; these devices are generally composed of chips, memories, interfaces, etc. These network connection devices generally work 24 hours a day, and the long-term operation causes a large amount of heat to accumulate in the chips. If heat dissipation treatment is not carried out in time, the stability and security of network connection will be affected.
[0003] In order to dissipate heat, existing network device secure connection devices mostly directly open several heat dissipation holes on the shell or are internally provided with fans to promote the air convection speed and improve the heat dissipation efficiency; however, since the chips are the main heat accumulation components, the heat dissipation of this method has poor pertinence, the heat dissipation efficiency is not good, and the convective air carries dust into the shell, which will also affect the working efficiency and stability of the components inside the shell after long-term operation. Summary of the Utility Model
[0004] I. Technical Problems to be Solved
[0005] The technical problem to be solved by the utility model is that direct heat dissipation through heat dissipation holes and forced heat dissipation by heat dissipation holes in cooperation with fans have poor heat dissipation pertinence, poor heat dissipation efficiency, and will introduce dust, thereby affecting the operation of components.
[0006] II. Technical Solutions
[0007] To solve the above technical problems, the technical solution provided by the utility model is: a network device secure connection device, including a shell and a chip connected inside the shell, a heat-insulating partition is connected in the middle of the shell, the partition divides the shell into a working chamber and a heat dissipation chamber, a through hole is opened under the chip on the partition, a semiconductor refrigeration sheet is hermetically connected in the through hole, the cold end of the semiconductor refrigeration sheet passes through the through hole and abuts against the chip at the end, the hot end of the semiconductor refrigeration sheet extends into the heat dissipation chamber and is connected with a heat dissipation component at the end, and a plurality of interfaces are connected on one side of the working chamber of the shell.
[0008] Furthermore, a sealing gasket with heat insulation function is connected in the circumferential direction of the semiconductor refrigeration sheet in the through hole to avoid heat exchange between the working chamber and the heat dissipation chamber, thereby improving the refrigeration efficiency of the working chamber where the chip is located.
[0009] Furthermore, thermal conductive grease is respectively provided between the cold end of the thermoelectric cooler and the chip, and between the hot end of the thermoelectric cooler and the heat dissipation component. The arrangement of the thermal conductive grease facilitates increasing the contact area between the cold end of the thermoelectric cooler and the chip, and between the hot end of the thermoelectric cooler and the heat dissipation component, and improving the heat conduction efficiency between them.
[0010] Furthermore, the heat dissipation component includes a main heat conducting plate connected to the hot end of the thermoelectric cooler. A plurality of heat dissipation fins are connected to the main heat conducting plate. The heat dissipation fins are arranged parallel to each other. A plurality of air inlet holes and a plurality of air outlet holes are respectively connected to both sides of the heat dissipation fins at the bottom wall of the heat dissipation cavity. An air inlet fan is connected to one side of the heat dissipation cavity where the air inlet holes are located, and an air outlet fan is connected to one side of the heat dissipation cavity where the air outlet holes are located. The hot end of the thermoelectric cooler conducts heat to the main heat conducting plate, and then the heat is dispersed through the heat dissipation fins, which facilitates increasing the contact area between the heat dissipation component and the air and facilitating heat radiation. By starting the air inlet fan and the air outlet fan, it is further convenient to increase the air flow rate in the heat dissipation cavity, and further improve the heat convection speed.
[0011] Furthermore, the interface is electrically connected to the chip.
[0012] Furthermore, support columns are respectively connected to the four corners of the bottom end of the housing. Rubber - material foot pads are connected to the bottom ends of the support columns, and anti - slip patterns are connected to the bottom ends of the foot pads. The combined setting of the support columns and the foot pads facilitates increasing the gap between the bottom wall of the housing and the ground, and making it more convenient for air to flow in and out smoothly.
[0013] III. Beneficial Effects
[0014] The advantages of the present utility model compared with the prior art are as follows:
[0015] Through the combined setting of the housing, the chip, the partition board, the through - holes, the thermoelectric cooler, and the interface, it is convenient to divide the housing into a working cavity and a heat dissipation cavity by the partition board. The working cavity is relatively independent, which can prevent dust from directly entering and avoid dust accumulation from affecting the working performance. Then, the cold end of the thermoelectric cooler cools the chip in the working cavity, and the hot end of the thermoelectric cooler dissipates heat in the heat dissipation cavity through the heat dissipation component by means of heat convection, thereby avoiding heat accumulation of the chip due to long - term operation and affecting the stability of network connection. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic structural view of a network device secure connection device of the present utility model Figure 1 .
[0017] Figure 2 is a schematic structural view of a network device secure connection device of the present utility model Figure 2 .
[0018] Figure 3 It is a schematic side-sectional structure diagram of a network device security connection device of the present utility model.
[0019] Figure 4 It is a schematic main-sectional structure diagram of a network device security connection device of the present utility model.
[0020] As shown in the figure: 1. Housing, 2. Chip, 3. Partition board, 4. Working chamber, 5. Heat dissipation chamber, 6. Through hole, 7. Thermoelectric cooler, 8. Interface, 9. Sealing gasket, 10. Thermal conductive silicone grease, 11. Main heat conduction plate, 12. Heat dissipation fins, 13. Air inlet hole, 14. Air outlet hole, 15. Inlet fan, 16. Exhaust fan, 17. Support column, 18. Foot pad. Specific implementation manner
[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments; based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0022] Embodiment 1
[0023] Combined with the attached Figure 1 , Figure 2 , Figure 3 and Figure 4 , a network device security connection device includes a housing 1 and a chip 2 connected inside the housing 1. An insulating partition board 3 is connected in the middle of the housing 1. The partition board 3 divides the housing 1 into a working chamber 4 and a heat dissipation chamber 5. The partition board 3 is provided with a through hole 6 below the chip 2. A thermoelectric cooler 7 is hermetically connected in the through hole 6. A sealing gasket 9 with an adiabatic function is connected circumferentially to the through hole 6 around the thermoelectric cooler 7. The cold end of the thermoelectric cooler 7 passes through the through hole 6 and abuts against the chip 2 at the end. The hot end of the thermoelectric cooler 7 extends into the heat dissipation chamber 5 and is connected with a heat dissipation component at the end. The heat dissipation component includes a main heat conduction plate 11 connected to the hot end of the thermoelectric cooler 7. A plurality of heat dissipation fins 12 are connected to the main heat conduction plate 11. The heat dissipation fins 12 are arranged parallel to each other. A plurality of air inlet holes 13 and a plurality of air outlet holes 14 are respectively connected to both sides of the heat dissipation fins 12 on the bottom wall of the heat dissipation chamber 5. An inlet fan 15 is connected to one side of the heat dissipation chamber 5 where the air inlet hole 13 is located. An exhaust fan 16 is connected to one side of the heat dissipation chamber 5 where the air outlet hole 14 is located. Thermal conductive silicone grease 10 is respectively provided between the cold end of the thermoelectric cooler 7 and the chip 2 and between the hot end of the thermoelectric cooler 7 and the heat dissipation component. A plurality of interfaces 8 are connected to one side of the housing 1 in the working chamber 4. The interfaces 8 are electrically connected to the chip 2.
[0024] Through the cooperative setting of the housing 1, the chip 2, the partition 3, the semiconductor refrigeration sheet 7 and the heat dissipation component in the above structure, the chip 2 is arranged in the working cavity, and it is difficult for dust to enter. Moreover, the cold end of the semiconductor refrigeration sheet 7 can be used to dissipate heat from the chip 2, avoiding the overheating of the chip 2 during long-term operation and affecting the safety and stability of the network connection. And the heat dissipation component diffuses the heat at the hot end of the semiconductor refrigeration sheet 7 to facilitate its continuous operation.
[0025] Embodiment 2
[0026] On the basis of Embodiment 1, in combination with the attached Figure 1 , support columns 17 are respectively connected and arranged at the four corners of the bottom end of the housing 1. Anti-slip pads 18 made of rubber are connected to the bottom ends of the support columns 17, and anti-slip patterns are connected to the bottom ends of the anti-slip pads 18.
[0027] Through the setting of the support columns 17 and the anti-slip pads 18 in the above structure, it is convenient to provide conditions for the heat dissipation of the heat dissipation component and facilitate the introduction and export of air.
[0028] The specific usage method is as follows:
[0029] Through the cooperative setting of the housing 1, the chip 2, the partition 3, the through hole 6, the semiconductor refrigeration sheet 7 and the interface 8, it is convenient to separate the housing 1 into a working cavity 4 and a heat dissipation cavity 5 by the partition 3. Then, through the setting of the semiconductor refrigeration sheet 7 passing through the through hole 6 and the gasket 9, the heat exchange between the working cavity 4 and the heat dissipation cavity 5 is avoided;
[0030] Through the setting of the thermal conductive silicone grease 10, it is convenient to increase the contact area between the cold end of the semiconductor refrigeration sheet 7 and the chip 2 and between the hot end of the semiconductor refrigeration sheet 7 and the heat dissipation component, and improve the heat conduction efficiency between them; the cold end of the semiconductor refrigeration sheet 7 cools the chip 2 in the working cavity 4, and the hot end of the semiconductor refrigeration sheet 7 conducts the heat to the main heat conducting plate 11, and then it is dispersed by the heat dissipation fins 12, which is convenient to increase the contact area between the heat dissipation component and the air and facilitate heat radiation. By starting the intake fan 15 and the exhaust fan 16, it is further convenient to increase the air flow rate in the heat dissipation cavity 5, and then improve the heat convection speed, and further avoid the heat accumulation of the chip 2 due to long-term operation and affect the stability of the network connection;
[0031] Through the cooperative setting of the support columns 17 and the anti-slip pads 18, it is convenient to increase the gap between the bottom wall of the housing 1 and the ground, avoid being blocked by the ground, and facilitate the air to flow into the air intake hole 13 and be exported from the air exhaust hole 14 more smoothly.
[0032] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.
[0033] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
[0034] The above description of the present utility model and its embodiments is not restrictive. What is shown in the drawings is only one of the embodiments of the present utility model, and the actual structure is not limited thereto. In short, if those of ordinary skill in the art are inspired by it and, without departing from the purpose of the creation of the present utility model, design similar structural modes and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the present utility model.
Claims
1. A network device secure connection device, comprising a housing (1) and a chip (2) connected to the housing (1), characterized in that: A heat-insulating partition (3) is connected to the middle of the shell (1), and the partition (3) divides the shell (1) into a working chamber (4) and a heat dissipation chamber (5). The partition (3) is provided with a through hole (6) below the chip (2), and a semiconductor cooling plate (7) is sealed and connected in the through hole (6). The cold end of the semiconductor cooling plate (7) passes through the through hole (6) and abuts against the chip (2) at the end, and the hot end of the semiconductor cooling plate (7) extends into the heat dissipation chamber (5) and is connected to a heat dissipation component at the end. The shell (1) is connected to a plurality of interfaces (8) on one side of the working chamber (4).
2. A network device secure connection device according to claim 1, characterized in that: The through hole (6) is circumferentially connected to the semiconductor cooling plate (7) and is provided with a sealing gasket (9) having a heat insulating function.
3. A network device secure connection device according to claim 1, characterized in that: Thermally conductive silicone grease (10) is provided between the cold end of the semiconductor refrigeration sheet (7) and the chip (2), and between the hot end of the semiconductor refrigeration sheet (7) and the heat dissipation component.
4. A network device secure connection device according to claim 1, characterized in that: The heat dissipation component comprises a main heat dissipation plate (11) connected to the hot end of the semiconductor refrigeration plate (7), the main heat dissipation plate (11) is connected to a plurality of heat dissipation fins (12), the heat dissipation fins (12) are arranged parallel to each other, the bottom wall of the heat dissipation cavity (5) is respectively connected to a plurality of air inlet holes (13) and a plurality of air exhaust holes (14) on both sides of the heat dissipation fins (12), the heat dissipation cavity (5) is connected to an air inlet fan (15) on one side of the air inlet hole (13), and the heat dissipation cavity (5) is connected to an exhaust fan (16) on one side of the exhaust hole (14).
5. A network device secure connection device according to claim 1, characterized in that: The interface (8) is electrically connected to the chip (2).
6. A network device secure connection device according to claim 1, characterized in that: The four corners of the bottom end of the housing (1) are respectively connected with support columns (17), the bottom end of the support column (17) is connected with a rubber foot pad (18), and the bottom end of the foot pad (18) is connected with an anti-slip pattern.