Up-conversion power amplifier

Abstract

The utility model discloses an up-conversion power amplifier, which belongs to the technical field of satellite communication equipment and comprises an amplifier body with a first outer side face and a second outer side face, a first radiator detachably mounted on the first outer side face and a second radiator detachably mounted on the second outer side face. The first radiator comprises a first substrate, a first captive spring screw and a plurality of first radiating fins; the second radiator comprises a second substrate, a second captive spring screw and a plurality of second radiating fins. The plurality of first radiating fins are arranged on the first substrate at intervals, the plurality of second radiating fins are arranged on the second substrate at intervals, the first substrate is mounted on the first outer side surface through the first captive spring screws, and the second substrate is mounted on the second outer side surface through the second captive spring screws. According to the up-conversion power amplifier, the number of the radiators can be adjusted according to intermediate-frequency input power, and waste and burden of resources are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of satellite communication equipment, in particular to an up-conversion power amplifier. Background Art

[0002] In the field of satellite communication, in order to meet the requirements of more and more application fields such as communication, monitoring, and remote sensing, it is required that the up-conversion power amplifier (BUC) in the KU band in satellite communication equipment can be flexibly integrated into different satellite communication equipment.

[0003] As the unit with the largest heat generation, the existing up-conversion power amplifier is fixed with many radiators, which occupy a large space in terms of volume. Different satellite communication equipment has different input powers. During the actual operation of satellite communication equipment, different intermediate-frequency powers will be input, and the up-conversion power amplifier will convert them into a larger radio-frequency output power through the frequency conversion and amplification function. At present, the radiators on the up-conversion power amplifier are set to have good heat dissipation performance under the condition of maximum output power. Therefore, the number of radiators is large and the volume is large. However, in the actual working scenario, in most cases, the intermediate-frequency input power is low, and it is not necessary to configure so many radiators according to the maximum power, which not only causes waste of resources but also increases the operation burden of the omnidirectional rotation of the antenna servo system. Summary of the Utility Model

[0004] The purpose of the embodiment of the utility model is to provide an up-conversion power amplifier, which can adjust the number of radiators according to the intermediate-frequency input power, reducing waste of resources and burden.

[0005] To achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An up-conversion power amplifier, comprising:

[0007] An amplifier body, having a first outer side and a second outer side; the first outer side and the second outer side face away from each other;

[0008] A first radiator, detachably mounted on the first outer side;

[0009] A second radiator, detachably mounted on the second outer side;

[0010] The first radiator includes a first substrate, a first non-loosening spring screw, and a plurality of first heat dissipation fins; the second radiator includes a second substrate, a second non-loosening spring screw, and a plurality of second heat dissipation fins;

[0011] A plurality of the first heat sinks are arranged on the first substrate at intervals, and a plurality of the second heat sinks are arranged on the second substrate at intervals. The first substrate is mounted on the first outer side surface through the first non-loosening spring screw, and the second substrate is mounted on the second outer side surface through the second non-loosening spring screw.

[0012] Optionally, both the first non-loosening spring screw and the second non-loosening spring screw include a screw body, a first spring sleeved on the screw body, and a base having a through hole; guide holes are formed on both the first outer side surface and the second outer side surface, and threaded holes adapted to the screw body are provided on the bottom wall of the guide hole. The base is riveted to the first substrate or the second substrate, and the screw rod of the screw body passes through the through hole and is threadedly connected to the threaded hole.

[0013] Optionally, the guide hole has an orifice located on the first outer side surface or the second outer side surface, the inner wall of the orifice is provided with a first chamfer, the base has a plug-in end for being inserted into the guide hole, and a second chamfer is provided around the plug-in end.

[0014] Optionally, a plurality of the first heat sinks are detachably mounted on the first substrate, and a plurality of the second heat sinks are detachably mounted on the second substrate.

[0015] Optionally, the first heat sink and the second heat sink are corrugated plates, both the first heat sink and the second heat sink have a first corrugated heat dissipation surface and a second corrugated heat dissipation surface, and the first corrugated heat dissipation surface and the second corrugated heat dissipation surface face away from each other.

[0016] Optionally, both the first heat sink and the second heat sink have a clamping end, both the first substrate and the second substrate are provided with a sliding locking member and a second spring, both the first substrate and the second substrate are provided with a clamping groove and a sliding groove, the second spring is installed in the sliding groove and clamped between the sliding locking member and the inner wall of the sliding groove. The sliding locking member has a connecting end connected to the second spring and a locking end located in the clamping groove and jointly forming a clamping space with the bottom wall of the clamping groove or the amplifier body. A guiding inclined surface is provided on the locking end, and the guiding inclined surface is located on the moving path of the clamping end being inserted into the clamping groove.

[0017] Optionally, the amplifier body further has a third outer side surface and a fourth outer side surface, and the third outer side surface and the fourth outer side surface face away from each other;

[0018] The third outer side surface and the fourth outer side surface are both located between the first outer side surface and the second outer side surface. The first outer side surface and the second outer side surface are both perpendicular to and connected to the third outer side surface. The first outer side surface and the second outer side surface are both perpendicular to and connected to the fourth outer side surface;

[0019] The third outer side surface is provided with a first heat dissipation groove. The fourth outer side surface is provided with a second heat dissipation groove. A plurality of third heat dissipation fins arranged at intervals are provided on the bottom wall of the first heat dissipation groove. One end of each of the third heat dissipation fins is connected to and integrally formed with the bottom wall of the first heat dissipation groove. The other end of each of the third heat dissipation fins is flush with the third outer side surface. A plurality of fourth heat dissipation fins arranged at intervals are provided on the bottom wall of the second heat dissipation groove. One end of each of the fourth heat dissipation fins is connected to and integrally formed with the bottom wall of the second heat dissipation groove. The other end of each of the fourth heat dissipation fins is flush with the fourth outer side surface.

[0020] Optionally, the amplifier body includes a box body having an installation cavity and an up-conversion power amplification circuit module installed in the installation cavity; a radio frequency connector is provided on the box body.

[0021] Optionally, the first outer side surface is located on the box body. The radio frequency connector is installed on the first outer side surface. An avoidance groove is provided on the first radiator. When the first radiator is installed on the first outer side surface, the radio frequency connector is located in the avoidance groove.

[0022] Optionally, a flange is provided on the amplifier body. The flange is located outside the box body and is integrally formed with the box body.

[0023] The beneficial effects of the present utility model are:

[0024] The up-conversion power amplifier of the present utility model can adjust the installation quantity of the radiator according to the intermediate-frequency input power of the amplifier body. When the amplifier body is in the first working state of high-power input, the first radiator is installed on the first outer side surface and the second radiator is installed on the second outer side surface, meeting the heat dissipation requirements for high-power input. When the amplifier body is in the second working state of medium-power input, the first radiator is installed on the first outer side surface or the second radiator is installed on the second outer side surface, meeting the heat dissipation requirements for medium-power input. When the amplifier body is in the third working state of low-power input, the first radiator does not need to be installed on the first outer side surface and the second radiator does not need to be installed on the second outer side surface, meeting the heat dissipation requirements for low-power input. Selectively installing the first radiator and the second radiator according to different power inputs can reduce waste of resources and also reduce the burden of omnidirectional rotation during the operation of the antenna servo system. The first radiator and the second radiator are respectively installed by the first non-loosening spring screw and the second non-loosening spring screw, which can achieve the rapid installation of the first radiator and the second radiator, and at the same time prevent the first radiator and the second radiator from separating from the amplifier body when the first non-loosening spring screw and the second non-loosening spring screw become loose. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present utility model will be further described in detail below with reference to the drawings and embodiments.

[0026] Figure 1 is a schematic structural diagram of the up-conversion power amplifier;

[0027] Figure 2 is an exploded view of the up-conversion power amplifier;

[0028] Figure 3 is a side view of the up-conversion power amplifier perpendicular to the first outer side surface;

[0029] Figure 4 is a side view of the up-conversion power amplifier perpendicular to the fifth outer side surface;

[0030] Figure 5 is an installation schematic diagram of the first radiator;

[0031] Figure 6 is an exploded view of the first radiator;

[0032] Figure 7 is an installation schematic diagram of the first heat sink fin and the first substrate.

[0033] Description of the reference numerals in the drawings:

[0034] 11. Amplifier body; 12. First radiator; 13. Second radiator; 14. RF connector; 15. Flange; 16. Third heat sink fin; 17. Fourth heat sink fin;

[0035] 110, First outer side; 111, Second outer side; 112, Third outer side; 113, Fourth outer side; 114, Fifth outer side; 115, Guide hole; 116, Threaded hole; 117, First chamfer; 118, First heat dissipation groove; 119, Second heat dissipation groove;

[0036] 121, First substrate; 122, First non-loosening spring screw; 123, First heat sink; 124, Avoidance groove; 125, Connection hole;

[0037] 131, Second substrate; 132, Second non-loosening spring screw; 133, Second heat sink;

[0038] 1001, Screw body; 1002, Base; 1003, Second chamfer; 1004, First wavy heat dissipation surface; 1005, Second wavy heat dissipation surface; 1006, Clamping end; 1007, Sliding locking member; 1008, Second spring; 1009, Clamping groove; 1010, Sliding groove; 1011, Guiding inclined surface. Detailed implementation mode

[0039] To make the technical problems solved by the present utility model, the technical solutions adopted and the achieved technical effects clearer, the technical solutions of the embodiments of the present utility model will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present utility model.

[0040] In the description of the present utility model, unless otherwise clearly defined and limited, terms such as "connected", "fixed", "connected", "communicated", "abutted", "clamped" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0041] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but are in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0042] In the description herein, it should be understood that the orientation or positional relationships such as "above", "below", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0043] In the description of this specification, the description referring to terms such as "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0044] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0045] Unless otherwise specifically stated or defined, the term "and / or" used in the present utility model includes any and all combinations of one or more of the related listed items.

[0046] For the convenience of narration, unless otherwise stated, the up and down directions mentioned below are consistent with the up and down directions of Figure 3 itself, the front and back directions mentioned below are consistent with the left and right directions of Figure 3 itself, and the left and right directions mentioned below are consistent with the up and down directions of Figure 4 itself.

[0047] In the prior art, different satellite communication devices have different working spaces. Due to the omnidirectional rotation of the antenna servo system of the satellite communication device, the internal space of the satellite communication device is cramped. As the BUC is the unit with the largest heat generation, the up-conversion power amplifier is fixedly provided with a radiator. The number of radiators provided on the up-conversion power amplifier is designed to meet the heat dissipation requirements in the maximum power environment. Inevitably, it occupies a large space in terms of volume, is prone to movement trajectory interference with the omnidirectional rotating antenna servo system, and cannot adjust the number of radiators according to the input power of the up-conversion power amplifier during actual use, resulting in waste of resources and an increased burden on the satellite communication device.

[0048] As Figures 1 to 5 shown, an up-conversion power amplifier includes an amplifier body 11, a first radiator 12, and a second radiator 13. The amplifier body 11 is generally square, and the amplifier body 11 has a first outer side 110 and a second outer side 111. The first outer side 110 and the second outer side 111 face away from each other. In this embodiment, the first outer side 110 is located on the left side of the amplifier body 11, and the second outer side 111 is located on the right side of the amplifier body 11. The amplifier body 11 is an up-conversion power amplifier body 11, and the up-conversion power amplifier body 11 can convert the L-band signal output by the satellite Modem into a high-frequency radio frequency signal and reverse-transmit it to a C-band, KU-band, or KA-band satellite. The first radiator 12 is detachably installed on the first outer side 110, and the second radiator 13 is detachably installed on the second outer side 111. The first radiator 12 and the second radiator 13 are located on the left and right sides of the amplifier body 11 respectively, so as to achieve the heat dissipation of the amplifier body 11.

[0049] The first radiator 12 includes a first substrate 121, a first non-loosening spring screw 122, and a plurality of first heat dissipation fins 123. The second radiator 13 includes a second substrate 131, a second non-loosening spring screw 132, and a plurality of second heat dissipation fins 133.

[0050] A plurality of first heat sinks 123 are arranged at intervals from front to back on the first substrate 121, and a plurality of second heat sinks 133 are arranged at intervals from front to back on the second substrate 131. The first substrate 121 is installed on the first outer side 110 through the first non-loosening spring screw 122, and the second substrate 131 is installed on the second outer side 111 through the second non-loosening spring screw 132. Each first substrate 121 is quickly installed on the first outer side 110 of the amplifier body 11 through a plurality of first non-loosening spring screws 122, and each second substrate 131 is quickly installed on the second outer side 111 of the amplifier body 11 through a plurality of second non-loosening spring screws 132. The first non-loosening spring screw 122 and the second non-loosening spring screw 132 are also called spring screws, and their specific structures and principles can be referred to Patent CN109372878A. The first substrate 121 abuts against the first outer side 110, and the second substrate 131 abuts against the second outer side 111. The heat generated by the amplifier body 11 is conducted to each first heat sink 123 through the first substrate 121 and / or conducted to each second heat sink 133 through the second substrate 131, and heat dissipation is achieved by using each first heat sink 123 and / or each second heat sink 133.

[0051] The amplifier body 11 has a first working state, a second working state, and a third working state. Among them, the intermediate-frequency input power of the amplifier body 11 in the first working state is greater than the intermediate-frequency input power of the amplifier body 11 in the second working state, and the intermediate-frequency input power of the amplifier body 11 in the second working state is greater than the intermediate-frequency input power of the amplifier body 11 in the third working state. For example, in the first working state, the amplifier body 11 is in high-power input, in the third working state, the amplifier body 11 is in low-power input, and in the second working state, the amplifier body 11 is in low-power input between high-power input and low-power input. Thus, when the amplifier body 11 is in the first working state, the first heat sink 12 is installed on the first outer side 110 and the second heat sink 13 is installed on the second outer side 111. Both the first heat sink 12 and the second heat sink 13 are installed on the amplifier body 11, meeting the application scenarios of large space, high life, and high-power input. When the amplifier body 11 is in the second working state, the first heat sink 12 is installed on the first outer side 110 or the second heat sink 13 is installed on the second outer side 111. The first heat sink 12 or the second heat sink 13 is selectively installed on the amplifier body 11, meeting the application scenarios of limited space, general life, and general power input. When the amplifier body 11 is in the third working state, the first heat sink 12 is separated from the first outer side 110 and the second heat sink 13 is separated from the second outer side 111. Both the first heat sink 12 and the second heat sink 13 do not need to be installed on the amplifier body 11, and the heat dissipation structure of the amplifier body 11 itself can meet the heat dissipation requirements, meeting the application scenarios of small space, low life, and low-power input.

[0052] In this way, the up-conversion power amplifier of the present application can be applied under different working spaces, different working lifetimes, and different input power conditions, enabling the KU BUC to be flexibly integrated into different satellite communication devices, reducing the waste of resources and the operating burden of satellite communication devices.

[0053] Optionally, the first non-loosening spring screw 122 and the second non-loosening spring screw 132 both include a screw body 1001, a first spring sleeved on the screw body 1001, and a base 1002 having a through hole. Guide holes 115 are provided on both the first outer side 110 and the second outer side 111. Threaded holes 116 adapted to the screw body 1001 are provided on the bottom wall of the guide holes 115. The base 1002 is riveted to the first substrate 121 or the second substrate 131. The first substrate 121 and the second substrate 131 are provided with connection holes 125 through which the screw body 1001 passes. The screw rod of the screw body 1001 passes through the through hole and is threadedly connected to the threaded hole 116. The base 1002 can be pre-riveted to the first substrate 121 or the second substrate 131 for convenient installation. The screw body 1001 passes through the through hole and the connection hole 125. Under the action of the guide hole 115, the screw body 1001 passes through the guide hole 115 and is threadedly connected to the threaded hole 116. In this way, the first non-loosening spring screw 122 and the second non-loosening spring screw 132 of this embodiment are simple and easy to install, can be quickly positioned, are convenient for manual operation, and can achieve the quick installation of the first radiator 12 and the second radiator 13 without special tools. When networking satellite communication devices on-site, the first radiator 12 and the second radiator 13 can be flexibly and quickly installed according to different application scenarios, enabling the up-conversion power amplifier to meet the usage requirements.

[0054] Furthermore, the guide hole 115 has an opening located at the first outer side surface 110 or the second outer side surface 111, and the inner wall of the opening is provided with a first chamfer 117. The base 1002 has a plug-in end for inserting into the guide hole 115 for easy positioning. The plug-in end ring is provided with a second chamfer 1003, and a third chamfer is provided at the connection between the guide hole 115 and the threaded hole 116. Under the guidance and cooperation of the first chamfer 117, the second chamfer 1003, and the third chamfer, it is convenient for the first captive spring screw 122 and the second captive spring screw 132 to quickly install or disassemble the first radiator 12 and the second radiator 13, respectively. The first captive spring screw 122 and the second captive spring screw 132 can be tightened or loosened by human fingers without the need for any tools, which is convenient for on-site engineering personnel to operate flexibly. During on-site networking, the first radiator 12 and the second radiator 13 on the left and right sides of the up-conversion power amplifier may interfere with the antenna servo system and other components of the satellite communication equipment. The satellite communication equipment of some portable stations does not work around the clock and does not need such a long working time. Therefore, the up-conversion power amplifier of this embodiment can flexibly remove one or two of the first radiator 12 and the second radiator 13, greatly improving the flexibility of on-site networking operations. In particular, for the satellite communication equipment of the portable station, the redundant first radiator 12 and the second radiator 13 can be removed to obtain the performance requirements of lightness and smallness.

[0055] In one embodiment, a plurality of first heat sinks 123 are detachably mounted on the first substrate 121, and a plurality of second heat sinks 133 are detachably mounted on the second substrate 131. At present, the number of first heat sinks 123 on the first heat sink 12 and the number of second heat sinks 133 on the second heat sink 13 are both set according to the heat dissipation requirements of the up-conversion power amplifier at maximum power. In many actual working scenarios, the intermediate frequency input power of the up-conversion power amplifier is low, and it is not necessary to configure so many first heat sinks 123 and second heat sinks 133 according to the maximum power, thereby causing the operating burden of various systems of the satellite communication equipment. At the same time, some satellite modems work and transmit pulse signals instead of single-tone signals, and the heat and power consumption generated by the two are obviously different. The power consumption is small when the pulse signal is transmitted, so fewer first heat sinks 123 and second heat sinks 133 can be configured. The multiple first heat sinks 123 and the multiple second heat sinks 133 in this embodiment can be installed in a detachable manner, so that in actual applications, a suitable number of first heat sinks 123 and second heat sinks 133 can be installed according to the operating power of the variable frequency power amplifier, and the spacing between adjacent first heat sinks 123 and the spacing between adjacent second heat sinks 133 can also be adjusted.

[0056] like Figures 6 to 7As shown, furthermore, the first heat sink 123 and the second heat sink 133 are corrugated plates. Both the first heat sink 123 and the second heat sink 133 have a first corrugated heat dissipation surface 1004 and a second corrugated heat dissipation surface 1005. The first corrugated heat dissipation surface 1004 and the second corrugated heat dissipation surface 1005 face away from each other, increasing the heat dissipation area of the first heat sink 123 and the second heat sink 133 and improving the heat dissipation performance.

[0057] Optionally, both the first heat sink 123 and the second heat sink 133 have clamping ends 1006. The cross-sections of the first heat sink 123 and the second heat sink 133 along the direction perpendicular to the left-right direction are both inverted T-shaped. Both the first substrate 121 and the second substrate 131 are equipped with sliding locking members 1007 and second springs 1008. Both the first substrate 121 and the second substrate 131 are provided with clamping grooves 1009 and sliding grooves 1010. The sliding grooves 1010 communicate with the outside of the first substrate 121 or the second substrate 131 through the clamping grooves 1009. The second spring 1008 is installed in the sliding groove 1010 and clamped between the sliding locking member 1007 and the inner wall of the sliding groove 1010. The sliding locking member 1007 has a connection end connected to the second spring 1008 and a locking end located in the clamping groove 1009 and jointly forming a clamping space with the bottom wall of the clamping groove 1009 or the amplifier body 11. A guiding inclined surface 1011 is provided on the locking end, and the guiding inclined surface 1011 is located on the moving path of the clamping end 1006 when it is inserted into the clamping groove 1009. Specifically, multiple sliding grooves 1010 are provided on the two opposite inner walls of the clamping groove 1009, and the multiple sliding grooves 1010 correspond one-to-one to the multiple sliding locking members 1007 and the multiple second springs 1008. When installing the first heat sink 123 or the second heat sink 133, the clamping end 1006 first enters the clamping groove 1009, and then the clamping end 1006 abuts against the guiding inclined surface 1011, causing the sliding locking member 1007 to slide into the sliding groove 1010 and compress the second spring 1008. After the clamping end 1006 enters the clamping space, the second spring 1008 resets, and the locking end of the sliding locking member 1007 enters the clamping groove 1009 to prevent the clamping end 1006 from disengaging from the clamping groove 1009. The clamping end 1006 of the first heat sink 123 or the second heat sink 133 is clamped between the locking end of the sliding locking member 1007 and the bottom wall of the clamping groove 1009. When the clamping groove 1009 penetrates the first substrate 121 and the second substrate 131, the clamping end 1006 of the first heat sink 123 or the second heat sink 133 is clamped between the locking end of the sliding locking member 1007 and the amplifier body 11. At this time, the first substrate 121 and the second substrate 131 can be detached from the amplifier body 11, and then the first heat sink 123 and the second heat sink 133 can be detached from the first substrate 121 and the second substrate 131.

[0058] As Figures 1 to 5As shown, in one embodiment, the amplifier body 11 further has a third outer side surface 112 and a fourth outer side surface 113, and the third outer side surface 112 and the fourth outer side surface 113 face away from each other. Both the third outer side surface 112 and the fourth outer side surface 113 are located between the first outer side surface 110 and the second outer side surface 111. Both the first outer side surface 110 and the second outer side surface 111 are perpendicular to and connected to the third outer side surface 112, and both the first outer side surface 110 and the second outer side surface 111 are perpendicular to and connected to the fourth outer side surface 113. The first outer side surface 110 is arranged to face left, the second outer side surface 111 is arranged to face right, the third outer side surface 112 is arranged to face up, and the fourth outer side surface 113 is arranged to face down.

[0059] The third outer side surface 112 is provided with a first heat dissipation groove 118, and the fourth outer side surface 113 is provided with a second heat dissipation groove 119. A plurality of third heat dissipation fins 16 are arranged at intervals on the bottom wall of the first heat dissipation groove 118. One end of each third heat dissipation fin 16 is connected to and integrally formed with the bottom wall of the first heat dissipation groove 118, and the other end of each third heat dissipation fin 16 is flush with the third outer side surface 112. A plurality of fourth heat dissipation fins 17 are arranged at intervals on the bottom wall of the second heat dissipation groove 119. One end of each fourth heat dissipation fin 17 is connected to and integrally formed with the bottom wall of the second heat dissipation groove 119, and the other end of each fourth heat dissipation fin 17 is flush with the fourth outer side surface 113. Each of the third heat dissipation fins 16 and each of the fourth heat dissipation fins 17 are integrally formed on the outer side of the amplifier body 11 to meet the most basic heat dissipation requirements of the amplifier body 11. At the same time, the first heat dissipation groove 118 and the second heat dissipation groove 119 are used to accommodate each of the third heat dissipation fins 16 and each of the fourth heat dissipation fins 17, reducing the volume of the up-conversion power amplifier.

[0060] In one embodiment, the amplifier body 11 includes a box body having an installation cavity and an up-conversion power amplification circuit module installed in the installation cavity. The first outer side surface 110 is located on the box body and is provided with a radio frequency connector 14. The first radiator 12 is provided with an avoidance groove 124. When the first radiator 12 is installed on the first outer side surface 110, the radio frequency connector 14 is located in the avoidance groove 124. The provision of the avoidance groove 124 on the first radiator 12 does not affect the use of input and output interfaces such as the radio frequency connector 14. The first outer side surface 110, the second outer side surface 111, the third outer side surface 112, and the fourth outer side surface 113 are all located on the outer side surface of the box body.

[0061] In one embodiment, a flange 15 is provided on the amplifier body 11, and the box body of the amplifier body 11 further has a fifth outer side surface 114. The flange 15 is located on the fifth outer side surface 114 of the box body and is integrally formed with the box body.

[0062] The technical principle of the present utility model has been described in combination with specific embodiments above. These descriptions are only for explaining the principle of the present utility model and cannot be construed as limiting the protection scope of the present utility model in any way. Based on the explanations herein, those skilled in the art can readily conceive of other specific embodiments of the present utility model without creative efforts, and these embodiments will fall within the protection scope of the present utility model.

Claims

1. An up-conversion power amplifier, characterized in that: include: An amplifier body (11) having a first outer side surface (110) and a second outer side surface (111); the first outer side surface (110) and the second outer side surface (111) are facing away from each other; A first heat sink (12) is detachably mounted on the first outer side surface (110); the first heat sink (12) comprises a first substrate (121), a first captive spring screw (122) and a plurality of first heat sinks (123); A second heat sink (13) is detachably mounted on the second outer side surface (111); the second heat sink (13) comprises a second substrate (131), a second captive spring screw (132) and a plurality of second heat sinks (133); A plurality of first heat sinks (123) are arranged at intervals on the first substrate (121); a plurality of second heat sinks (133) are arranged at intervals on the second substrate (131); the first substrate (121) is mounted on the first outer side surface (110) via the first captive spring screws (122); and the second substrate (131) is mounted on the second outer side surface (111) via the second captive spring screws (132).

2. The up-conversion power amplifier according to claim 1, characterized in that: The first captive spring screw (122) and the second captive spring screw (132) both comprise a screw body (1001), a first spring sleeved on the screw body (1001), and a base (1002) having a through hole; the first outer side surface (110) and the second outer side surface (111) are both provided with a guide hole (115), a threaded hole (116) adapted to the screw body (1001) is provided on the bottom wall of the guide hole (115), the base (1002) is riveted to the first substrate (121) or the second substrate (131), and the screw of the screw body (1001) passes through the through hole and is threadedly connected to the threaded hole (116).

3. The up-conversion power amplifier according to claim 2, characterized in that: The guide hole (115) has an opening located on the first outer side surface (110) or the second outer side surface (111), the inner wall of the opening is provided with a first chamfer (117), and the base (1002) has a plug-in end for inserting into the guide hole (115), and the plug-in end ring is provided with a second chamfer (1003).

4. The up-conversion power amplifier according to claim 1, characterized in that: A plurality of the first heat sinks (123) are detachably mounted on the first substrate (121), and a plurality of the second heat sinks (133) are detachably mounted on the second substrate (131).

5. The up-conversion power amplifier according to claim 4, characterized in that: The first heat sink (123) and the second heat sink (133) are wave plates, and both the first heat sink (123) and the second heat sink (133) have a first wave heat sink surface (1004) and a second wave heat sink surface (1005), and the first wave heat sink surface (1004) and the second wave heat sink surface (1005) are opposite to each other.

6. The up-conversion power amplifier according to claim 5, characterized in that: The first heat sink (123) and the second heat sink (133) both have a clamping end (1006); the first substrate (121) and the second substrate (131) are both installed with a sliding locking member (1007) and a second spring (1008); the first substrate (121) and the second substrate (131) are both provided with a clamping groove (1009) and a sliding groove (1010); the second spring (1008) is installed in the sliding groove (1010) and clamped in the sliding locking member (1007). 07) and the inner wall of the sliding groove (1010), the sliding locking member (1007) has a connecting end connected to the second spring (1008) and a locking end located in the snap-fit ​​groove (1009) and forming a clamping space together with the bottom wall of the snap-fit ​​groove (1009) or the amplifier body (11), and a guiding slope (1011) is provided on the locking end, and the guiding slope (1011) is located on the moving path of the snap-fit ​​end (1006) snapping into the snap-fit ​​groove (1009).

7. The up-conversion power amplifier according to any one of claims 1 to 6, characterized in that: The amplifier body (11) further comprises a third outer side surface (112) and a fourth outer side surface (113), wherein the third outer side surface (112) and the fourth outer side surface (113) face away from each other; The third outer side surface (112) and the fourth outer side surface (113) are both located between the first outer side surface (110) and the second outer side surface (111); the first outer side surface (110) and the second outer side surface (111) are both perpendicular to and connected to the third outer side surface (112); and the first outer side surface (110) and the second outer side surface (111) are both perpendicular to and connected to the fourth outer side surface (113); The third outer side surface (112) is provided with a first heat dissipation groove (118), and the fourth outer side surface (113) is provided with a second heat dissipation groove (119). A plurality of third heat dissipation fins (16) arranged at intervals are provided on the bottom wall of the first heat dissipation groove (118), one end of each of the third heat dissipation fins (16) is connected to the bottom wall of the first heat dissipation groove (118) and is integrally formed, and the other end of each of the third heat dissipation fins (16) is flush with the third outer side surface (112). A plurality of fourth heat dissipation fins (17) arranged at intervals are provided on the bottom wall of the second heat dissipation groove (119), one end of each of the fourth heat dissipation fins (17) is connected to the bottom wall of the second heat dissipation groove (119) and is integrally formed, and the other end of each of the fourth heat dissipation fins (17) is flush with the fourth outer side surface (113).

8. The up-conversion power amplifier according to any one of claims 1 to 6, characterized in that: The amplifier body (11) comprises a box body having an installation cavity and an up-conversion power amplifier circuit module installed in the installation cavity; a radio frequency connector (14) is provided on the box body.

9. The up-conversion power amplifier according to claim 8, characterized in that: The first outer side surface (110) is located on the box body, the radio frequency connector (14) is installed on the first outer side surface (110), and a avoidance groove (124) is provided on the first heat sink (12). When the first heat sink (12) is installed on the first outer side surface (110), the radio frequency connector (14) is located in the avoidance groove (124).

10. The up-conversion power amplifier according to claim 8, characterized in that: The amplifier body (11) is provided with a flange (15), and the flange (15) is located outside the box body and is integrally formed with the box body.

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