Flow guide part, heat dissipation structure, heat dissipation module and electronic equipment

Abstract

The utility model discloses a flow guide part, a heat dissipation structure, a heat dissipation module and electronic equipment. The flow guide part comprises a first side plate, a second side plate, a third side plate and a fourth side plate. The first side plate is connected with one end of the second side plate, the other end of the second side plate is connected with one end of the third side plate, the other end of the third side plate is connected with the fourth side plate to form a cavity, one end, close to the first side plate, of the fourth side plate is provided with a first inlet, the first side plate is provided with a first outlet, and the cavity is communicated with the first inlet and the first outlet. Air flow can flow out along the first outlet after entering the cavity from the first inlet, so that the heat dissipation effect of the flow guide part is improved.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly relates to a flow guiding member, a heat dissipation structure, a heat dissipation module, and an electronic device. Background Art

[0002] Inside a server, there are usually various functional components, such as communication components and graphics processor components, etc. When the functional components work, heat is generated, and an air outlet assembly and heat dissipation components are correspondingly arranged inside the server to dissipate heat from the functional components. With the development of technology, the power of some functional components (such as communication components) is getting higher and higher. Correspondingly, the requirements for heat dissipation of the functional components are getting higher and higher.

[0003] To increase the heat dissipation capacity of the functional components, usually a wind guide cover is added between the air outlet assembly and the functional components. After the wind guide cover collects the air flow, the air pressure increases and the flow rate increases, so that as much air as possible flows from the wind guide cover into the functional components for heat dissipation. However, since the outlet of the functional component is blocked by the functional component, the air flow resistance is large, resulting in poor heat dissipation effect. In addition, since the wind guide cover occupies a large space, it affects the heat dissipation of other functional modules. Summary of the Invention

[0004] This application provides a flow guiding member, a heat dissipation structure, a heat dissipation module, and an electronic device.

[0005] In a first aspect, an embodiment of this application provides a flow guiding member. The flow guiding member includes a first side plate, a second side plate, a third side plate, and a fourth side plate. One end of the first side plate is connected to one end of the second side plate, the other end of the second side plate is connected to one end of the third side plate, and the other end of the third side plate is connected to the fourth side plate to form a cavity. A first inlet is provided at one end of the fourth side plate close to the first side plate, and a first outlet is provided on the first side plate. The cavity communicates the first inlet and the first outlet.

[0006] In some embodiments, in the length direction of the flow guiding member, the second side plate protrudes from the third side plate.

[0007] In some embodiments, there are multiple first outlets, and the multiple first outlets are distributed on the first side plate.

[0008] In a second aspect, an embodiment of this application provides a heat dissipation structure. The heat dissipation structure includes the flow guiding member according to any one of the above embodiments.

[0009] In a third aspect, an embodiment of this application provides a heat dissipation module. The heat dissipation mode includes the heat dissipation structure according to any one of the above embodiments and a first component to be heat dissipated. The first component to be heat dissipated is installed at the loading position.

[0010] Fourth aspect, an embodiment of the present application provides an electronic device, which includes the heat dissipation module described in any of the above embodiments.

[0011] For the flow guide, heat dissipation structure, heat dissipation module, and electronic device provided in the first to fourth aspects of the present application, after the air flow enters the heat dissipation structure provided with the flow guide, there are at least two air outlet paths in total for the air flow. The first air outlet path is that a part of the air flow flows out from the existing air outlet (such as the second outlet) of the heat dissipation structure. The second air outlet path is that a part of the air flow enters the cavity from the first inlet of the flow guide and then flows out from the first outlet. Compared with the heat dissipation structure without the flow guide, the heat dissipation structure of the present application additionally adds an air outlet path, improving the heat dissipation effect. In addition, the first outlet is provided on the first side plate, and the first inlet is provided at one end of the fourth side plate close to the first side plate. Therefore, the distance between the first outlet and the first inlet is short, which can shorten the flow distance of the air flow and improve the heat dissipation efficiency.

[0012] Fifth aspect, an embodiment of the present application further provides a heat dissipation structure. The heat dissipation structure includes a flow guide and an air duct. The flow guide is provided with a cavity and a first inlet. The air duct is communicated with the first inlet through the cavity.

[0013] In some embodiments, the flow guide further includes a first outlet, and the first inlet and the first outlet are respectively located on adjacent sides of the flow guide. The first inlet is communicated with the first outlet through the cavity.

[0014] In some embodiments, the heat dissipation structure further includes a loading member. The loading member is provided with a loading position for installing the first heat dissipation component to be cooled, an air duct, and a second outlet. The loading position is arranged on the air duct.

[0015] In some embodiments, the loading member is further provided with a second outlet, and the air duct is communicated with the second outlet.

[0016] In some embodiments, the second outlet is located on the first side of the loading position. The flow guide is arranged on one side of the loading member, and the first inlet is located on the second side of the loading position, and the second side and the first side are connected.

[0017] In some embodiments, the first outlet and the second outlet are located on the same side of the heat dissipation structure.

[0018] In some embodiments, the loading member includes a loading unit and a partition plate. The loading position is arranged on the loading unit, and the air duct is formed on the loading unit. The partition plate is arranged at one end of the loading unit and is connected to the loading unit, and the extending direction of the loading unit is perpendicular to the extending direction of the partition plate.

[0019] In some embodiments, the loading unit includes a plurality of loading parts. In the height direction of the spacer, the plurality of loading parts are stacked to form a plurality of air ducts. At least one of the loading parts is provided with the loading position.

[0020] In some embodiments, there are a plurality of second outlets, and the plurality of second outlets are distributed on the spacer.

[0021] In some embodiments, the deflector includes a first side plate, a second side plate, a third side plate, and a fourth side plate. One end of the first side plate is connected to one end of the second side plate, the other end of the second side plate is connected to one end of the third side plate, and the other end of the third side plate is connected to the fourth side plate to form a cavity. A first inlet is provided at one end of the fourth side plate close to the first side plate, a first outlet is provided on the first side plate, and the cavity communicates the first inlet and the first outlet.

[0022] In some embodiments, in the length direction of the deflector, the second side plate protrudes from the third side plate.

[0023] In some embodiments, there are a plurality of first outlets, and the plurality of first outlets are distributed on the first side plate.

[0024] In some embodiments, the heat dissipation structure further includes an air outlet assembly, which is arranged on the third side of the loading member and is opposite to the second inlet of the air duct away from the second outlet. The air outlet assembly is used to blow air towards the second inlet.

[0025] In a sixth aspect, an embodiment of the present application provides a heat dissipation module. The heat dissipation mode includes the heat dissipation structure and the first component to be heat-dissipated described in any of the above embodiments. The first component to be heat-dissipated is installed at the loading position of the heat dissipation structure.

[0026] In some embodiments, the air outlet assembly includes a first air outlet unit, and the air outlet of the first air outlet unit is opposite to the second inlet of the heat dissipation structure.

[0027] In some embodiments, the heat dissipation module further includes a second component to be heat-dissipated. The deflector is located between the loading member and the second component to be heat-dissipated. The second side plate of the deflector is installed on one side of the second component to be heat-dissipated, and the air outlet assembly of the heat dissipation structure is also used to blow air towards the second component to be heat-dissipated.

[0028] In some embodiments, the air outlet assembly further includes a second air outlet unit. The first air outlet unit and the second air outlet unit of the air outlet assembly are arranged in sequence in the direction from the fourth side plate to the second side plate of the deflector, and the air outlet of the second air outlet unit is opposite to the second component to be heat-dissipated.

[0029] In a seventh aspect, an embodiment of the present application provides an electronic device, and the electronic device includes the heat dissipation module described in any one of the above embodiments.

[0030] For the flow guiding member, heat dissipation structure, heat dissipation module, and electronic device provided in the fifth to seventh aspects of the present application, after the air flow enters the heat dissipation structure provided with the flow guiding member, there are at least two air outlet paths in total for the air flow. The first air outlet path is that a part of the air flow entering from the air duct flows out through the existing air outlet (such as the second outlet) of the heat dissipation structure. The second air outlet path is that a part of the air flow entering from the air duct enters the cavity through the first inlet of the flow guiding member and then flows out from the first outlet. Compared with the heat dissipation structure without the flow guiding member, the heat dissipation structure of the present application adds an air outlet path, thereby improving the heat dissipation effect.

[0031] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0032] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0033] Figure 1 is a three-dimensional assembly schematic diagram of a heat dissipation module of some embodiments of the present application;

[0034] Figure 2 is Figure 1 a three-dimensional exploded schematic diagram of the heat dissipation module in;

[0035] Figure 3 is Figure 1 a three-dimensional exploded schematic diagram of a partial structure of the heat dissipation module in;

[0036] Figure 4 is Figure 1 a three-dimensional structure schematic diagram of a partial structure of the heat dissipation module in;

[0037] Figure 5 is a structure schematic diagram of an electrical device of some embodiments of the present application.

[0038] Description of the Main Element Numbers:

[0039] Electronic device 10000; Heat dissipation module 1000;

[0040] Heat dissipation structure 100; flow guiding member 10; cavity 11; first inlet 13; first outlet 15; first side plate 101; second side plate 102; third side plate 103; fourth side plate 104; loading member 30; loading unit 31; loading position 311; air duct 313; loading portion 315; second outlet 317; spacer 33; first side 301; second side 302; third side 303, second inlet 35; air outlet assembly 50; first air outlet unit 51; second air outlet unit 52; first component to be heat dissipated 300; second component to be heat dissipated 500. Detailed implementation manner

[0041] In the description of the present application, some of the disclosed content has been correspondingly shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The content described by referring to the drawings below is exemplary and is only used to explain the present application and cannot be construed as a limitation to the present application.

[0042] In the description of the present application, many different contents or examples are disclosed to implement different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application.

[0043] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0044] In the description of the present application, it should be understood that the terms used to indicate the orientation or position relationship (such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc.) are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and facilitating the understanding of the corresponding implementation manners, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms used to indicate the orientation or position relationship cannot be construed as a limitation to the present application.

[0045] In the description of the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0046] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection. It may be a mechanical connection or an electrical connection. It may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0047] Please refer to Figures 1 to 4 , an embodiment of the present application provides a heat dissipation structure 100. The heat dissipation structure 100 includes a flow guiding member 10 and an air duct 313. The flow guiding member 10 is provided with a cavity 11, a first inlet 13 and a first outlet 15. The first inlet 13 and the second inlet 35 are respectively located on two adjacent sides of the flow guiding member 10. The first inlet 13 communicates with the first outlet 15 through the cavity 11. The air duct 313 communicates with both the first inlet 13 and the second outlet 317.

[0048] In an electronic device 10000 (such as a server, Figure 5 as shown), there are usually multiple functional components (such as communication components). The functional components generate heat during operation. Therefore, the electronic device 10000 usually is also provided with a heat dissipation component (such as the heat dissipation structure 100) to cool the functional components (also known as components to be cooled) that need to be cooled. With the development of artificial intelligence, the power of communication components has increased from about 10W to about 150W, and the power of optical components has increased from about 0.5W to about 5W. Therefore, the heat dissipation requirements of some functional components (such as communication components) are getting higher and higher. Correspondingly, the requirements for the heat dissipation components are also getting higher and higher.

[0049] Traditionally, in order to increase the heat dissipation capacity of the component to be cooled, a horn-shaped air guide cover is usually added near the component to be cooled close to the air outlet unit, so that as much air flow as possible flows from the air outlet unit into the air guide cover, thereby increasing the heat dissipation capacity of the component to be cooled. However, the heat dissipation capacity of the air guide cover is limited. Generally, it can only reduce the temperature of the component to be cooled by 2-3 °C. Moreover, due to the use of a horn-shaped air inlet, the air inlet of the air guide cover will be larger than the size of the component to be cooled on the side of the air inlet. Therefore, the setting of the air guide cover will also affect the heat dissipation of other adjacent functional components.

[0050] Traditionally, an air outlet unit can also be added near the component to be cooled. However, due to the limited internal space of the electrical device, a large-sized air outlet unit cannot be set. In addition, since the air outlet unit occupies extra space, the heat sink needs to be reduced accordingly to make room for the extra space. Therefore, the scheme of adding an air outlet unit also has limited improvement on the heat dissipation effect of the heat dissipation component.

[0051] For the embodiments of the present application, the width direction of the heat dissipation structure 100 is taken as the first direction X, the length direction is taken as the second direction Y, and the height direction is taken as the third direction Z. Therefore, the first side 301 of the loading position 311 is one side in the second direction Y, the second side 302 of the loading position 311 is one side in the first direction X, and the first side 301 is connected to the second side 302.

[0052] Specifically, the flow guide member 10 is used to dissipate heat from the first component to be cooled 300 on the loading position 311. The flow guide member 10 can be one or more. In the present application, it is one. The flow guide member 10 is arranged on one side of the loading member 30, and can be any one of the first direction X, the second direction Y and the third direction Z. In the present application, the flow guide member 10 is arranged on the second side 302 of the loading member 30. It can be understood that on the second direction Y, a flow guide member 10 can also be arranged on the side opposite to the second side 302 of the loading member 30. The air duct 313 is the path for the air flow to flow in the heat dissipation structure 100.

[0053] In the heat dissipation structure 100 of the present application, after the air flow flows out from components such as the air outlet component 50 that can generate air flow, on the heat dissipation structure 100 provided with the flow guide 10, there are at least two air outlet paths for the air flow. The first air outlet path is that a part of the air flow entering from the air duct 313 flows out through the existing air outlet of the heat dissipation structure 100 (such as the second outlet 317). The second air outlet path is that a part of the air flow entering from the air duct 313 enters the cavity 11 through the first inlet 13 of the flow guide 10 and then flows out from the first outlet 15. Compared with the heat dissipation structure without the flow guide, the heat dissipation structure 100 of the present application adds an air outlet path, improving the heat dissipation effect. Further, the first outlet 15 and the first inlet 13 are located on adjacent sides of the flow guide 10 (for example, the first outlet is provided on the first side plate 101 of the flow guide 10, and the first inlet is provided at one end of the fourth side plate 104 of the flow guide 10 close to the first side plate 101). Therefore, the distance between the first outlet 15 and the first inlet 13 is short, which can shorten the flow distance of the air flow. After the air flow enters the first inlet from the air duct 313, the air flow can enter the cavity 11 from the first inlet 13 in time and be discharged from the first outlet 15.

[0054] Please refer to Figures 1 to 4 , the loading member 30 is provided with a loading position 311 for installing the first component to be cooled 300, an air duct 313, and a second outlet 317. The loading position 311 is arranged on the air duct 313, and the second outlet 317 is located on the first side 301 of the loading position 311. The flow guide 10 is arranged on one side of the loading member 30, the first inlet 13 is located on the second side 302 of the loading position 311, and the second side 302 and the first side 301 are connected. The first outlet 15 and the second outlet 317 are located on the same side of the heat dissipation structure 100. The air duct 313 is communicated with both the first inlet 13 and the second outlet 317.

[0055] Specifically, in some embodiments, the flow guide 10 and the loading member 30 are of an integral structure, that is, the flow guide 10 and the loading member 30 are a whole structure, thereby improving the bonding strength between the flow guide 10 and the loading member 30, preventing the flow guide 10 and the loading member 30 from separating during the operation of the heat dissipation structure 100, and thus ensuring the stability and reliability of the operation of the heat dissipation structure 100. In other embodiments, the flow guide 10 and the loading member 30 are of a split structure, that is, the flow guide 10 and the loading member 30 are two separable structures. In one example, the flow guide 10 and the loading member 30 can be combined together by a detachable connection method, and the detachable connection method includes but is not limited to snap connection or screw connection, etc. In another example, the flow guide 10 and the loading member 30 can be combined together by a non-detachable connection method, and the non-detachable connection method includes but is not limited to bonding or welding, etc.

[0056] The loading member 30 is used to mount the first component to be cooled 300. The air duct 313 is the path through which the air blown by the air outlet assembly 50 into the loading member 30 flows inside the loading member 30. The air outlet assembly 50 of the present application is arranged in the second direction Y and is located on the third side 303 of the loading member 30 in the second direction Y, which is away from the second outlet 317. Thus, the air can flow out from the second outlet 317 after passing through the air duct 313 from the air outlet assembly 50, so as to cool the first component to be cooled 300 located on the air duct 313.

[0057] The first inlet 13 is located on the second side 302 of the loading member 30, and the second side 302 is adjacent to the first side 301. The second side 302 is the side where the flow guide member 13 is connected to the loading member 30. The first inlet 13 can be located in the second direction Y. One end of the second side 302 close to the first side 301 can be located at one end of the second side 302 away from the first side 301. The first inlet 13 is communicated with the air duct 313, enabling the air to not only flow out from the second outlet 317 along the air duct 313, but also flow into the cavity 11 from the first inlet 13 along the air duct 313 and then flow out from the first outlet 15.

[0058] Preferably, the first inlet 13 is located at one end of the second side 302 close to the first side 301, which can make the positions of the first inlet 13 and the second outlet 317 close to each other, so that part of the air that cannot flow out from the second outlet 317 can enter the cavity 11 from the first inlet 13, relieve the pressure at the second outlet 317, and avoid the structural looseness caused by the excessive acting force of the air flow at the second outlet 317, thus affecting the stability of the loading member 30.

[0059] The first outlet 15 is located on the same side of the heat dissipation structure 100 as the second outlet 317, that is, the first outlet 15 is located on the first side 301, and the first outlet 15 and the first inlet 13 are located on two adjacent sides of the flow guide member 10. Therefore, the distance between the first outlet 15 and the first inlet 13 is short, which can shorten the flow distance of the air flow, so that the air flow entering the cavity 11 from the first inlet 13 can be discharged from the first outlet 15 in time.

[0060] Therefore, in the heat dissipation structure 100 of the present application, after the air flow flows out from components such as the air outlet component 50 that can produce air flow, on the heat dissipation structure 100 provided with the flow guide member 10, there are at least two air outlet paths for the air flow. The first air outlet path is that a part of the air flow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313 and then flows out from the second outlet 317. The second air outlet path is that a part of the air flow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313, enters the cavity 11 from the first inlet 13, and then flows out along the first outlet 15. Thus, by increasing the air outlet paths of the air flow, the flow guide member 10 can improve the heat dissipation effect of the heat dissipation structure 100. In addition, the flow guide member 10 of the present application is provided on the air duct owned by the electrical device 10000 and does not occupy space.

[0061] Please refer to Figure 1 and Figure 3 , in some embodiments, the loading member 30 includes a loading unit 31 and a partition plate 33. The loading position 311 is arranged on the loading unit 31, and an air duct 313 is formed on the loading unit 31. The partition plate 33 is arranged at one end of the loading unit 31 and is connected to the loading unit 31. The extending direction of the loading unit 31 is perpendicular to the extending direction of the partition plate 33.

[0062] Specifically, the materials of the loading unit 31 and the partition plate 33 can be the same or different, which is not limited in the present application. The shapes of the loading unit 31 and the partition plate 33 include but are not limited to circular, oval, triangular, quadrilateral or other polygons, etc. The extending direction of the loading unit 31 is perpendicular to the extending direction of the partition plate 33, that is, the plane where the loading unit 31 is located is perpendicular to the plane where the partition plate 33 is located. For example, in one embodiment, the plane where the loading unit 31 is located is the XY plane, and the plane where the partition plate 33 is located is the XZ plane. Therefore, the partition plate 33 arranged perpendicular to the loading unit 31 can connect and fix the loading unit 31.

[0063] Please refer to Figure 1 and Figure 3 , in some embodiments, the loading unit 31 includes a plurality of loading parts 315. In the height direction of the partition plate 33, the plurality of loading parts 315 are stacked to form a plurality of air ducts 313. At least one loading part 315 is provided with a loading position 311.

[0064] Specifically, the shapes of the multiple loading parts 315 can be the same, which is beneficial for molding. The sizes of the multiple loading parts 315 can also be different to adapt to the shapes of different parts to be separated. The height direction of the spacer 33 is the third direction Z, and the multiple loading parts 315 are stacked in the third direction Z. In this application, the stacked arrangement of two loading parts 315 is shown. In other embodiments of this application, the number of loading parts 315 can be other numbers. The intervals between the multiple loading parts 315 in the third direction Z can be the same, which can facilitate the molding and connection of the heat dissipation structure 100. The intervals between the multiple loading parts 315 in the third direction Z can be different to adapt to the different sizes of different parts to be separated in the third direction Z.

[0065] The stacked loading parts 315 can save space of the heat dissipation structure 100 in the first direction X and the second direction Y. The multiple loading parts 315 form multiple air ducts 313, which can increase the flow distance of the air flow and improve the heat dissipation efficiency of the heat dissipation structure 100. It can be understood that in the heat dissipation structure 100, one loading position 311 can correspond to one flow guiding part 10, or multiple loading positions 311 can correspond to one flow guiding part 10. In this application, two loading parts 315 correspond to one flow guiding part 10, which can reduce the size of the heat dissipation structure 100 and thus save space.

[0066] Please refer to Figure 1 and Figure 3 , in some embodiments, there are multiple second outlets 317, and the multiple second outlets 317 are distributed on the spacer 33.

[0067] Specifically, the cross-sectional shape of the second outlet 317 includes but is not limited to a perfect circle, an ellipse or a polygon, etc. The cross-sectional shapes of the multiple second outlets 317 can be the same or different. For example, in some embodiments, the shapes of the second outlets 317 are all squares. The multiple second outlets 317 can be randomly distributed, or arranged in an array, or arranged in a serpentine shape, which is not limited in this application. In this application. The multiple second outlets 317 are arranged in an array, which is beneficial for the processing and molding of the second outlets 317 on the spacer 33.

[0068] Please refer to Figure 1 and Figure 3 , in some embodiments, the flow guiding part 10 includes a first side plate 101, a second side plate 102, a third side plate 103 and a fourth side plate 104. One end of the first side plate 101 is connected to one end of the second side plate 102. The other end of the second side plate 102 is connected to one end of the third side plate 103. The other end of the third side plate 103 is connected to the fourth side plate 104 to form a cavity 11. The fourth side plate 104 is spaced from the first side plate 101 to form a first inlet 13. The first side plate 101 is provided with a first outlet 15. The cavity 11 communicates with the first inlet 13 and the first outlet 15.

[0069] Specifically, in some embodiments, the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 are of an integral structure, that is, the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 are a single integral structure. Thereby, the bonding strength between the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 can be improved, preventing the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 from separating during the operation of the flow guide member 10, thus ensuring the stability and reliability of the operation of the flow guide member 10. In other embodiments, the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 are of a split structure, that is, the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 are two different structures. In one example, the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 can be combined together by a detachable connection method, and the detachable connection methods include but are not limited to snap connection or threaded connection, etc. In another example, the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 can be combined together by a non-detachable connection method, and the non-detachable connection methods include but are not limited to bonding or welding, etc.

[0070] It should be noted that the materials of the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 can be the same. For example, the materials of the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 are all plastics; or, the materials of the first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 can also be partially different or all different. For example, the materials of the second side plate 102, the third side plate 103, and the fourth side plate 104 can be aluminum alloy, and the material of the first side plate 101 can be copper with higher strength to avoid the first side plate 101 from cracking during the formation of the first outlet 15, thus ensuring the strength of the first side plate 101.

[0071] A first inlet 13 is formed at an interval between the fourth side plate 104 and the first side plate 101. The first side plate 101, the second side plate 102, the third side plate 103, and the fourth side plate 104 enclose a cavity 11. The first side plate 101 is provided with a first outlet 15, which can form a second air outlet path in the heat dissipation structure 100. Thereby, after the air flow enters the air duct 313, it can enter the cavity 11 from the first inlet 13 and flow out from the first outlet 15, thereby improving the heat dissipation effect of the heat dissipation structure 100.

[0072] Please refer to Figure 1 andFigure 3 , in some embodiments, in the length direction of the flow guide member 10, the second side plate 102 protrudes from the third side plate 103.

[0073] Specifically, the length direction of the flow guide member 10 is the second direction Y. The second side plate 102 protruding from the third side plate 103 enables the dimension of the second side plate 102 in the second direction Y to be greater than that of the fourth side plate 104. The second side plate 102 can be fixed to other structures, and the larger second side plate 102 can increase the fixing area with other structures, thereby improving the structural strength of the flow guide member 10.

[0074] Please refer to Figure 1 and Figure 3 , in some embodiments, the first outlet 15 includes a plurality of them, and the plurality of first outlets 15 are distributed on the first side plate 101.

[0075] Specifically, the shape of the cross-section of the first outlet 15 includes but is not limited to a regular circle, an ellipse, a polygon, etc. The shapes of the cross-sections of the plurality of first outlets 15 can be the same or different. For example, in some embodiments, the shapes of the first outlets 15 are all squares. The plurality of first outlets 15 can be randomly distributed, can be arranged in an array, or can be serpentinely distributed, which is not limited in this application. In this application. The plurality of first outlets 15 are arranged in an array, which is beneficial to the processing and forming of the first outlets 15 on the first side plate 101.

[0076] Please refer to Figure 1 and Figure 3 , in some embodiments, the heat dissipation structure 100 further includes an air outlet assembly 50. The air outlet assembly 50 is disposed on the third side 303 of the loading member 30 and is opposite to the second inlet 35 of the air duct 313 away from the second outlet 317. The air outlet assembly 50 is used to blow air toward the second inlet 35.

[0077] Specifically, the third side 303 and the first side 301 are opposite sides in the second direction Y. The air outlet assembly 50 is used to generate an air flow. The air outlet assembly 50 includes but is not limited to a fan, a blower, an air conditioner, etc. The air outlet assembly 50 can be one or more. In this application, there is one air outlet assembly 50. The air outlet assembly 50 being opposite to the second inlet 35 can directly blow the air flow from the second inlet 35 into the air duct 313 along the shortest path from the air outlet assembly 50 to the second inlet 35, improving the heat dissipation efficiency.

[0078] Please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5, an embodiment of the present application provides a flow guide member 10. The flow guide member 10 includes a first side plate 101, a second side plate 102, a third side plate 103, and a fourth side plate 104. One end of the first side plate 101 is connected to one end of the second side plate 102, the other end of the second side plate 102 is connected to one end of the third side plate 103, and the other end of the third side plate 103 is connected to the fourth side plate 104 to form a cavity 11. A first inlet 13 is provided at one end of the fourth side plate 104 close to the first side plate 101, and a first outlet 15 is provided on the first side plate 101. The cavity 11 communicates with the first inlet 13 and the first outlet 15.

[0079] It can be understood that the flow guide member 10 is the same as the aforementioned flow guide member 10 located in the heat dissipation structure 100. Therefore, the flow guide member 10 also has the beneficial effects of the heat dissipation structure 100 described in any of the above embodiments.

[0080] In the flow guide member 10 of the present application, after the air flow flows out from components such as the air outlet component 50 that can generate air flow, on the heat dissipation structure 100 provided with the flow guide member 10, there are at least two air outlet paths for the air flow. The first air outlet path is that a part of the air flow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313 and then flows out from the second outlet 317. The second air outlet path is that a part of the air flow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313, enters the cavity 11 from the first inlet 13, and then flows out along the first outlet 15. Thus, by increasing the air outlet paths of the air flow, the flow guide member 10 can improve the heat dissipation effect of the heat dissipation structure 100.

[0081] Please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5 , an embodiment of the present application provides a heat dissipation module 1000. The heat dissipation module 1000 includes the heat dissipation structure 100 of any of the above embodiments and the first component to be heat dissipated 300. The first component to be heat dissipated 300 is installed on the loading position 311.

[0082] In the heat dissipation module 1000 of the present application, after the air flow flows out from components such as the air outlet component 50 that can generate air flow, on the heat dissipation structure 100 provided with the flow guide member 10, there are at least two air outlet paths for the air flow. The first air outlet path is that a part of the air flow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313 and then flows out from the second outlet 317. The second air outlet path is that a part of the air flow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313, enters the cavity 11 from the first inlet 13, and then flows out along the first outlet 15. Thus, by increasing the air outlet paths of the air flow, the flow guide member 10 can improve the heat dissipation effect of the heat dissipation structure 100.

[0083] Please refer to Figure 1 andFigure 3 , in some embodiments, the heat dissipation module 1000 further includes a second component to be cooled 500. The flow guide member 10 is located between the loading member 30 and the second component to be cooled 500. The second side plate 102 of the flow guide member 10 is mounted on one side of the second component to be cooled 500, and the air outlet assembly 50 of the heat dissipation structure 100 is also used to blow air toward the second component to be cooled 500.

[0084] Specifically, the second component to be cooled 500 can be one or more. Multiple second components to be cooled 500 can be arranged in a tiled manner in the first direction X, or in the second direction Y, or in a stacked manner in the third direction Z, which is not limited in this application. Mounting the second side plate 102 of the flow guide member 10 on one side of the second component to be cooled 500 can improve the fixing strength of the heat dissipation structure 100. The heat dissipation structure 100 and the second component to be cooled 500 can be directly connected or can be connected through a spacer plate, and are respectively connected through the spacer plate. The air outlet assembly 50 is also used to blow air toward the second component to be cooled 500, which can enable the first component to be cooled 300 and the second component to be cooled 500 to share one air outlet assembly 50, thereby saving space.

[0085] Please refer to Figure 1 and Figure 3 , in some embodiments, the air outlet assembly 50 includes a first air outlet unit 51 and a second air outlet unit 52. The first air outlet unit 51 and the second air outlet unit 52 are arranged at intervals in the direction from the fourth side plate 104 to the second side plate 102 of the flow guide member 10. The air outlet of the first air outlet unit 51 faces the second inlet 35, and the air outlet of the second air outlet unit 52 faces the second component to be cooled 500.

[0086] Specifically, the first air outlet unit 51 and the second air outlet unit 52 are arranged at intervals in the first direction X. Correspondingly, the air outlet of the first air outlet unit 51 faces the second inlet 35, and the air outlet of the second air outlet unit 52 faces the second component to be cooled 500, that is, the first component to be cooled 300 and the second component to be cooled 500 are arranged at intervals in the first direction X. Thus, it can make the first air outlet unit 51 face the first component to be cooled 300, and the second air outlet unit 52 face the second component to be cooled 500, with a neat layout and a clear air flow path, so that the air flow flowing into the first component to be cooled 300 and the second component to be cooled 500 will not interfere with each other, improving the heat dissipation efficiency of the heat dissipation module 1000.

[0087] Please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5 , an embodiment of the present application provides an electronic device 10000, and the electronic device 10000 includes the heat dissipation module 1000 of any one of the above embodiments.

[0088] Specifically, the heat dissipation module 1000 disclosed in the present application can be used in an electronic device 10000. The electronic device 10000 includes, but is not limited to, a server, a data center, a supercomputer, etc. These electronic devices 10000 need to maintain a high power during operation to maintain the normal operation of their internal components. Therefore, the internal components also have a high demand for heat dissipation. Hereinafter, the present application will be described only by taking the electronic device 10000 as a server as an example. The server can be applied to various scenarios such as cloud computing, big data analysis, online services, and enterprise operations. The server can be a traditional physical server, a virtualized server, or a cloud server, etc. A heat dissipation module 1000 is provided inside the server, and the heat dissipation module 1000 can be provided inside or outside the server. The heat dissipation module 1000 can be used for heat dissipation of the server. For example, it can dissipate heat for the processor, memory, storage device, and other components of the server. The server can also include a control unit and a network interface card. The control unit is used to manage the heat dissipation module 1000 to dissipate heat for each component of the server to ensure the stable operation of the server.

[0089] In the electronic device 10000 provided by the present application, after the airflow flows out from components such as the air outlet component 50 that can generate airflow, on the heat dissipation structure 100 provided with the flow guiding member 10, there are at least two air outlet paths for the airflow in total. The first air outlet path is that a part of the airflow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313 and then flows out from the second outlet 317. The second air outlet path is that a part of the airflow passes through the first component to be heat dissipated 300 on the loading position 311 along the air duct 313, enters the cavity 11 from the first inlet 13, and then flows out from the first outlet 15. Thus, by increasing the air outlet paths of the airflow, the flow guiding member 10 can improve the heat dissipation effect of the heat dissipation structure 100.

[0090] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to the embodiments of the present application without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A flow guide (10), characterized in that: The flow guide (10) comprises a first side plate (101), a second side plate (102), a third side plate (103) and a fourth side plate (104); the first side plate (101) is connected to one end of the second side plate (102); the other end of the second side plate (102) is connected to one end of the third side plate (103); the other end of the third side plate (103) is connected to the fourth side plate (104) to form a cavity (11); a first inlet (13) is provided at one end of the fourth side plate (104) close to the first side plate (101); the first side plate (101) is provided with a first outlet (15); and the cavity (11) is connected to the first inlet (13) and the first outlet (15).

2. The flow guide (10) according to claim 1, characterized in that: In the length direction of the guide member (10), the second side plate (102) protrudes from the third side plate (103).

3. The flow guide (10) according to claim 1, characterized in that: The first outlet (15) comprises a plurality of first outlets (15), and the plurality of first outlets (15) are distributed on the first side plate (101).

4. A heat dissipation structure (100), characterized in that: include: The flow guide (10) as claimed in any one of claims 1 to 3.

5. A heat dissipation structure (100), characterized in that: include: A flow guide (10), wherein the flow guide (10) is provided with a cavity (11) and a first inlet (13); and An air duct (313), wherein the air duct (313) is in communication with the first inlet (13) through the cavity (11).

6. The heat dissipation structure (100) according to claim 5, characterized in that: The flow guide (10) further comprises a first outlet (15), the first inlet (13) and the first outlet (15) are respectively located on two adjacent sides of the flow guide (10), and the first inlet (13) is connected to the first outlet (15) through the cavity (11).

7. The heat dissipation structure (100) according to claim 6, characterized in that: The heat dissipation structure (100) further comprises a loading member (30), on which a loading position (311) for mounting a first heat dissipation member (300) to be dissipated and the air duct (313) are provided, and the loading position (311) is arranged on the air duct (313).

8. The heat dissipation structure (100) according to claim 7, characterized in that: The loading member (30) is also provided with a second outlet (317), and the air duct (313) is in communication with the second outlet (317).

9. The heat dissipation structure (100) according to claim 8, characterized in that: The second outlet (317) is located on the first side (301) of the loading position (311), the flow guide (10) is arranged on one side of the loading position (30), the first inlet (13) is located on the second side (302) of the loading position (311), and the second side (302) and the first side (301) are connected.

10. The heat dissipation structure (100) according to claim 8, characterized in that: The first outlet (15) and the second outlet (317) are located on the same side of the heat dissipation structure (100).

11. The heat dissipation structure (100) according to claim 8, characterized in that: The loading member (30) comprises: A loading unit (31), the loading position (311) being arranged on the loading unit (31), and the air duct (313) being formed on the loading unit (31); and A partition plate (33), wherein the partition plate (33) is arranged at one end of the loading unit (31) and connected to the loading unit (31); an extension direction of the loading unit (31) is perpendicular to an extension direction of the partition plate (33).

12. The heat dissipation structure (100) according to claim 11, characterized in that: The loading unit (31) comprises a plurality of loading parts (315). In the height direction of the partition plate (33), the plurality of loading parts (315) are stacked to form a plurality of air ducts (313), and at least one of the loading parts (315) is provided with the loading position (311).

13. The heat dissipation structure (100) according to claim 11, characterized in that: There are a plurality of the second outlets (317), and the plurality of the second outlets (317) are distributed on the partition plate (33).

14. The heat dissipation structure (100) according to claim 6, characterized in that: The flow guide (10) comprises a first side plate (101), a second side plate (102), a third side plate (103) and a fourth side plate (104); the first side plate (101) is connected to one end of the second side plate (102); the other end of the second side plate (102) is connected to one end of the third side plate (103); the other end of the third side plate (103) is connected to the fourth side plate (104) to form a cavity (11); a first inlet (13) is provided at one end of the fourth side plate (104) close to the first side plate (101); the first side plate (101) is provided with a first outlet (15); and the cavity (11) is connected to the first inlet (13) and the first outlet (15).

15. The heat dissipation structure (100) according to claim 14, characterized in that: In the direction from the first side plate (101) to the third side plate (103), the second side plate (102) protrudes from the third side plate (103).

16. The heat dissipation structure (100) according to claim 14, characterized in that: The first outlet (15) comprises a plurality of first outlets (15), and the plurality of first outlets (15) are distributed on the first side plate (101).

17. The heat dissipation structure (100) according to claim 8, characterized in that: Also includes: An air outlet component (50) is disposed on the third side (303) of the loading member (30) and is opposite to a second inlet (35) of the air duct (313) away from the second outlet (317), and the air outlet component (50) is used to blow air toward the second inlet (35).

18. A heat dissipation module (1000), characterized in that: include: The heat dissipation structure (100) according to any one of claims 5 to 17; and A first heat dissipation component (300) is installed at a loading position (311) of the heat dissipation structure (100).

19. The heat dissipation module (1000) according to claim 18, characterized in that: The air outlet assembly (50) of the heat dissipation structure (100) comprises a first air outlet unit (51), and the air outlet of the first air outlet unit (51) is opposite to the second inlet (35) of the heat dissipation structure (100).

20. The heat dissipation module (1000) according to claim 18, characterized in that: Also includes: A second heat element (500) to be cooled, the guide member (10) being located between the loading member (30) and the second heat element (500) to be cooled, the second side plate (102) of the guide member (10) being installed on one side of the second heat element (500) to be cooled, and the air outlet assembly (50) of the heat dissipation structure (100) being further used for blowing air toward the second heat element (500) to be cooled.

21. The heat dissipation module (1000) according to claim 20, characterized in that: The air outlet assembly (50) further comprises a second air outlet unit (52); the first air outlet unit (51) and the second air outlet unit (52) of the air outlet assembly (50) are arranged at intervals in a direction from the fourth side plate (104) to the second side plate (102) of the air guide member (10); and an air outlet of the second air outlet unit (52) is opposite to the second heat element (500) to be cooled.

22. An electronic device (10000), characterized in that: include: The heat dissipation module (1000) as described in any one of claims 18 to 21.

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