PIN structure of light emitting diode

Abstract

The utility model relates to the technical field of light-emitting diodes, in particular to a PIN structure of a light-emitting diode. By means of the supporting parts arranged on the supporting feet, when the light-emitting diodes are placed in the mounting holes of the PCB, the supporting feet can be prevented from falling continuously, the distance between the light-emitting diode colloid and the PCB is limited, and therefore it is guaranteed that in the high-temperature welding process, heat transferred to the light-emitting diode colloid from the PCB is reduced, and the heat dissipation efficiency of the light-emitting diodes is improved. The deformation of the colloid caused by temperature is reduced, so that the stability of a circuit in the colloid is ensured, the normal light emitting of the light emitting diode is ensured, the supporting parts on the supporting legs are bent, the processing of the supporting parts can be greatly facilitated, and meanwhile, the stability of the bent parts can be further ensured by setting the relative positions of the bent parts; electrical potential safety hazards are avoided; the problem that in the prior art, in the high-temperature welding process of a light-emitting diode, due to the fact that colloid makes direct contact with a PCB, a short circuit and other dead lamps are possibly caused is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of light-emitting diodes, and specifically to a PIN foot structure of a light-emitting diode. Background Art

[0002] When using a light-emitting diode at the application end, generally, the pins of the light-emitting diode are inserted into the mounting holes of the PCB board. Under the action of gravity, the pins will slide down all the way until the bottom of the light-emitting diode colloid is flat against the PCB board, and then the light-emitting diode is welded by high-temperature wave soldering or reflow soldering.

[0003] However, during the high-temperature welding process of the light-emitting diode, since the colloid is in direct contact with the PCB board and the PCB board is heated during welding, the surface temperature of the PCB board is relatively high, which will cause excessive internal stress in the colloid of the light-emitting diode in contact with it, resulting in deformation of the colloid, and thus components such as chips encapsulated inside the colloid may be misaligned, leading to short circuits and other situations where the lamp does not light up. The conventional usage method is generally to use epoxy resin outer-sealing glue with different standards to increase the high-temperature resistance of the light-emitting diode, but this will increase the cost of the epoxy resin glue. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a PIN foot structure of a light-emitting diode, which solves the problem that the colloid of the light-emitting diode in the prior art may cause short circuits and other situations where the lamp does not light up when directly contacting the PCB board during the high-temperature welding process.

[0005] To achieve the above object, the utility model provides the following technical solutions:

[0006] A PIN foot structure of a light-emitting diode includes a colloid encapsulating a light-emitting diode chip and pins serving as the positive and negative electrodes of the light-emitting diode. A support portion for preventing the pins from falling in the mounting holes of the PCB board is provided on the pins;

[0007] The distance between the support portion on any one of the pins and the other pin is greater than or equal to the pin pitch between the two pins, and the two support portions are symmetric about the central position of the two pins.

[0008] Preferably, the support portion is a protrusion provided on the pin.

[0009] Preferably, the protrusion on the pin is provided on the side away from the other pin.

[0010] Preferably, the support portion is a curved portion provided on the pin, and the curved portion is provided on the side of the corresponding pin away from the other pin.

[0011] Preferably, the distance between the supporting part and the colloid is not less than 4 mm.

[0012] Preferably, the supporting part is a bent part arranged on the supporting leg.

[0013] Preferably, the bent part is half a rhombus, and the angle at the sharp corner is greater than 45°.

[0014] Compared with the prior art, the present utility model provides a PIN foot structure of a light-emitting diode, having the following beneficial effects:

[0015] 1. By providing the supporting part on the supporting leg, when the light-emitting diode is placed into the mounting hole of the PCB board, the continuous falling of the supporting leg can be blocked, and the distance between the colloid of the light-emitting diode and the PCB board can be limited, so as to ensure that during the high-temperature soldering process, the heat transferred from the PCB board to the colloid of the light-emitting diode is reduced, and the deformation of the colloid caused by temperature is reduced, so as to ensure the stability of the circuit in the colloid and ensure that the light-emitting diode can emit light normally.

[0016] 2. By setting the supporting part on the supporting leg to be bent, the processing of the supporting part can be greatly facilitated, and by setting the relative position of the bent part, the stability of the bent part can be further ensured, and electrical safety hazards can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings:

[0018] Figure 1 is a schematic diagram of Embodiment 1 of the present utility model;

[0019] Figure 2 is a schematic diagram of Embodiment 2 of the present utility model;

[0020] Figure 3 is a schematic diagram of Embodiment 3 of the present utility model.

[0021] In the figure: 1, colloid; 2, supporting leg; 3, supporting part. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following will describe in detail the embodiments of the present application in conjunction with the drawings and embodiments, so as to fully understand how the present application uses technical means to solve technical problems and achieve the realization process of technical effects and implement accordingly.

[0023] Embodiment 1

[0024] To solve the problem that in the prior art, during the high-temperature soldering process of light-emitting diodes, the colloid 1 directly contacting the PCB board may cause short circuits and other problems resulting in the failure of the lights to light up. This embodiment provides a PIN foot structure for a light-emitting diode, including a colloid 1 encapsulating a light-emitting diode chip, and pins 2 serving as the positive and negative electrodes of the light-emitting diode. A support portion 3 is provided on the pin 2 to prevent the pin 2 from falling in the mounting hole of the PCB board. When the pin 2 is inserted into the mounting hole of the PCB board, the pin 2 and the colloid 1 as a whole will slide inward along the mounting hole. At this time, due to the effect of the support portion 3, when the pin 2 slides downward to the support portion 3, the size at the position of the support portion 3 cannot pass through the mounting hole, so that the pin 2 and the colloid 1 as a whole will stop at the support portion 3, so that the colloid 1 of the light-emitting diode does not directly contact the surface of the PCB board, thereby reducing the heat transfer efficiency between the colloid 1 and the PCB board, thereby reducing the temperature rise amplitude of the colloid 1, thereby reducing the deformation of the colloid 1, thereby protecting the internal circuit from short circuits and other phenomena. The distance between the support portion 3 on any one pin 2 and the other pin 2 is greater than or equal to the pitch between the two pins 2. The two support portions 3 are symmetric about the central position of the two pins 2 to ensure that the positions of the two added support portions 3 can meet the requirements of the pitch for electrical safety between the two pins 2, so as to ensure that the modified light-emitting diode will not have electrical safety failures during use.

[0025] Here, the support portion 3 can be in the form of a protrusion provided on the pin 2. The diameter of the protrusion is greater than the diameter of the mounting hole on the PCB board to prevent the pin 2 from falling. The protrusion can be made of other materials such as more heat-resistant colloid 1 or metal, etc., which can prevent melting when contacting the PCB and under the condition of high-temperature soldering. And, the protrusion on the pin 2 can be further arranged on the side away from the other pin 2, as Figure 1 shown. In this way, when adding the protrusions, there is no need to further measure the distance between the protrusions, which can ensure that the distance between the two protrusions is greater than the pitch between the two pins 2, and it can be directly visually inspected, which is more convenient.

[0026] To further fully ensure that when the PCB is soldered, the temperature on its surface will not cause excessive deformation of the colloid 1 after being transferred to the colloid 1, resulting in a failure of its internal circuit, the distance between the support portion 3 and the colloid 1 is not less than 4 mm, so as to meet this requirement.

[0027] Embodiment Two

[0028] To achieve the same technical effect as in Embodiment One, the support portion 3 can also adopt other structures. For example, the support portion 3 is a curved portion provided on the pin 2. Figure 2Shown is a spiral structure. Of course, other curved structures can also be adopted, as long as the curved part cannot pass through the mounting holes on the PCB. Since the compressive performance of the curved part is relatively weak, in order to prevent the distance between the two curved parts from being less than the pin pitch after the curved part is compressed, the curved part is arranged on the corresponding leg 2 on the side away from the other leg 2, as Figure 2 shown in, the curved part on the leg 2 will not cross the dotted line, so as to ensure that the pin pitch after the curved part is deformed can also meet the requirements.

[0029] Embodiment Three

[0030] Embodiment Three is a further improvement on the basis of Embodiment One, and the same technical effect as Embodiment One can be achieved without using additional materials.

[0031] Compared with Embodiment One, what is more optimized in Embodiment Three is that the support part 3 is a bent part arranged on the leg 2. The bending method in Embodiment Three saves more materials compared with the scheme in Embodiment One, and is simpler than the treatment method of the leg 2 in Embodiment Two, and saves more process time.

[0032] In order to prevent the distance between the bent part and the leg 2 after bending from being too short and causing electrical safety, the bent part is a half diamond shape, and the angle at the sharp corner is greater than 45°, that is Figure 3 the angle at A in, on the one hand, can improve the stability after the leg 2 is inserted into the mounting hole of the PCB board, and at the same time ensure its electrical safety performance. And even if the light-emitting diode is subjected to external force during installation or transportation, the distance between the two bent parts will not be reduced to less than the pin pitch, improving safety.

[0033] It should be noted that in this article, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PIN pin structure of a light emitting diode, comprising a colloid (1) encapsulating a light emitting diode chip, and legs (2) serving as positive and negative electrodes of the light emitting diode, characterized in that: The support foot (2) is provided with a support portion (3) for preventing the support foot (2) from falling into the mounting hole of the PCB board; The distance between the support portion (3) on any of the supporting legs (2) and the other supporting leg (2) is greater than or equal to the distance between the two supporting legs (2), and the two supporting portions (3) are symmetrical about the center positions of the two supporting legs (2); The support portion (3) is a bent portion arranged on the support leg (2); the bent portion is half a rhombus, and the angle at the sharp corner is greater than 45°.

2. The PIN pin structure of a light emitting diode according to claim 1, characterized in that: The distance between the support portion (3) and the colloid (1) is not less than 4 mm.

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