Light-emitting substrate, packaging unit, light-emitting device and vehicle lamp control system
By designing the distribution method of light emitting strings and pads in the light emitting substrate and packaging monomer, the problems of excessive spacing between light emitting units, cumbersome assembly process and high production costs in matrix car lights are solved, and the effects of tight distribution, simplification of assembly and reduction of costs are achieved.
Patent Information
- Application Number
- CN202422132890.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-30
AI Technical Summary
The existing matrix lights have problems such as excessive spacing between the luminous unit, cumbersome assembly process and high production costs.
A light emitting substrate and packaging monomer design is adopted, in which the light emitting strings are distributed in one area and the pads are distributed in another area, through which the layout enables the light emitting units to be closely distributed and simplifies the assembly process while reducing the need for pads to reduce costs.
It realizes the reduction of the spacing between the light emitting units, simplifies the assembly process, and reduces the production cost of matrix headlights.
Smart Images
Figure CN223024884U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field, and particularly relates to a light-emitting substrate, a packaging unit, and a light-emitting device. Background Art
[0002] Automobiles are becoming more and more popular in daily life. Vehicle lamps are the soul of automobiles, which requires that vehicle lamps not only have high recognition, but also their functionality and safety are increasingly valued by people.
[0003] As Figure 1 and Figure 2 shown, the existing matrix vehicle lamp 100 includes a circuit substrate 110 and a plurality of packaging units 120. The plurality of packaging units 120 are arranged in an array on the circuit substrate 110. The packaging unit 120 includes a packaging substrate 121, a light-emitting unit 122, a pad 123, a packaging layer 124, and a lead frame 125. The lead frame 125 is disposed on the packaging substrate 121, the light-emitting unit 122 is disposed on the lead frame 125, and the pad 123 is disposed on the packaging substrate 121 and outside the light-emitting unit 122. Two pads 123 corresponding to the light-emitting unit 122 are capable of independently controlling the corresponding light-emitting unit 122 to be turned on and off. The pads 123 are distributed adjacent to the corresponding light-emitting units 122. Each light-emitting unit 122 can be wire-bonded to the circuit substrate 110 through the pad 123 to establish an electrical connection between the light-emitting unit 122 and the circuit substrate 110.
[0004] The existing matrix vehicle lamp 100 has the following first problem and third problem. First problem, the distance between two adjacent light-emitting units 122 is too large. Second problem, the process of assembling the light-emitting unit 122 to the circuit substrate 110 is relatively cumbersome. Third problem, the manufacturing cost of the existing matrix vehicle lamp 100 is relatively high.
[0005] Therefore, how to reduce the distance between adjacent light-emitting units, how to simplify the assembly process of the light-emitting unit on the circuit substrate, and how to reduce the production cost of the matrix vehicle lamp are still technical problems that need to be urgently solved by those skilled in the art. Summary of the Utility Model
[0006] In view of this, to solve the above technical problems, the present application provides a light-emitting substrate, a packaging unit, a light-emitting device, and a vehicle lamp control system.
[0007] To solve the above technical problems, one of the technical solutions adopted in the present application is to provide a light-emitting substrate, which includes a packaging substrate, a light-emitting string, pads, and a packaging layer;
[0008] The encapsulated substrate has a plurality of mounting areas; the mounting areas include a first area and a second area located outside the first area; the light-emitting strings are distributed in the first area, the light-emitting strings include a plurality of light-emitting units connected in series, and the pads are distributed in the second area; the encapsulation layer covers all the light-emitting units, and the light-emitting units are constituted by a circuit including at least one LED chip;
[0009] Wherein, in the same mounting area, each light-emitting unit corresponds to two pads in the second area that can control the corresponding light-emitting unit to be independently lit and extinguished; and the part between two adjacent light-emitting units in the light-emitting string is connected to the same pad; the light-emitting strings of any one mounting area are insulated from the pads of other mounting areas.
[0010] To solve the above technical problems, another technical solution adopted by this application is to provide an encapsulation monomer, which includes an encapsulated substrate, a light-emitting string, pads and an encapsulation layer;
[0011] The encapsulated substrate has a first area and a second area located outside the first area and distributed along the edge of the encapsulated substrate; the light-emitting strings are distributed in the first area, the light-emitting strings include a plurality of light-emitting units connected in series, and a plurality of pads are distributed in the second area; the encapsulation layer covers all the light-emitting units, and the light-emitting units are constituted by a circuit including at least one LED chip;
[0012] Wherein, in the encapsulation monomer, each light-emitting unit corresponds to two pads in the second area that can control the corresponding light-emitting unit to be independently lit and extinguished; and the part between two adjacent light-emitting units in the light-emitting string is connected to the same pad.
[0013] To solve the above technical problems, another technical solution adopted by this application is to provide a lighting device, which includes a circuit board and at least one encapsulation monomer, and the encapsulation monomers are distributed in an array on the circuit board; the encapsulation monomer is the above-mentioned encapsulation monomer.
[0014] To solve the above technical problems, another technical solution adopted by this application is to provide a vehicle lamp control system, which includes:
[0015] A lighting device, which is the above-mentioned lighting device;
[0016] A sensing device for monitoring at least one of vehicle speed, weather conditions, road environment and oncoming vehicle conditions;
[0017] And a processor, which is electrically connected to each pad of the encapsulation monomer of the lighting device and the sensing device respectively through the circuit board of the lighting device.
[0018] Beneficial effects: Different from the prior art, the encapsulation monomer of this application has at least the following first to fourth effects.
[0019] The first effect is that the light-emitting strings are distributed in the first region, and multiple pads are distributed in the second region. With such an arrangement, the multiple light-emitting units of all the light-emitting strings distributed in the first region are separately distributed from the multiple pads distributed in the second region, so that the multiple light-emitting units distributed in the first region can be distributed more closely, and thus the pitch between the light-emitting units can be reduced.
[0020] The second effect is that in the encapsulation monomer, since the light-emitting string includes multiple serially connected light-emitting units, each light-emitting unit corresponds to two pads in the second region that can control the corresponding light-emitting unit to be independently lit and extinguished. In this way, when each encapsulation monomer is assembled onto the circuit board, the multiple independently lit light-emitting units in the encapsulation monomer can be assembled onto the circuit board. Furthermore, when the light-emitting device is used as a matrix headlight, the production efficiency of the matrix headlight can be improved and the production cost can be reduced.
[0021] The third effect is that in the encapsulation monomer, the portion between two adjacent light-emitting units in the light-emitting string is connected to the same pad. This enables two adjacent light-emitting units in the same light-emitting string to share one pad, thereby reducing the preparation cost of the encapsulation monomer. Also, since the encapsulation monomer is a component of the light-emitting device and the light-emitting device can be used as a matrix headlight, the purpose of reducing the production cost of the matrix headlight can be achieved.
[0022] The fourth effect is that in this way, the encapsulation layer covering multiple light-emitting units that can be independently lit and extinguished during the preparation of the encapsulation monomer of the present application can be formed by one-time filling and curing, thereby reducing the production cost of the encapsulation monomer, and further reducing the production cost of the light-emitting device. Description of the Drawings
[0023] Figure 1 is a schematic structural diagram of an existing matrix headlight;
[0024] Figure 2 is Figure 1 a schematic cross-sectional structure diagram of a single encapsulation monomer in Figure 2 For clearly showing each structure in, the area ratio of each structure shown does not represent the actual area ratio;
[0025] Figure 3 is a schematic structural diagram of the light-emitting device according to Embodiment 1 of the present application;
[0026] Figure 4 is a schematic structural diagram of the encapsulation monomer according to Embodiment 1 of the present application, Figure 4 in which the fluorescent sheet is not shown;
[0027] Figure 5 is a schematic cross-sectional structure diagram of a single encapsulation monomer according to Embodiment 1 of the present application, Figure 5For clearly showing each structure, the area ratio of each structure shown does not represent the actual area ratio;
[0028] Figure 6 It is a schematic circuit structure diagram of the encapsulation monomer of Embodiment 1 of the present application, Figure 6 in which the dam body and the encapsulation layer are not shown;
[0029] Figure 7 It is a schematic structure diagram of the light-emitting substrate of Embodiment 1 of the present application, Figure 7 in which the phosphor sheet is not shown;
[0030] Figure 8 It is Figure 7 a schematic structure diagram of the installation area in, Figure 8 For clearly showing each structure, the area ratio of each structure shown does not represent the actual area ratio;
[0031] Figure 9 It is Figure 8 a schematic cross-sectional structure diagram of the installation area in, Figure 9 For clearly showing each structure, the area ratio of each structure shown does not represent the actual area ratio;
[0032] Figure 10 It is a schematic circuit structure diagram of the light-emitting substrate of Embodiment 1 of the present application, Figure 10 in which the dam body and the encapsulation layer are not shown;
[0033] Figure 11 It is a schematic structure diagram of the light-emitting substrate of Embodiment 2 of the present application, Figure 11 in which the phosphor sheet is not shown;
[0034] Figure 12 It is Figure 11 a schematic structure diagram of the installation area in, Figure 12 For clearly showing each structure, the area ratio of each structure shown does not represent the actual area ratio;
[0035] Figure 13 It is a schematic circuit structure diagram of the light-emitting substrate of Embodiment 2 of the present application, Figure 13 in which the dam body and the encapsulation layer are not shown;
[0036] Figure 14 It is a schematic structure diagram of the light-emitting substrate of Embodiment 3 of the present application, Figure 14 in which the phosphor sheet is not shown;
[0037] Figure 15 It is Figure 14 a schematic structure diagram of the installation area in, Figure 15 For clearly showing each structure, the area ratio of each structure shown does not represent the actual area ratio;
[0038] Figure 16 It is a schematic diagram of the circuit structure of the light-emitting substrate according to Embodiment 3 of the present application. Figure 16 The middle dam body and the encapsulation layer are not shown.
[0039] Figure 17 It is a schematic diagram of the modules of the vehicle headlight control system of the present application.
[0040] Description of reference numerals:
[0041] Matrix vehicle headlight 100; circuit substrate 110; encapsulation monomer 120; encapsulation substrate 121; light-emitting unit 122; pad 123; encapsulation layer 124; lead frame 125;
[0042] Light-emitting device 200; circuit substrate 210; encapsulation monomer 220;
[0043] Light-emitting substrate 300; encapsulation substrate 310; light-emitting string 320; light-emitting unit 321; first electrical connection line 322; pad 330; encapsulation layer 340; phosphor sheet 341; filling part 342; electrode lead-out line 350; dam body 360; filling groove 370; second electrical connection line 380; lead frame 390; installation area A; first area S; first sub-area S-1; second sub-area S-2; second area P; front side B1 of encapsulation substrate 310; back side B2 of encapsulation substrate 310; first direction L; second direction G; thickness direction H of encapsulation substrate 310; first light-emitting unit S1; second light-emitting unit S2; third light-emitting unit S3; first pad P1; second pad P2; third pad P3; fourth pad P4; vehicle headlight control system 400; sensing device 410; processor 420. Detailed implementation manners
[0044] To enable those skilled in the art to better understand the technical solutions of the present application, the following further describes the present application in detail with reference to the accompanying drawings and specific implementation manners. Obviously, the described implementation manners are only a part of the implementation manners of the present application, rather than all of them. All other implementation manners obtained by those of ordinary skill in the art based on the implementation manners in the present application without creative efforts shall fall within the scope of protection of the present application.
[0045] The following combines Figure 1 and Figure 2 , and the inventors have the following First Discovery to Third Discovery through research.
[0046] First Discovery, as Figure 1 and Figure 2As shown, in the existing matrix vehicle lamp 100, each independently lit and extinguished light-emitting unit 122 is generally composed of a single LED chip, and the pad 123 corresponding to each light-emitting unit 122 is distributed adjacent to the corresponding light-emitting unit 122. Thus, there is a pad 123 at the position between two adjacent light-emitting units 122, which results in too large a distance between two adjacent light-emitting units 122. In this regard, the inventor found ( Figure 1 and Figure 2 the relevant structure is not shown), by concentrating the distribution of multiple independently lit and extinguished light-emitting units in the first area and concentrating the distribution of the pads corresponding to the multiple light-emitting units in the second area, the distance between adjacent light-emitting units in the first area can be reduced.
[0047] The second discovery is that, as Figure 1 and Figure 2 shown, in the existing matrix vehicle lamp, when assembling the package unit 120 on the circuit board 110, each time a package unit 120 is assembled onto the circuit board 110, only one independently lit and extinguished light-emitting unit 122 can be assembled onto the circuit board 110, resulting in a rather cumbersome assembly process. In this regard, the inventor found ( Figure 1 and Figure 2 the relevant structure is not shown), by increasing the number of light-emitting units that can be independently lit in a single package unit, when each package unit is assembled onto the circuit board, the number of light-emitting units assembled onto the circuit board and capable of being independently lit and extinguished is increased, so that the production efficiency of the matrix vehicle lamp can be improved and the production cost can be reduced.
[0048] The third discovery is that in the existing matrix vehicle lamp 100, since each light-emitting unit 122 needs to be independently configured with two corresponding pads 123, the demand for pads 123 is relatively large, resulting in an increase in the manufacturing cost of the matrix vehicle lamp 100. In this regard, the inventor found ( Figure 1 and Figure 2 the relevant structure is not shown), by sharing pads among different light-emitting units, the demand for the number of pads can be reduced, achieving the purpose of reducing the production cost.
[0049] Based on the above first to third discoveries, the inventor proposed the following embodiments.
[0050] Embodiment 1
[0051] Refer to Figure 3, the light-emitting device 200 of the present application includes a circuit board 210 and at least one packaging unit 220. The packaging unit 220 is disposed on the circuit board 210 and electrically connected to the circuit board 210. Among them, the light-emitting device 200 includes, but is not limited to, a matrix-type vehicle lamp. Of course, in other embodiments, the light-emitting device 200 may be a lighting lamp used in a home living room, and the lighting lamp includes, but is not limited to, one of a chandelier, a ceiling lamp, a wall lamp, a table lamp, and a floor lamp, but is not limited thereto. In another embodiment, the light-emitting device 200 may be a handheld lighting lamp.
[0052] Combined with Figure 3 Refer to Figures 4 - 6 , the packaging unit 220 includes a packaging substrate 310, a light-emitting string 320, pads 330, and a packaging layer 340.
[0053] The packaging substrate 310 has a first region S and a second region P located outside the first region S and distributed along the edge of the packaging substrate 310. The light-emitting string 320 is distributed in the first region S. The light-emitting string 320 includes a plurality of light-emitting units 321 connected in series. A plurality of pads 330 are distributed in the second region P. The packaging layer 340 covers all the light-emitting units 321. The light-emitting unit 321 is composed of a circuit including at least one LED chip.
[0054] Among them, in the packaging unit 220, each light-emitting unit 321 corresponds to two pads 330 in the second region P that can control the corresponding light-emitting unit 321 to be independently lit and extinguished. And the part between two adjacent light-emitting units 321 in the light-emitting string 320 is connected to the same pad 330. Each light-emitting unit 321 can be wire-bonded to the circuit board 210 through the pad 330 to establish an electrical connection between the light-emitting unit 321 and the circuit board 210.
[0055] Thus, the packaging unit 220 of the present application has at least the following first to fourth effects.
[0056] First effect, the light-emitting string 320 is distributed in the first region S, and a plurality of pads 330 are distributed in the second region P. In this way, the plurality of light-emitting units 321 of all the light-emitting strings 320 distributed in the first region S are separately distributed from the plurality of pads 330 distributed in the second region P, so that the plurality of light-emitting units 321 distributed in the first region S can be distributed more closely, and thus the distance between the light-emitting units 321 can be reduced.
[0057] Second effect: In the encapsulation unit 220, since the light-emitting string 320 includes a plurality of light-emitting units 321 connected in series, each light-emitting unit 321 has two pads 330 in the second region P that can control the corresponding light-emitting unit 321 to be independently lit and extinguished. Thus, each time an encapsulation unit 220 is assembled onto the circuit board 210, a plurality of independently lit light-emitting units 321 within the encapsulation unit 220 can be assembled onto the circuit board 210. Therefore, when the light-emitting device 200 is used as a matrix headlight, the production efficiency of the matrix headlight can be improved and the production cost can be reduced.
[0058] Third effect: In the encapsulation unit 220, the portion between two adjacent light-emitting units 321 in the light-emitting string 320 is connected to the same pad 330. In this way, two adjacent light-emitting units 321 in the same light-emitting string 320 can share one pad 330, thereby reducing the preparation cost of the encapsulation unit 220. Moreover, since the encapsulation unit 220 is a component of the light-emitting device 200 and the light-emitting device 200 can be used as a matrix headlight, the purpose of reducing the production cost of the matrix headlight can be achieved.
[0059] Fourth effect: Thus, during the preparation process of the encapsulation unit 220 of the present application, the encapsulation layer 340 covering a plurality of light-emitting units that can be independently lit and extinguished can be formed by one-time filling and curing, thereby reducing the production cost of the encapsulation unit 220, and further reducing the production cost of the light-emitting device 200.
[0060] Optionally, in combination with Figures 4 - 6 refer to Figures 7 - 10 , the encapsulation unit 220 can be obtained by cutting the light-emitting substrate 300, but it is not limited thereto. Optionally, the method of cutting the light-emitting substrate 300 includes but is not limited to laser cutting or blade cutting.
[0061] As Figures 7 - 10 shown, the light-emitting substrate 300 includes an encapsulation substrate 310, a light-emitting string 320, pads 330, and an encapsulation layer 340.
[0062] The encapsulation substrate 310 has a plurality of installation areas A distributed at intervals from each other. The installation area A includes a first region S and a second region P located outside the first region S. The light-emitting string 320 is distributed in the first region S. The light-emitting string 320 includes a plurality of light-emitting units 321 connected in series. A plurality of pads 330 are distributed in the second region P. The encapsulation layer 340 covers all the light-emitting units 321, and the light-emitting unit 321 is composed of a circuit including at least one LED chip.
[0063] Among them, in the same installation area A, each light-emitting unit 321 corresponds to two pads 330 in the second area P that can control the independent lighting and extinguishing of the light-emitting unit 321; and the part between two adjacent light-emitting units 321 in the light-emitting string 320 is connected to the same pad 330. The light-emitting string 320 of any one installation area A is insulated from the pads 330 of other installation areas A, so that the light-emitting substrate 300 can be divided into multiple packaging monomers 220. Each packaging monomer 220 includes a packaging substrate 310, a light-emitting string 320, a pad 330, and a packaging layer 340 in the same installation area A.
[0064] Through the above method, the light-emitting substrate 300 of the present application has at least the following first effect to the second effect.
[0065] First effect, since in the light-emitting substrate 300, multiple installation areas A are distributed at intervals and the light-emitting string 320 of any one installation area A is insulated from the pads 330 of other installation areas A, the packaging layer 340 and the packaging substrate 310 of the light-emitting substrate 300 can be cut along the interval between two adjacent installation areas A, so as to cut the light-emitting substrate 300 into multiple independent packaging monomers 220.
[0066] Second effect, in the packaging monomer 220, since the light-emitting string 320 includes multiple light-emitting units 321 connected in series, each light-emitting unit 321 corresponds to two pads 330 in the second area P that can control the corresponding light-emitting unit 321 to light and extinguish independently; and in the light-emitting substrate 300, the packaging layer 340 covers all the light-emitting units 321, and the light-emitting unit 321 is composed of a circuit including at least one LED chip. Thus, the packaging layer 340 covering multiple LED chips in the preparation process of the light-emitting substrate 300 of the present application can be formed by one-time filling and curing, so as to reduce the production cost of the light-emitting substrate 300, and further reduce the production cost of the light-emitting device 200.
[0067] Optionally, as Figures 7 - 10 shown, looking down from the side of the packaging substrate 310 facing the light-emitting unit 321 to the packaging substrate 310, the mathematical concept set formed by the outer shapes of multiple installation areas A is the first set, and the first set satisfies the first condition. The first condition is that if all the outer shapes in the first set are combined into a larger figure by at least one of translation and rotation, the outer shapes in the first set can be arranged together in a completely non-overlapping and almost gapless manner. Thus, the outer shape of the installation area A can be one of a rectangle, an equilateral triangle, and a regular hexagon, but is not limited thereto.
[0068] In another example (not shown in the figures), when multiple sectors form a circle by at least one of translation and rotation, the multiple sectors can be arranged together in a way that there is no overlap and almost no gap left. Therefore, the shape of the installation area can be a sector. In still another example (not shown in the figures), the first set may also not meet the first condition.
[0069] Optionally, as Figures 7 - 10 shown, define the two opposite side surfaces of the encapsulation substrate 310 along the thickness direction as the front surface B1 and the back surface B2 of the encapsulation substrate 310 respectively. Among them, the encapsulation substrate 310 has a first direction L and a second direction G that are perpendicular to each other. The first direction L is perpendicular to the thickness direction H of the encapsulation substrate 310, and the second direction G is perpendicular to the first direction L and the thickness direction H of the encapsulation substrate 310. The first region S and the second region P are both distributed on the front surface B1 of the encapsulation substrate 310, and the back surface B2 of the encapsulation substrate 310 faces the circuit substrate 210.
[0070] Optionally, as Figures 7 - 10 shown, multiple installation areas A on the encapsulation substrate 310 are arranged in at least one row, and each row of installation areas A includes multiple installation areas A arranged in sequence along the first direction L. In the installation area A, multiple light-emitting units 321 of the light-emitting string 320 are arranged in sequence along the first direction L, and the first region S and the second region P are arranged along the second direction G.
[0071] Among them, between two adjacent light-emitting units 321 in each light-emitting string 320 and along the length direction of the light-emitting string 320, two electrodes that are relatively close to each other along the length direction of the light-emitting string 320 share one electrode lead wire 350 and are electrically connected to the same pad 330. Between two adjacent light-emitting units 321 in each light-emitting string 320 and along the length direction of the light-emitting string 320, one of the two electrodes that are relatively far apart from each other along the length direction of the light-emitting string 320 is electrically connected to a pad 330 through an electrode lead wire 350, and the other of the two electrodes that are relatively far apart from each other along the length direction of the light-emitting string 320 is electrically connected to another pad 330 through another electrode lead wire 350.
[0072] Through the above method, the light-emitting substrate 300 of the present application has at least the following first effect to the second effect. The first effect is that it can make the multiple installation areas A arranged more regularly and orderly, so that it is convenient to cut the encapsulation substrate 310 along the interval between two adjacent installation areas A subsequently. The second effect is that it is convenient to connect the part between two adjacent light-emitting units 321 in the light-emitting string 320 to the same pad 330.
[0073] It should be understood that Figure 7Exemplarily shown in the encapsulation substrate 310 of the light-emitting substrate 300 has a row of mounting areas A, and this row of mounting areas A includes two mounting areas A, namely the first mounting area A1 and the second mounting area A2 respectively. However, the number of mounting areas A included in the encapsulation substrate 310 of the light-emitting substrate 300 in Embodiment 1 is not limited to this. That is, in Embodiment 1, the number of mounting areas A in the encapsulation member 310 of the light-emitting substrate 300 can be more than two, and there can be multiple rows of mounting areas A.
[0074] Optionally, as Figures 7 - 10 shown, multiple light-emitting strings 320 are distributed in each first region S, and in each first region S, the multiple light-emitting strings 320 are arranged in multiple rows along the second direction G, so that in each first region S, all the light-emitting units 321 of the multiple light-emitting strings 320 are arranged in multiple rows and multiple columns.
[0075] In the above way, the regularity of the arrangement of all the light-emitting units 321 in each first region S is further increased, so as to facilitate the electrical connection of different light-emitting units 321 to the pads 330.
[0076] Optionally, the multiple mounting areas A on the encapsulation substrate 310 are arranged in multiple rows and multiple columns. Each column of mounting areas A includes multiple mounting areas A arranged in sequence along the second direction G.
[0077] Optionally, as Figures 7 - 10 shown, in the same mounting area A, second regions P are correspondingly arranged on both sides of the first region S along the second direction G in opposite directions. The first region S includes a first sub-region S-1 and a second sub-region S-2, and the first sub-region S-1 and the second sub-region S-2 are arranged in sequence along the second direction G.
[0078] The light-emitting units 321 of the first sub-region S-1 are correspondingly electrically connected to the pads 330 of the second region P on the side of the first sub-region S-1 facing away from the second sub-region S-2 and are insulated from the pads 330 of the second region P on the side of the second sub-region S-2 facing away from the first sub-region S-1. The light-emitting units 321 of the second sub-region S-2 are correspondingly electrically connected to the pads 330 of the second region P on the side of the second sub-region S-2 facing away from the first sub-region S-1 and are insulated from the pads 330 of the second region P on the side of the first sub-region S-1 facing away from the second sub-region S-2.
[0079] In the above way, the light-emitting units 321 in the first sub-region S-1 and the light-emitting units 321 in the second sub-region S-2 can be independently lit. Thus, when the light-emitting units 321 in the first sub-region S-1 are extinguished, it will not affect the normal lighting of the light-emitting units 321 in the second sub-region S-2, and when the light-emitting units 321 in the second sub-region S-2 are extinguished, it will not affect the normal lighting of the light-emitting units 321 in the first sub-region S-1.
[0080] Optionally, as Figures 7 - 10As shown, in two adjacent mounting areas A along the first direction L, the number of rows formed by all the light-emitting units 321 in one mounting area A is equal to the number of rows formed by all the light-emitting units 321 in the other mounting area A. Moreover, in two adjacent mounting areas A along the first direction L, the light-emitting units 321 in each row of one mounting area A are aligned with the light-emitting units 321 in one row of the other mounting area A along the first direction L.
[0081] Optionally, as Figures 7 - 10 shown, in two adjacent mounting areas A along the second direction G, the number of columns formed by all the light-emitting units 321 in one mounting area A is equal to the number of columns formed by the light-emitting units 321 in the other mounting area A. Moreover, in two adjacent mounting areas A along the second direction G, the light-emitting units 321 in each column of one mounting area A are aligned with the light-emitting units 321 in one column of the other mounting area A along the second direction G.
[0082] By the above method, the distribution rules of the light-emitting units 321 in different mounting areas A have high consistency, so that it is convenient to cut the encapsulation substrate 310 along the gap between two adjacent mounting areas A, and the light-emitting performance per unit area of each independent encapsulation monomer 220 formed is similar.
[0083] Optionally, as Figures 7 - 10 shown, the light-emitting substrate 300 includes a lead frame 390. The lead frame 390 is disposed on the encapsulation substrate 310, and the LED chips are disposed on the lead frame 390. The LED chips in the first region S are electrically connected to the electrode lead-out lines 350 through the lead frame 390.
[0084] Optionally, the LED chips are disposed on the lead frame 390 by one of eutectic bonding, conductive adhesive, AuSn solder paste, and flux, but not limited thereto.
[0085] As Figures 7 - 10 shown, the lead frame 390 includes a first electrical connection line 322. Two adjacent light-emitting units 321 in the light-emitting string 320 are connected in series through the first electrical connection line 322; wherein, two adjacent light-emitting units 321 in the light-emitting string 320 are electrically connected to the electrode lead-out line 350 through the first electrical connection line 322.
[0086] By the above method, the conductive wires required for the electrical connection pads 330 can be reduced, and thus the production cost of the light-emitting substrate 300 can be reduced.
[0087] Optionally, as Figures 7 - 10As shown, the encapsulation layer 340 includes a phosphor sheet 341 and a filling portion 342. A phosphor sheet 341 is correspondingly disposed on each light-emitting unit 321; the filling portion 342 is disposed on the encapsulation substrate 310 and is located on the outer periphery of the light-emitting unit 321 to wrap the side wall of the light-emitting unit 321 and expose the surface of the phosphor sheet 341 facing away from the light-emitting unit 321.
[0088] In the above manner, there are at least the following first effect to the second effect. First effect, the phosphor sheet 341 is used to receive the light emitted by the light-emitting unit 321 and convert the light emitted by the light-emitting unit 321 into light of a specific color. The specific color includes but is not limited to one or a mixture of multiple colors among red, green, and blue. Second effect, the filling portion 342 wrapping the side wall of the light-emitting unit 321 can cooperate with the phosphor sheet 341 and the encapsulation substrate 310 to isolate the light-emitting unit 321 from contact with moisture or oxygen, thereby playing a role in protecting the light-emitting unit 321. Optionally, the filling portion 342 includes but is not limited to a first optical adhesive.
[0089] Optionally, in the first example, the phosphor sheet 341 includes but is not limited to a second optical adhesive and phosphor particles, and the phosphor particles are distributed in the second optical adhesive.
[0090] Optionally, in the second example, the phosphor sheet 341 includes but is not limited to a light-transmitting ceramic and phosphor particles, and the phosphor particles are distributed in the light-transmitting ceramic.
[0091] Optionally, in the third example, the phosphor sheet 341 includes but is not limited to a light-transmitting glass and phosphor particles, and the phosphor particles are distributed in the light-transmitting glass.
[0092] Furthermore, as Figures 7 - 10 shown, the light-emitting substrate 300 includes a dam body 360, and the dam body 360 and the encapsulation substrate 310 enclose a filling groove 370. The first region S and the filling portion 342 are located in the filling groove 370, and the second region P is located outside the filling groove 370.
[0093] In the above manner, the dam body 360 can be used to block the optical adhesive to prevent the optical adhesive from flowing out of the first region S before curing. Optionally, the size of the dam body 360 in the thickness direction H of the encapsulation substrate 310 is 0.3 mm to 0.5 mm (including but not limited to 0.3 mm, 0.4 mm, 0.5 mm)
[0094] By way of example and not limitation, define positive integers n, i, and k, where 2 ≤ n, 1 ≤ i < n, 1 < k ≤ n, and i < k. Then each light-emitting string 320 includes n light-emitting units 321, and the n light-emitting units 321 are respectively the 1st light-emitting unit 321 to the nth light-emitting unit 321 sequentially distributed along the first direction L. Each second region P includes n + 1 pads 330, and the n + 1 pads 330 are respectively the 1st pad P1 to the (n + 1)th pad P(n + 1) sequentially distributed along the first direction L.
[0095] In the above manner, in the same installation area A, the pads 330 and the LED chips satisfy the second condition, and the second condition is that the ith pad Pi and the kth pad Pk can control the independent lighting and extinguishing of the area composed of the ith light-emitting unit Si to the (k - 1)th light-emitting unit Sk - 1.
[0096] It should be understood that the area composed of the ith light-emitting unit Si to the (k - 1)th light-emitting unit Sk - 1 is an overall composed of the areas where the k - i light-emitting units 321 are located, including the area where the ith light-emitting unit Si is located to the area where the (k - 1)th light-emitting unit Sk - 1 is located.
[0097] By way of example and not limitation, as Figures 7 - 10 shown, for example, n can be 3. Then, the 1st pad P1 and the 2nd pad P2 can control the independent lighting and extinguishing of the area composed of the 1st light-emitting unit S1, and the 2nd pad P2 and the 4th pad P4 can control the independent lighting and extinguishing of the area composed of the 2nd light-emitting unit S2 and the 3rd light-emitting unit S3. The following will not be listed one by one.
[0098] Embodiment 2
[0099] Comparison Figures 7 - 10 Refer to Figures 11 - 13 As shown, the parts of the light-emitting substrate 300 in Embodiment 2 that are the same as those in Embodiment 1 will not be described in detail. The differences between the light-emitting substrate 300 in Embodiment 2 and the light-emitting substrate 300 in Embodiment 1 are as follows.
[0100] Optionally, in the installation area A, a second region P is correspondingly provided on one of the two opposite sides of the first region S along the second direction G, and the second region P may not be provided on the other of the two opposite sides of the first region S along the second direction G. In this way, in the same installation area A, the part of the encapsulation substrate 310 on the other of the two opposite sides of the first region S along the second direction G can be made narrower to achieve the purpose of miniaturizing the light-emitting substrate 300.
[0101] The light-emitting substrate 300 includes a lead frame 390 disposed on the encapsulation substrate 310. The LED chips are disposed on the lead frame 390, and the LED chips in the first region S are electrically connected to the electrode lead-out wires 350 through the lead frame 390.
[0102] Optionally, the LED chips are disposed on the lead frame 390 by one of eutectic bonding, conductive adhesive, AuSn solder paste, and flux, but not limited thereto.
[0103] The lead frame 390 includes a first electrical connection line 322 and a second electrical connection line 380. Two adjacent light-emitting units 321 of the light-emitting string 320 are connected in series through the first electrical connection line 322. In the same first region S, two adjacent light-emitting units 321 in the same column are connected in parallel through the second electrical connection line 380. Among them, in the same mounting area A, the light-emitting units 321 in two adjacent columns are electrically connected to the electrode lead-out wires 350 through the first electrical connection line 322 closest to the corresponding pads 330.
[0104] In the above manner, the light-emitting units 321 in the same column are electrically connected to two different pads 330 through two electrode lead-out wires 350, so that the conductive wires required for electrically connecting the pads 330 can be reduced, and thus the production cost of the light-emitting substrate 300 can be reduced. Moreover, the light-emitting substrate 300 can be divided into encapsulation monomers 220, and the encapsulation monomers 220 are components of the light-emitting device 200. The light-emitting device 200 can be used as a matrix headlight, so the production cost of the matrix headlight can be reduced.
[0105] By way of example and not limitation, Figures 11 - 13 as shown, for example, n can be 2. Then, the first pad P1 and the second pad P2 can control the independent lighting and extinguishing of the area composed of the first light-emitting unit S1, the second pad P2 and the third pad P3 can control the independent lighting and extinguishing of the area composed of the second light-emitting unit S2, and the first pad P1 and the third pad 330 can control the independent lighting and extinguishing of the area composed of the first light-emitting unit 321 and the second light-emitting unit 321. The following will not be listed one by one.
[0106] Embodiment III
[0107] Comparison Figures 7 - 10 Refer to Figures 14 - 16 As shown, the parts of the light-emitting substrate 300 in Embodiment III that are the same as those of the light-emitting substrate 300 in Embodiment I will not be described in detail. The differences between the light-emitting substrate 300 in Embodiment III and the light-emitting substrate 300 in Embodiment I are as follows.
[0108] Optionally, in the installation area A, a second area P is correspondingly provided on one side of the two opposite sides of the first area S along the second direction G, and the second area P may not be provided on the other side of the two opposite sides of the first area S along the second direction G. In this way, the part of the encapsulation substrate 310 on the other side of the two opposite sides of the first area S along the second direction G can be made narrower, so as to achieve the purpose of miniaturizing the light-emitting substrate 300.
[0109] Optionally, each first area S is distributed with 1 light-emitting string 320. In the installation areas A in the same row, the light-emitting strings 320 of different installation areas A are aligned along the first direction L.
[0110] By way of example and not limitation, as Figures 14 - 16 shown, for example, n may be 2. Then, the first pad P1 and the second pad P2 can control the independent lighting and extinguishing of the area composed of the first light-emitting unit S1, the second pad P2 and the third pad P3 can control the independent lighting and extinguishing of the area composed of the second light-emitting unit S2, and the first pad P1 and the third pad 330 can control the independent lighting and extinguishing of the area composed of the first light-emitting unit 321 and the second light-emitting unit 321. The following will not be listed one by one.
[0111] The above is only the implementation manner of this application, and does not limit the patent scope of this application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.
Claims
1. A light-emitting substrate, characterized in that: The light-emitting substrate comprises a packaging substrate, a light-emitting string, a plurality of pads and a packaging layer; The packaging substrate has a plurality of mounting areas spaced apart from each other; the mounting area includes a first area and a second area outside the first area; the light-emitting string is distributed in the first area, the light-emitting string includes a plurality of light-emitting units connected in series, and a plurality of the pads are distributed in the second area; the packaging layer covers all the light-emitting units, and the light-emitting units are composed of a circuit including at least one LED chip; Among them, in the same installation area, each of the light-emitting units has two corresponding pads in the second area that can control the corresponding light-emitting units to light up and extinguish independently; and the part between two adjacent light-emitting units in the light-emitting string is connected to the same pad; the light-emitting units in any installation area are insulated from the pads in other installation areas.
2. The light-emitting substrate according to claim 1, characterized in that: The packaging substrate has a first direction and a second direction perpendicular to each other; the plurality of mounting areas on the packaging substrate are arranged into at least one row, and the mounting areas in each row include a plurality of mounting areas arranged in sequence along the first direction; in the mounting area, the plurality of light-emitting units of the light-emitting string are arranged in sequence along the first direction, and the first area and the second area are arranged along the second direction; the first direction is perpendicular to the thickness direction of the packaging substrate, and the second direction is perpendicular to the first direction and the thickness direction of the packaging substrate; Among them, in each of the light-emitting strings and between two of the light-emitting units adjacent to each other along the length direction of the light-emitting string, two electrodes that are close to each other along the length direction of the light-emitting string share an electrode lead wire electrically connected to the same soldering pad; in each of the light-emitting strings and between two of the light-emitting units adjacent to each other along the length direction of the light-emitting string, one of the two electrodes that are far apart from each other along the length direction of the light-emitting string is electrically connected to one of the soldering pads through an electrode lead wire, and the other of the two electrodes that are far apart from each other along the length direction of the light-emitting string is electrically connected to the other of the soldering pads through another electrode lead wire.
3. The light-emitting substrate according to claim 2, characterized in that: In the same installation area, the second areas are correspondingly arranged on both sides of the first area opposite to each other along the second direction, the first area includes a first sub-area and a second sub-area, and the first sub-area and the second sub-area are arranged in sequence along the second direction; The light-emitting unit of the first sub-region corresponds to the soldering pad electrically connected to the second area of the first sub-region on the side facing away from the second sub-region, and is insulated from the soldering pad of the second area of the second sub-region on the side facing away from the first sub-region; the second sub-region corresponds to the soldering pad electrically connected to the second area of the second sub-region on the side facing away from the first sub-region, and is insulated from the soldering pad of the second area of the first sub-region on the side facing away from the second sub-region.
4. The light-emitting substrate according to claim 2, characterized in that: A plurality of the light-emitting strings are distributed in each of the first regions, and in each of the first regions, the plurality of light-emitting strings are arranged into a plurality of rows along the second direction, so that all the light-emitting units of the plurality of light-emitting strings in each of the first regions are arranged into a plurality of rows and columns.
5. The light-emitting substrate according to claim 4, characterized in that: The light-emitting substrate comprises a lead frame, the lead frame is arranged on the packaging substrate, the LED chip is arranged on the lead frame, and the LED chip in the first area is electrically connected to the electrode lead wire through the lead frame; The lead frame includes a first electrical connection line and a second electrical connection line; two adjacent light-emitting units of the light-emitting string are connected in series through the first electrical connection line, and two adjacent light-emitting units in the same column in the same first region are connected in parallel through the second electrical connection line; Wherein, in the same mounting area, the light-emitting units in two adjacent columns are electrically connected to the electrode lead wires via the first electrical connection wires that are closest to the corresponding pads.
6. The light-emitting substrate according to claim 3 or 5, characterized in that: In two adjacent mounting areas along the first direction, the number of rows in which all the light-emitting units in one of the mounting areas are arranged is equal to the number of rows in which all the light-emitting units in the other of the mounting areas are arranged; and, in two adjacent mounting areas along the first direction, the light-emitting units in each row of one of the mounting areas are aligned with the light-emitting units in one row of the other of the mounting areas along the first direction; In two adjacent mounting areas along the second direction, the number of columns in which all the light-emitting units in one of the mounting areas are arranged is equal to the number of columns in which all the light-emitting units in the other of the mounting areas are arranged; and, in two adjacent mounting areas along the second direction, the light-emitting units in each column of one of the mounting areas are aligned with the light-emitting units in one column of the other of the mounting areas along the second direction.
7. The light-emitting substrate according to claim 1, characterized in that: The encapsulation layer includes a fluorescent sheet and a filling portion; The fluorescent sheet is correspondingly arranged on each LED chip; the filling portion is arranged on the packaging substrate and is located at the periphery of the LED chip to wrap the side wall of the LED chip and expose the surface of the fluorescent sheet facing away from the LED chip; The light emitting substrate comprises a dam, and the dam and the packaging substrate enclose a filling groove; the first area and the filling portion are located in the filling groove, and the second area is located outside the filling groove.
8. A packaging monomer, characterized in that: The packaging monomer comprises a packaging substrate, a light-emitting string, a pad and a packaging layer; The packaging substrate has a first area and a second area outside the first area and distributed along the edge of the packaging substrate; the light-emitting string is distributed in the first area, the light-emitting string includes a plurality of light-emitting units connected in series, and a plurality of the pads are distributed in the second area; the packaging layer covers all the light-emitting units, and the light-emitting units are composed of a circuit including at least one LED chip; Among them, in the packaging monomer, each of the light-emitting units has two corresponding pads in the second area that can control the corresponding light-emitting units to light up and extinguish independently; and the part between two adjacent light-emitting units in the light-emitting string is connected to the same pad.
9. A light emitting device, characterized in that: The light-emitting device comprises a circuit substrate and at least one packaging unit, wherein the packaging unit is arranged on the circuit substrate; the packaging unit is the packaging unit according to claim 8.
10. A vehicle light control system, characterized in that: The vehicle light control system comprises: A light-emitting device, wherein the light-emitting device is the light-emitting device according to claim 9; A sensor device for monitoring at least one of vehicle speed, weather conditions, road environment, and oncoming vehicles; and a processor, which is electrically connected to each of the pads of the package unit of the light-emitting device and to the sensor device through the circuit substrate of the light-emitting device.