Substrate laser splitting machine for circuit board production

Abstract

The utility model relates to a splitting machine, in particular to a substrate laser splitting machine for circuit board production. The substrate laser splitting machine for circuit board production comprises a first base, a second base, a screen, a first transmission set, a board taking mechanical arm, a board feeding table and the like, the second base is welded to the front portion of the first base, the first base is composed of an installation frame and an equipment platform, and the screen is rotationally installed on the left side of the upper portion of the first base. An upper plate table is fixedly arranged on the front side of the lower portion of the second base. According to the utility model, the plate is automatically taken and placed through the plate taking manipulator, and the manual plate feeding work of workers is not needed, so that the labor is saved, and the efficiency is higher.

Description

Technical Field

[0001] The utility model relates to a slitter, in particular to a substrate laser slitter for circuit board production. Background Art

[0002] Laser cutting and processing technology can be formed in one step. It has the advantages of no burrs, high precision, high speed, small cutting gap, high precision, and small heat affected zone. Compared with the traditional circuit board cutting process, circuit board cutting has no dust, no stress, no burrs, and the cutting edge is smooth and neat. Especially for printed circuit boards with processed welding parts, the parts will not be damaged, making it the choice of many enterprises.

[0003] Laser cutting of circuit boards usually requires cutting large sheets into the required sizes and shapes. Laser cutting can efficiently achieve precise cutting, ensuring the size and edge quality of the circuit board. During laser slitting, the circuit board is placed on the cutting equipment manually. The operator adjusts and positions the board manually based on visual information. The operation efficiency is low, the error rate is high, and there may be risks of production delay and cost increase. Content of the Utility Model

[0004] In order to overcome the disadvantages that during laser slitting, the circuit board is placed on the cutting equipment manually, the operator adjusts and positions the board manually based on visual information, with low operation efficiency, high error rate, and possible risks of production delay and cost increase, the purpose of the utility model is to provide a substrate laser slitter for circuit board production that uses automated machinery for board feeding, avoids the risk of personnel injury, realizes long-term stable feeding, improves the overall automation level of the enterprise, reduces the risks encountered due to human factors during production, and further optimizes the production process while ensuring the production quality of the circuit board.

[0005] The technical implementation solution of the present utility model is: a substrate laser slitter for circuit board production, including a first base, a second base, a screen, a first transmission group, a board-taking manipulator, an upper board table, a second transmission group, a cutting table, a lower board table, a support frame, a third transmission group and a laser cutting machine. The second base is welded to the front of the first base. The first base is composed of an installation frame and an equipment platform. The screen is rotatably installed on the upper left side of the first base. The upper board table is fixedly arranged on the front side of the lower part of the second base. The first transmission groups are installed on both the left and right sides of the upper part of the second base. Support frames are fixedly arranged on both the left and right sides of the equipment platform of the first base. The third transmission group is installed between the upper parts of the support frames. Both the first transmission group and the third transmission group are composed of a base plate, a lead screw and a servo motor. The board-taking manipulator is arranged between the first transmission groups. The board-taking manipulator is composed of a material-taking cylinder, a material-taking frame and a suction cup. The board-taking manipulator moves back and forth through the first transmission group. The laser cutting machine is arranged on the third transmission group. The laser cutting machine moves left and right through the third transmission group. The second transmission group is installed on the equipment platform of the first base. The second transmission group is composed of two interconnected guide rails, a lead screw and a servo motor. The cutting table is arranged on the second transmission group. The cutting table moves back and forth through the second transmission group. The lower board table is fixedly arranged on the rear side of the first base.

[0006] Furthermore, it also includes a fixed block, a rotating plate, a rotating rod, a spring and a top rod. Fixed blocks are symmetrically arranged on the left and right sides of the upper part of the cutting table. Rotating rods are rotatably arranged in the fixed blocks. A rotating plate is fixedly arranged between the two rotating rods. Springs are wound around the outer sides of the rotating rods. The two ends of the springs are respectively connected to the fixed block and the rotating plate. Top rods are symmetrically arranged on the left and right sides of the front part of the lower board table.

[0007] Furthermore, it also includes a positioning frame. The positioning frame is welded to the top of the upper board table and is in a U shape.

[0008] Furthermore, it also includes equipment protection. The equipment protection is installed between the upper parts of the installation frames on the first base.

[0009] Furthermore, it also includes transparent plates. Transparent plates are arranged on both the left and right sides of the equipment protection.

[0010] Furthermore, it also includes support feet. A number of support feet are symmetrically arranged in a threaded manner on both the left and right sides of the lower parts of the first base and the second base.

[0011] The present utility model has the following advantages: The present utility model automatically takes and places boards through the board-taking manipulator, eliminating the need for workers to manually load the boards, saving labor and having high efficiency.

[0012] The present utility model is provided with rotating rods. During the process of the cutting table moving for material discharging, the rotating rods contact the top rods, driving the rotating plate to tilt for material discharging, eliminating the need for manual removal of the cut circuit boards on the cutting table. The actions are continuous, improving the automation degree of the equipment and reducing the waste of labor costs and time costs. Description of the Drawings

[0013] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model.

[0014] Figure 2 This is a three-dimensional structural schematic diagram of the present utility model with the feeding mechanism and equipment protection removed.

[0015] Figure 3 This is a three-dimensional structural schematic diagram of components such as the cutting table, turntable, and rotating rod of the present utility model.

[0016] Figure 4 This is a three-dimensional structural schematic diagram of the lower plate table and the ejector rod of the present utility model.

[0017] In the above figures: 1: Base one, 2: Base two, 3: Equipment protection, 4: Screen, 5: Transmission group one, 6: Plate-taking manipulator, 7: Upper plate table, 8: Positioning frame, 9: Transmission group two, 10: Cutting table, 101: Lower plate table, 11: Support frame, 12: Transmission group three, 13: Laser cutting machine, 14: Fixed block, 141: Turntable, 142: Rotating rod, 143: Spring, 144: Ejector rod, 15: Transparent plate, 16: Support feet. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0019] Embodiment 1: A substrate laser slitter for circuit board production, as Figures 1-4As shown in the figure, it includes base one 1, base two 2, screen 4, drive group one 5, board-taking manipulator 6, upper board table 7, drive group two 9, cutting table 10, lower board table 101, support frame 11, drive group three 12 and laser cutting machine 13. Base two 2 is welded to the front of base one 1. Base two 2 is made of a relatively hard metal material. Base one 1 consists of an installation frame and an equipment platform. Screen 4 is rotatably installed on the upper left side of base one 1. Screen 4 is used to control and monitor the working status of each power component in the slitter. A upper board table 7 is fixedly provided on the lower front side of base two 2. Unslit circuit board substrates will be placed on the upper board table 7. When placing, multiple circuit boards need to be stacked upwards. When placing the circuit boards, they need to be placed at a relatively centered position on the top surface of the upper board table 7. Drive group one 5 is installed on both the left and right sides of the upper part of base two 2. Support frames 11 are fixedly provided on both the left and right sides of the equipment platform of base one 1. Drive group three 12 is installed between the upper parts of the support frames 11. Both drive group one 5 and drive group three 12 are composed of a base plate, a lead screw, and a servo motor. A board-taking manipulator 6 is provided between drive group one 5. The board-taking manipulator 6 is composed of a material-taking cylinder, a material-taking frame, and a suction cup. The left and right sides of the board-taking manipulator are connected to the lead screws on the left and right drive group one 5 through threads. The board-taking manipulator 6 moves back and forth through drive group one 5. When it is necessary to pick up a board by the board-taking manipulator 6, the servo motor on drive group one 5 starts to work, driving the lead screw to rotate. The board-taking manipulator 6 moves to stop above the upper board table. Then the material-taking cylinder extends its movable rod and pushes the material-taking frame downward, so that the suction cup on the material-taking frame contacts the upper surface of the topmost circuit board on the upper board table 7. The suction cup will suck the circuit board. When the material-taking cylinder retracts its movable rod, it drives the material-taking frame to move upward, and the board-taking of the board-taking manipulator 6 is completed. A laser cutting machine 13 is provided on drive group three 12. The laser cutting machine 13 is composed of a main machine, a laser, a cutting head, a water chiller, a servo motor, a gas supply system, a control system (different structures), etc. When the laser beam emitted by the laser cutting machine 13 irradiates the circuit board, a slit will be formed on the board material. The laser cutting machine 13 moves left and right through drive group three 12. A drive group two 9 is installed on the equipment platform of base one 1. Drive group two 9 is composed of two interconnected guide rails, a lead screw, and a servo motor. A cutting table 10 is provided on drive group two 9. The cutting table 10 moves back and forth through drive group two 9. There is a groove on the cutting table 10. After the board-taking manipulator 6 picks up the board, it will be placed in the groove on the cutting table 10. When slitting, drive group two 9 needs to move the cutting table 10 to a position below the laser cutting machine 13. A positioning module is provided on the laser cutting machine 13. The positioning module will collect images of the positions on the circuit board that need to be slit and transmit them to the servo motors of drive group two 9 and drive group three 12. At the same time, signals will be transmitted to the laser cutting machine 13. According to the size and boundary positions of the small circuit boards to be slit, drive group two 9 and drive group three 12 will drive the laser cutting machine 13 and the cutting table 10 to move in cooperation with each other.All the small circuit boards on the substrate are cut off. A lower plate platform 101 is fixedly arranged at the rear side of the base 1. After the cutting is completed, the transmission group two 9 will drive the cutting table 10 to move to the rear position of the transmission group two 9. At this time, all the circuit boards on the cutting table 10 are moved onto the lower plate platform 101.,

[0020] Initially, the cutting table 10 is located at the front side waiting material position of the second transmission group. When the circuit board substrate needs to be cut, first, the circuit board substrate to be cut is neatly stacked and placed at the center position on the top of the upper plate platform 7. Then, the transmission group one 5 is started to drive the board taking manipulator 6 to move forward above the stacked circuit boards. Then, the board taking manipulator 6 will pick up the topmost layer of the circuit board through the suction cup and place it on the cutting table 10. Driven by the transmission group two 9, the cutting table 10 moves backward to the position below the laser cutting machine 13. Subsequently, the laser cutting machine 13 performs the cutting work on the circuit board substrate. During the cutting, the transmission group two 9 drives the circuit board substrate on the cutting table 10 to move back and forth, and the laser cutting machine 13 moves left and right driven by the transmission group three 12. Through the cooperation of the transmission group two 9 and the transmission group three 12, when cutting, the ray of the laser cutting machine 13 can accurately move and cut at the position on the board surface that needs to be cut. After the cutting is completed, the transmission group two 9 will drive the cutting table 10 to move backward. When the cutting table 10 moves to the rear limit position of the transmission group two 9, after all the circuit boards on the cutting table 10 are pushed into the lower plate platform 101, the transmission group two 9 continues to move the cutting table 10 forward to the waiting material position of the upper plate platform 7, and the operations of taking the board, placing the board, and cutting are carried out in a cycle. Through the automatic board taking and placing by the board taking manipulator 6, there is no need for workers to manually load the board, saving labor and having high efficiency.,

[0021] Embodiment 2: On the basis of Embodiment 1, as Figures 1-3 shown, it further includes a fixed block 14, a rotating plate 141, a rotating rod 142, a spring 143, and a top rod 144. Fixed blocks 14 are symmetrically welded on the upper part of the left and right sides of the cutting table 10. Rotating rods 142 are rotatably arranged in the fixed blocks 14. A rotating plate 141 is fixedly arranged between the two rotating rods 142. The rotating plate 141 is used to place the circuit board to be cut, and the rotatable and tiltable rotating plate 141 can quickly slide and transfer the circuit board onto the lower plate platform 101 when the circuit board needs to be unloaded after cutting. Springs 143 are wound around the outer sides of the rotating rods 142, and the two ends of the springs 143 are respectively connected to the fixed block 14 and the rotating plate 141. Top rods 144 are symmetrically arranged on the front part of the left and right sides of the lower plate platform 101. The transmission group two 9 will drive the cutting table 10 and the rotating plate 141 to move back and forth. During the process of the cutting table 10 moving backward, the lower part of the rotating rod 142 will contact the upper part of the top rod 144 on the lower plate platform 101, and under the action of the top rod 144, when the rotating rod 142 is pushed and continues to move, the lower part starts to rotate, driving the rotating plate 141 to rotate clockwise by a certain angle with the connection point of the two rotating rods 142 as the axis point.,

[0022] As Figure 1 shown, it further includes a positioning frame 8. The positioning frame 8 is welded to the top of the upper plate table 7. The positioning frame 8 is in a U shape and is used to set the U-shaped frame type positioning frame 8 when stacking circuit boards on the upper plate table 7, so as to quickly pre-position the upper plate table 7 and the circuit board, and reduce the influence of the plate placing error on the board taking manipulator 6.

[0023] Stack the circuit boards to be cut in the U-shaped positioning frame 8 of the upper plate table 7. Through the positioning frame 8, the upper plate work of the upper plate table 7 can be quickly carried out, avoiding the influence of the plate placing position on the work of the board taking manipulator 6 for taking and placing the board. The board taking manipulator 6 will place the circuit board to be slit on the rotating plate 141, and the laser cutting machine 13 will perform the cutting work. After the cutting is completed, when the second transmission group 9 drives the cutting table 10 to move backward, the lower part of the rotating rod 142 will contact the ejector rod 144 during the backward movement of the rotating rod 142. The ejector rod 144 will hold the rotating rod 142. When the cutting table 10 continues to move backward, the rotating rod 142 will be forced to rotate, driving the front part of the rotating plate 141 to rotate downward, and the spring 143 will be compressed by force. The circuit board on the rotating plate 141 will slide backward and pour into the lower plate table 101 under the action of the inclination of the rotating plate 141. After the circuit board is separated from the rotating plate 141, the second transmission group drives the cutting table 10 to move forward, and the rotating rod 142 is separated from the ejector rod 144. Under the action of the spring 143, the rotating plate 141 rotates back to its original position. By setting the rotating rod 142, it contacts the ejector rod 144 during the process of the cutting table 10 moving for blanking, driving the rotating plate 141 to incline for blanking, eliminating the need for manual removal of the slit circuit board on the cutting table 10. The operation is coherent, improving the automation degree of the equipment and reducing the waste of labor cost and time cost.

[0024] In a preferred embodiment: As Figure 1 shown, it further includes an equipment protection 3. The equipment protection 3 is installed between the upper parts of the mounting frames on the first base 1, which is used to protect the components inside the equipment protection 3, reduce the damage to the equipment caused by impacts and collisions, and at the same time protect the safety of the staff, effectively preventing injuries caused by accidental contact with people during the operation of the machine in the production process.

[0025] In a preferred embodiment: As Figure 1 shown, it further includes a transparent plate 15. The transparent plates 15 are arranged on both the left and right sides of the equipment protection 3. During laser slitting, people can directly observe the working conditions of the components inside the equipment protection 3 through the set transparent plates 15, which is more convenient.

[0026] In a preferred embodiment: As Figures 1-2As shown in the figure, it further includes feet 16. On the left and right sides of the lower parts of the first base 1 and the second base 2, a number of feet 16 are symmetrically provided in a threaded manner. The feet 16 are also known as horizontal feet, foot cups, caster adjustment blocks, horizontal adjustment foot seats, adjustment blocks, etc. The height can be adjusted through the threads. While supporting the equipment, the overall level and inclination of the equipment can be adjusted, avoiding the overall inclination of the equipment affecting the precision during slitting after the slitting equipment is installed.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A substrate laser slitter for circuit board production, comprising a first base (1), a second base (2), and a screen (4). The second base (2) is welded to the front of the first base (1). The first base (1) consists of a mounting frame and an equipment platform. The screen (4) is rotatably mounted on the upper left side of the first base (1). Its characteristics are: It further includes a first transmission group (5), a board-taking manipulator (6), an upper board table (7), a second transmission group (9), a cutting table (10), a lower board table (101), a support frame (11), a third transmission group (12), and a laser cutting machine (13). The upper board table (7) is fixedly provided at the front lower side of the second base (2). The first transmission groups (5) are mounted on both the left and right sides of the upper part of the second base (2). Support frames (11) are fixedly provided on both the left and right sides of the equipment platform of the first base (1). The third transmission group (12) is mounted between the upper parts of the support frames (11). Both the first transmission group (5) and the third transmission group (12) are composed of a base plate, a lead screw, and a servo motor. The board-taking manipulator (6) is arranged between the first transmission groups (5). The board-taking manipulator (6) consists of a material-taking cylinder, a material-taking frame, and suction cups. The board-taking manipulator (6) moves back and forth through the first transmission group (5). The laser cutting machine (13) is provided on the third transmission group (12). The laser cutting machine (13) moves left and right through the third transmission group (12). The second transmission group (9) is mounted on the equipment platform of the first base (1). The second transmission group (9) is composed of two interconnected guide rails, a lead screw, and a servo motor. The cutting table (10) is provided on the second transmission group (9). The cutting table (10) moves back and forth through the second transmission group (9). The lower board table (101) is fixedly provided at the rear of the first base (1).

2. A substrate laser cutting machine for circuit board production according to claim 1, characterized in that: It further includes fixing blocks (14), a rotating plate (141), a rotating rod (142), a spring (143), and a top rod (144). Fixing blocks (14) are symmetrically provided on both the left and right sides of the upper part of the cutting table (10). Rotating rods (142) are rotatably provided inside the fixing blocks (14). A rotating plate (141) is fixedly provided between the two rotating rods (142). Springs (143) are wound around the outer sides of the rotating rods (142). The two ends of the springs (143) are respectively connected to the fixing blocks (14) and the rotating plate (141). Top rods (144) are symmetrically provided on both the left and right sides of the front part of the lower board table (101).

3. A substrate laser cutting machine for circuit board production according to claim 2, characterized in that: It further includes a positioning frame (8). The positioning frame (8) is welded to the top of the upper board table (7). The positioning frame (8) is in a U shape.

4. A substrate laser cutting machine for circuit board production according to claim 3, characterized in that: It further includes equipment protection (3). The equipment protection (3) is mounted between the upper parts of the mounting frames on the first base (1).

5. A substrate laser cutting machine for circuit board production according to claim 4, characterized in that: It further includes transparent plates (15). Transparent plates (15) are provided on both the left and right sides of the equipment protection (3).

6. A substrate laser cutting machine for circuit board production according to claim 5, characterized in that: It further includes feet (16). A number of feet (16) are symmetrically and threadedly provided on both the left and right sides of the lower parts of the first base (1) and the second base (2).

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