Slicer system
By introducing an elevation measurement device into the slicer system, measuring the height of the workpiece to be cut and determining the starting cutting position, the problem of randomness and subjectivity of the starting cutting position judgment of the workpiece in the prior art is solved, and the cutting efficiency and slice quality are improved.
Patent Information
- Application Number
- CN202422026518.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-20
AI Technical Summary
During the slicing process of existing slicers, due to the randomness and subjectivity of the judgment of the initial cutting position of the workpiece, the slice quality problems, such as edge collapse, impermeable cutting, etc., which in turn affects the cutting efficiency and production losses.
A slicer system is designed, equipped with an elevation measurement device, which measures the height of the workpiece to be cut during the transmission process, determines the starting cutting position, and ensures that the workpiece moves accurately to the position of the cutting machine network.
Through the use of the height measurement device, the initial cutting position of the workpiece to be cut can be accurately determined, cutting efficiency can be improved, production losses can be reduced, and slice quality stability can be ensured.
Smart Images
Figure CN223030090U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing, and more particularly, to a slicing machine system. Background Art
[0002] Currently, during the slicing of a silicon rod by a slicing machine, after the silicon rod is clamped, the operator manually controls the silicon rod to descend until it is close to the wire mesh, and this position is taken as the starting cutting position of the silicon rod, and then the silicon rod is cut into silicon wafers. However, different operators' judgments of the starting cutting position are random and subjective. An inappropriate starting cutting position is likely to cause slicing quality problems, such as chipping, incomplete cutting, etc., resulting in problems such as low cutting efficiency and high production losses. Summary of the Invention
[0003] The purpose of the embodiments of this application is to provide a slicing machine system. By setting a height measuring device, during the transportation of the workpiece to be cut to the slicing machine, the height of the workpiece to be cut is measured to determine the height of the workpiece to be cut, so that the starting cutting position for cutting the workpiece to be cut can be determined according to the height of the workpiece to be cut.
[0004] In a first aspect, this application provides a slicing machine system, which includes: a slicing machine; a transmission device for transporting the workpiece to be cut to the slicing machine; a height measuring device for measuring the height of the workpiece to be cut being transported on the transmission device; the height measuring device includes: a bracket and a height measuring sensor; the bracket is arranged around the transmission device to form a detection area, and the workpiece to be cut passes through the detection area during the transportation on the transmission device; the height measuring sensor is arranged on the bracket; a processor, connected to the height measuring device.
[0005] In the embodiments of this application, a height measuring device is set in the slicing machine system to measure the heights of workpieces to be cut of various sizes, so that the starting cutting positions of workpieces to be cut of various sizes can be determined according to the measured heights of the workpieces to be cut, and the workpieces to be cut can be accurately moved to a position close to the wire mesh of the multi-wire cutting machine, thereby improving the cutting efficiency and reducing production losses.
[0006] In an optional embodiment, the bracket includes a first bracket arm and a second bracket arm. The first bracket arm is arranged above the transmission device, and the extending direction of the first bracket arm is perpendicular to the transmission direction of the transmission device; the second bracket arm is arranged below the transmission device, and the extending direction of the second bracket arm is perpendicular to the transmission direction of the transmission device.
[0007] In an alternative embodiment, the height measurement sensor includes a first laser distance measurement sensor and a second laser distance measurement sensor; the first laser distance measurement sensor is disposed on the first support arm, and the laser emission direction of the first laser distance measurement sensor faces the workpiece to be cut and is perpendicular to the plane where the workpiece to be cut is located; the second laser distance measurement sensor is disposed on the second support arm, and the laser emission direction of the second laser distance measurement sensor faces the workpiece to be cut and is perpendicular to the plane where the workpiece to be cut is located.
[0008] In an alternative embodiment, the support includes a first support arm, the first support arm is disposed above the conveying device, and the extending direction of the first support arm is perpendicular to the conveying direction of the conveying device.
[0009] In an alternative embodiment, the height measurement sensor includes a contact type distance measurement sensor; the contact type distance measurement sensor is disposed on the first support arm, and when the workpiece to be cut is located below the first support arm, the contact type distance measurement sensor moves to contact the workpiece to be cut to determine the height of the workpiece to be cut.
[0010] In an alternative embodiment, the height measurement device includes a laser scanner, and the laser scanner is configured to scan the surface of the workpiece to be cut to determine the height of the workpiece to be cut.
[0011] In an alternative embodiment, the height measurement device further includes: a position detection module; the position detection module is connected to the height measurement sensor, and the position detection module is disposed at the edge of the conveying device.
[0012] In the embodiment of the present application, considering that errors may be introduced during height measurement when the workpiece to be cut is conveyed by the conveying device, a position detection module is disposed at the edge of the conveying device. The position detection module is configured to determine whether the workpiece to be cut is in the detection area, and control the conveying device to stop moving when the workpiece to be cut is in the detection area, so that the height measurement sensor can perform height measurement on the stationary workpiece to be cut, thereby improving the measurement accuracy.
[0013] In an alternative embodiment, the position detection module includes: a first optoelectronic sensor; the first optoelectronic sensor is connected to the processor, and the conveying device is connected to the processor; the light signal emission direction of the first optoelectronic sensor is perpendicular to the conveying direction of the conveying device and parallel to the plane where the conveying device is located.
[0014] In an alternative embodiment, the position detection module further includes: a second optoelectronic sensor; the second optoelectronic sensor is located on the extension line of the first optoelectronic sensor along the transmission direction of the transmission device; the light signal emission direction of the second optoelectronic sensor is perpendicular to the transmission direction of the transmission device and parallel to the plane where the transmission device is located.
[0015] In the embodiments of the present application, by setting the second optoelectronic sensor, according to the change of the light signal of the second optoelectronic sensor, it is determined whether the workpiece to be cut has left the detection area. After the workpiece to be cut leaves the detection area, the next workpiece to be cut is transported to the detection area, so that the height sensor can measure the height of each workpiece to be cut, reducing the situation where the height sensor cannot measure the heights of a continuous plurality of workpieces to be cut in a timely manner.
[0016] In an alternative embodiment, the slicer system further includes: a barcode scanner; the barcode scanner is connected to the processor. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.
[0018] Figure 1 It is a structural block diagram of the slicer system provided by the embodiments of the present application;
[0019] Figure 2 It is a schematic diagram of a crystal carrier and a workpiece to be cut provided by the embodiments of the present application;
[0020] Figure 3 It is a side view of a slicer system provided by the embodiments of the present application;
[0021] Figure 4 It is a side view of another slicer system provided by the embodiments of the present application;
[0022] Figure 5 It is a front view of a slicer system provided by the embodiments of the present application;
[0023] Figure 6 It is a schematic diagram of the positional relationship between a calibration workpiece and the wire mesh of the slicer provided by the embodiments of the present application.
[0024] Icons: 100 - slicing machine system; 101 - slicing machine; 102 - transmission device; 103 - height measuring device; 104 - processor; 1031 - bracket; 1032 - height measuring sensor; 301 - first bracket arm; 302 - second bracket arm; 303 - first laser distance measuring sensor; 304 - second laser distance measuring sensor; 401 - first bracket arm; 402 - contact distance measuring sensor; 501 - first photoelectric sensor; 502 - second photoelectric sensor. Detailed implementation
[0025] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application.
[0026] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The following embodiments can be used as examples to more clearly illustrate the technical solutions of the present application, but cannot be used to limit the protection scope of the present application. Those skilled in the art can understand that, without conflict, the features in the following embodiments and the embodiments can be combined with each other.
[0027] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, relational terms such as "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.
[0028] Please refer to Figure 1 , Figure 1 , which is a structural block diagram of a slicing machine system provided by an embodiment of the present application. The slicing machine system 100 may include: a slicing machine 101, a transmission device 102, a height measuring device 103, and a processor 104.
[0029] The slicing machine 101 may be, but is not limited to, a multi-wire slicing machine, a laser slicing machine, etc. The present application does not limit the type of the slicing machine 101.
[0030] The transfer device 102 transfers the workpiece to be cut to the slicing machine 101 for cutting. The workpiece to be cut can be, but is not limited to, a silicon rod, and can also be a hard and brittle material workpiece such as photovoltaic silicon (single-crystal silicon rod, polycrystalline silicon ingot), quartz crystal, silicon carbide, semiconductor, silicon nitride, sapphire, magnetic material, ceramic, cemented carbide, etc. The transfer device 102 can be, but is not limited to, a conveyor belt, a roller conveyor, a chain conveyor, etc.
[0031] The height measuring device 103 is used to measure the height of the workpiece to be cut being transferred on the transfer device 102. The height measuring device 103 can include: a bracket 1031 and a height measuring sensor 1032; the bracket 1031 is arranged around the transfer device 102 to form a detection area. This detection area can be understood as a plane perpendicular to the transfer direction of the transfer device 102. The workpiece to be cut will pass through this detection area during the transfer process of the transfer device 102. The height measuring sensor 1032 is arranged on the bracket 1031. When the workpiece to be cut is in the detection area, the height measuring sensor 1032 measures the height of the workpiece to be cut. The height measuring sensor 1032 is a sensor device capable of measuring the height of the workpiece to be cut, and the specific form of the height measuring sensor 1032 will be introduced and described in the subsequent specification.
[0032] In some embodiments, during the process of the slicing machine 101 cutting the workpiece to be cut, the workpiece to be cut is adhered to the crystal carrier by an adhesive. The workpiece to be cut and the crystal carrier are regarded as a whole, and the transfer device 102 transports the crystal carrier and the workpiece to be cut from the loading area to the slicing machine 101 for cutting. In this embodiment, the height of the workpiece to be cut measured by the height measuring sensor 1032 is the total height of the crystal carrier and the workpiece to be cut as a whole after the workpiece to be cut is adhered to the crystal carrier. As Figure 2 shown, Figure 2 is a schematic diagram of the workpiece to be cut adhered to the crystal carrier. The h in the figure is the height of the workpiece to be cut.
[0033] If the height measuring sensor 1032 needs to measure when the workpiece to be cut is in a stationary state, when the workpiece to be cut passes through this detection area, the transfer device 102 stops transferring, the height measuring sensor 1032 detects the height of the workpiece to be cut. After determining the height of the workpiece to be cut, the transfer device 102 starts transferring again and transports the workpiece to be cut to the slicing machine 101.
[0034] If the height measuring sensor 1032 can measure when the workpiece to be cut is in a moving state, when the workpiece to be cut passes through this detection area, the transfer device 102 does not stop transferring, and the height measuring sensor 1032 detects the height of the workpiece to be cut during the process of the workpiece to be cut passing through this detection area to determine the height of the workpiece to be cut.
[0035] The processor 104 is connected to the altimeter 103. After the altimeter 103 measures the height of the workpiece to be cut, it sends the height to the processor 104, and the processor 104 determines the starting cutting position of the slicer 101 when cutting the workpiece to be cut according to the height of the workpiece to be cut.
[0036] As an alternative embodiment, as Figure 3 shown, the bracket 1031 includes a first bracket arm 301 and a second bracket arm 302. The first bracket arm 301 is disposed above the transmission device 102, and the extending direction of the first bracket arm 301 is perpendicular to the transmission direction of the transmission device 102; the second bracket arm 302 is disposed below the transmission device 102, and the extending direction of the second bracket arm 302 is perpendicular to the transmission direction of the transmission device 102.
[0037] In this embodiment, the first bracket arm 301 and the second bracket arm 302 are parallel to each other. The bracket 1031 further includes two vertical support arms, and the two vertical support arms and the first bracket arm 301 and the second bracket arm 302 enclose a rectangular area, and this rectangular area is the detection area. The plane where this rectangular area is located is perpendicular to the transmission direction of the transmission device 102.
[0038] Further, the altimeter sensor 1032 includes a first laser distance measuring sensor 303 and a second laser distance measuring sensor 304; the first laser distance measuring sensor 303 is disposed on the first bracket arm 301, and the laser emitting direction of the first laser distance measuring sensor 303 faces the workpiece to be cut and is perpendicular to the plane where the workpiece to be cut is located. The second laser distance measuring sensor 304 is disposed on the second bracket arm 302, and the laser emitting direction of the second laser distance measuring sensor 304 faces the workpiece to be cut and is perpendicular to the plane where the workpiece to be cut is located.
[0039] As Figure 3As shown, the first laser distance measuring sensor 303 and the second laser distance measuring sensor 304 are two non-contact laser rangefinders. When the workpiece to be cut is in the detection area, the first laser distance measuring sensor 303 emits laser towards the plane where the upper surface of the workpiece to be cut is located. The laser is reflected by the upper surface of the workpiece to be cut, and the first laser distance measuring sensor 303 receives the reflected laser, and calculates and determines the first length d1 between the first laser distance measuring sensor 303 and the upper surface of the workpiece to be cut. Similarly, when the workpiece to be cut is in the detection area, the second laser distance measuring sensor 304 emits laser towards the plane where the lower surface of the workpiece to be cut is located. The laser is reflected by the lower surface of the workpiece to be cut, and the second laser distance measuring sensor 304 receives the reflected laser, and calculates and determines the second length d2 between the second laser distance measuring sensor 304 and the lower surface of the workpiece to be cut. The first laser distance measuring sensor 303 and the second laser distance measuring sensor 304 are respectively fixedly installed on the first support arm 301 and the second support arm 302, and the distance between the first laser distance measuring sensor 303 and the second laser distance measuring sensor 304 is fixed and is the third length d3. The height h of the workpiece to be cut = d3 - (d1 + d2).
[0040] As another alternative implementation, as Figure 4 shown, the support 1031 includes a first support arm 401. The first support arm 401 is arranged above the transmission device 102, and the extending direction of the first support arm 301 is perpendicular to the transmission direction of the transmission device 102.
[0041] In this implementation, for the first support arm 301, the support 1031 further includes two vertical support arms. The two vertical support arms and the first support arm 301 enclose a rectangular area, and this rectangular area is the detection area. The plane where this rectangular area is located is perpendicular to the transmission direction of the transmission device 102.
[0042] Furthermore, the height measuring sensor 1032 includes a contact type distance measuring sensor 402; the contact type distance measuring sensor 402 is arranged on the first support arm 401. When the workpiece to be cut is below the first support arm 401, the contact type distance measuring sensor 402 moves to contact the workpiece to be cut to determine the height of the workpiece to be cut.
[0043] As Figure 4 shown, when the workpiece to be cut is in the detection area, the contact type distance measuring sensor 402 moves downward until it contacts the upper surface of the workpiece to be cut. After the contact type distance measuring sensor 402 contacts the upper surface of the workpiece to be cut, it can determine the distance d4 between the contact type distance measuring sensor 402 and the upper surface of the workpiece to be cut. The distance between the contact type distance measuring sensor 402 and the transmission device 102 is fixed and is the fifth length d5. The height d of the workpiece to be cut = d5 - d4.
[0044] As an alternative implementation, the height measurement sensor 1032 includes a laser scanner for scanning the surface of the workpiece to be cut to determine the height of the workpiece to be cut.
[0045] In this implementation, during the transportation of the workpiece to be cut by the transportation device 102, the laser scanner scans the cross-section of the workpiece to be cut in the vertical direction to construct point cloud data, and determines the height of the workpiece to be cut by analyzing the point cloud data. The present application does not limit the installation position of the laser scanner on the bracket 1031, and the laser scanner can be installed at any position on the bracket 1031 where the workpiece to be cut can be scanned.
[0046] As an alternative implementation, the height measurement device 103 further includes a position detection module. The position detection module is connected to the height measurement sensor 1032 and is arranged at the edge of the transportation device 102.
[0047] In this implementation, considering that errors may be introduced during the height measurement of the workpiece to be cut during the transportation by the transportation device 102, in order to improve the measurement accuracy of the height measurement sensor 1032, a position detection module is arranged at the edge of the transportation device 102. The position detection module is used to determine whether the workpiece to be cut is in the detection area. If so, a detection instruction is sent to the height measurement sensor 1032, and the height measurement sensor 1032 is used to measure the height of the workpiece to be cut in the detection area according to the detection instruction.
[0048] Further, as Figure 5 shown, the position detection module includes a first photoelectric sensor 501. The first photoelectric sensor 501 is connected to the processor 104 ( Figure 5 not shown), and the transportation device 102 is connected to the processor 104. The light signal emission direction of the first photoelectric sensor 501 is perpendicular to the transportation direction of the transportation device 102 and parallel to the plane where the transportation device 102 is located.
[0049] In this embodiment, the first photoelectric sensor 501 emits a light signal. When the light signal of the first photoelectric sensor 501 is blocked, it is determined that the workpiece to be cut is in the detection area. The processor 104 is used to control the transportation device 102 to stop running, and the height measurement sensor 1032 measures the height of the workpiece to be cut.
[0050] The workpiece to be cut moves along the transmission direction under the action of the transmission device 102. When the workpiece to be cut reaches the detection area, it blocks the optical signal emitted by the first photoelectric sensor 501. The first photoelectric sensor 501 receives the reflected optical signal and determines that the workpiece to be cut is in the detection area. The first photoelectric sensor 501 sends a signal to the processor 104. After receiving the signal, the processor 104 controls the transmission device 102 to stop operating, so that the workpiece to be cut is in the detection area, and the height of the workpiece to be cut is measured by the height measurement sensor 1032.
[0051] Further, the position detection module further includes: a second photoelectric sensor 502. The second photoelectric sensor 502 is located on the extension line of the first photoelectric sensor 501 along the transmission direction of the transmission device 102. The optical signal emission direction of the second photoelectric sensor 502 is perpendicular to the transmission direction of the transmission device 102 and parallel to the plane where the transmission device is located.
[0052] In this embodiment, when the optical signal of the second photoelectric sensor 502 changes from being blocked to unblocked, it is determined that the workpiece to be cut has left the detection area.
[0053] After the height measurement sensor 1032 completes the height measurement of the workpiece to be cut, it can send a signal to the processor 104. After receiving the signal, the processor 104 controls the transmission device 102 to resume transmission. Alternatively, the processor 104 is provided with a timer, which starts timing after the transmission device 102 stops working. When the timing reaches the preset time, the processor 104 controls the transmission device 102 to resume transmission. After the transmission device 102 starts transmitting, the workpiece to be cut continues to move along the transmission direction. When the workpiece to be cut passes through the position of the second photoelectric sensor 502, it blocks the optical signal emitted by the second photoelectric sensor 502. When the workpiece to be cut leaves the detection area, the optical signal emitted by the second photoelectric sensor 502 changes from being blocked to unblocked.
[0054] Considering that in continuous cutting operations, multiple workpieces to be cut are transmitted on the transmission device 102. To prevent the distance between two adjacent workpieces to be cut from being too close, resulting in the height measurement sensor 1032 being unable to measure the height of each workpiece to be cut in a timely manner, the second photoelectric sensor 502 is set to determine whether the workpiece to be cut has left the detection area. After the workpiece to be cut leaves the detection area, the next workpiece to be cut is transmitted to the detection area, so that the height measurement sensor 1032 can measure the height of each workpiece to be cut.
[0055] As an optional implementation manner, the slicing machine system further includes: a barcode scanner. The barcode scanner is connected to the processor 104.
[0056] In this embodiment, the scanner can be arranged on the bracket 1031. An identifier can be arranged on the workpiece to be cut. The identifier can be a label with the function of storing information such as a bar code, a two-dimensional code, an RFID radio frequency tag, etc. The bar code scanner is used to scan the identifier on the workpiece to be cut to determine the number of the workpiece to be cut. The processor 104 is used to receive the number of the workpiece to be cut sent by the bar code scanner and associate the number of the workpiece to be cut with the height of the workpiece to be cut measured by the height measuring device 103.
[0057] Further, a second bar code scanner is also arranged on the slicing machine 101. After the workpiece to be cut reaches the slicing machine 101, the identifier of the workpiece to be cut is identified by the second bar code scanner. The processor 104 determines the height of the workpiece to be cut associated with the identifier according to the identifier of the workpiece to be cut, and determines the starting cutting position of the workpiece to be cut according to the height of the workpiece to be cut.
[0058] The following describes the method for the processor 104 to determine the starting cutting position of the workpiece to be cut according to the height of the workpiece to be cut.
[0059] The total height of the calibrated workpiece and the calibrated descending distance are pre-stored in the processor 104. The total height of the calibrated workpiece is the historical total height of the historical crystal carrier and the historical workpiece to be cut, that is, the height of the historical workpiece to be cut adhered to the historical crystal carrier to form an integral body. The calibrated descending distance is the distance from the feed zero position to the starting cutting position of the historical crystal carrier and the historical workpiece to be cut during the calibration process of the slicing machine by the historical crystal carrier and the historical workpiece to be cut.
[0060] After the processor 104 determines the height of the workpiece to be cut, it determines the starting cutting position of the workpiece to be cut according to the height of the workpiece to be cut, the total height of the calibrated workpiece pre-stored in the processor, and the calibrated descending distance.
[0061] To facilitate the understanding of this solution, the calibration process will be described below first.
[0062] During the calibration process of the slicing machine, the workpiece to be cut (hereinafter referred to as the calibrated workpiece) and the crystal carrier for calibration are transported above the wire mesh of the slicing machine through the transmission device, and the calibrated workpiece and the crystal carrier are at the feed zero position. The positional relationship between the calibrated workpiece and the wire mesh of the slicing machine is as Figure 6 shown. After the main roller of the slicing machine is installed, the radius r of the main roller will be fixed, and the distance H between the feed zero position and the center of the main roller will be fixed. Measure the total height of the calibrated workpiece and the crystal carrier as the total height h1 of the calibrated workpiece. Then lower the calibrated workpiece and the crystal carrier to a position close to the wire mesh, and use the descending distance as the calibrated descending distance x1 to complete the calibration.
[0063] Considering that during the actual operation of the slicing machine, the position of the main roller may change or other models of main rollers may be replaced, resulting in a change in the radius r of the main roller. Therefore, after the above situation occurs, recalibration is required to determine the new total height h1 of the calibration workpiece and the new calibration descent distance x1. If the above situation does not occur, there is no need to perform recalibration, and the existing total height h1 of the calibration workpiece and the calibration descent distance x1 are used to determine the starting cutting position of the workpiece to be cut.
[0064] According to Figure 6 it is known that the distance H between the feed zero position and the center of the main roller is fixed, and the workpiece to be cut and the crystal carrier reach the feed zero position through the transmission device. Therefore, the following relationship exists:
[0065] H = h1 + x1 + r = h2 + x2 + r (1)
[0066] where H is the distance between the feed zero position and the center of the main roller, h1 is the total height of the calibration workpiece, x1 is the calibration descent distance, h2 is the actual total height, and x2 is the descent distance of the workpiece to be cut.
[0067] By transposing the above formula (1), we can obtain:
[0068] x2 = h1 + x1 - h2 (2)
[0069] The starting cutting position can be represented in various ways. For example, the starting cutting position can be represented by the descent distance x2 of the workpiece to be cut. Another example is to establish a coordinate system, and after the workpiece to be cut descends by x2 from the feed zero position, the coordinate point where the upper part of the crystal carrier is located is used as the starting cutting position. The present application does not limit the representation method of the starting cutting position.
[0070] In addition, the unit described as a separation component may or may not be physically separated, and the component displayed as a unit may or may not be a physical unit, that is, it can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0071] Furthermore, in each embodiment of the present application, the functional modules can be integrated together to form an independent part, or each module can exist alone, or two or more modules can be integrated to form an independent part.
[0072] In this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.
[0073] The above are only embodiments of the present application and are not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.
Claims
1. A slicer system, characterized in that: The slicer system comprises: Slicer; A transmission device, used for transmitting the workpiece to be cut to the slicer; A height measuring device is used to measure the height of the workpiece to be cut being transported on the transport device; the height measuring device comprises: a bracket and a height measuring sensor; the bracket is arranged around the transport device to form a detection area, and the workpiece to be cut passes through the detection area during the transport of the transport device; the height measuring sensor is arranged on the bracket; A processor is connected to the height measuring device.
2. The microtome system according to claim 1, characterized in that: The support comprises a first support arm and a second support arm, the first support arm is arranged above the transmission device, and the extension direction of the first support arm is perpendicular to the transmission direction of the transmission device; The second support arm is arranged below the transmission device, and an extending direction of the second support arm is perpendicular to a transmission direction of the transmission device.
3. The slicer system according to claim 2, characterized in that: The height measuring sensor comprises a first laser distance measuring sensor and a second laser distance measuring sensor; The first laser distance measuring sensor is arranged on the first bracket arm, and the laser emission direction of the first laser distance measuring sensor is toward the workpiece to be cut and is perpendicular to the plane where the workpiece to be cut is located; The second laser ranging sensor is arranged on the second support arm, and the laser emission direction of the second laser ranging sensor is toward the workpiece to be cut and is perpendicular to the plane where the workpiece to be cut is located.
4. The slicer system according to claim 1, characterized in that: The support comprises a first support arm, the first support arm is arranged above the transmission device, and an extension direction of the first support arm is perpendicular to a transmission direction of the transmission device.
5. The slicer system according to claim 4, characterized in that: The height measuring sensor comprises a contact distance measuring sensor; The contact distance measuring sensor is arranged on the first support arm. When the workpiece to be cut is located below the first support arm, the contact distance measuring sensor moves to contact with the workpiece to be cut to determine the height of the workpiece to be cut.
6. The slicer system according to claim 1, characterized in that: The height measuring device comprises a laser scanner, and the laser scanner is used to scan the surface of the workpiece to be cut to determine the height of the workpiece to be cut.
7. The microtome system according to any one of claims 1 to 6, characterized in that: The height measuring device further comprises: a position detection module; the position detection module is connected to the height measuring sensor, and the position detection module is arranged at the edge of the transmission device.
8. The slicer system according to claim 7, characterized in that: The position detection module includes: a first photoelectric sensor; the first photoelectric sensor is connected to the processor, and the transmission device is connected to the processor; the light signal emission direction of the first photoelectric sensor is perpendicular to the transmission direction of the transmission device and parallel to the plane where the transmission device is located.
9. The microtome system according to claim 8, characterized in that: The position detection module further includes: a second photoelectric sensor; the second photoelectric sensor is located on an extension line of the first photoelectric sensor along the transmission direction of the transmission device; The light signal emission direction of the second photoelectric sensor is perpendicular to the transmission direction of the transmission device and parallel to the plane where the transmission device is located.
10. The microtome system according to claim 1, characterized in that: The slicer system also includes: a barcode scanner; the barcode scanner is connected to the processor.