Semiconductor mold easy to demold

Abstract

The utility model relates to the technical field of injection molds, and provides a semiconductor mold easy to demold, which comprises a lower mold base and an upper mold base, an upper mold base is arranged at the top end of the lower mold base, mold grooves are evenly formed in the top end of the lower mold base, and demolding structures are arranged in the mold grooves. By arranging the demolding structure, the connecting rod is extruded towards the interior of the mold groove through the guide groove in the process of installing the upper mold base so as to drive the demolding plate to synchronously move towards the interior of the mold groove, so that when the upper mold base is disassembled after production is finished, the demolding plate is pushed through the elastic force of the demolding spring, and the demolding effect is improved. Therefore, the semiconductor material at the top end of the mold is extruded, and the purposes of facilitating demolding and improving the production efficiency of the semiconductor are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of injection molds, and particularly relates to a semiconductor mold that is easy to demold. Background Art

[0002] With the development of the times, the research and production technology of new materials by people are becoming more and more mature. As an important part of them, semiconductors are used more and more widely in people's daily life, and thus the demand for them is getting higher and higher. However, the traditional production method is inefficient and difficult to meet the requirement that the production quality will not be affected during mass production. Therefore, in order to meet the actual production needs, an injection mold is adopted for production and use.

[0003] After the production is completed, it is necessary to take out the semiconductor in the mold. However, the traditional injection mold is difficult to conveniently demold and take out the semiconductor during actual production and use, which increases a certain degree of inconvenience during production and use, and thus it is difficult to meet the actual production needs. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a semiconductor mold that is easy to demold, so as to solve the defect that the existing semiconductor mold is not convenient to demold during production and use.

[0005] To solve the above technical problems, the utility model provides the following technical solution: a semiconductor mold that is easy to demold, including a lower mold base and an upper mold base;

[0006] The upper mold base is arranged at the top end of the lower mold base. The top end of the lower mold base is evenly provided with mold grooves, and demolding structures are arranged inside the mold grooves;

[0007] The demolding structure includes a demolding plate, guide grooves, connecting rods and demolding springs. The demolding plates are all arranged inside the mold grooves. The guide grooves are opened on both sides of the mold grooves inside the lower mold base. Connecting rods are fixed on both sides of the demolding plate, and demolding springs are evenly arranged at the bottom end of the demolding plate;

[0008] The top end of the upper mold base is evenly provided with feeding ports. One side of the feeding ports at the top end of the upper mold base is provided with heat dissipation holes, and mounting structures are fixed on both sides of the bottom end of the upper mold base.

[0009] Preferably, the mold grooves are equidistantly distributed at the top end of the lower mold base, and the guide grooves are symmetrically distributed on both sides of the mold grooves inside the lower mold base.

[0010] Preferably, the connecting rods are all arranged inside the guide grooves, and the demolding plate and the guide grooves form a sliding connection through the connecting rods.

[0011] Preferably, the demolding springs are symmetrically distributed at the bottom end of the demolding plate, and one side of each demolding spring away from the demolding plate is fixedly connected to one side of the mold groove.

[0012] Preferably, the installation structure includes fixing blocks, clamping grooves, reserved grooves, clamping blocks, return springs and pull rods. The fixing blocks are fixed to both sides of the bottom end of the upper mold base. Clamping grooves are formed on one side of each fixing block. Reserved grooves are formed on both sides of the top end of the lower mold base. Clamping blocks are arranged inside the reserved grooves. Return springs are evenly arranged on one side of each clamping block. Pull rods are fixed at the middle positions on one side of each clamping block.

[0013] Preferably, the fixing blocks are symmetrically distributed at the bottom end of the upper mold base, and one side of each return spring away from the clamping block is fixedly connected to one side inside the reserved groove.

[0014] Preferably, the reserved grooves are arranged inside the clamping grooves, and the reserved grooves and the fixing blocks form a clamping structure through the clamping grooves.

[0015] An easy-to-demold semiconductor mold provided by the present utility model has the following advantages:

[0016] By providing a demolding structure, during the installation process of the upper mold base, the connecting rod is squeezed into the mold groove through the guiding groove, thereby driving the demolding plate to move synchronously into the mold groove. Then, when the upper mold base is removed after the production is completed, the demolding plate is pushed by the elastic force of the demolding spring, so that it moves outward, and then the semiconductor material at its top is extruded, thus achieving the purpose of facilitating demolding and increasing the semiconductor production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is the main three-dimensional structural schematic diagram of the present utility model;

[0018] Figure 2 is the partial cross-sectional three-dimensional structural schematic diagram of the present utility model;

[0019] Figure 3 is the enlarged structural schematic diagram at A of the present utility model;

[0020] Figure 4 is the side cross-sectional three-dimensional structural schematic diagram of the present utility model;

[0021] Figure 5 is the semi-sectional three-dimensional structural schematic diagram of the present utility model.

[0022] Description of the reference numerals in the figures: 1. Lower die base; 2. Upper die base; 3. Die cavity; 4. Demolding structure; 401. Demolding plate; 402. Guide groove; 403. Connecting rod; 404. Demolding spring; 5. Feeding port; 6. Heat dissipation hole; 7. Mounting structure; 701. Fixed block; 702. Clamping groove; 703. Reserved groove; 704. Clamping block; 705. Return spring; 706. Pull rod. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Please refer to Figures 1 - 5 , a semiconductor mold that is easy to demold provided by the present invention includes a lower die base 1 and an upper die base 2.

[0025] Referring to Figure 2 and Figure 4 As shown, an upper die base 2 is provided at the top of the lower die base 1. Mold cavities 3 are evenly opened at the top of the lower die base 1. Demolding structures 4 are arranged inside the mold cavities 3. The demolding structure 4 includes a demolding plate 401, a guide groove 402, a connecting rod 403, and a demolding spring 404. The demolding plates 401 are all arranged inside the mold cavities 3. The guide grooves 402 are opened on both sides of the mold cavities 3 inside the lower die base 1. Connecting rods 403 are fixed on both sides of the demolding plate 401. Demolding springs 404 are evenly arranged at the bottom end of the demolding plate 401. The mold cavities 3 are equally spaced at the top of the lower die base 1. The guide grooves 402 are symmetrically distributed on both sides of the mold cavities 3 inside the lower die base 1. The connecting rods 403 are all arranged inside the guide grooves 402. The demolding plate 401 and the guide groove 402 are slidably connected through the connecting rod 403. The demolding springs 404 are symmetrically distributed at the bottom end of the demolding plate 401. The sides of the demolding springs 404 away from the demolding plate 401 are all fixed to one side of the mold cavity 3.

[0026] Semiconductors, as new materials, are used more and more widely in people's daily lives. During the production process, injection molding is usually used. By providing the demolding structure 4, when installing the upper die base 2, the connecting rod 403 is squeezed, so that the demolding plate 401 moves into the mold cavity 3, and then injection molding production is carried out. After the production is completed, the upper die base 2 is removed, and the demolding plate 401 moves outward through the elastic force of the demolding spring 404 to extrude the formed semiconductor, which is convenient for demolding, meets the actual production requirements, and increases the production efficiency.

[0027] Refer to Figure 1 、 Figure 2 and Figure 5 As shown, the top end of the upper die base 2 is evenly provided with a feeding port 5, and heat dissipation holes 6 are provided on one side of the feeding port 5 at the top end of the upper die base 2. On both sides of the bottom end of the upper die base 2, mounting structures 7 are fixed. The mounting structure 7 includes fixing blocks 701, clamping grooves 702, reserved grooves 703, clamping blocks 704, return springs 705, and pull rods 706. The fixing blocks 701 are fixed on both sides of the bottom end of the upper die base 2. Clamping grooves 702 are provided on one side of the fixing blocks 701. Reserved grooves 703 are provided on both sides of the top end of the lower die base 1. Clamping blocks 704 are arranged inside the reserved grooves 703. Return springs 705 are evenly arranged on one side of the clamping blocks 704. Pull rods 706 are fixed at the middle positions on one side of the clamping blocks 704. The fixing blocks 701 are symmetrically distributed at the bottom end of the upper die base 2. The sides of the return springs 705 away from the clamping blocks 704 are fixedly connected to one side inside the reserved grooves 703. The reserved grooves 703 are all arranged inside the clamping grooves 702. The reserved grooves 703 and the fixing blocks 701 form a clamping structure through the clamping grooves 702.

[0028] During the installation process of the upper die base 2, by setting the mounting structure 7, when installing the device, the fixing blocks 701 on both sides of the bottom end of the upper die base 2 are directly pressed into the reserved grooves 703, so that the clamping blocks 704 move towards one side inside the reserved grooves 703. When the clamping groove 702 on one side of the fixing block 701 moves to one side of the clamping block 704, the clamping block 704 is placed inside the clamping groove 702 by the elastic force of the return spring 705 to complete the clamping and positioning. When disassembling, pulling the pull rod 706 makes the clamping block 704 move away from the clamping groove 702 to release the clamping and positioning, thus greatly increasing the practicability of the device.

[0029] When in use, press the upper die base 2 downward so that the fixing block 701 squeezes the clamping block 704 to move it towards one side of the reserved groove 703. When the clamping groove 702 moves to one side of the clamping block 704, the clamping block 704 moves into the clamping groove 702 through the elastic force of the return spring 705 for positioning. During the installation process, the stripping plate 401 is moved into the mold cavity 3 through the connecting rod 403, and then raw materials are added into it through the feeding port 5 for injection molding production.

[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor mold that is easy to demould, comprising a lower mold base (1) and an upper mold base (2); Features: An upper mold base (2) is arranged at the top of the lower mold base (1), mold grooves (3) are evenly arranged at the top of the lower mold base (1), and demoulding structures (4) are arranged inside the mold grooves (3); The demoulding structure (4) comprises a demoulding plate (401), a guide groove (402), a connecting rod (403) and a demoulding spring (404); the demoulding plate (401) is arranged inside the mold groove (3); the guide groove (402) is opened on both sides of the mold groove (3) inside the lower mold base (1); connecting rods (403) are fixed on both sides of the demoulding plate (401); and demoulding springs (404) are evenly arranged at the bottom end of the demoulding plate (401); The top of the upper die seat (2) is evenly provided with a feed port (5), one side of the feed port (5) at the top of the upper die seat (2) is provided with a heat dissipation hole (6), and both sides of the bottom of the upper die seat (2) are fixed with a mounting structure (7).

2. The semiconductor mold that is easy to demold according to claim 1, characterized in that: The mold grooves (3) are distributed at equal intervals on the top of the lower mold base (1), and the guide grooves (402) are distributed symmetrically on both sides of the mold groove (3) inside the lower mold base (1).

3. The semiconductor mold that is easy to demold according to claim 1, characterized in that: The connecting rods (403) are all arranged inside the guide grooves (402), and the stripping plate (401) and the guide grooves (402) are slidably connected via the connecting rods (403).

4. The semiconductor mold that is easy to demold according to claim 1, characterized in that: The demoulding springs (404) are symmetrically distributed at the bottom end of the demoulding plate (401), and the side of the demoulding springs (404) away from the demoulding plate (401) is fixedly connected to one side of the mold groove (3).

5. The semiconductor mold that is easy to demold according to claim 1, characterized in that: The mounting structure (7) comprises a fixed block (701), a clamping groove (702), a reserved groove (703), a clamping block (704), a reset spring (705) and a pull rod (706); the fixed blocks (701) are fixed on both sides of the bottom end of the upper die base (2); one side of the fixed block (701) is provided with a clamping groove (702); the reserved grooves (703) are provided on both sides of the top end of the lower die base (1); a clamping block (704) is arranged inside the reserved groove (703); a reset spring (705) is evenly arranged on one side of the clamping block (704); and a pull rod (706) is fixed at the middle position of one side of the clamping block (704).

6. The semiconductor mold that is easy to demold according to claim 5, characterized in that: The fixing blocks (701) are symmetrically distributed at the bottom end of the upper die seat (2), and the side of the return spring (705) away from the clamping block (704) is fixedly connected to one side inside the reserved groove (703).

7. The semiconductor mold that is easy to demold according to claim 5, characterized in that: The reserved grooves (703) are all arranged inside the clamping grooves (702), and the reserved grooves (703) and the fixing blocks (701) form a clamping structure through the clamping grooves (702).

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