Intelligent temperature control device of automobile part hot-pressing coating equipment

Abstract

The utility model relates to an intelligent temperature control device of automobile part hot-pressing coating equipment, which belongs to the technical field of automobile part processing, and comprises a bottom plate, the top of the bottom plate is provided with a coating temperature adjusting mechanism, the coating temperature adjusting mechanism comprises a lower module fixedly connected with the top of the bottom plate, and the top of the bottom plate is movably connected with a movable plate. The bottom of the movable plate is fixedly connected with an upper mold piece, and the top of the bottom plate is provided with an adjusting assembly used for adjusting the position of the movable plate. According to the intelligent temperature control device of the automobile part hot-pressing coating equipment, the electric heating sleeve and the semiconductor cooler can adjust the temperature of liquid at the two ends of the liquid flowing pipeline, so that switching between the heating effect and the cooling effect is achieved by adjusting the flowing direction of the liquid in the liquid flowing pipeline; and therefore, the activation effect of the glue is conveniently guaranteed during mold closing, the curing efficiency of the glue is improved after mold closing, the coating work efficiency is effectively improved, and the practicability of the device is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile parts processing, and particularly relates to an intelligent temperature control device for a hot pressing and coating device of automobile parts. Background Technique

[0002] Hot pressing and coating of automobile parts is a common process for forming a protective covering layer on the surface of parts; this process usually involves heating a thermoplastic material or resin to a certain temperature and then pressing it on the surface of the automobile parts to make it adhere to the surface of the automobile parts and form a thin film.

[0003] In the patent document with the publication number CN113733541A, an interior trim part constant temperature hot pressing and coating tooling is proposed, which includes a base, a top plate arranged above the base, a movable plate arranged between the base and the top plate, a lower mold arranged on the movable plate, and an upper mold arranged at the bottom of the top plate; the lower mold includes a lower cavity arranged at the top of the lower mold, a plurality of hot runners arranged in parallel in the lower mold and penetrating both sides of the lower mold, and a plurality of water pipes for sequentially connecting the heads and tails of the plurality of hot runners...; through the above patent, by fixing the interior trim panel and the veneer material on the upper mold and the lower mold respectively, automatic hot pressing and coating can be realized, and the lower mold can achieve constant temperature through a plurality of hot runners, thus greatly improving the coating effect and accuracy.

[0004] However, in the above patent, when performing hot pressing and coating, it is necessary to close the upper mold and the lower mold to make the activated glue on the interior trim panel and the veneer material fully contact. However, during this process, after the upper mold and the lower mold are fitted together, the interior trim panel will be isolated from the outside world, reducing the heat dissipation efficiency of the interior trim panel. The curing time of the glue after heating and activation is relatively long, which is not convenient for rapid temperature adjustment, reducing the hot pressing and coating efficiency and having poor practicability; in view of this, the present application proposes an intelligent temperature control device for a hot pressing and coating device of automobile parts. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides an intelligent temperature control device for a hot pressing and coating device of automobile parts, which has the function of controlling temperature adjustment according to needs, can effectively improve the coating work efficiency, ensure the coating work quality, enhance the practicability of the device, etc., and solves the problems that in the prior art, when the hot pressing and coating device of automobile parts performs hot pressing and coating operations, the automobile parts will be isolated from the outside world due to mold closing, reducing the heat dissipation efficiency of the interior trim panel, the curing time of the glue after heating and activation is relatively long, which is not convenient for rapid temperature adjustment, reducing the hot pressing and coating efficiency and having poor practicability.

[0006] To achieve the above object, the utility model provides the following technical solution: an intelligent temperature control device for a hot pressing and coating device of automobile parts, including a bottom plate, and a coating temperature adjustment mechanism is arranged on the top of the bottom plate;

[0007] The described coating temperature adjustment mechanism includes a lower mold part fixedly connected to the top of the bottom plate. An activity plate is movably connected to the top of the bottom plate. An upper mold part is fixedly connected to the bottom of the activity plate. A regulating component for adjusting the position of the activity plate is arranged on the top of the bottom plate. Heat transfer frames are fixedly connected inside both the lower mold part and the upper mold part. A temperature sensor is fixedly connected to the top of the activity plate;

[0008] Drainage grooves are formed inside both the lower mold part and the upper mold part. A water storage tank is movably connected to the outside of the bottom plate. A first heat insulation frame and a second heat insulation frame are fixedly connected inside the water storage tank. A cooling pipe is fixedly connected inside the first heat insulation frame. A semiconductor refrigerator extending into the first heat insulation frame is fixedly connected inside the water storage tank;

[0009] A heating pipe is fixedly connected inside the second heat insulation frame. An electric heating sleeve sleeved outside the heating pipe is fixedly connected inside the second heat insulation frame. A water supply component for realizing the circulating flow of liquid in the heating pipe, the drainage groove and the cooling pipe is arranged inside the water storage tank. An air extraction component for realizing the heat dissipation and air exchange of the semiconductor refrigerator is arranged on the top of the water storage tank.

[0010] Furthermore, the regulating component includes a support rod fixedly connected to the top of the bottom plate, and the activity plate is slidably connected to the support rod. A top plate is fixedly connected to the top of the support rod. A driving part is fixedly connected inside the top plate, and the output end of the driving part is fixedly connected to the top of the activity plate.

[0011] Furthermore, the drainage grooves are distributed on the outside of the heat transfer frame in a serpentine arrangement. The probe of the temperature sensor extends to the inside of the heat transfer frame in the upper mold part.

[0012] Furthermore, the water supply component includes a circulation pump fixedly connected to the top of the water storage tank and communicated with the cooling pipe. One end of the circulation pump away from the cooling pipe is fixedly connected to a first three-way pipe. A second three-way pipe communicated with the heating pipe is fixedly connected inside the water storage tank.

[0013] Furthermore, the water supply component further includes water guide pipes fixedly connected inside the lower mold part and the upper mold part and located at both ends of the drainage groove, and the water guide pipes located at both ends of the drainage groove are respectively communicated with the first three-way pipe and the second three-way pipe.

[0014] Furthermore, the air extraction component includes a protection frame fixedly connected to the top of the water storage tank and corresponding to the position of the semiconductor refrigerator. An air extraction structure is arranged inside the protection frame. An air guide pipe extending to the second heat insulation frame is fixedly connected to the top of the protection frame.

[0015] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0016] The intelligent temperature control device of the hot pressing and coating equipment for automobile parts can extract the liquid inside the water storage tank to the inside of the lower die and the upper die through the operation of the water supply component, so as to adjust the temperature of the lower die and the upper die. When the heating pipe is the liquid inlet, the electric heating sleeve can heat the liquid entering the circulation pipeline, so as to conveniently increase the temperature of the lower die and the upper die, effectively activate the glue on the facing material, and realize the preheating and heat preservation of the facing material and automobile parts, thus facilitating the maintenance of a good coating effect.

[0017] After the coating operation is completed, the water supply component can be made to extract the liquid in the reverse direction, so that the cooling pipe is the inlet of the liquid circulation pipeline, so as to cooperate with the refrigeration effect of the semiconductor cooler to cool the liquid entering the circulation pipeline, thus facilitating the cooling of the lower die and the upper die and accelerating the curing speed of the glue; furthermore, the effect of realizing temperature control according to needs can be achieved, effectively improving the coating work efficiency of automobile parts and enhancing the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a structural cross-sectional view of the present utility model;

[0019] Figure 2 is a schematic structural view of the water storage tank of the present utility model;

[0020] Figure 3 is a schematic structural view of the bottom plate of the present utility model.

[0021] In the figure: 1, bottom plate; 2, lower die; 3, support rod; 4, top plate; 5, driving member; 6, movable plate; 7, upper die; 8, heat transfer frame; 9, drainage groove; 10, water storage tank; 11, circulation pump; 12, first three-way pipe; 13, cooling pipe; 14, second three-way pipe; 15, heating pipe; 16, water guide pipe; 17, first heat insulation frame; 18, semiconductor cooler; 19, protection frame; 20, second heat insulation frame; 21, electric heating sleeve; 22, air extraction structure; 23, air guide pipe; 24, temperature sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1 to 3 , an intelligent temperature control device of a hot pressing and coating equipment for automobile parts in this embodiment includes a bottom plate 1, and a coating temperature adjustment mechanism is arranged on the top of the bottom plate 1.

[0024] In this embodiment, the coating temperature adjustment mechanism includes a lower mold part 2 fixedly connected to the top of a bottom plate 1. A movable plate 6 is movably connected to the top of the bottom plate 1, and an upper mold part 7 is fixedly connected to the bottom of the movable plate 6, facilitating the movable plate 6 to drive the upper mold part 7 to move vertically. A regulating component for adjusting the position of the movable plate 6 is arranged on the top of the bottom plate 1.

[0025] Among them, the regulating component includes a support rod 3 fixedly connected to the top of the bottom plate 1, and the movable plate 6 is slidably connected to the support rod 3. The top of the support rod 3 is fixedly connected to a top plate 4, and a driving member 5 is fixedly connected to the inside of the top plate 4. The output end of the driving member 5 is fixedly connected to the top of the movable plate 6, facilitating the adjustment of the position of the movable plate 6 by the operation of the driving member 5, and the sliding of the movable plate 6 outside the support rod 3 can ensure the positioning accuracy of the lower mold part 2 and the upper mold part 7.

[0026] In this embodiment, heat transfer frames 8 are fixedly connected to the inside of both the lower mold part 2 and the upper mold part 7. A temperature sensor 24 is fixedly connected to the top of the movable plate 6, and the probe of the temperature sensor 24 extends to the inside of the heat transfer frame 8 in the upper mold part 7, facilitating the monitoring of the temperature inside the heat transfer frame 8 in the upper mold part 7 by the temperature sensor 24.

[0027] Among them, diversion grooves 9 are formed inside both the lower mold part 2 and the upper mold part 7, and the diversion grooves 9 are distributed outside the heat transfer frame 8 in a serpentine arrangement, facilitating the adjustment of the temperature inside the heat transfer frame 8 by the flowing liquid.

[0028] In this embodiment, a water storage tank 10 is movably connected to the outside of the bottom plate 1. A first heat insulation frame 17 and a second heat insulation frame 20 are fixedly connected to the inside of the water storage tank 10. A cooling pipe 13 is fixedly connected to the inside of the first heat insulation frame 17, and a semiconductor refrigerator 18 extending into the inside of the first heat insulation frame 17 is fixedly connected to the inside of the water storage tank 10, facilitating the cooling of the liquid in the cooling pipe 13 by the semiconductor refrigerator 18.

[0029] Among them, a heating pipe 15 is fixedly connected to the inside of the second heat insulation frame 20, and an electric heating sleeve 21 sleeved outside the heating pipe 15 is fixedly connected to the inside of the second heat insulation frame 20, facilitating the heating of the liquid in the heating pipe 15 by the electric heating sleeve 21. A water supply component for realizing the circulating flow of the liquid in the heating pipe 15, the diversion groove 9, and the cooling pipe 13 is arranged inside the water storage tank 10.

[0030] In this embodiment, the water supply component includes a circulation pump 11 fixedly connected to the top of the water storage tank 10 and communicating with the cooling pipe 13. One end of the circulation pump 11 away from the cooling pipe 13 is fixedly connected to a first three-way pipe 12, and a second three-way pipe 14 communicating with the heating pipe 15 is fixedly connected to the inside of the water storage tank 10, facilitating the adjustment of the liquid flow direction by the regulation of the circulation pump 11.

[0031] Among them, the water supply assembly further includes water conduits 16 fixedly connected inside the lower module 2 and the upper module 7 and located at both ends of the drainage groove 9. The water conduits 16 located at both ends of the drainage groove 9 are respectively communicated with the first three-way pipe 12 and the second three-way pipe 14, facilitating the water supply driving structure to communicate with the drainage groove 9 through the water conduits 16, thereby facilitating the control of the liquid flow.

[0032] In this embodiment, an air extraction assembly for realizing heat dissipation and ventilation of the semiconductor cooler 18 is provided at the top of the water storage tank 10. The air extraction assembly includes a protective frame 19 fixedly connected to the top of the water storage tank 10 and corresponding to the position of the semiconductor cooler 18. An air extraction structure 22 is provided inside the protective frame 19. A gas conduit 23 extending to the second heat insulation frame 20 is fixedly connected to the top of the protective frame 19. The air extraction structure 22 is composed of a driving motor and a fan blade, facilitating the rotation of the fan blade to drive the air flow inside the protective frame 19, so as to improve the heat dissipation efficiency of the hot end of the semiconductor cooler 18.

[0033] It should be noted that the electrical components appearing in the text are all electrically connected to the main controller and the power supply. The main controller can be a conventional known device such as a PLC for control, facilitating the staff to control the operation of each electrical component according to needs. The PLC control is an existing publicly known electrical connection technology and will not be elaborated in the text.

[0034] The beneficial effects of the above embodiment are as follows:

[0035] The intelligent temperature control device of the hot press coating equipment for automotive parts can extract the liquid inside the water storage tank 10 to the inside of the lower module 2 and the upper module 7 through the operation of the water supply assembly, realizing the temperature adjustment of the lower module 2 and the upper module 7. When the heating pipe 15 is the liquid inlet, the electric heating sleeve 21 can heat the liquid entering the circulation pipeline, thereby facilitating the increase of the temperature of the lower module 2 and the upper module 7, effectively activating the glue on the veneer material, and realizing the preheating and heat preservation of the veneer material and the automotive parts, thus facilitating the maintenance of a good coating effect;

[0036] After the coating operation is completed, the water supply assembly can reverse the extraction of the liquid, making the cooling pipe 13 the inlet of the liquid circulation pipeline, so as to cooperate with the refrigeration effect of the semiconductor cooler 18 to cool the liquid entering the circulation pipeline, thereby facilitating the cooling of the lower module 2 and the upper module 7 and accelerating the curing speed of the glue; furthermore, the effect of realizing temperature control according to needs can be achieved, effectively improving the coating work efficiency of automotive parts and enhancing the practicability of the device.

[0037] The working principle of the above embodiment is as follows:

[0038] For the intelligent temperature control device of the hot pressing and coating equipment for automotive parts, during use, first, the veneer material needs to be installed in the lower die part 2, and the automotive part to be processed needs to be installed in the upper die part 7. Then, the circulation pump 11 can be operated to make the liquid in the water storage tank 10 enter the liquid circulation pipeline from the heating pipe 15 and flow into the interiors of the lower die part 2 and the upper die part 7 along the liquid circulation pipeline. During this process, the provided electric heating sleeve 21 can heat the liquid flowing in the heating pipe 15, so as to realize the heating and heat preservation of the heat transfer frame 8 inside the lower die part 2 and the upper die part 7, thereby preventing the temperature of the automotive part and the veneer material from decreasing and keeping the glue on the veneer material in an activated state;

[0039] At this time, the driving part 5 can be operated to drive the movable plate 6 to move downward, so as to facilitate the closing of the mold and make the automotive part fully contact the veneer material. After that, to ensure the bonding effect between the automotive part and the veneer material, the circulation pump 11 can be operated in reverse to make the liquid in the water storage tank 10 enter the liquid circulation pipeline from the cooling pipe 13. With the cooling effect of the semiconductor cooler 18 on the liquid flowing in the cooling pipe 13, the temperature reduction of the heat transfer frame 8 inside the lower die part 2 and the upper die part 7 can be realized, so as to facilitate the acceleration of the glue curing speed, effectively improve the coating work efficiency of the automotive part, and enhance the practicability of the device;

[0040] In addition, when the semiconductor cooler 18 is operating, the provided air extraction structure 22 can extract the air in the protective frame 19 to the second heat insulation frame 20, so as to improve the heat dissipation efficiency of the hot end of the semiconductor cooler 18 and maintain the use effect of the semiconductor cooler 18. Moreover, after the liquid flow direction is adjusted, the hot air entering the second heat insulation frame 20 can preheat the liquid in the heating pipe 15, so as to improve the working efficiency of the electric heating sleeve 21.

[0041] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the process, method, article or device including the said element.

[0042] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An intelligent temperature control device for hot pressing and coating equipment for automobile parts, comprising a bottom plate (1), characterized in that: A covering temperature regulating mechanism is provided on the top of the bottom plate (1); The coating temperature adjustment mechanism comprises a lower mold (2) fixedly connected to the top of a bottom plate (1), a movable plate (6) movably connected to the top of the bottom plate (1), an upper mold (7) fixedly connected to the bottom of the movable plate (6), an adjustment component for adjusting the position of the movable plate (6) is arranged at the top of the bottom plate (1), a heat transfer frame (8) is fixedly connected to the inside of the lower mold (2) and the upper mold (7), and a temperature sensor (24) is fixedly connected to the top of the movable plate (6); The lower mold (2) and the upper mold (7) are both provided with drainage grooves (9); the outer side of the bottom plate (1) is movably connected to a water storage tank (10); the interior of the water storage tank (10) is fixedly connected to a first insulation frame (17) and a second insulation frame (20); the interior of the first insulation frame (17) is fixedly connected to a cooling pipe (13); the interior of the water storage tank (10) is fixedly connected to a semiconductor refrigerator (18) extending into the interior of the first insulation frame (17); A heating tube (15) is fixedly connected to the interior of the second heat insulation frame (20), and an electric heating sleeve (21) sleeved on the outside of the heating tube (15) is fixedly connected to the interior of the second heat insulation frame (20). A water supply component for realizing the circulation of liquid in the heating tube (15), the drainage groove (9) and the cooling tube (13) is arranged inside the water storage tank (10), and an exhaust component for realizing heat dissipation and ventilation of the semiconductor refrigerator (18) is arranged on the top of the water storage tank (10).

2. The intelligent temperature control device for hot pressing and coating equipment of automobile parts according to claim 1 is characterized in that: The adjustment assembly comprises a support rod (3) fixedly connected to the top of the base plate (1), and a movable plate (6) is slidably connected to the support rod (3), the top of the support rod (3) is fixedly connected to a top plate (4), the interior of the top plate (4) is fixedly connected to a driving member (5), and the output end of the driving member (5) is fixedly connected to the top of the movable plate (6).

3. The intelligent temperature control device for hot pressing and coating equipment of automobile parts according to claim 1 is characterized in that: The drainage grooves (9) are distributed on the outside of the heat transfer frame (8) in a serpentine arrangement, and the probe of the temperature sensor (24) extends to the inside of the heat transfer frame (8) inside the upper mold (7).

4. The intelligent temperature control device for hot pressing and coating equipment of automobile parts according to claim 1 is characterized in that: The water supply assembly comprises a circulation pump (11) fixedly connected to the top of a water storage tank (10) and in communication with a cooling pipe (13); one end of the circulation pump (11) away from the cooling pipe (13) is fixedly connected to a first three-way pipe (12); and the interior of the water storage tank (10) is fixedly connected to a second three-way pipe (14) in communication with a heating pipe (15).

5. The intelligent temperature control device for hot pressing and coating equipment of automobile parts according to claim 4 is characterized in that: The water supply assembly further comprises a water pipe (16) fixedly connected to the interior of the lower mold (2) and the upper mold (7) and located at both ends of the drainage groove (9), and the water pipes (16) located at both ends of the drainage groove (9) are respectively connected to the first three-way pipe (12) and the second three-way pipe (14).

6. The intelligent temperature control device for hot pressing and coating equipment of automobile parts according to claim 1, characterized in that: The exhaust assembly comprises a protective frame (19) fixedly connected to the top of the water storage tank (10) and corresponding to the position of the semiconductor refrigerator (18), an exhaust structure (22) is arranged inside the protective frame (19), and an air guide pipe (23) extending to the second insulation frame (20) is fixedly connected to the top of the protective frame (19).

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