Packaging structure of sound box suite
By using the first and second buffers in the package of the audio kit, and packing it into one piece with tie-fitting, the existing audio kit is solved for complex packaging and inconvenient transportation, and a simpler and safer transportation and handling process is achieved.
Patent Information
- Application Number
- CN202421485136.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-06-26
AI Technical Summary
The packaging design of the existing audio kit is complex, and the subwoofer and speaker main body need to be removed separately, which leads to inconvenient transportation and handling, and is prone to missing accessories.
The low-pressure audio and accessory box are secured using a first and second cushioning member and packaged into a whole by a tie ties, simplifying the transportation and handling process.
The overall packaging of the audio kit is realized, reducing the loss of accessories during transportation, reducing the volume, making it more convenient to pick up and carry.
Smart Images

Figure CN223031644U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display audio, and particularly to a packaging structure for an audio kit. Background Art
[0002] With the progress of society, people aspire to a more colorful life. As a form of entertainment that has been passed down for thousands of years, singing and dancing have penetrated into the lives of people of all ethnic groups. However, with the development and progress of technology, people have more and more and higher requirements for the performance forms and venues of singing and dancing. The audio system has been continuously improved and perfected to meet people's needs. It can meet the needs of live sound reinforcement for tens of thousands of people in large concerts, and also meet the needs of individuals for playing musical instruments and singing karaoke at home.
[0003] For the packaging design of larger strip-shaped audio, the subwoofer and the main body of the speaker are often clamped separately with foam and then packed separately. When users extract them, they need to take out each piece separately, which is rather cumbersome. Especially when the subwoofer is usually installed in the package, it is only wrapped with a plastic bag, and it is large in volume and heavy in weight, making it very inconvenient to take.
[0004] At the same time, since different parts of the product need to be taken out separately, it is easy to miss accessories; on the other hand, if the configurations of the products are different, it is often necessary to replace the accessory box or adjust the product packaging and structure, resulting in inconvenient preparation of materials and transportation. Summary of the Utility Model
[0005] In order to solve the above technical problems or at least partially solve the above technical problems, this application provides a packaging structure for an audio kit.
[0006] This application provides a packaging structure for an audio kit, including:
[0007] A first buffer member, the upper surface of the first buffer member is recessed downward to form a first card slot;
[0008] A low-frequency subwoofer, the lower end of the low-frequency subwoofer is clamped in the first card slot;
[0009] A second buffer member, the lower surface of the second buffer member is provided with a second card slot, and the second card slot is fixedly clamped with the upper end of the low-frequency subwoofer;
[0010] An accessory box, the accessory box is arranged adjacent to the low-frequency subwoofer, and the accessory box is clamped between the first buffer member and the second buffer member;
[0011] A binding band, which is wound around the first buffer member and the second buffer member to pack the first buffer member, the second buffer member, the low-frequency subwoofer and the accessory box into a whole.
[0012] In some embodiments, a third card slot is further provided on the upper surface of the first buffer member. The third card slot is spaced apart from the first card slot, and the third card slot is used for installing a surrounding box.
[0013] In some embodiments, the surrounding box is disposed lower than the upper surface of the first buffer member, or the surrounding box is flush with the upper surface of the first buffer member.
[0014] In some embodiments, the projection of the accessory box on the first buffer member completely covers the third card slot.
[0015] In some embodiments, a first avoidance notch is provided at a position corresponding to the binding strap on the upper surface of the second buffer member.
[0016] In some embodiments, a fourth card slot is provided on the lower surface of the second buffer member. The fourth card slot is used for installing a surrounding box.
[0017] In some embodiments, the surrounding box located in the fourth card slot is disposed lower than the lower surface of the second buffer member, or the surrounding box located in the fourth card slot is flush with the lower surface of the second buffer member.
[0018] In some embodiments, an outer packing box is further included. A handle position is provided on the side wall of the outer packing box, and a groove is provided at a position corresponding to the handle position of the accessory box.
[0019] In some embodiments, a main speaker is further included. The main speaker is disposed above the second buffer member.
[0020] In some embodiments, a third buffer member is further included. The number of the third buffer members is multiple. The multiple third buffer members are sleeved on the main speaker at intervals along the length direction of the main speaker.
[0021] In some embodiments, a second avoidance notch is provided on the upper surface of at least part of the third buffer members.
[0022] The technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:
[0023] The packaging structure of the audio kit provided by the embodiment of the present application fixes the subwoofer and the accessory box between the first buffer member and the second buffer member, and uses a binding strap to surround the first buffer member and the second buffer member, and packs the first buffer member, the second buffer member, the subwoofer and the accessory box into a whole. During transportation and handling, the packed whole can be carried, avoiding the loss of accessories during transportation. At the same time, the volume of the packed whole structure is reduced, which is convenient to take and is convenient for handling and transportation. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings here are incorporated into the description and form a part of this description, showing embodiments consistent with this application, and are used together with the description to explain the principles of this application.
[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0026] Figure 1 It is an exploded view of the packaging structure of the audio kit according to some embodiments of this application;
[0027] Figure 2 It is a schematic structural view of the first buffer member according to some embodiments of this application;
[0028] Figure 3 It is a schematic structural view of the second buffer member according to some embodiments of this application;
[0029] Figure 4 It is a schematic structural view of the accessory box according to some embodiments of this application;
[0030] Figure 5 It is a schematic view of the packaging structure of the first buffer member, the second buffer member, the subwoofer, the accessory box and the surround box according to some embodiments of this application;
[0031] Figure 6 It is a schematic view of the packaging structure of the audio kit according to some embodiments of this application;
[0032] Figure 7 It is a schematic view of the packaging structure of the audio kit according to some embodiments of this application;
[0033] Figure 8 It is a schematic structural view of the main speaker according to some embodiments of this application;
[0034] Figure 9 It is a schematic structural view of the subwoofer according to some embodiments of this application;
[0035] Figure 10 It is a schematic structural view of the surround box according to some embodiments of this application.
[0036] Among them, 1 is the first buffer member; 101 is the first card slot; 102 is the third card slot; 2 is the subwoofer; 3 is the accessory box; 301 is the groove; 4 is the second buffer member; 401 is the first avoidance notch; 5 is the surround box; 6 is the binding strap; 7 is the main speaker; 8 is the third buffer member; 801 is the second avoidance notch; 9 is the outer packing box. Detailed implementation manners
[0037] In order to more clearly understand the above-mentioned objects, features and advantages of the present application, the solutions of the present application will be further described below. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0038] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present application, rather than all the embodiments.
[0039] It should be noted that the directional indications (such as up, down, left, right, front, back,...) in the present utility model are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture (as shown in the drawings). If this specific posture changes, the directional indications will also change accordingly.
[0040] The terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.
[0041] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. In addition, when describing pipelines, the terms "connected" and "coupled" used in the present application have the meaning of conducting. The specific meaning needs to be understood in combination with the context.
[0042] A bar-shaped soundbar refers to a single bar-shaped soundbar that has two or more channels installed and usually comes with a subwoofer. In the packaging design of larger bar-shaped soundbars, the subwoofer and the main body of the speaker are often clamped separately with foam and then packed separately in boxes. When users extract them, they need to take out each piece separately, which is rather cumbersome. Especially when the subwoofer is usually installed in the packaging, it is only wrapped with a plastic bag, and it is large in volume and weight, making it very inconvenient to take.
[0043] At the same time, since different parts of the product need to be taken out separately, it is easy to miss accessories; on the other hand, if there are differences in the configuration of the product, it is often necessary to replace the accessory box or adjust the product packaging and structure, resulting in inconvenience in material preparation and transportation.
[0044] To solve the above technical problems, an embodiment of the present application provides a packaging structure for a sound kit. The sound kit is first bundled and packed with a binding band, which is convenient for transportation and handling.
[0045] As Figures 1 to 10 described, in some embodiments of the present application, the packaging structure of the sound kit includes:
[0046] A first buffer member 1, which is made of materials such as foam or sponge, plays a buffering and protecting role for the sound kit. A first card slot 101 is formed by downward depression on the upper surface of the first buffer member 1, and the first card slot 101 is used to install the sound kit.
[0047] In some embodiments, the packaging structure of the sound kit further includes a subwoofer 2. The shape of the subwoofer 2 is a rectangular block structure. The shape of the first card slot 101 is adapted to the outer shape of the lower end of the subwoofer 2, and the lower end of the subwoofer 2 is clamped in the first card slot 101; the side wall of the first card slot 101 tightly wraps the lower end of the subwoofer 2 in the circumferential direction, thereby limiting and buffering the lower end of the subwoofer 2, preventing the lower end of the subwoofer 2 from shaking in the first card slot 101, improving the stability of the packaging structure, and avoiding collisions between the various parts of the sound kit during transportation.
[0048] In some embodiments, the packaging structure of the sound kit further includes a second buffer member 4, which is made of sponge or foam material. The second buffer member 4 is disposed above the subwoofer 2, and a second card slot is provided on the lower surface of the second buffer member 4. The shape of the second card slot is adapted to the shape of the upper end of the subwoofer 2, and the upper end of the subwoofer 2 is clamped in the second card slot. The side wall of the second card slot tightly wraps the upper end of the subwoofer 2 in the circumferential direction, thereby realizing the functions of limiting and buffering the upper end of the subwoofer 2, preventing the upper end of the subwoofer 2 from shaking in the second card slot, improving the stability of the packaging structure, and avoiding collisions between the various parts of the sound kit during transportation.
[0049] The outer shape of the second buffer member 4 is the same as that of the first buffer member 1, and they also have the same length, height, and width. After the speaker kit is installed, the first buffer member 1 and the second buffer member 4 are arranged opposite to each other, and the four side surfaces of the first buffer member and the four side surfaces of the second buffer member are located in a plane in one-to-one correspondence. Exemplarily, the left side surface of the first buffer member 1 and the left side surface of the second buffer member 4 are located in the same plane, the right side surface of the first buffer member 1 and the right side surface of the second buffer member 4 are located in the same plane, the front side surface of the first buffer member 1 and the front side surface of the second buffer member 4 are located in the same plane, and the rear side surface of the first buffer member 1 and the rear side surface of the second buffer member 4 are located in the same plane. This reduces the size of the outer packaging box 9, enables the four side surfaces of the first buffer member and the second buffer member to fit against the side walls of the outer packaging box 9, and reduces the waste of space.
[0050] In some embodiments, the packaging structure of the speaker kit further includes an accessory box 3. The accessory box 3 is arranged adjacent to the subwoofer 2, and the accessory box 3 is clamped between the first buffer member 1 and the second buffer member 4. The accessory box 3 has a rectangular box-like structure, and the upper surface of the accessory box 3 fits against the lower surface of the second buffer member 4, and the lower surface of the accessory box 3 fits against the upper surface of the first buffer member 1; the interior of the accessory box 3 is hollow and is used for storing accessories of the audio product, such as data cables, power cords, charging plugs, product manuals, etc.
[0051] The accessory box 3 is made of hard cardboard, which is an empty box folded from hard cardboard, and at least one side can be opened to facilitate the taking and placing of accessories of the audio product.
[0052] In some embodiments, the packaging structure of the speaker kit further includes a binding strap 6. The binding strap 6 successively bypasses the first buffer member 1 and the second buffer member 4 to bundle the first buffer member 1, the second buffer member 4, the subwoofer 2, and the accessory box 3 into a whole.
[0053] In some embodiments, the number of the binding straps 6 is one or more. One end of the binding strap 6 successively bypasses the first buffer member 1 and the second buffer member 4 and then is fixedly connected to the other end of the binding strap 6. The binding strap 6 can wind around the first buffer member 1 and the second buffer member 4 for at least one circle.
[0054] In some embodiments, the number of the binding straps 6 is two, and the two binding straps 6 are arranged at intervals; the two binding straps 6 are arranged at positions close to both ends of the first buffer member 1 and the second buffer member 4, so that the two binding straps 6 can have a good fixing effect on the first buffer member 1, the second buffer member 4, the subwoofer 2, and the accessory box 3, and prevent the bundled overall structure from falling apart during handling.
[0055] When handling the bundled overall structure, the operator only needs to hold the two binding straps 6 with both hands to lift the bundled overall structure, which is very convenient.
[0056] The overall volume of the packaged structure is reduced, making it convenient to pick up, carry, and transport.
[0057] In some embodiments, a third card slot 102 is further provided on the upper surface of the first buffer member 1. The third card slot 102 is spaced apart from the first card slot 101, and the third card slot 102 is used to install the surrounding box 5. The side wall of the second card slot tightly wraps the surrounding box 5 in the circumferential direction, thereby limiting the surrounding box 5 and playing a buffering role, preventing the surrounding box 5 from shaking in the third card slot 102, improving the stability of the packaging structure, and avoiding collisions between various parts of the audio kit during transportation.
[0058] In some embodiments, the surrounding box 5 is completely accommodated in the third card slot 102 and does not protrude from the third card slot 102. That is to say, the height of the surrounding box 5 is less than or equal to the depth of the third card slot 102, and the surrounding box 5 is disposed below the upper surface of the first buffer member 1 or flush with the upper surface of the first buffer member 1. When the accessory box 3 is installed, the surface in contact with the lower surface of the accessory box 3 is the upper surface of the first buffer member 3. The installation of the surrounding box 5 does not affect the installation and fixation of the accessory box 3. The side wall of the third card slot 102 tightly wraps the surrounding box 5, preventing the surrounding box 5 from contacting, rubbing, or colliding with the subwoofer 2.
[0059] The surrounding box 5 is completely accommodated in the third card slot 102, and at the same time, it can be ensured that when the accessory box 3 is placed on the first buffer member 1, the lower surface of the accessory box 3 is in planar contact with the first buffer member 1, preventing the accessory box 3 from tilting.
[0060] In some embodiments, the projection of the accessory box 3 on the first buffer member 1 completely covers the third card slot 102, preventing the accessory box 3 from entering the third card slot 102 and affecting the surrounding box 5.
[0061] In some embodiments, the cross-section of the accessory box 3 is rectangular, and the cross-section of the third card slot 102 is also rectangular. The length of the cross-section of the accessory box 3 is greater than the length of the cross-section of the third card slot 102, and the width of the cross-section of the accessory box 3 is greater than the width of the cross-section of the third card slot 102. When the accessory box 3 is placed on the first buffer member 1, the accessory box 3 will not fall into the third card slot 102, and the gravity of the accessory box 3 does not act on the surrounding box 5 in the third card slot 102, avoiding affecting the normal packaging of the surrounding box 5.
[0062] In some embodiments, a first avoidance notch 401 is provided at a position corresponding to the binding strap 6 on the upper surface of the second buffer member 4. The first avoidance notch 401 is provided directly below the binding strap 6. The first avoidance notch 401 provides an operating space for the operator's hand. The operator's hand passes through the first avoidance notch 401 to grab the binding strap 6, facilitating lifting the packaged overall structure.
[0063] The first avoidance notch 401 is a recessed structure formed on the upper surface of the second buffer member 4. The size of the notch of the first avoidance notch 401 is larger than the size of the bottom of the first avoidance notch 401. In some embodiments, the two side walls of the first avoidance notch 401 located on both sides of the binding strap 6 are inclined, meeting the requirements of ergonomics and facilitating the operator's hand to pass through from below the binding strap 6 to grip the binding strap 6.
[0064] In some embodiments, a fourth card slot is provided on the lower surface of the second buffer member 4 for mounting the surround box 5. That is to say, the audio kit includes two surround boxes 5. One surround box 5 is arranged in the third card slot 102, and the other surround box 5 is arranged in the fourth card slot.
[0065] In some embodiments, the number of surround boxes 5 can also be one. One surround box 5 is arranged in the third card slot 102 or the fourth card slot. The third card slot 102 can exist simultaneously, or only the third card slot 102 is provided on the first buffer member 1, or only the fourth card slot is provided on the second buffer member 4.
[0066] In some embodiments, the side wall of the fourth card slot tightly wraps the surround box 5 in the circumferential direction to limit and buffer the surround box 5, preventing the surround box 5 from shaking in the fourth card slot.
[0067] In some embodiments, the surround box 5 located in the fourth card slot does not protrude from the notch of the fourth card slot. That is to say, the surround box 5 located in the fourth card slot is completely accommodated in the fourth card slot, and the surround box 5 is arranged lower than the lower surface of the second buffer member 4 or flush with the lower surface of the second buffer member 4, so that the surround box 5 is completely accommodated in the fourth card slot, preventing the surround box 5 from protruding from the notch of the fourth card slot and affecting the installation of the accessory box 3.
[0068] In some embodiments, the fourth card slot is arranged opposite to the third card slot 102 and has exactly the same size. The cross-sectional area of the accessory box 3 is larger than the cross-sectional area of the fourth card slot, the length of the cross-section of the accessory box 3 is larger than the length of the cross-section of the fourth card slot, and the width of the cross-section of the accessory box 3 is larger than the width of the cross-section of the fourth card slot. When packaging the audio kit, the upper end of the accessory box 3 will not be embedded in the fourth card slot but will fit against the lower surface of the second buffer member 4.
[0069] When the upper and lower ends of the subwoofer 2 are respectively matched with the first buffer member 1 and the second buffer member 4, the distance between the first buffer member 1 and the second buffer member 4 is equal to or slightly larger than the height of the accessory box 3. That is to say, after assembly, the first buffer member 1 and the second buffer member 4 have a clamping and fixing effect on the accessory box 3, thus preventing the accessory box 3 from falling from between the first buffer member 1 and the second buffer member 4.
[0070] The height of the subwoofer 2 is equal to the sum of the height of the accessory box 3 and the depths of the first card slot 101 and the second card slot. Exemplarily, the height of the subwoofer 2 (the distance between the upper surface and the lower surface of the subwoofer 2) is H, the height of the accessory box 3 (the distance between the upper surface and the lower surface of the accessory box 3) is L, the depth of the first card slot is M, and the depth of the second card slot is N, and H = L + M + N.
[0071] In some embodiments, when the audio kit does not include the surround box 5, the third card slot 102 and the fourth card slot are completely empty, which does not affect the normal packaging of the accessory box 3, does not affect the overall structural strength after packaging, and reduces the material consumption of the first buffer 1 and the second buffer 4.
[0072] In some embodiments, when the audio kit includes the surround box 5, the accessory box 3 is arranged opposite to the third card slot 102 and the fourth card slot, and plays a role in supporting and buffering the surround box 5 in the third card slot 102 and the fourth card slot.
[0073] When packaging the audio kit, first place the two surround boxes 5 in the third card slot 102 and the fourth card slot respectively, then place the subwoofer 2 in the first card slot 101, place the accessory box 3 above the third card slot 102, and then invert the second buffer 4 on the subwoofer 2 and the accessory box 3 so that the upper end of the subwoofer 2 is clamped in the second card slot. At this time, the upper end of the accessory box 3 is arranged opposite to the fourth card slot and just fits the lower surface of the second buffer 4; then tie the first buffer 1, the second buffer 4, the subwoofer 2 and the accessory box 3 into a whole with the binding strap 6.
[0074] When carrying the bound overall structure, the operator's hand passes through the first avoidance notch 401 and grasps the binding strap 6, and the above overall structure can be lifted simultaneously.
[0075] In some embodiments, the packaging structure of the audio kit further includes an outer packaging box 9, and a handle position is provided on the side wall of the outer packaging box 9, and a groove 301 is provided at the position of the accessory box 3 corresponding to the handle position.
[0076] In some embodiments, the bound overall structure is placed in the outer packaging box 9. The outer packaging box 9 is a rigid cardboard box, which plays a role in protecting the bound overall structure. A handle position is provided on the side wall of the outer packaging box 9. In some embodiments, the handle position is set as a through hole penetrating the side wall of the outer packaging box 9, generally a rectangular through hole. When carrying the outer packaging box 9, the operator's hand can be inserted into the handle position to conveniently apply an upward force to the outer packaging box 9 to lift the outer packaging box 9.
[0077] In some embodiments, the side of the accessory box 3 away from the low-noise speaker 2 is flush with the sides of the first buffer component 1 and the second buffer component 4. After the above-mentioned packaged overall structure is placed in the outer packaging box 9, the side of the first buffer component 1, the side of the second buffer component 4 and the side of the accessory box 3 away from the low-noise speaker 2 are almost in contact with the side wall of the outer packaging box 9, and the groove 301 on the accessory box 3 is opposite to the hand-clasp position on the outer packaging box 9, making room for the operator's hands.
[0078] In some embodiments, there is a certain distance between the side wall of the first card slot 101 away from the third card slot 102 and the side wall of the first buffer 1. Therefore, when the subwoofer 2 is placed in the first card slot 101 and the third card slot 102, there is a certain distance between the side of the subwoofer 2 away from the accessory box 3 and the corresponding side walls of the first buffer 1 and the second buffer 4. When the packaged overall structure is placed in the outer packaging box 9, even if the first buffer 1 and the second buffer 4 are in contact with the side walls of the outer packaging box 9, there will be a certain distance between the side wall of the subwoofer 2 away from the accessory box 3 and the side wall of the outer packaging box 9, because the inner side of the outer packaging box 9 at the hand buckle position is empty, which can automatically make way for the operator's hands.
[0079] In some embodiments, when the subwoofer 2 is placed in the first card slot 101 and the second card slot, and the accessory box 3 is placed between the third card slot 102 and the fourth card slot, the side wall of the subwoofer 2 is fitted with the side wall of the accessory box 3 .
[0080] In some embodiments, the packaging structure of the audio kit further includes a main speaker 7 , which is disposed above the second buffer 4 .
[0081] The main speaker 7 is a long strip of speaker, and the outer packaging box 9 is L-shaped. The outer lower part of the outer packaging box 9 is used to place the above-mentioned packaged overall structure, and the upper structure of the outer packaging box 9 is used to place the main speaker 7. The lower part of the outer packaging box 9 is wrapped around the outside of the packaged overall structure. The shape of the upper space of the outer packaging box 9 matches the outer box of the main speaker 7, and the upper part of the outer packaging box 9 is wrapped around the outside of the main speaker 7.
[0082] In some embodiments, the packaging structure of the audio kit further includes a third buffer member 8 , and the number of the third buffer members 8 is multiple, and the multiple third buffer members 8 are arranged on the main speaker 7 at intervals along the length direction of the main speaker 7 .
[0083] In some embodiments, the cross-section of the main speaker 7 is rectangular, therefore, the shape of the third buffer member 8 is also a rectangular block, and the second buffer member 4 is provided with a perforation, the shape of the perforation is adapted to the shape of the cross-section of the main speaker 7, so that the third buffer member 8 can be tightly wrapped around the main speaker 7 to provide limitation and buffering for the main speaker 7.
[0084] In some embodiments, part of the third buffer 8 is placed on the second buffer 4, and another part of the third buffer 8 is placed on the outer packing box 9.
[0085] A second avoidance notch 801 is provided on the upper surface of at least part of the third buffer 8 to provide a force application space for the operator's hand when the main speaker 7 is placed in or taken out of the outer packing box 9.
[0086] In some embodiments, each component of the speaker kit further includes a packaging bag. When the speaker kit is packaged, the packaging bags of the respective components are sleeved outside the respective components to protect the respective components. The packaging bag is a transparent plastic bag, and the packaging bags of the respective components are adapted to the outer shapes of the respective parts.
[0087] In summary, for the packaging structure of the speaker kit provided by the present application, first, the subwoofer speaker 2, the accessory box 3, and the surround box 5 are bundled into a whole by the first buffer 1, the second buffer 4, and the binding strap 6, and then placed in the outer packing box 9; the third buffer 8 is sleeved on the main speaker 7 and then placed above the overall structure packed as above. The packaging structure of the speaker kit facilitates transportation during the sales process and extraction by the operator.
[0088] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments described herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A packaging structure of an audio kit, characterized in that: include: A first buffer member, wherein the upper surface of the first buffer member is recessed downward to form a first clamping groove; A bass speaker, the lower end of which is clamped in the first clamping slot; A second buffer, wherein a second slot is provided on the lower surface of the second buffer, and the second slot is fixedly connected to the upper end of the bass speaker; An accessory box, the accessory box is disposed adjacent to the low-pitched sound system, and the accessory box is sandwiched between the first buffer member and the second buffer member; The binding belt is wrapped around the first buffer member and the second buffer member to pack the first buffer member, the second buffer member, the low-pitched speaker and the accessory box into a whole.
2. The packaging structure of the audio kit according to claim 1, characterized in that: A third slot is also provided on the upper surface of the first buffer member. The third slot is spaced apart from the first slot and is used for installing a surround box.
3. The packaging structure of the audio kit according to claim 2, characterized in that: The surrounding box is arranged below the upper surface of the first buffer, or the surrounding box is flush with the upper surface of the first buffer.
4. The packaging structure of the audio kit according to claim 2, characterized in that: The projection of the accessory box on the first buffer completely covers the third card slot.
5. The packaging structure of the audio kit according to claim 4, characterized in that: The upper surface of the second buffer member is provided with a first avoidance notch at a position corresponding to the binding belt.
6. The packaging structure of the audio kit according to claim 3, characterized in that: A fourth slot is provided on the lower surface of the second buffer member, and the fourth slot is used for installing the surround box.
7. The packaging structure of the audio kit according to claim 6, characterized in that: The surrounding box located in the fourth slot is arranged lower than the lower surface of the second buffer, or the surrounding box located in the fourth slot is flush with the lower surface of the second buffer.
8. The packaging structure of the audio kit according to claim 1, characterized in that: It also includes an outer packaging box, a handle position is provided on the side wall of the outer packaging box, and the accessory box is provided with a groove at a position corresponding to the handle position.
9. The packaging structure of the audio kit according to claim 1, characterized in that: It also includes a main speaker and a third buffer. The main speaker is arranged above the second buffer. There are multiple third buffers, and the multiple third buffers are sleeved on the main speaker at intervals along the length direction of the main speaker.
10. The packaging structure of the audio kit according to claim 9, characterized in that: A second avoidance notch is disposed on the upper surface of at least a portion of the third buffer member.