Elastic jacking mechanism for SMD (Surface Mount Device) diode

Abstract

The utility model discloses an elastic jacking mechanism for a surface-mounted diode, which relates to the technical field of auxiliary detection of electronic devices and specifically structurally comprises a working platform provided with an inclined working surface; the conveying track is installed on the working face, ejector pin holes are formed in the bottom of the conveying track, and pressurizing holes are formed in the top of the conveying track; the jacking mechanism is mounted in the working platform; the ejector pin mechanism is arranged in the ejector pin hole, and the ejector pin mechanism is connected with the output end of the material ejecting mechanism; and the pressurizing mechanism is installed on the working face of the working platform, and the pressurizing end of the pressurizing mechanism is matched with the pressurizing hole. According to the utility model, the technical problems of narrow application range and easy material blocking of the existing SMD diode detection device are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic device auxiliary detection, in particular to an elastic jacking mechanism for a patch diode. Background Technique

[0002] With the development of society, the competition among enterprises is becoming increasingly fierce. Improving product quality and energy conservation and consumption reduction have become the key points of enterprise innovation. At present, glass-encapsulated patch diodes are widely used, and their production scale is gradually expanding. In order to ensure the production qualification of glass-encapsulated patch diodes, it is necessary to use a test tool for electrical performance to conduct qualification detection on glass-encapsulated patch diodes, so as to ensure the safety and stability of the subsequent use of glass-encapsulated patch diodes.

[0003] There are devices for testing patch diodes in the existing market. When performing detection work, such devices usually send the product into the track and then use the fixed detection device in the track for detection. This requires the stability of the product during movement. Once the product deviates or its size changes, the product will get stuck in the track, forming a jam, which affects the detection operation. Content of the Utility Model

[0004] The purpose of the utility model is to provide an elastic jacking mechanism for a patch diode, which solves the technical problems of narrow application range and easy jamming of the existing patch diode detection device.

[0005] The embodiment of the present application discloses an elastic jacking mechanism for a patch diode, including:

[0006] A working platform, which is provided with an inclined working surface;

[0007] A conveying track, which is installed on the working surface. The bottom of the conveying track is provided with a thimble hole, and the top of the conveying track is provided with a pressure hole;

[0008] A material pushing mechanism, which is installed inside the working platform;

[0009] A thimble mechanism, which is arranged inside the thimble hole, and the thimble mechanism is connected to the output end of the material pushing mechanism;

[0010] A pressurizing mechanism, which is installed on the working surface of the working platform, and the pressurizing end of the pressurizing mechanism is matched with the pressure hole.

[0011] The present application is provided with a material pushing mechanism, a thimble mechanism and a pressurizing mechanism, which cooperate with each other to complete the clamping and detection of products, so that products of different sizes can be detected.

[0012] On the basis of the above technical solution, the embodiment of the present application can also be improved as follows:

[0013] Furthermore, the ejector mechanism includes:

[0014] An ejector cylinder, installed inside the working platform, and the movement direction of the piston rod of the ejector cylinder is perpendicular to the working surface;

[0015] An ejector connecting plate, installed at the piston rod end of the ejector cylinder, and the ejector connecting plate is parallel to the working surface. The beneficial effect of this step is that the ejector connecting plate is driven by the ejector cylinder to move, thereby realizing the movement of the subsequent ejector pin mechanism.

[0016] Furthermore, the ejector pin mechanism includes:

[0017] A top plate, installed on the ejector connecting plate;

[0018] At least two ejector pins, installed on the top plate at intervals, and the ejector pins are located inside the ejector pin holes. The beneficial effect of this step is that through the two ejector pins, they are subsequently electrically connected to the detection device to complete the normal temperature electrical test.

[0019] Furthermore, the ejector pin includes:

[0020] A sleeve section, installed on the top plate, and an assembly cavity is provided inside the sleeve section;

[0021] A shrapnel, arranged inside the sleeve section;

[0022] A test pin section, installed inside the sleeve section, and the bottom of the test pin section contacts the shrapnel. The beneficial effect of this step is that through the mutual cooperation of the test pin section and the shrapnel, telescoping can be achieved, thereby realizing the flexible contact between the test pin section and the product and ensuring the quality of the product.

[0023] Furthermore, the pressing mechanism includes:

[0024] A pressing cylinder, installed on the working surface of the working platform;

[0025] A pressing block, installed at the output end of the pressing cylinder, and the pressing block is located inside the pressing hole. The beneficial effect of this step is that the pressing block is pushed by the pressing cylinder and cooperates with the test pin section to complete the clamping of the product.

[0026] Furthermore, the pressing block corresponds to the ejector pin. The beneficial effect of this step is to facilitate clamping.

[0027] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0028] 1. The present application is provided with a blanking mechanism, a thimble mechanism and a pressurizing mechanism. Through the cooperation of these three mechanisms, the detection of products with different sizes can be realized, thereby improving the scope of application.

[0029] 2. The present application is provided with a shrapnel and a test needle section to ensure that the contact between the test needle section and the product is a flexible contact, so as to avoid damaging the product when contacting and ensure the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 It is a schematic structural diagram of an elastic lifting mechanism for a patch diode according to a specific embodiment of the present invention;

[0032] Figure 2 For Figure 1 the schematic structural diagram of the thimble in the middle;

[0033] 1 - working platform; 2 - conveying track; 3 - blanking mechanism; 4 - thimble mechanism; 5 - pressurizing mechanism;

[0034] 101 - working surface;

[0035] 201 - thimble hole; 202 - pressurizing hole;

[0036] 301 - blanking cylinder; 302 - blanking connecting plate;

[0037] 401 - top plate; 402 - thimble; 403 - sleeve section; 404 - assembly cavity; 405 - shrapnel; 406 - test needle section;

[0038] 501 - pressurizing cylinder; 502 - pressing block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The following will describe in detail the embodiments of the technical solutions of the present invention with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention, so they are only examples and cannot be used to limit the protection scope of the present invention.

[0040] It should be noted that unless otherwise specified, the technical terms or scientific terms used in the present application should have the ordinary meaning understood by those skilled in the art to which the present invention belongs.

[0041] In this application, unless otherwise clearly stipulated and defined, terms such as "installation", "connection", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0042] To better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific embodiments.

[0043] Embodiment:

[0044] As Figure 1 、 2 shown, this application discloses an elastic lifting mechanism for a patch diode, which uses a flexible lifting mechanism to complete the lifting of the patch diode, thereby achieving stable clamping and detection.

[0045] The specific structure of this application includes:

[0046] A working platform 1, the working platform 1 is provided with an inclined working surface 101, and the working platform 1 can be welded by multiple plate members, as long as the working surface 101 has an inclined surface;

[0047] A conveying track 2, installed on the working surface 101, the bottom of the conveying track 2 is provided with a thimble hole 201, and the top of the conveying track 2 is provided with a pressure hole 202. The conveying track 2 is an existing track, and a material track is opened inside it to facilitate the passage of the patch diode. When the patch diode moves, it is necessary to detect the patch diode, so corresponding holes are provided for pressurization and monitoring;

[0048] A material pushing mechanism 3, installed inside the working platform 1, and the material pushing mechanism 3 is used to provide power to drive the subsequent thimble mechanism 4 to move, realizing adjustability, so as to meet the detection requirements of patch diodes of different sizes;

[0049] A thimble mechanism 4, arranged inside the thimble hole 201, and the thimble mechanism 4 is connected to the output end of the material pushing mechanism 3. The thimble mechanism 4 makes a movement perpendicular to the working surface 101 under the drive of the material pushing mechanism 3, that is, it extends into and withdraws from the thimble hole 201. When in use, the thimble mechanism 4 can be connected to the detection device through a wire for easy monitoring;

[0050] The pressing mechanism 5 is installed on the working surface 101 of the working platform 1, and the pressing end of the pressing mechanism 5 is matched with the pressing hole 202. The pressing mechanism 5 cooperates with the ejector pin mechanism 4 to complete the clamping and detection of different products.

[0051] In one embodiment, the ejecting mechanism 3 includes:

[0052] An ejecting cylinder 301 is installed inside the working platform 1, and the moving direction of the piston rod of the ejecting cylinder 301 is perpendicular to the working surface 101;

[0053] An ejecting connecting plate 302 is installed at the piston rod end of the ejecting cylinder 301, and the ejecting connecting plate 302 is parallel to the working surface 101.

[0054] The ejecting cylinder 301 is used to push the ejecting connecting plate 302 to move towards or away from the working surface 101, so as to drive the ejector pin mechanism to make the same movement subsequently; a plurality of ejector pin mechanisms can be arranged on the ejecting connecting plate 302 to complete multiple detections.

[0055] Among them, the ejector pin mechanism 4 includes:

[0056] A top plate 401 is installed on the ejecting connecting plate 302;

[0057] At least two ejector pins 402 are installed on the top plate 401 at intervals, and the ejector pins 402 are located inside the ejector pin holes 201; in this application, the ejector pins 402 can move along with the top plate. When the ejecting cylinder 301 moves, the ejector pins 402 can enter or exit the ejector pin holes, and the number is at least two, which is beneficial to complete the electrical detection.

[0058] Specifically, as Figure 2 shown, the ejector pin 402 includes:

[0059] A sleeve section 403 is installed on the top plate 401, and an assembly cavity 404 is opened inside the sleeve section 403;

[0060] A shrapnel 405 is arranged inside the sleeve section 403, and the shrapnel 405 can be replaced with a spring or other types of elastic structures;

[0061] A test pin section 406 is installed inside the sleeve section 403, and the bottom of the test pin section 406 is in contact with the shrapnel 405; the ejector pin 402 in this application is a telescopic ejector pin, and the elastic movement of the test pin section 406 can be realized by using the shrapnel, avoiding hard contact with the surface mount diode and affecting the quality of the surface mount diode.

[0062] Among them, the pressing mechanism 5 includes:

[0063] A pressurizing cylinder 501 is installed on the working surface 101 of the working platform 1;

[0064] A pressing block 502 is installed at the output end of the pressurizing cylinder 501, and the pressing block 502 is located inside the pressurizing hole 202; in this application, the pressurizing cylinder 501 pushes the pressing block 502 into the inside of the pressurizing hole 202, thereby squeezing the surface mount diode.

[0065] The pressing block 502 and the ejector pin 402 in this application correspond to each other and cooperate with each other to achieve flexible contact and measurement; because the material channel of the existing conveying track 2 is relatively narrow in order to cooperate with fixed detection points, so the application is relatively narrow, and if the movement direction of the product is incorrect, it is easy to jam the material; therefore, the material channel of the conveying track 2 in this application is relatively large, which is beneficial to the conveyance of products of different sizes and avoids jamming of materials. In order to achieve subsequent detection, a corresponding telescopic detection unit, that is, a material ejecting mechanism, an ejector pin mechanism and a pressurizing mechanism, needs to be provided to complete the detection.

[0066] The working process of this application is as follows:

[0067] The product to be detected is sent into the conveying track 2. When the surface mount diode product moves to the ejector pin hole 201, the ejecting cylinder 301 of the material ejecting mechanism 3 drives the ejecting connecting plate 302 to move towards the ejector pin hole 201, so that the test pin section 406 extends out of the ejector pin hole 201 and contacts the product to be detected. In order to ensure the tightness during contact, the pressurizing mechanism 5 is started, and the pressurizing cylinder 501 pushes the pressing block 502 to contact the surface of the product and forms a pressure, so that the product is in close contact with the test pin section 406, thereby ensuring the stability of the detection.

[0068] In the description of this specification, a large number of specific details are illustrated. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and technologies are not shown in detail so as not to obscure the understanding of this specification.

[0069] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and the specification of the present invention.

Claims

1. A chip diode elastic lifting mechanism, characterized in that: include: A working platform, wherein the working platform is provided with an inclined working surface; A conveying track is installed on the working surface, a pin hole is arranged at the bottom of the conveying track, and a pressurizing hole is arranged at the top of the conveying track; A material ejecting mechanism is installed inside the working platform; An ejector mechanism is disposed inside the ejector hole and connected to an output end of the ejector mechanism; The pressurizing mechanism is installed on the working surface of the working platform, and the pressurizing end of the pressurizing mechanism matches with the pressurizing hole.

2. The elastic lifting mechanism for the SMD diode according to claim 1, characterized in that: The ejection mechanism comprises: A material-lifting cylinder is installed inside the working platform, and the movement direction of the piston rod of the material-lifting cylinder is perpendicular to the working surface; A material ejection connection plate is installed on the piston rod end of the material ejection cylinder, and the material ejection connection plate is parallel to the working surface.

3. The elastic lifting mechanism for the SMD diode according to claim 2, characterized in that: The ejector mechanism comprises: A top plate, mounted on the top material connecting plate; At least two ejector pins are installed on the ejector plate at intervals, and the ejector pins are located inside the ejector pin holes.

4. The SMD diode elastic lifting mechanism according to claim 3, characterized in that: The ejector pin comprises: A sleeve section is installed on the top plate, and an assembly cavity is provided inside the sleeve section; A spring piece, arranged inside the sleeve section; The test needle segment is installed inside the sleeve segment, and the bottom of the test needle segment contacts the spring sheet.

5. The elastic lifting mechanism for the SMD diode according to claim 4, characterized in that: The pressurizing mechanism comprises: A pressurized cylinder is installed on the working surface of the working platform; A pressure block is installed at the output end of the pressurizing cylinder, and the pressure block is located inside the pressurizing hole.

6. The SMD diode elastic lifting mechanism according to claim 5, characterized in that: The pressing block corresponds to the ejector pin.

Images