Feeding mechanism with overturning function

Abstract

The utility model discloses a feeding mechanism with an overturning function, which comprises a placing frame and a pressing limiting block, the pressing limiting block is movably arranged at one end of the placing frame, and a wafer placing box is placed in the placing frame; the first driving part is mounted outside the placement frame, and the first driving part is in transmission connection with the pressing limiting block, so that the wafer placement box is limited in the placement frame by the pressing limiting block; and the driving assembly is in transmission connection with the placing frame, so that the placing frame and the wafer placing box in the placing frame are converted into a vertical state from a horizontal state. According to the utility model, the situation that the wafer placing box needs to be vertically placed manually is avoided, manual participation is reduced, the operation is simpler, the risk of wafer reversing is avoided, and the wafer placing box is more stable and convenient to adjust and control.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning, in particular to a loading mechanism with a flipping function. Background Art

[0002] With the development of semiconductor cleaning technology, the advantages of single-wafer cleaning type semiconductor cleaning equipment have become more obvious. Therefore, the loading mechanism of the equipment plays an increasingly important role in the whole equipment. The wafer loading mechanism can place a wafer placement box with wafers through manual or automated equipment to provide wafers for the wafer transfer mechanism; it can also place an empty wafer placement box through manual or automated equipment to store the processed wafers; at the same time, it can obtain a wafer placement box with wafers after processing through manual or automated equipment and transfer the wafers to subsequent process equipment.

[0003] In the prior art, manually place the wafer placement box containing wafers on the pallet, fix the wafer placement box, confirm the accurate position through a sensor, and then the manipulator grabs it for the next step.

[0004] Special attention needs to be paid during the manual placement process, otherwise it is easy to cause wafer inversion, resulting in great losses. This situation is more likely to occur when the wafer size is small, and there are also situations of violent and random placement during the manual placement process.

[0005] Therefore, it is of great significance to design a loading mechanism that can be flipped. Summary of the Utility Model

[0006] Aiming at the above problems existing in the existing wafer loading, the present invention aims to provide a loading mechanism with a flipping function.

[0007] The specific technical solutions are as follows:

[0008] A loading mechanism with a flipping function includes:

[0009] A placement frame and a pressing and limiting block, the pressing and limiting block is movably arranged at one end of the placement frame, and the placement frame is used for placing a wafer placement box;

[0010] A first driving member, the first driving member is installed outside the placement frame, and the first driving member is in transmission connection with the pressing and limiting block to limit the wafer placement box in the placement frame;

[0011] A driving assembly, the driving assembly is in transmission connection with the placement frame to convert the placement frame and the wafer placement box therein from a horizontal state to a vertical state.

[0012] The above-mentioned feeding mechanism with a flipping function, wherein the driving assembly includes: a second driving member, a rotating shaft, and a belt. Synchronous wheels are installed on both the second driving member and the rotating shaft, the belt is installed on the two synchronous wheels, and the placement frame is installed on the rotating shaft.

[0013] The above-mentioned feeding mechanism with a flipping function, wherein the placement frame includes: a first support plate and a second support plate. The first driving member is installed on the first support plate, the pressing and limiting block is movably located at one end of the first support plate, the second support plate is provided at the other end of the first support plate, and the two ends of the wafer placement box are clamped by the second support plate and the pressing and limiting block.

[0014] The above-mentioned feeding mechanism with a flipping function, further including: a mounting plate, and the driving assembly is installed on the mounting plate.

[0015] The above-mentioned feeding mechanism with a flipping function, wherein at least one first sensing module is provided on at least one side of the placement frame, at least one first photoelectric switch is provided on the mounting plate, and the first photoelectric switch is in sensing cooperation with the first sensing module.

[0016] The above-mentioned feeding mechanism with a flipping function, wherein at least one second sensing module is provided at the end of the placement frame, at least one second photoelectric switch is provided on the mounting plate, and the second photoelectric switch is in sensing cooperation with the second sensing module.

[0017] The above-mentioned feeding mechanism with a flipping function, wherein two first photoelectric switches and two second photoelectric switches are provided on the mounting plate, one first sensing module is provided on each side of the first support plate, and one second sensing module is provided on each side of the second support plate.

[0018] The above-mentioned feeding mechanism with a flipping function, wherein the first support plate is in a horizontal position or a vertical position through the driving assembly. When the first support plate is in the horizontal position, the two first photoelectric switches are respectively in sensing cooperation with the two first sensing modules. When the first support plate is in the vertical position, the two second photoelectric switches are respectively in sensing cooperation with the two second sensing modules.

[0019] The above-mentioned feeding mechanism with a flipping function, wherein a position sensing module is provided at the bottom of the first support plate for sensing whether the wafer placement box in the placement frame is in place and tilted.

[0020] The above-mentioned feeding mechanism with a flipping function, wherein two flipping support seats are provided on the mounting plate, and the other end of the first support plate is respectively rotatably connected to the two flipping support seats;

[0021] The first pallet is rotationally engaged with the flipping support base through a rotating shaft.

[0022] The positive effects of the above technical solution compared with the prior art are as follows:

[0023] (1) The present utility model avoids the need for manual vertical placement of the wafer placement box, reduces manual participation, is more simple in operation, and avoids the risk of wafer inversion, is more stable, and is convenient for adjustment and control;

[0024] (2) The present utility model can be compatible with wafer placement boxes of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic diagram of the overall structure of a loading mechanism with a flipping function according to the present utility model;

[0026] Figure 2 is a schematic diagram of the overall structure of a loading mechanism with a flipping function according to the present utility model;

[0027] Figure 3 is a schematic diagram of the structure of the mounting plate of a loading mechanism with a flipping function according to the present utility model;

[0028] Figure 4 is a schematic diagram of the overall structure of a loading mechanism with a flipping function according to the present utility model after placing a wafer placement box;

[0029] Figure 5 is a schematic diagram of the overall structure of a loading mechanism with a flipping function according to the present utility model after placing a wafer placement box;

[0030] Figure 6 is a schematic diagram of the structure of the mounting plate of a loading mechanism with a flipping function according to the present utility model;

[0031] In the drawings: 1, placement frame; 2, pressing and limiting block; 3, first driving member; 4, wafer placement box; 5, driving assembly; 6, mounting plate; 61, buffer pad; 11, first pallet; 12, second pallet; 51, second driving member; 52, rotating shaft; 53, belt; 54, synchronous pulley; 55, flipping support base; 56, bracket; 71, first sensing module; 72, first photoelectric switch; 73, second sensing module; 74, second photoelectric switch; 81, position sensing module; 82, third driving member; 83, sensor; 91, first positioning and limiting block; 92, second positioning and limiting block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The present utility model will be further described below in conjunction with the drawings and specific embodiments, but it is not limited to the present utility model.

[0033] As Figures 1 to 6As shown in the figure, a feeding mechanism with a flipping function in a preferred embodiment is shown, including: a placement frame 1, a pressing and limiting block 2, and a first driving member 3. The pressing and limiting block 2 is movably arranged at one end of the placement frame 1. The placement frame 1 is used to place a wafer placement box 4. The first driving member 3 is installed outside the placement frame 1, and the first driving member 3 is in transmission connection with the pressing and limiting block 2, so that the pressing and limiting block 2 limits the wafer placement box 4 within the placement frame 1.

[0034] Furthermore, as a preferred embodiment, the feeding mechanism with a flipping function further includes: a driving assembly 5. The driving assembly 5 is in transmission connection with the placement frame 1, so that the placement frame 1 and the wafer placement box 4 inside it are transformed from a horizontal state to a vertical state.

[0035] The above is only a preferred embodiment of the present invention, and does not limit the implementation manners and protection scope of the present invention accordingly.

[0036] The present invention further has the following implementation manners on the above basis:

[0037] In a further embodiment of the present invention, please continue to refer to Figures 1 to 6 As shown in the figure, the driving assembly 5 includes: a second driving member 51, a rotating shaft 52, and a belt 53. Synchronous wheels 54 are installed on both the second driving member 51 and the rotating shaft 52. The belt 53 is installed on the two synchronous wheels 54, and the placement frame 1 is installed on the rotating shaft 52.

[0038] In a further embodiment of the present invention, the placement frame 1 includes: a first support plate 11 and a second support plate 12. The first driving member 3 is installed on the first support plate 11. The pressing and limiting block 2 is movably located at one end of the first support plate 11. The second support plate 12 is arranged at the other end of the first support plate 11. The second support plate 12 and the pressing and limiting block 2 clamp both ends of the wafer placement box 4.

[0039] In a further embodiment of the present invention, the feeding mechanism with a flipping function further includes: a mounting plate 6. The driving assembly 5 is installed on the mounting plate 6.

[0040] In a further embodiment of the present invention, at least one first sensing module 71 is provided on at least one side of the placement frame 1, and at least one first photoelectric switch 72 is provided on the mounting plate 6. The first photoelectric switch 72 is in sensing cooperation with the first sensing module 71.

[0041] In a further embodiment of the present invention, at least one second sensing module 73 is provided at the end of the placement frame 1, and at least one second photoelectric switch 74 is provided on the mounting plate 6. The second photoelectric switch 74 is in sensing cooperation with the second sensing module 73.

[0042] In a further embodiment of the utility model, two first photoelectric switches 72 and two second photoelectric switches 74 are provided on the mounting plate 6 , a first sensing module 71 is provided on both sides of the first support plate 11 , and a second sensing module 73 is provided on both sides of the second support plate 12 .

[0043] In a further embodiment of the utility model, the first pallet 11 is in a horizontal position or a vertical position through the driving component 5. When the first pallet 11 is in a horizontal position, the two first photoelectric switches 72 respectively sense and cooperate with the two first sensing modules 71. When the first pallet 11 is in a vertical position, the two second photoelectric switches 74 respectively sense and cooperate with the two second sensing modules 73.

[0044] In a further embodiment of the utility model, a position sensing module 81 is provided at the bottom of the first support plate 11 for sensing whether the wafer placement box 4 in the placement frame 1 is in place and tilted.

[0045] In a further embodiment of the utility model, two flip support seats 55 are provided on the mounting plate 6 , and the other end of the first support plate 11 is rotatably connected to the two flip support seats 55 .

[0046] In a further embodiment of the present invention, the first support plate 11 is rotatably matched with the flip support seat 55 via the rotation shaft 53 .

[0047] Preferably, a first positioning limit block 91 is provided on the first support plate 11, and a second positioning limit block 92 is provided on the second support plate 12. The first positioning limit block 91 abuts against the bottom of the wafer placement box 4, and the clamping limit block 2 and the second positioning limit block 94 abut against the two sides of the wafer placement box 4 respectively.

[0048] Preferably, a third driving member 82 is provided at the bottom of the mounting plate 6 , and a sensor 83 is transmission-connected to the third driving member 82 , and the sensor 83 is used to adapt to wafers of different sizes.

[0049] Preferably, the first driving member 3 and the third driving member 82 are cylinders, and the second driving member 51 is a motor.

[0050] Preferably, at least one buffer pad 61 is provided on the mounting plate 6 .

[0051] Preferably, at least one bracket 56 is disposed on one of the flip support seats 55 .

[0052] The workflow of this utility model:

[0053] The loading mechanism is installed at the loading end of the equipment through the mounting plate 6. The second driving member 51 is fixed on the mounting plate 6 through the flipping support seat 55. The rotating shaft 52 is fixed on the mounting plate 6 through the flipping support seat 55. The second support plate 12 is fixed together with the rotating shaft 52. The first support plate 11 is fixed on the second support plate 12. The belt 53 is installed on the synchronous pulley 54, and one synchronous pulley 54 is connected to the driving shaft of the second driving member 51. The position sensing module 81 is installed on the first support plate 11 to confirm whether the wafer placement box is placed in place manually. The first driving member 3 is installed on the first support plate 11. When the wafer placement box is placed, the first driving member 3 is opened and closed after the placement is completed to drive the pressing limit block 2 to fix the wafer placement box. The first positioning limit block 91 and the second positioning limit block 92 are respectively fixed on the first support plate 11 and the second support plate 12 to play a role in limiting. The second sensing module 73 is installed on the second support plate 12 to detect whether the loading mechanism fixed on the mounting plate rotates in place. The buffer pad 61 is fixed on the mounting plate 6 to play a buffering role. The third driving member 82 is fixed on the mounting plate 6 to drive the sensor 83 to adapt to different sizes.

[0054] The utility model avoids the need for manual vertical placement of the wafer placement box, reduces the participation of manual labor, has a simpler operation, and avoids the risk of wafer inversion, is more stable, and is convenient for adjustment and control.

[0055] The utility model can be compatible with wafer placement boxes of different sizes.

[0056] The above are only the preferred embodiments of the utility model, and do not limit the implementation manners and protection scope of the utility model accordingly. For those skilled in the art, it should be realized that all the equivalent replacements and obvious changes made by using the description and illustrations of the utility model should be included in the protection scope of the utility model.

Claims

1. A feeding mechanism with a flipping function, characterized in that: include: A placement frame and a clamping limit block, wherein the clamping limit block is movably arranged at one end of the placement frame, and the placement frame is used to place a wafer placement box; A first driving member, the first driving member is installed outside the placement frame, and the first driving member is drivingly connected to the clamping and limiting block, so that the clamping and limiting block limits the wafer placement box to be located within the placement frame; A driving component is connected to the placement frame in a driving manner so as to transform the placement frame and the wafer placement box therein from a horizontal state to a vertical state.

2. The feeding mechanism with flipping function according to claim 1, characterized in that: The driving assembly comprises: a second driving member, a rotating shaft and a belt. The second driving member and the rotating shaft are both equipped with synchronous wheels. The belt is installed on the two synchronous wheels. The placement frame is installed on the rotating shaft.

3. The feeding mechanism with flipping function according to claim 2 is characterized in that: The placement frame includes: a first pallet and a second pallet, the first driving member is installed on the first pallet, the clamping limit block is movably located at one end of the first pallet, the second pallet is arranged at the other end of the first pallet, and the second pallet and the clamping limit block clamp the two ends of the wafer placement box.

4. The feeding mechanism with flipping function according to claim 3 is characterized in that: Also includes: A mounting plate, wherein the drive assembly is mounted on the mounting plate.

5. The feeding mechanism with flipping function according to claim 4 is characterized in that: A first sensing module is disposed on at least one side of the placement frame, and at least one first photoelectric switch is disposed on the mounting plate. The first photoelectric switch is inductively matched with the first sensing module.

6. The feeding mechanism with flipping function according to claim 5, characterized in that: At least one second sensing module is disposed at the end of the placement frame, and at least one second photoelectric switch is disposed on the mounting plate. The second photoelectric switch is inductively matched with the second sensing module.

7. The feeding mechanism with flipping function according to claim 6, characterized in that: Two first photoelectric switches and two second photoelectric switches are arranged on the mounting plate, one first sensing module is arranged on both sides of the first supporting plate, and one second sensing module is arranged on both sides of the second supporting plate.

8. The feeding mechanism with flipping function according to claim 7, characterized in that: The first pallet is in a horizontal position or a vertical position through the driving assembly. When the first pallet is in the horizontal position, the two first photoelectric switches respectively cooperate with the two first sensing modules for sensing. When the first pallet is in the vertical position, the two second photoelectric switches respectively cooperate with the two second sensing modules for sensing.

9. The feeding mechanism with flipping function according to claim 8, characterized in that: A position sensing module is provided at the bottom of the first support plate for sensing whether the wafer placement box in the placement frame is in place and tilted.

10. The feeding mechanism with flipping function according to claim 9, characterized in that: The mounting plate is provided with two flip support seats, and the other end of the first support plate is rotatably connected to the two flip support seats respectively; The first supporting plate is rotationally matched with the flip supporting seat through the rotating shaft.

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