High-temperature, high-viscosity and high-buffering integrated copper foil gel composite material

Abstract

The utility model discloses a high-temperature, high-viscosity and high-buffering integrated copper foil gel composite material. Comprising a copper foil layer, an acrylic acid adhesive layer arranged on the upper end face of the copper foil layer in a coating mode, a foam layer arranged on the upper end face of the acrylic acid adhesive layer in a bonding mode and a silica gel layer arranged on the upper end face of the foam layer in a coating mode. The high-temperature and high-viscosity acrylic acid adhesive layer is coated on the upper end surface of the silica gel layer; and the release film layer is adhered to the upper end surface of the high-temperature and high-viscosity acrylic acid adhesive layer. The anti-impact and anti-falling adhesive tape has the advantages that the whole adhesive tape can be supported through the copper foil, rapid heat dissipation can be achieved through the copper foil, the foam layer and the silica gel layer are utilized to form the buffer layer, buffer is formed on an attached product, and therefore the good anti-impact and anti-falling effect is achieved; and the high-temperature high-viscosity acrylic acid adhesive layer is used for effectively adhering a product, so that the product can be stably connected under a high-temperature condition.

Description

Technical Field

[0001] The utility model relates to the field of composite tapes, in particular to a high-temperature, high-viscosity and high-buffer integrated copper foil gel composite material. Background Art

[0002] With the popularization of the Internet era and the advent of the information era, mobile phones have become increasingly important to us. Currently, most mobile phone screens use OLED screens, which are different from traditional LCD screens. Without a backlight module, the products are thinner and lighter. There are various design schemes for SCF integration. Currently, the mainstream scheme still adopts the foam sticker grid glue scheme to achieve the OLED buffer protection effect. However, due to product iteration, the disadvantages of the foam scheme have gradually emerged, such as poor impact absorption rate and easy delamination. It no longer meets the needs of the terminal.

[0003] In view of this, it is necessary to provide a high-temperature, high-viscosity and high-buffer integrated copper foil gel composite material. Summary of the Invention

[0004] The high-temperature, high-viscosity and high-buffer integrated copper foil gel composite material provided by the utility model effectively solves the problems of poor impact and drop resistance and poor bonding effect after high temperature when the existing composite tape is applied to the OLED screen.

[0005] The technical solution adopted by the utility model is

[0006] The high-temperature, high-viscosity and high-buffer integrated copper foil gel composite material includes a copper foil layer, an acrylic adhesive layer coated on the upper end surface of the copper foil layer, a foam layer adhesively provided on the upper end surface of the acrylic adhesive layer, a silicone gel layer coated on the upper end surface of the foam layer, a high-temperature and high-viscosity acrylic adhesive layer coated on the upper end surface of the silicone gel layer, and a release film layer adhesively provided on the upper end surface of the high-temperature and high-viscosity acrylic adhesive layer.

[0007] Furthermore: the thickness range of the copper foil layer is 0.010 mm to 0.05 mm.

[0008] Furthermore: the thickness range of the acrylic adhesive layer is 0.010 mm to 0.025 mm.

[0009] Furthermore: the thickness range of the foam layer is 0.05 mm to 0.08 mm.

[0010] Furthermore: the thickness range of the silicone gel layer is 0.05 mm to 0.075 mm.

[0011] Furthermore: the thickness range of the high-temperature and high-viscosity acrylic adhesive layer is 0.012 mm to 0.025 mm.

[0012] Advantages of the utility model: The overall tape can be supported by the copper foil and quickly dissipate heat through the copper foil. A buffer layer is formed by the foam layer and the silicone gel layer to buffer the product to be bonded, thereby achieving good anti-impact and anti-drop effects; the high-temperature and high-viscosity acrylic adhesive layer is used to effectively bond the product, enabling stable connection with the product even under high-temperature conditions. Brief Description of the Drawings

[0013] Figure 1 The overall schematic diagram of the pin gauge detection mechanism provided by the embodiment of the present application.

[0014] In the figure, the markings are: 1. Copper foil layer; 2. Acrylic adhesive layer; 3. Foam layer; 4. Silicone gel layer; 5. High-temperature and high-viscosity acrylic adhesive layer; 6. Release film layer. Detailed Embodiments

[0015] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given with reference to the accompanying drawings.

[0016] As Figure 1 shown, the high-temperature, high-viscosity, and high-buffer integrated copper foil gel composite material provided by the embodiment of the present application has a structure including a copper foil layer 1, an acrylic adhesive layer 2 coated on the upper end surface of the copper foil layer 1, a foam layer 3 adhesively provided on the upper end surface of the acrylic adhesive layer 2, a silicone gel layer 4 coated on the upper end surface of the foam layer 3, a high-temperature and high-viscosity acrylic adhesive layer 5 coated on the upper end surface of the silicone gel layer 4, and a release film layer 6 adhesively provided on the upper end surface of the high-temperature and high-viscosity acrylic adhesive layer 5.

[0017] In actual use, after removing the release film, it is attached to the product through the high-temperature and high-viscosity acrylic adhesive layer 5, and then heat dissipation and support for the entire composite material are carried out through the copper foil layer 1. The foam layer 3 and the copper foil layer 1 are effectively connected through the acrylic adhesive layer 2. Due to the soft and flexible characteristics of the foam layer 3, the anti-drop and anti-moire effects of the overall attached OLED screen module are enhanced; since the spatial arrangement of silicone gel molecules is spiral, similar to a spring, the integrated tape can have excellent anti-buffer performance through the silicone gel layer 4; the high-temperature and high-viscosity acrylic adhesive layer 5 increases the bonding force of the integrated copper foil tape, making it not easily delaminate from the OLED module under high-temperature conditions; the release film layer 6 can protect the high-temperature and high-viscosity acrylic adhesive layer 5 from contamination.

[0018] In the above design, the overall tape can be supported by the copper foil and quickly dissipate heat through the copper foil. A buffer layer is formed by the foam layer 3 and the silicone gel layer 4 to buffer the product to be bonded, thereby achieving good anti-impact and anti-drop effects; the high-temperature and high-viscosity acrylic adhesive layer 5 is used to effectively bond the product, enabling stable connection with the product even under high-temperature conditions.

[0019] Specifically, the thickness range of the copper foil layer 1 is 0.010 mm to 0.05 mm.

[0020] In the above design, the thickness of the copper foil layer 1 can be 0.012 mm, 0.015 mm, 0.018 mm, 0.025 mm, 0.035 mm, 0.038 mm, 0.05 mm, etc. The copper foil layer 1, as the main carrier, has a high tensile strength and also plays a good role in heat dissipation and shielding.

[0021] Specifically, the thickness range of the acrylic adhesive layer 2 is 0.010 mm to 0.025 mm.

[0022] In the above design, the thickness of the acrylic adhesive layer 2 can be 0.010 mm, 0.012 mm, 0.015 mm, 0.018 mm, 0.025 mm, etc. The acrylic adhesive layer 2, as the connection layer, mainly plays a role in connecting the copper foil layer 1 and the foam layer 3. The thickness range of the acrylic adhesive layer 2 from 0.010 mm to 0.025 mm can meet the requirements of product thinning and ensure the bonding performance at the same time.

[0023] Specifically, the thickness range of the foam layer 3 is 0.05 mm to 0.08 mm.

[0024] In the above design, the thickness of the foam layer 3 can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, and any one of polyethylene foam, polyurethane foam, and silicone foam is used, which has excellent resilience. Secondly, due to the fluffy and soft characteristics of the foam, the overall anti-drop and anti-stamping effects of the OLED screen module can be increased.

[0025] Specifically, the thickness range of the silicone gel layer 4 is 0.05 mm to 0.075 mm.

[0026] In the above design, the thickness of the silicone gel layer 4 can be 0.05 mm, 0.06 mm, 0.07 mm, 0.075 mm. Since the spatial arrangement of silicone gel molecules in the silicone gel layer 4 is spiral, similar to a spring, the integrated tape can have excellent cushioning performance. The thickness range of the silicone gel layer 4 from 0.05 mm to 0.075 mm can not only meet the requirements of product thinning but also achieve the cushioning performance.

[0027] Specifically, the thickness range of the high-temperature and high-viscosity acrylic adhesive layer 5 is 0.012 mm to 0.025 mm.

[0028] In the above design, the thickness of the high-temperature and high-viscosity acrylic adhesive layer 5 can be 0.010 mm, 0.012 mm, 0.015 mm, 0.018 mm, 0.025 mm, which can effectively bond the product and ensure the requirements of product thinning at the same time.

[0029] For further detailed description, it should be understood that the above are only specific embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. High temperature, high viscosity and high buffer integrated copper foil gel composite material, characterized by: The invention comprises a copper foil layer (1), an acrylic adhesive layer (2) coated on the upper end surface of the copper foil layer (1), a foam layer (3) bonded to the upper end surface of the acrylic adhesive layer (2), a silicone gel layer (4) coated on the upper end surface of the foam layer (3), a high-temperature high-viscosity acrylic adhesive layer (5) coated on the upper end surface of the silicone gel layer (4), and a release film layer (6) bonded to the upper end surface of the high-temperature high-viscosity acrylic adhesive layer (5).

2. The high-temperature, high-viscosity, high-buffer integrated copper foil gel composite material according to claim 1, characterized in that: The thickness of the copper foil layer (1) ranges from 0.010 mm to 0.05 mm.

3. The high-temperature, high-viscosity, high-buffer integrated copper foil gel composite material according to claim 1, characterized in that: The thickness of the acrylic adhesive layer (2) ranges from 0.010 mm to 0.025 mm.

4. The high-temperature, high-viscosity, high-buffer integrated copper foil gel composite material according to claim 1, characterized in that: The thickness of the foam layer (3) is in the range of 0.05 mm to 0.08 mm.

5. The high-temperature, high-viscosity, high-buffer integrated copper foil gel composite material according to claim 1, characterized in that: The thickness of the silicone gel layer (4) ranges from 0.05 mm to 0.075 mm.

6. The high-temperature, high-viscosity, high-buffer integrated copper foil gel composite material according to claim 1, characterized in that: The thickness of the high-temperature and high-viscosity acrylic adhesive layer (5) is in the range of 0.012 mm to 0.025 mm.

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