PECVD equipment wafer lifting and placing device

Abstract

The utility model relates to a wafer lifting and placing device for PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment, which comprises a cavity and a bracket, the bracket is hung at the lower part of the cavity, a heater is arranged in the cavity, four counter bores are arranged at the bottom in the cavity, springs are arranged in the counter bores and are uniformly distributed at the periphery of a cylinder of the heater, a tray is placed at the upper ends of the springs, and the tray is arranged on the bracket. The tray is arranged on a cylinder of the heater in a sliding and penetrating mode, four ceramic supporting rods are vertically and fixedly distributed on the tray and penetrate through the heater in a sliding mode, and the upper ends of the ceramic supporting rods extend out of the upper surface of the heater. The device is simple and ingenious in structure, and equipment manufacturing cost is saved; the structure is stable and reliable, horizontal adjustment is easy, it is guaranteed that the heater moves in the vertical direction in the lifting process, double limiting protection is conducted through a sensor and a hard limit, it is guaranteed that the heater operates within the allowed stroke range, and safety and reliability are achieved; and the heater is leveled by adjusting the adjusting bolts of the lifting platform, which is simple and convenient.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a wafer lifting and placing device for a PECVD device. Background Art

[0002] As a production device for depositing functional material thin films, the thin film deposition device plays a very important role in the chip manufacturing process. With the continuous development of power semiconductor devices, the variety of thin films to be prepared is constantly increasing, and the performance requirements for thin films are becoming increasingly high. Plasma-enhanced chemical vapor deposition (PECVD) is a currently relatively ideal and important thin film preparation method. Semiconductor PECVD devices account for the highest proportion among thin film deposition devices, and have the advantages of low process temperature, fast deposition rate, and good film formation quality.

[0003] At present, the wafer lifting and placing mechanism of the PECVD device is controlled by two motors. One controls the lifting of the tray, and the other controls the heater, which increases the machine carrying load and the equipment manufacturing cost. Summary of the Invention

[0004] In view of this, the purpose of the utility model is to provide a wafer lifting and placing device for a PECVD device to solve the problems raised in the above background art.

[0005] In order to achieve the above purpose, the following technical solutions are further adopted:

[0006] A wafer lifting and placing device for a PECVD device includes a cavity and a bracket. The bracket is hoisted below the cavity. A heater is arranged in the cavity. The cylinder of the heater slides vertically downward through the lower part of the cavity. The lower end of the cylinder of the heater is connected to a support plate. Sliders are respectively installed on both sides of the support plate. The sliders are slidably connected to the guide rails on both sides of the bracket. One of the sliders is connected to a lead screw through a screw sleeve. The lead screw is arranged vertically. The upper and lower ends of the lead screw are connected to an upper limit block and a lower limit block respectively. The lower end of the lead screw is connected to the output end of a servo motor through a coupling;

[0007] Four counterbores are opened at the bottom inside the cavity. Springs are installed in the counterbores. The springs are evenly distributed around the cylinder of the heater. A tray is placed on the upper ends of the springs. The tray slidably penetrates through the cylinder of the heater. Four ceramic support rods are vertically and fixedly distributed on the tray. The ceramic support rods slidably penetrate through the heater, and the upper ends of the ceramic support rods extend out of the upper surface of the heater.

[0008] As a further improvement of the utility model, a corrugated pipe is sleeved on the cylinder of the heater. A lifting platform is installed at the lower end of the cylinder of the heater. The lifting platform is connected to the support plate through evenly distributed bolt pairs. At the same time, an adjusting bolt is threadedly connected to the lifting platform. The adjusting bolt abuts against the upper surface of the support plate to adjust the balance of the heater.

[0009] As a further improvement of the present utility model, a slot-type photoelectric sensor I and a slot-type photoelectric sensor II are installed on the bracket, a baffle is installed on the slider without the screw sleeve, the sensing end of the slot-type photoelectric sensor I is below the baffle, and the sensing end of the slot-type photoelectric sensor II is within the coverage of the baffle.

[0010] The beneficial effects of the present utility model are as follows:

[0011] 1. The structure is concise and ingenious, saving design costs

[0012] The device has a concise and ingenious structure, saving the manufacturing cost of the equipment; the device is driven by a servo motor, and through the change of the relative positions of the ceramic support rod, the tray and the heater, and in cooperation with the movement of the manipulator, the functions of wafer picking, lifting and placing can be realized;

[0013] 2. The structure is stable and reliable, and the level is easy to adjust

[0014] The device uses two vertical guide rails and a lead screw module for transmission, ensuring that the heater moves only in the vertical direction during the lifting process. Through double limit protection by sensors and hard limits, it is ensured that the heater operates within the allowable stroke range, which is safe and reliable; the level of the heater is corrected by adjusting the adjustment bolts of the lifting platform, which is simple and convenient. Description of the Drawings

[0015] The drawings forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0016] Figure 1 is a schematic structural diagram of the present utility model. Detailed Embodiments

[0017] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The present utility model will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0018] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0019] Please refer to Figure 1, A wafer lifting and placing device for a PECVD equipment, comprising a cavity 1 and a bracket 2. The bracket 2 is hoisted below the cavity 1, and the cavity 1 is installed above the bracket 2. A heater 3 is arranged inside the cavity 1. The cylinder of the heater 3 slides vertically downward through the lower part of the cavity 1. The lower end of the cylinder of the heater 3 is connected to a support plate 4. Sliders 5 are respectively installed on both sides of the support plate 4. The sliders 5 are slidably connected to the guide rails 6 on both sides of the bracket 2. One of the sliders 5 is connected to a lead screw 7 through a screw sleeve 23. The lead screw 7 is arranged vertically. The upper and lower ends of the lead screw 7 are connected to an upper limit block 8 and a lower limit block 9 respectively. The lower end of the lead screw 7 is connected to the output end of a servo motor 11 through a coupling 10; the upper limit block 8 and the lower limit block 9, as hard limits, protect the device from lifting and lowering within the allowed range.

[0020] Four counterbores are provided at the bottom inside the cavity 1. Springs 12 are installed in the counterbores. The springs 12 are evenly distributed around the cylinder of the heater 3. A tray 13 is placed at the upper end of the spring 12. The tray 13 slides through the cylinder of the heater 3. Four ceramic support rods 14 are vertically and fixedly distributed on the tray 13. The ceramic support rods 14 slide through the heater 3, and the upper ends of the ceramic support rods 14 extend out of the upper surface of the heater 3. The four ceramic support rods 14 serve to hold up the wafer 22.

[0021] A bellows 15 is sleeved on the cylinder of the heater 3. A lifting platform 16 is installed at the lower end of the cylinder of the heater 3. The lifting platform 16 is connected to the support plate 4 through evenly distributed bolt pairs 17. At the same time, an adjusting bolt 18 is threadedly connected to the lifting platform 16. The adjusting bolt 18 abuts against the upper surface of the support plate 4 for adjusting the balance of the heater 3.

[0022] A slot-type photoelectric sensor one 19 and a slot-type photoelectric sensor two 20 are installed on the bracket 2. A baffle 21 is installed on the slider 5 without the screw sleeve 23. The sensing end of the slot-type photoelectric sensor one 19 is below the baffle 21, and the sensing end of the slot-type photoelectric sensor two 20 is within the coverage range of the baffle 21; the slot-type photoelectric sensor one 19 and the slot-type photoelectric sensor two 20 are respectively used for the servo motor 11 to return to the origin and the lifting and lowering limit functions. During the lifting and lowering process, the baffle 21 is driven to lift and lower together. When the slot-type photoelectric sensor two 20 is blocked by the baffle, it indicates that the device is lifting and lowering within the allowed stroke. Once the baffle no longer blocks the slot-type photoelectric sensor two 20 during the movement process, it indicates that the device has exceeded the working allowed stroke, and the servo motor 11 is forced to stop running.

[0023] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A PECVD equipment wafer lifting and placement device, comprising a chamber and a bracket, wherein the bracket is hoisted at the bottom of the chamber, and is characterized in that: A heater is arranged in the cavity, and the cylinder of the heater slides vertically downward to pass through the lower part of the cavity, and the lower end of the cylinder of the heater is connected to the support plate, and sliders are respectively installed on both sides of the support plate, and the sliders are slidably connected to the guide rails on both sides of the bracket, and the slider on one side is connected to the lead screw through a screw sleeve, and the lead screw is arranged vertically, and the upper and lower ends of the lead screw are connected to the upper limit block and the lower limit block, and the lower end of the lead screw is connected to the output end of the servo motor through a coupling; Four countersunk holes are provided at the bottom of the cavity, and springs are installed in the countersunk holes. The springs are evenly distributed around the cylinder of the heater. A tray is placed on the upper end of the springs, and the tray is slidably passed through the cylinder of the heater. Four ceramic support rods are vertically fixed on the tray, and the ceramic support rods slide through the heater, and the upper ends of the ceramic support rods extend out of the upper surface of the heater.

2. A PECVD equipment wafer lifting and placement device according to claim 1, characterized in that: A bellows is sleeved on the cylinder of the heater, and a lifting platform is installed at the lower end of the cylinder of the heater. The lifting platform is connected to the support plate through evenly distributed bolt pairs. At the same time, an adjusting bolt is threaded on the lifting platform, and the adjusting bolt is connected to the upper surface of the support plate to adjust the balance of the heater.

3. The PECVD equipment wafer lifting and placement device according to claim 1, characterized in that: A slot-type photoelectric sensor 1 and a slot-type photoelectric sensor 2 are installed on the bracket, a baffle is installed on the slider without the screw sleeve, the sensing end of the slot-type photoelectric sensor 1 is below the baffle, and the sensing end of the slot-type photoelectric sensor 2 is within the coverage of the baffle.

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