Metal surface coating structure based on silver-tin alloy
By designing cavity and annular grooves in the metal surface plating structure, combined with the bending structure of nickel layer, copper layer and silver tin layer, the problem of easy falling off at the connection is solved, and the stable connection and long-term use of the plating are achieved.
Patent Information
- Application Number
- CN202421677566.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The metal surface plating is easily shedded due to extrusion pressure at the connection, and the rubber pad and metal plating have weak bonding force, which makes it easy to fall off, resulting in the plating being unable to obtain effective buffering, which in turn leads to the plating falling off and the base corrosion.
A metal surface plating structure based on silver-tin alloy is designed, including setting cavity on both sides of the substrate for bending, through holes and annular grooves are provided on the substrate, a second buffer layer is installed in the annular groove as rubber pads, and a nickel layer, a copper layer and a silver-tin layer are provided on the substrate. The bonding and combination of these layers are improved and the anti-extrusion ability of the coating is improved.
The bending of the substrate and the bending of the coating drive the deformation of the rubber pad, reduce the extrusion pressure on the coating, prevent the coating from falling off, and improve the bonding force between the coating and the substrate, extending the service life.
Smart Images
Figure CN223033480U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of metal surface coating structures, in particular to a metal surface coating structure based on silver-tin alloy. Background Technique
[0002] A metal surface coating is a technology of depositing one or more layers of metal or non-metal materials on a metal substrate to improve the surface properties of the metal, such as corrosion resistance, wear resistance, oxidation resistance, electrical conductivity, thermal conductivity and appearance, etc.
[0003] At the position where the metal surface coating is connected to other components, extrusion force will be applied, which may cause the coating at this place to easily fall off, and connection holes are usually provided on the metal surface. The inner layer of the hole will also be subjected to extrusion force, resulting in the peeling off of the underlying layer in the hole. In order to prevent damage to the surface coating at the connection, a rubber pad is usually added at the connection. However, when the rubber material is placed on the outside of the coating structure, it is easy to fall off. This is mainly because the bonding force between the rubber and the metal coating is weak, and when the rubber is located on the outermost layer, it is easily rubbed frequently, resulting in the problem of the rubber material falling off. Once the rubber material falls off, the coating on the metal surface cannot be effectively buffered, resulting in the coating falling off, exposing the surface of the substrate, and causing the substrate to rust. Summary of the Invention
[0004] The purpose of the utility model is to solve the problems existing in the background technique and propose a metal surface coating structure based on silver-tin alloy that can prevent the rubber from easily falling off.
[0005] The technical solution of the utility model: A metal surface coating structure based on silver-tin alloy, including a substrate, cavities are provided on both sides of the substrate, a first buffer layer is fixedly installed in the cavities, through holes are provided on the substrate, an annular groove is provided on the substrate, the annular groove is located outside the through hole, a second buffer layer is fixedly installed in the annular groove, a nickel layer is provided on the substrate, a copper layer is provided on the nickel layer, and a silver-tin layer is provided on the copper layer.
[0006] Optionally, the annular groove and the through hole are coaxially positioned.
[0007] Optionally, a protrusion is provided on the substrate, the protrusion is cylindrical and coaxially positioned with the through hole.
[0008] Optionally, the nickel layer covers the protrusion and the through hole, and the nickel layer is bent at the protrusion.
[0009] Optionally, the copper layer covers the protrusion and the through hole, and the copper layer is bent at the protrusion.
[0010] Optionally, the silver - tin layer wraps the protrusion and the through - hole, and the silver - tin layer bends at the protrusion.
[0011] Optionally, the silver - tin layer is located on the outermost layer, and the surface of the silver - tin layer is in a horizontal state.
[0012] Compared with the prior art, the utility model has the following beneficial technical effects:
[0013] In the utility model, a cavity is arranged at the contact - connection position between the base body and other components, so that the base body above the cavity can be bent more easily. When the coating layer here is bent under pressure, it will drive the rubber soft pad to deform, and then the coating layer can deform along with the deformation of the surface of the base body, thereby preventing the coating layer on the base body from falling off.
[0014] Furthermore, when the through - hole is squeezed, due to the arrangement of the annular groove, the base body outside the annular groove can bend towards the inside of the annular groove. When the through - hole is squeezed, it will drive the base body to bend and squeeze the second buffer layer, and the second buffer layer is a rubber soft pad, so it can play a role in buffering and resetting. By the deformation of the base body, the extrusion force on the coating layer on the base body is reduced, thereby preventing the coating layer on the base body from falling off and enabling long - term use.
[0015] Furthermore, there are protrusions on the base body. The bending of the nickel layer, the copper layer, and the silver - tin layer at the protrusions can increase the contact area between the nickel layer and the copper layer and between the copper layer and the silver - tin layer. And by the simultaneous bending of the nickel layer, the copper layer, and the silver - tin layer towards the through - hole, the bonding force between the multiple nickel layers, copper layers, silver - tin layers and the base body can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 The structural schematic diagram of an embodiment of the utility model is given;
[0017] Figure 2 The internal sectional view of the utility model is given;
[0018] Figure 3 The utility model is given Figure 2 The partial enlarged view at A in
[0019] Reference numerals: 1, base body; 2, cavity; 3, first buffer layer; 4, through - hole; 5, second buffer layer; 6, nickel layer; 7, copper layer; 8, silver - tin layer. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Next, the technical solutions of the utility model will be described clearly and completely with reference to the drawings. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all of the embodiments.
[0021] The components of the embodiments of the present utility model, which are usually described and shown in the accompanying drawings here, can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model.
[0022] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the scope of protection of the present utility model.
[0023] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0024] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0025] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected" and "coupled" should be construed broadly. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0026] Embodiment
[0027] Such as Figures 1-3As shown in the figure, the metal surface coating structure based on silver-tin alloy proposed by the present utility model includes a substrate 1. There are cavities 2 on both sides of the substrate 1. A first buffer layer 3 is fixedly installed in the cavities 2. There is a through hole 4 on the substrate 1. There is an annular groove on the substrate 1, and the annular groove is located outside the through hole 4. A second buffer layer 5 is fixedly installed in the annular groove. There is a nickel layer 6 on the substrate 1, a copper layer 7 on the nickel layer 6, and a silver-tin layer 8 on the copper layer 7. Since the cavity 2 is provided in the substrate 1 at the position where it is in contact and connected with other components, and the distance between the cavity 2 and the surface of the substrate 1 is relatively thin, the substrate 1 above the cavity 2 can be bent relatively easily. By providing the first buffer layer 3 in the cavity 2, and the first buffer layer 3 is a rubber soft pad. When the coating at this place is bent under pressure, it will drive the rubber soft pad to deform, so that the coating can deform along with the deformation of the surface of the substrate 1, thereby preventing the coating on the substrate 1 from falling off. And because the first buffer layer 3 is located inside the substrate 1, it can prevent the problem of the rubber pad falling off due to the rubber pad being exposed outside, and can carry out normal electroplating work on the surface of the substrate 1.
[0028] Furthermore, when the through hole 4 is squeezed, due to the setting of the annular groove, the substrate 1 outside the annular groove can be bent towards the inside of the annular groove. When the through hole 4 is squeezed, it will drive the substrate 1 to bend and squeeze the second buffer layer 5. And the second buffer layer 5 is a rubber soft pad, so it can play a role in buffering and resetting. By the deformation of the substrate 1, the extrusion force on the coating on the substrate 1 is reduced, so that the coating on the substrate 1 can be prevented from falling off and can be used for a long time.
[0029] The nickel layer 6 uses nickel sulfate and ammonium sulfate as electrolytes, and an appropriate amount of stabilizer such as sodium sulfate is added to prevent the coating from being rough. The thickness of the nickel layer 6 is 10 - 50 microns. Before nickel plating, the substrate 1 needs to be cleaned and activated, usually including grinding, polishing and chemical cleaning to remove surface oxides and other pollutants. pH range: Usually between 3 - 6. The pH within this range can provide the best electroplating rate and coating quality. Temperature: The temperature depends on the type and concentration of the electroplating solution, usually between 35 - 50 °C. The nickel layer 6 has good adhesion and corrosion resistance and can be used as a bottom layer to improve the bonding force between the coating and the substrate 1 metal. The bottom nickel layer 2 can also provide a smooth surface for the subsequent copper layer 7 and reduce the defects during the deposition of the copper layer 7.
[0030] Copper has excellent electrical conductivity and thermal conductivity. The middle copper layer 7 can be used as a buffer layer to reduce the difference in thermal expansion coefficients between different metals (nickel, silver-tin, ceramic), and at the same time provide good mechanical properties and electrical conductivity.
[0031] The copper layer 7 uses copper sulfate as the electrolyte. The thickness of the copper layer 7 is between 1 - 10 microns to provide sufficient conductivity and adhesion. Copper has good compatibility with nickel, and the copper layer 7 can be directly electroplated on the nickel layer 6. pH range: Usually between 7 - 9. The pH within this range can provide good adhesion and uniformity of the copper layer 7. Temperature: The temperature is usually between 40 - 60 °C to ensure the deposition rate and quality of the copper layer 7. The silver - tin layer 8 has good conductivity and corrosion resistance, and has a low contact resistance, making it suitable for electronic components that require high conductivity.
[0032] The silver - tin layer 8 uses an alloy solution containing silver and tin as the electrolyte, and the specific composition depends on the required silver - tin ratio and performance. The thickness of the silver - tin layer 8 is between 0.1 - 5 microns to provide good oxidation resistance and conductivity. pH range: Usually between 4 - 6. The pH within this range can provide good adhesion and uniformity of the silver - tin layer. Temperature: The temperature is usually between 40 - 60 °C to ensure the deposition rate and quality of the silver - tin layer.
[0033] Furthermore, there are protrusions on the substrate 1. The protrusions are cylindrical and coaxial with the through - hole 4. The nickel layer 6 covers the protrusions and the through - hole 4, and the nickel layer 6 bends at the protrusions. The copper layer 7 covers the protrusions and the through - hole 4, and the copper layer 7 bends at the protrusions. The silver - tin layer 8 covers the protrusions and the through - hole 4, and the silver - tin layer 8 bends at the protrusions. By bending at the protrusions of the nickel layer 6, the copper layer 7, and the silver - tin layer 8, the contact area between the nickel layer 6 and the copper layer 7, and between the copper layer 7 and the silver - tin layer 8 can be increased. And by the nickel layer 6, the copper layer 7, and the silver - tin layer 8 bending into the through - hole 4 simultaneously, the bonding force between the multiple nickel layers 6, the copper layer 7, the silver - tin layer 8 and the substrate 1 can be improved.
[0034] Working principle: Since there is a cavity 2 inside the substrate 1 at the position where it is in contact and connected with other components, and the distance between the cavity 2 and the surface of the substrate 1 is relatively thin, the substrate 1 above the cavity 2 can be bent relatively easily. When the coating layer at this place is bent under pressure, it will drive the rubber soft pad to deform, and then the coating layer can deform along with the deformation of the surface of the substrate 1, thus preventing the coating layer on the substrate 1 from peeling off.
[0035] Furthermore, when the through - hole 4 is squeezed, due to the setting of the annular groove, the substrate 1 outside the annular groove can bend towards the inside of the annular groove. When the through - hole 4 is squeezed, it will drive the substrate 1 to bend and squeeze the second buffer layer 5. And the second buffer layer 5 is a rubber soft pad, which can play a role in buffering and resetting. By the deformation of the substrate 1, the extrusion force on the coating layer on the substrate 1 is reduced, thus preventing the coating layer on the substrate 1 from peeling off and enabling long - term use.
[0036] The above specific embodiments are merely several alternative embodiments of the present utility model. Based on the technical solution of the present utility model and the relevant inspirations of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. A metal surface coating structure based on silver-tin alloy, comprising a substrate (1), characterized in that: Cavities (2) are provided on both sides of the substrate (1), a first buffer layer (3) is fixedly installed in the cavity (2), a through hole (4) is provided on the substrate (1), an annular groove is provided on the substrate (1), the annular groove is located outside the through hole (4), a second buffer layer (5) is fixedly installed in the annular groove, a nickel layer (6) is provided on the substrate (1), a copper layer (7) is provided on the nickel layer (6), and a silver-tin layer (8) is provided on the copper layer (7).
2. The metal surface coating structure based on silver-tin alloy according to claim 1, characterized in that: The annular groove and the through hole (4) are in a coaxial position.
3. The metal surface plating structure based on silver-tin alloy according to claim 1, characterized in that: The base (1) is provided with a protrusion, which is cylindrical and is coaxial with the through hole (4).
4. The metal surface plating structure based on silver-tin alloy according to claim 3, characterized in that: The nickel layer (6) covers the protrusion and the through hole (4), and the nickel layer (6) is bent at the protrusion.
5. The metal surface plating structure based on silver-tin alloy according to claim 3, characterized in that: The copper layer (7) covers the protrusion and the through hole (4), and the copper layer (7) is bent at the protrusion.
6. The metal surface plating structure based on silver-tin alloy according to claim 3, characterized in that: The silver-tin layer (8) covers the protrusion and the through hole (4), and the silver-tin layer (8) is bent at the protrusion.
7. The metal surface plating structure based on silver-tin alloy according to claim 6, characterized in that: The silver-tin layer (8) is located at the outermost layer, and the surface of the silver-tin layer (8) is in a horizontal state.