Test fixture for semiconductor embedded capacitor

Abstract

The utility model belongs to the technical field of circuit board testing, and particularly relates to a testing jig for a semiconductor embedded capacitor, which comprises a special capacitor tray fixed on an aluminum plate, a lead plate arranged on the aluminum plate, a guide plate positioned on the lead plate and a panel positioned on the guide plate, the panel at the upper position in the panels is a dial panel, and the panel at the lower position in the panels is a dial bottom plate; a bottom plate is arranged between the uppermost wire guide plate and the guide plate, the bottom plate surface of the lowermost wire guide plate and the top end of a main supporting column are fixed into a whole, and the bottom end of the main supporting column and an aluminum plate are fixed into a whole; the guide plate, the bottom plate and the wire guide plate at the lowermost layer are fixed into a whole through locking screws a; the panel and the guide plate located at the uppermost position are both provided with element avoiding grooves and hollow parts. Due to the structure, the fixture can be commonly used with a conventional fixture in specification, is simple to disassemble and assemble, is convenient to maintain, and reduces the test cost.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board testing, and provides a test fixture for semiconductor embedded capacitors that can be universally used with conventional fixture specifications, is simple to disassemble and assemble, easy to maintain, and reduces testing costs. Background Art

[0002] After the conventional O / S open-short circuit and four-wire testing of high-precision CPU chip boards are completed, it is necessary to test the capacitance value. Due to the special features of high-precision CPU chip boards, such as small BGA wire pitch, protruding solder joints, and surface-mounted capacitors or buried capacitors in the circuit, their manufacturing is difficult and time-consuming.

[0003] A test fixture for a semiconductor embedded capacitor of an existing high-precision CPU chip board all uses an imported fixture produced in Japan. The imported fixture includes an aluminum plate, a capacitor-specific tray fixed on the aluminum plate, three-layer wire boards arranged on the aluminum plate, two-layer guide boards located on the wire boards, and two-layer face plates located on the guide boards. When in use, the capacitor-specific tray is electrically connected to an external capacitor testing system. Such imported fixtures are expensive, have high requirements for raw materials, and complex processing techniques. The imported fixture is not universal with conventional fixtures. The high-precision CPU chip board to be detected can only be placed in the face plate, and the probe is perpendicular to the top plate surface of the aluminum plate and is a specially customized short needle. The probe is expensive and easy to cause misoperation during disassembly and assembly, resulting in needle dropping, and the testing cost is high.

[0004] Therefore, there is an urgent need in this industry to develop a domestic capacitor test fixture that can be universal with conventional fixtures, is simple to disassemble and assemble, easy to maintain, and reduces testing costs, so as to break through the current situation of high testing costs brought by imported fixtures monopolized by foreign capital. Summary of the Utility Model

[0005] In view of this, the purpose of the utility model is to provide a test fixture for semiconductor embedded capacitors that can be universal with conventional fixture specifications, is simple to disassemble and assemble, easy to maintain, and reduces testing costs.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] The utility model provides a test fixture for semiconductor embedded capacitors, including an aluminum plate, a capacitor-specific tray fixed on the aluminum plate, three-layer wire boards arranged on the aluminum plate, three-layer guide boards located on the wire boards, and two-layer face plates located on the guide boards; wherein: the upper panel of the two-layer face plates is a needle plate panel, and the lower panel of the two-layer face plates is a needle plate bottom plate; a bottom plate is arranged between the topmost wire board and the guide board, the bottom plate surface of the lowermost wire board is integrally fixed with the top end of the main support column, and the bottom end of the main support column is integrally fixed with the aluminum plate;

[0008] Fix the guide plate, bottom plate and three-layer wire plates at the lowermost layer together with locking screw a;

[0009] On the bottom plate surface of the guide plate at the uppermost position in the three-layer guide plate, there are needle plate support columns. The bottom end of the needle plate support column sequentially passes through the guide plate at the middle position and the guide plate at the lowermost position in the three-layer guide plate. The bottom end of the needle plate support column is flush with the bottom plate surface of the guide plate at the lowermost position. The bottom end of the needle plate support column is fixed to the bottom plate with locking screw b passing through the bottom plate. The top end of the needle plate support column is fixed to the bottom plate surface of the guide plate at the uppermost position with locking screw c sequentially passing through two panel surfaces and the guide plate at the uppermost position;

[0010] Component avoidance grooves and hollow parts are provided on both the two panel surfaces and the guide plate at the uppermost position.

[0011] For the convenience of assembly and guidance, in the above solution, further: Guide holes are provided on the bottom plate, three-layer guide plate and two panel surfaces, and guide columns are provided in the guide holes.

[0012] To ensure compatibility with different models of high-precision CPU chip boards to be tested, in the above solution, further: Auxiliary support columns are fixed on the aluminum plate. The bottom end of the auxiliary support column is fixed to the aluminum plate with screws;

[0013] The top end of the auxiliary support column sequentially passes through the three-layer wire plates and is fixed on the wire plate at the uppermost position with screws. The top end of the auxiliary support column is flush with the top plate surface of the wire plate at the uppermost position.

[0014] For the convenience of wiring and electrical connection with an external capacitance test system, in the above solution, further: The capacitance special material tray is fixed on the aluminum plate with screws. The wiring terminals of the capacitance special material tray extend out of the top plate surface and the bottom plate surface of the aluminum plate respectively.

[0015] The beneficial effects of the present utility model are as follows: The settings of the needle plate support columns, component avoidance grooves and hollow parts make an angle formed between the probe and the top plate surface of the aluminum plate. During capacitance testing, a conventional probe can complete the test; According to the model of the high-precision CPU chip board to be tested, replacing the panel can complete the capacitance test, and it can be compatible with the specifications of conventional jigs; The whole structure is simple to disassemble and assemble, facilitating later maintenance; The probe loss rate is low, reducing the test cost.

[0016] Other advantages, objects and features of the present utility model will be described to some extent in the subsequent description, and to some extent, will be obvious to those skilled in the art based on the study of the following text, or can be learned from the practice of the present utility model. The objects and other advantages of the present utility model can be achieved and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the objects, technical solutions and advantages of the present utility model clearer, the present utility model will be described in detail preferably with reference to the accompanying drawings, wherein:

[0018] Figure 1 is a schematic structural diagram of the present utility model;

[0019] Figure 2 is a schematic structural diagram in the top view direction of the guide plate at the uppermost position of the present utility model;

[0020] Figure 3 is a schematic structural diagram in the top view direction of the special capacitor tray of the present utility model;

[0021] Reference numerals: 1, aluminum plate; 2, special capacitor tray; 3, wire board; 4, guide plate; 5, panel; 6, bottom plate; 7, main support column; 8, locking screw a; 9, needle tray support column; 10, probe; 11, locking screw b; 12, locking screw c; 13, component avoidance groove; 14, guide hole; 15, guide post; 16, auxiliary support column; 17, terminal; 18, wire. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following specific examples illustrate the embodiments of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present utility model in a schematic manner. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0023] Among them, the attached drawings are only for illustrative purposes, showing only schematic diagrams rather than actual product drawings, and should not be construed as limitations on this patent. To better illustrate the embodiments of the present invention, some components in the attached drawings are omitted, enlarged or reduced, which do not represent the dimensions of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the attached drawings may be omitted. In addition, the present invention may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed.

[0024] As Figures 1-3 shown, a test fixture for a semiconductor embedded capacitor according to the present invention includes an aluminum plate 1, a capacitor-specific tray 2 fixed on the aluminum plate 1, a three-layer wire board 3 provided on the aluminum plate 1, a three-layer guide board 4 located on the wire board 3, and two-layer panels 5 located on the guide board 4; wherein: the panel 5 at the upper position among the two-layer panels 5 is a pin tray panel, and the panel 5 at the lower position among the two-layer panels 5 is a pin tray bottom plate; a bottom plate 6 is provided between the wire board 3 at the uppermost layer and the guide board 4, and the bottom plate surface of the wire board 3 at the lowermost layer is integrally fixed with the top end of the main support column 7, and the bottom end of the main support column 7 is integrally fixed with the aluminum plate 1;

[0025] The guide board 4 at the lowermost layer, the bottom plate 6 and the three-layer wire board 3 are fixed into one body by a locking screw a8;

[0026] A pin tray support column 9 is provided on the bottom plate surface of the guide board 4 at the uppermost position among the three-layer guide boards 4. The bottom end of the pin tray support column 9 sequentially passes through the guide board 4 at the middle position and the guide board 4 at the lowermost position among the three-layer guide boards 4. The bottom end of the pin tray support column 9 is flush with the bottom plate surface of the guide board 4 at the lowermost position. The bottom end of the pin tray support column 9 is fixed to the bottom plate 6 by a locking screw b11 passing through the bottom plate 6, and the top end of the pin tray support column 9 is fixed to the bottom plate surface of the guide board 4 at the uppermost position by a locking screw c12 sequentially passing through the two-layer panels 5 and the guide board 4 at the uppermost position;

[0027] The two panels 5 and the guide plate 4 at the top are both provided with component avoidance grooves 13 and hollow parts. In this embodiment, when in use, the capacitor-specific material tray 2 is electrically connected to an external test device. During testing, the capacitor-specific material tray 2 is electrically connected to a conventional probe 10 through a wire 18, and the capacitance of the high-precision CPU chip board to be tested on the panel 5 is tested through the external test equipment. In this embodiment, the arrangement of the needle plate support column 9, the component avoidance groove 13 and the hollow part forms an angle between the probe and the top plate surface of the aluminum plate 1. During the capacitance test, a conventional probe can complete the test; according to the model of the high-precision CPU chip board to be tested, the capacitance test can be completed by replacing the panel 5, which can be compatible with conventional fixture specifications; the entire structure is easy to disassemble and assemble, which is convenient for later maintenance; the probe loss rate is low, which reduces the test cost.

[0028] To facilitate assembly and guiding, in the above embodiment, preferably: the bottom plate 6 , the three-layer guide plate 4 and the two-layer panel 5 are all provided with guide holes 14 , and guide columns 15 are provided in the guide holes 14 .

[0029] In order to ensure that different types of high-precision CPU chip boards to be tested are applicable, in the above embodiment, preferably: an auxiliary support column 16 is fixed on the aluminum plate 1, and the bottom end of the auxiliary support column 16 is fixed to the aluminum plate 1 as a whole by screws;

[0030] The top end of the auxiliary support column 16 passes through the three layers of wire boards 3 in sequence and is fixed to the wire board 3 at the top by screws. The top end of the auxiliary support column 16 is flush with the top plate surface of the wire board 3 at the top.

[0031] To facilitate wiring and electrical connection with an external capacitor testing system, in the above embodiment, preferably: the capacitor-specific material tray 2 is fixed to the aluminum plate 1 by screws, and the wiring terminals 17 of the capacitor-specific material tray 2 extend out of the top and bottom surfaces of the aluminum plate 1 respectively.

[0032] All components in the above embodiments are commercially available products.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution, which should be included in the scope of the claims of the utility model.

Claims

1. A test fixture for semiconductor embedded capacitors, comprising an aluminum plate (1), a capacitor material tray (2) fixed on the aluminum plate (1), a three-layer wire board (3) arranged on the aluminum plate (1), a three-layer guide plate (4) located on the wire board (3), and a two-layer panel (5) located on the guide plate (4); characterized in that: The panel (5) located at the upper position of the two layers of panels (5) is a needle disk panel, and the panel (5) located at the lower position of the two layers of panels (5) is a needle disk bottom plate; a bottom plate (6) is arranged between the uppermost wire plate (3) and the guide plate (4), and the bottom plate surface of the lowermost wire plate (3) is fixed to the top end of the main support column (7) as a whole, and the bottom end of the main support column (7) is fixed to the aluminum plate (1) as a whole; The guide plate (4), the bottom plate (6) and the three-layer wire plate (3) located at the bottom layer are fixed together by means of locking screws a (8); A needle disk support column (9) is arranged on the bottom plate surface of the guide plate (4) located at the top position among the three-layer guide plates (4), and the bottom end of the needle disk support column (9) sequentially passes through the guide plate (4) located at the middle position and the guide plate (4) located at the bottom position among the three-layer guide plates (4), and the bottom end of the needle disk support column (9) is flush with the bottom plate surface of the guide plate (4) located at the bottom position, and the bottom end of the needle disk support column (9) is fixed to the bottom plate (6) as a whole by a locking screw b (11) passing through the bottom plate (6), and the top end of the needle disk support column (9) is fixed to the bottom plate surface of the guide plate (4) located at the top position as a whole by a locking screw c (12) passing through the two layers of panels (5) and the guide plate (4) located at the top position in sequence; The two panels (5) and the guide plate (4) located at the uppermost position are both provided with component avoidance grooves (13) and hollow portions.

2. A semiconductor embedded capacitor test fixture according to claim 1, characterized in that: The bottom plate (6), the three-layer guide plate (4) and the two-layer panel (5) are all provided with guide holes (14), and guide columns (15) are provided in the guide holes (14).

3. The semiconductor embedded capacitor test fixture according to claim 1, characterized in that: An auxiliary support column (16) is fixed on the aluminum plate (1), and the bottom end of the auxiliary support column (16) is fixed to the aluminum plate (1) as a whole by screws; The top end of the auxiliary support column (16) passes through the three layers of wire boards (3) in sequence and is fixed to the wire board (3) at the top position by screws. The top end of the auxiliary support column (16) is flush with the top plate surface of the wire board (3) at the top position.

4. The semiconductor embedded capacitor test fixture according to claim 1, characterized in that: The capacitor-specific material tray (2) is fixed to the aluminum plate (1) by means of screws, and the connection terminals (17) of the capacitor-specific material tray (2) extend out of the top plate surface and the bottom plate surface of the aluminum plate (1) respectively.

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