Test fixture of Multi-TRAK connector

Abstract

The test fixture of the Multi-TRAK connector is used for testing a mainboard signal on a host processor module of a full-width appearance specification M-FLW through the Multi-TRAK connector, and comprises a test circuit board, one end of the test circuit board is provided with a protruding part, the end part of the protruding part is provided with a golden finger, and the golden finger is provided with a plurality of metal wires. The golden finger is used for being connected with a Multi-TRAK connector on a host processor module to be tested in an inserted mode, and the distance between the edge end of the golden finger and the edge end of the test circuit board on the same side of the golden finger is smaller than the distance between the edge end of the golden finger and the edge end, close to one side of the Multi-TRAK connector, of a radiator on the host processor module to be tested. A test adapter is arranged at one end, far away from the protruding part, of the test circuit board, and the test adapter is connected with the golden finger through a conductive circuit. The test fixture can avoid the radiator on the host processor module of the M-FLW, and interference with the radiator is avoided.

Description

Technical Field

[0001] This application relates to the field of testing technologies, and particularly to a test fixture for a Multi-TRAK connector. Background Art

[0002] The Multi-TRAK connector (multi-channel connector) is one of the connectors defined by the Open Compute Project (OCP) in the full-width HPM form factor base Specification (M-FLW). After the hardware system is modularized, it is necessary to test the signal compatibility of the motherboard through the Multi-TRAK connector.

[0003] If the current test fixtures on the market for measuring high-speed cables or connectors are directly applied to test the Multi-TRAK connector, interference may occur with other components on the board. For example, due to length reasons, the test fixture may interfere with the radiator (such as heat dissipation fins) adjacent to the Multi-TRAK connector, and even cause the test fixture to be unable to be plugged into the Multi-TRAK connector. Summary of the Utility Model

[0004] This application provides a test fixture for a Multi-TRAK connector, which can avoid the radiator on the host processor module with a full-width form factor M-FLW and prevent interference with the radiator. The test fixture can be easily plugged into the Multi-TRAK connector on the host processor module. The technical solution is as follows.

[0005] This application provides a test fixture for a Multi-TRAK connector, which is used to test the motherboard signal on the host processor module with a full-width form factor M-FLW through a multi-channel Multi-TRAK connector, and includes: a test circuit board, one end of the test circuit board is provided with a protrusion, and the end of the protrusion is provided with a gold finger, and the gold finger is used for plugging into the Multi-TRAK connector on the host processor module to be tested. The distance between the edge end of the gold finger and the edge end of the test circuit board on the same side is less than the distance between the edge end of the gold finger and the edge end of the radiator on the host processor module to be tested adjacent to the Multi-TRAK connector on one side; a test adapter is provided at the end of the test circuit board far from the protrusion, and the test adapter is connected to the gold finger through a conductive line.

[0006] In a possible implementation manner, the test fixture includes two test circuit boards, and the two test circuit boards are plugged into the same Multi-TRAK connector.

[0007] In a possible implementation, the channel dimension of each of the test circuit boards is half of the channel dimension of the Multi-TRAK connector.

[0008] In a possible implementation, the test circuit board has a non-axisymmetric geometric shape.

[0009] In a possible implementation, the protrusion is located on a side of the test circuit board adjacent to the heat sink.

[0010] In a possible implementation, the test adapter includes a pluggable MMPX connector.

[0011] In a possible implementation, the test adapter includes a transmit test adapter for connecting to the transmit terminals of the Multi-TRAK connector and a receive test adapter for connecting to the receive terminals of the Multi-TRAK connector.

[0012] In a possible implementation, the test circuit board includes a first surface and a second surface for assembling the test adapter.

[0013] In a possible implementation, a first area on the first surface where the test adapter is assembled is offset from a second area on the second surface where the test adapter is assembled.

[0014] In a possible implementation, the thickness of the test circuit board is greater than or equal to the thickness of the gold finger.

[0015] The test fixture for the Multi-TRAK connector provided by the present application is used to test the motherboard signals on a host processor module with a full-width form factor M-FLW through the Multi-TRAK connector, and includes: a test circuit board, one end of which is provided with a protrusion, and the end of the protrusion is provided with a gold finger for plugging into the Multi-TRAK connector on the host processor module to be tested. The distance between the edge end of the gold finger and the edge end of the test circuit board on the same side is less than the distance between the edge end of the gold finger and the edge end of the heat sink on the host processor module to be tested adjacent to the Multi-TRAK connector on one side; a test adapter is provided at the end of the test circuit board away from the protrusion, and the test adapter is connected to the gold finger through a conductive line. The test fixture can avoid the heat sink on the host processor module with M-FLW and prevent interference with the heat sink.

[0016] Additional aspects and advantages of the present application will be given in part in the following description, will be partly embodied from the following description, or will be learned through the practice of the present application. Brief Description of the Drawings

[0017] The drawings herein are incorporated into and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0018] Figure 1 It shows a schematic diagram of a test fixture for a Multi-TRAK connector provided by an exemplary embodiment of the present application;

[0019] Figure 2 It shows a layout diagram of the full-width form factor M-FLW specification provided by an exemplary embodiment of the present application;

[0020] Figure 3 It shows another schematic diagram of a test fixture for a Multi-TRAK connector provided by an exemplary embodiment of the present application;

[0021] Figure 4 It shows schematic diagrams of the front and back sides of a test circuit board provided by an exemplary embodiment of the present application;

[0022] Figure 5 It shows a schematic diagram of the dimension markings of a test fixture provided by an exemplary embodiment of the present application;

[0023] Figure 6 It shows a front view of a test fixture for a Multi-TRAK connector plugged into a host processor module;

[0024] Figure 7 It shows a top view of a test fixture for a Multi-TRAK connector plugged into a host processor module;

[0025] Figure 8 It shows a side view of a test fixture for a Multi-TRAK connector plugged into a host processor module;

[0026] Figure 9 It shows another side view of a test fixture for a Multi-TRAK connector plugged into a host processor module. Detailed Description of the Embodiments

[0027] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0028] The terms "first" and "second" in the description and claims of this application may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0029] In the description of this application, it should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "positive", "negative", "far", "near", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0030] In the description of this application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0031] The following Figures 1 - 9 describes the test fixture for the Multi-TRAK connector provided in the embodiments of this application.

[0032] The embodiments of this application provide a test fixture for a Multi-TRAK connector, which is used to test the motherboard signals on the host processor module with the full-width form factor M-FLW through the Multi-TRAK connector; Figure 1 shows a schematic diagram of the test fixture for the Multi-TRAK connector provided in an exemplary embodiment of this application, as Figure 1As shown, the test fixture 100 of the Multi-TRAK connector includes: a test circuit board 11, with a protrusion 12 provided at one end of the test circuit board. A gold finger 13 is provided at the end of the protrusion 12. The gold finger 13 is used to plug into the Multi-TRAK connector 200 on the host processor module to be tested. The distance between the edge end of the gold finger 13 and the edge end of the test circuit board on the same side is less than the distance between the edge end of the gold finger 13 and the edge end of the radiator 300 on the host processor module to be tested adjacent to one side of the Multi-TRAK connector 200. A test adapter 14 is provided at the end of the test circuit board 11 far from the protrusion 12. The test adapter 14 is connected to the gold finger 13 through a conductive line.

[0033] The test fixture 100 is used to test the motherboard signals on the host processor module of the M-FLW by plugging into the Multi-TRAK connector. Among them, the Multi-TRAK connector is a connector defined by the OCP (Open Compute Project) Association and can be assembled on the host processor module to connect the host processor module with external devices. In the embodiment of the present application, the Multi-TRAK connector is used to provide a plug-in port for the test fixture 100 and the host processor module to test the motherboard signals on the host processor module. The test fixture 100 can test the motherboard signals based on the high-speed signal transmission standard supported by the Multi-TRAK connector. Among them, the high-speed signal transmission standard supported by the Multi-TRAK connector can be PCI Express (PCIe, Serial Computer Extension Bus Standard) Gen 3, Gen 4, and Gen 5, and other achievable transmission standards. For example, the test fixture 100 can verify and analyze the signal integrity of the host processor module under the PCIe Gen5 standard based on the Multi-TRAK connector.

[0034] In a possible case, the Multi-TRAK connector is a Multi-TRAK x16 connector, where x16 is used to represent the number of channels of the connector, that is, the Multi-TRAK x16 connector supports 16 independent high-speed data transmission channels. In addition, the Multi-TRAK connector can also be other specifications of connectors, such as x8 specification, x4 specification, etc. The present application does not limit this.

[0035] A test circuit board refers to a circuit board used for signal testing, which can be implemented as types such as a Printed Circuit Board (PCB), a Printed Circuit Board Assembly (PCBA), etc.

[0036] One end of the test circuit board 11 is provided with a protrusion 12. Optionally, the protrusion 12 is part of the test circuit board 11. The protrusion 12 can be of an irregular shape, and a gold finger 13 is provided at the end of the protrusion 12. Here, the gold finger 13 refers to a row of gold-plated contacts on the test circuit board 11, and the function of these contacts is to provide a stable electrical contact surface. In the embodiment of the present application, the gold finger 13 is plugged into the Multi-TRAK connector on the host processor module to be tested, so that the test fixture 100 can establish a reliable electrical connection with the Multi-TRAK connector. The gold finger 13 provided at the end of the protrusion 12 is plugged into the Multi-TRAK connector on the one hand and connected to the test adapter 14 through a conductive line on the other hand to form a connection between the test adapter 14 and the Multi-TRAK connector, enabling the test adapter 14 to perform signal tests corresponding to different terminals of the Multi-TRAK connector.

[0037] As Figure 1 shown, in order to prevent interference in position between the test fixture 100 and the radiator on the host processor module, on the side of the test circuit board 11 close to the radiator, the distance x1 between the edge end of the gold finger 13 and the edge end of the test circuit board 11 on the same side is less than the distance between the edge end of the gold finger 13 and the edge end on the side adjacent to the Multi-TRAK connector of the radiator 300 on the host processor module to be tested. Thus, after the test fixture 100 is plugged into the Multi-TRAK connector 200 on the host processor module, the test fixture 100 will not contact or collide with the radiator 300 on the host processor module, ensuring the normal use of the test fixture.

[0038] Optionally, the radiator 300 on the host processing module can be a finned radiator (also called a heat sink fin), or it can also be a heat pipe radiator, a heat plate radiator, etc., which are optional radiator types, and the present application does not limit this.

[0039] In summary, the test fixture for the Multi-TRAK connector provided by the present utility model has a protrusion provided at one end of the test circuit board. A gold finger is provided at the end of the protrusion, and the gold finger is used for plugging into the Multi-TRAK connector on the host processor module to be tested. The distance between the edge end of the gold finger and the edge end of the test circuit board on the same side is less than the distance between the edge end of the gold finger and the edge end of the radiator on the host processor module to be tested that is adjacent to the Multi-TRAK connector on one side; a test adapter is provided at one end of the test circuit board away from the protrusion, and the test adapter is connected to the gold finger through a conductive line; through the above structural arrangement, when the test fixture is applied to the host processor module of M-FLW for main board signal testing, it can avoid the radiator on the host processor module and prevent interference with the radiator. The test fixture can be conveniently plugged into the Multi-TRAK connector on the host processor module to ensure the smooth progress of the main board signal testing.

[0040] Figure 2 shows the layout diagram of the full-width form factor M-FLW specification provided by an exemplary embodiment of the present application; as Figure 2 shown, the host processor module includes a platform customization area, an infrastructure connection area, a reference plane, a "far" IO connector area 20 away from the reference plane, a "near" IO connector area 30 close to the reference plane, etc., and the specification further stipulates the placement areas of different devices. For example, according to this specification, the Multi-TRAK connector should be placed in the "far" IO connector area 20. When performing main board signal testing based on the Multi-TRAK connector placed in the "far" IO connector area 20, the devices that are likely to interfere with its test fixture include memory slots, a central processing unit (CPU), a radiator, etc. Among them, the CPU can be replaced with a version with a relatively low height, for example, using an ultra-thin CPU; the memory slot can be avoided by setting the height of the protrusion 12 to be not less than the height of the memory slot for avoidance; when avoiding the radiator on the host processor module to be tested, since the settings between the hardware are relatively fixed, therefore, in order to ensure the normal operation of the test fixture, the distance between the edge end of the gold finger and the edge end of the radiator on the side adjacent to the Multi-TRAK connector needs to be considered.

[0041] In a possible implementation manner, the number of test circuit boards in the test fixture can be one or more to perform signal testing simultaneously through multiple test circuit boards to improve the test efficiency; the following embodiments will be described by taking the test fixture including two test circuit boards as an example, that is, in the embodiments of the present application, the test fixture includes two test circuit boards 11, and the two test circuit boards 11 are plugged into the same Multi-TRAK connector.Figure 3 Another schematic diagram of the test fixture for the Multi-TRAK connector provided by an exemplary embodiment of the present application is shown. As Figure 3 shown, the test fixture 100 for the Multi-TRAK connector includes: a test circuit board 11. One end of the test circuit board 11 is provided with a protrusion 12, and a gold finger 13 is provided at the end of the protrusion 12. The gold finger 13 is used to plug into the Multi-TRAK connector 200 on the host processor module to be tested (as Figure 3 shown is the state where the gold finger 13 has been plugged into the Multi-TRAK connector 200). The distance between the edge end of the gold finger 13 and the edge end of the test circuit board 11 on the same side is less than the distance between the edge end of the gold finger 13 and the edge end of the radiator 300 on the host processor module to be tested adjacent to the side of the Multi-TRAK connector; through the above settings, when the test fixture is applied to the host processor module, it can avoid colliding with the radiator and avoid interference with the radiator, so as to smoothly plug into the Multi-TRAK connector.

[0042] In a possible implementation, both of the two test circuit boards 11 included in the test fixture 100 have Figure 1 the two test circuit boards 11 shown plugged into the same Multi-TRAK connector, as Figure 3 shown, and each test circuit board satisfies the structure of the test circuit board as Figure 1 shown.

[0043] The sum of the channel dimensions of the two test circuit boards 11 is the same as the channel dimension of the Multi-TRAK connector. In a possible implementation, the channel dimension of each test circuit board 11 is half of the channel dimension of the Multi-TRAK connector. Schematically, if the channel dimension of the Multi-TRAK connector is 16x, that is, the Multi-TRAK connector is a Multi-TRAK16x connector, then the channel dimensions of the corresponding two test circuit boards 11 are 8 respectively. Two 8x test circuit boards 11 are applied to a Multi-TRAK connector of x16. That is to say, the channel dimensions of the two test circuit boards can be the same; in another possible implementation, the channel dimensions of the two test circuit boards can also be different.

[0044] In a possible implementation, based on the setting requirements of the test adapter on the test circuit board 11, the test circuit board 11 can be an axisymmetric geometric shape, or the test circuit board 11 is a non-axisymmetric geometric shape. Optionally, the protrusion 12 is located on the side of the test circuit board 11 adjacent to the radiator 300; as Figure 3As shown, the distance between the edge end of the protrusion 12 adjacent to one side of the radiator 300 and the edge end of the test circuit board on the same side is less than the distance between the edge end of the other side of the protrusion 12 and the edge end of the other side of the test circuit board. Based on different actual requirements, different length settings can also be adopted, and the present application does not limit this.

[0045] A test adapter 14 is provided at one end of the test circuit board 11 away from the protrusion 12, and the test adapter 14 is connected to the gold finger 13 through a conductive line. In a possible implementation manner, the test adapter 14 includes a pluggable MMPX connector; wherein, the MMPX connector is a small coaxial connector with a quick plug structure and has a small mechanical size. In addition, compared with connectors of other connection methods, using a pluggable MMPX (Miniature Modular Push-pull eXtension) connector can provide a reliable connection, ensure the stability of signal transmission and signal quality, so as to improve the accuracy of signal testing.

[0046] Among them, the test adapter 14 includes a transmitting test adapter for connecting the transmitting terminals of the Multi-TRAK connector, and a receiving test adapter for connecting the receiving terminals of the Multi-TRAK connector; the number of the transmitting test adapters corresponds to the number of the transmitting terminals of the Multi-TRAK connector, and the number of the receiving test adapters corresponds to the number of the receiving terminals of the Multi-TRAK connector.

[0047] In a possible implementation manner, the number of the transmitting test adapters is the same as the number of the transmitting terminals of the Multi-TRAK connector, and the number of the receiving test adapters is the same as the number of the receiving terminals of the Multi-TRAK connector. For example, for a Multi-TRAK 16x connector, the number of pairs of the transmitting test adapters on each test circuit board 11 is 8 pairs, and the number of pairs of the receiving test adapters is also 8 pairs. Further, the transmitting test adapters are connected to the transmitting terminals of the Multi-TRAK connector in a one-to-one correspondence manner, and the receiving test adapters are connected to the receiving terminals of the Multi-TRAK connector in a one-to-one correspondence manner to ensure the accuracy of signal transmission. At the same time, when a signal anomaly occurs, it is convenient for troubleshooting; for example, the first transmitting test adapter is connected to the first transmitting terminal of the Multi-TRAK connector. When the test signal corresponding to the first transmitting test adapter is abnormal, it indicates that there is a fault in the signal generating component on the host processor module corresponding to the first transmitting terminal of the Multi-TRAK connector. Therefore, the main board signals can be tested targeted through the respective terminals of the Multi-TRAK connector.

[0048] Figure 4The figure shows a schematic diagram of the front and back sides of a test circuit board provided by an exemplary embodiment of the present application, as Figure 4 shown, the test circuit board 11 includes a first surface (a) and a second surface (b) for assembling test adapters; in a possible implementation, the first surface of the test circuit board 11 is used to place the transmitting test adapter, and the second surface of the test circuit board 11 is used to place the receiving test adapter.

[0049] In a possible implementation, the first area on the first surface where the test adapter is assembled is offset from the second area on the second surface where the test adapter is assembled; that is, as Figure 4 shown, on the same test circuit board, the areas (i.e., the first area and the second area) on the front and back sides for assembling the test conversion adapter do not overlap; among them, the offset setting of the first area and the second area means that the deployment positions of each test adapter in the first area do not overlap with the deployment positions of each test adapter in the second area; in addition, based on different actual application requirements, the arrangement of the test adapters in the first area of the first surface is different from the arrangement of the test adapters in the second area of the second surface; by offsetting the first area and the second area, signal crosstalk during the test can be avoided, and the connection reliability between the test adapter and the test circuit board can be improved.

[0050] In a possible implementation, on the first surface a, the length of the first conductive line for connecting each transmitting test adapter to the gold finger is 2 inches; on the second surface b, the length of the second conductive line for connecting each receiving test adapter to the gold finger is 4 inches. By restricting the lengths of different conductive lines, the structure of the test fixture is further clarified. Based on the above settings, the test fixture can meet the compliance tests of the Multi-TRAK connector transmitter and receiver.

[0051] In the embodiment of the present application, the thickness of the test circuit board 11 is greater than or equal to the thickness of the gold finger 13; since among the different components included in the test circuit board 11, the thickness of the gold finger 13 is usually the thickest component, therefore, the thickness of the test circuit board 11 is not less than the thickness of the gold finger 13. The thickness of the gold finger 13 is adapted to the insertion port of the Multi-TRAK connector, and the length of the gold finger 13 is also adapted to the insertion port of the Multi-TRAK connector.

[0052] Schematically, Figure 5 The figure shows a schematic diagram of the dimension marking of a test fixture provided by an exemplary embodiment of the present application, as Figure 5As shown, the minimum size of the test circuit board of the test fixture 100 is 106.87 mm × 102.74 mm (length × width), and the width is 1.57 mm. Among them, on the side of the test fixture 100 close to the radiator, 0 < x1 = < 6.8 mm, where x1 is the distance between the edge end of the gold finger and the edge end of the test circuit board on the same side, to avoid interference between the test fixture 100 and the radiator. 6.8 mm refers to the distance between the edge end of the gold finger and the edge end of the radiator adjacent to the side of the Multi-TRAK connector. x2 = 63.05 mm, where x2 is the length of the gold finger, which is adapted to the length of the insertion port of the Multi-TRAK connector. x3 >= 37.2 mm, where x3 is the distance between the other edge end of the gold finger and the edge end of the test circuit board on the same side. The total length x4 of the test circuit board >= 106.87 mm. y1 >= 78.74 mm, y2 >= 24 mm, which meets the maximum height limit of the FLW specification. y4 >= 22 mm, which meets the maximum height limit of the FLW specification. y5 >= 92.74 mm, and the total width y3 of the test circuit board >= 102.74 mm. The setting of the above dimensions enables the test circuit board to accommodate 44 MMPX connectors. d = 1.57 mm, where d is the thickness of the gold finger, which is adapted to the thickness of the insertion port of the Multi-TRAK connector.

[0053] It should be noted that the above-mentioned values of each dimension are adapted to the reference dimensions provided by the current application example. In different application scenarios, the values of each parameter can be adjusted adaptively, and the present application does not limit this.

[0054] To further show the situation of using the test fixture of the Multi-TRAK connector of the embodiment of the present application on the host processor module, Figure 6 A front view of the test fixture 100 of the Multi-TRAK connector plugged into the host processor module is shown. Figure 7 A top view of the test fixture 100 of the Multi-TRAK connector plugged into the host processor module is shown. Figure 8 A side view of the test fixture 100 of the Multi-TRAK connector plugged into the host processor module is shown. Figure 9 Another side view of the test fixture 100 of the Multi-TRAK connector plugged into the host processor module is shown.

[0055] In summary, for the test fixture of the Multi-TRAK connector provided by the present utility model, a protruding portion is provided at one end of the test circuit board. A gold finger is provided at the end of the protruding portion. The gold finger is used for plugging into the Multi-TRAK connector on the host processor module to be tested. The distance between the edge end of the gold finger and the edge end of the test circuit board on the same side is less than the distance between the edge end of the gold finger and the edge end of the radiator on the host processor module to be tested adjacent to the Multi-TRAK connector on one side. A test adapter is provided at the end of the test circuit board far from the protruding portion. The test adapter is connected to the gold finger through a conductive circuit. Through the above structural settings, when the test fixture is applied to the host processor module of M-FLW for main board signal testing, it can avoid the radiator on the host processor module and prevent interference with the radiator. The test fixture can be easily plugged into the Multi-TRAK connector on the host processor module, ensuring the smooth progress of the main board signal testing.

[0056] After considering the specification and the practice of the application disclosed herein, those skilled in the art will readily conceive of other solutions to the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and the embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the following claims.

[0057] It should be understood that the present application is not limited to the exact structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A test fixture for a Multi-TRAK connector, used for testing motherboard signals on a host processor module of full-width form factor M-FLW through a multi-channel Multi-TRAK connector, characterized in that: include: A test circuit board (11), wherein a protrusion (12) is provided at one end of the test circuit board, and a gold finger (13) is provided at the end of the protrusion (12), and the gold finger (13) is used to be plugged into a Multi-TRAK connector on a host processor module to be tested, and the distance between the edge end of the gold finger (13) and the edge end of the test circuit board on the same side is smaller than the distance between the edge end of the gold finger (13) and the edge end of a heat sink on the host processor module to be tested that is adjacent to the Multi-TRAK connector; the test circuit board (11) is provided with a test adapter (14) at one end away from the protrusion (12), and the test adapter (14) is connected to the gold finger (13) through a conductive line.

2. The test fixture according to claim 1, characterized in that: The test fixture comprises two test circuit boards (11), and the two test circuit boards (11) are plugged into the same Multi-TRAK connector.

3. The test fixture according to claim 2, characterized in that: The channel dimension of each test circuit board (11) is half the channel dimension of the Multi-TRAK connector.

4. The test fixture according to claim 1, characterized in that: The test circuit board (11) has a non-axisymmetric geometric shape.

5. The test fixture according to claim 4, characterized in that: The protruding portion (12) is located on a side of the test circuit board (11) adjacent to the heat sink.

6. The test fixture according to claim 1, characterized in that: The test adapter (14) comprises a plug-in MMPX connector.

7. The test fixture according to claim 1, characterized in that: The test adapter (14) comprises a transmission test adapter for connecting to a transmission terminal of the Multi-TRAK connector, and a reception test adapter for connecting to a reception terminal of the Multi-TRAK connector.

8. The test fixture according to claim 1, characterized in that: The test circuit board (11) comprises a first surface and a second surface for assembling the test adapter.

9. The test fixture according to claim 8, characterized in that: A first area on the first surface where the test adapter is mounted is staggered with a second area on the second surface where the test adapter is mounted.

10. The test fixture according to claim 1, characterized in that: The thickness of the test circuit board (11) is greater than or equal to the thickness of the gold finger (13).

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