Photoetching workbench and photoetching machine

Abstract

The utility model discloses a photoetching workbench and a photoetching machine. The photoetching workbench comprises a shell, a wafer bearing seat and a mask frame assembly, a mounting space is formed in the shell, and a first window is formed in the side surface of the shell; the wafer bearing seat can be horizontally and movably inserted into the mounting space from the first window; the wafer bearing seat comprises a wafer bearing table for placing a wafer; the mask frame assembly is arranged on the shell and covers the installation space, the mask frame assembly comprises a mask frame used for placing a mask plate, a second window is formed in the mask frame, and the second window is exposed out of the wafer bearing table. The photoetching workbench and the photoetching machine disclosed by the utility model are simple in structure and convenient to operate, and the working efficiency is greatly improved due to the arrangement of the horizontal push-pull type wafer bearing seat and a vacuum wafer adsorption mode.

Description

Technical Field

[0001] The utility model belongs to the technical field of lithography equipment, and particularly relates to a lithography workbench and a lithography machine. Background Art

[0002] With the wide application of micro-optical elements and the substantial increase in demand, it is urgent to improve and perfect the manufacturing technology of micro-optical elements to improve their quality and output, and the lithography machine emerges as the times require.

[0003] The lithography machine is mainly used for the microfabrication of conventional micro-devices and structures, as well as the deep microfabrication of special devices and structures such as microfluidic structures, MEMS, thyristors, surface acoustic wave devices, high-power rectifiers, and quartz crystal resonators. It can also be widely used as relevant experimental equipment in universities and research institutes to carry out microfabrication process research.

[0004] In the existing lithography machines, the structure of the workbench is complex and the operation is not convenient.

[0005] The information disclosed in this background art section is only intended to enhance the overall understanding of the utility model and should not be regarded as an admission or any form of suggestion that this information constitutes the prior art already known to those of ordinary skill in the art. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a lithography workbench and a lithography machine, which can solve the problems in the existing technology.

[0007] To achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0008] A lithography workbench includes:

[0009] A housing having an installation space therein, and a first window on the side of the housing;

[0010] A wafer carrier seat that can be horizontally and movably inserted into the installation space from the first window, and the wafer carrier seat includes a wafer stage for placing a wafer;

[0011] A mask holder assembly is disposed on the housing and covers the installation space. The mask holder assembly includes a mask holder for placing a mask plate, and a second window is formed on the mask holder, and the second window exposes the wafer stage.

[0012] In one or more embodiments of the utility model, the mask holder assembly further includes:

[0013] A frame for carrying the mask holder, and the frame has a limiting portion that abuts against the side of the mask holder;

[0014] A pressing member is movably arranged on the frame and can approach or move away from the limiting portion. The pressing member cooperates with the limiting portion to lock and release the mask holder on the frame.

[0015] In one or more embodiments of the present invention, a plurality of vacuum adsorption holes are arranged in the mask holder.

[0016] In one or more embodiments of the present invention, the wafer carrier further includes a tray. The tray is horizontally movably inserted between the housing. The wafer support table is arranged on the tray and can be separated from the tray under the action of force.

[0017] In one or more embodiments of the present invention, one of the inner wall of the housing and the tray is provided with symmetric slide rails, and the other of the inner wall of the housing and the tray is provided with corresponding sliders. The movable insertion of the tray and the housing is realized through the cooperation of the sliders and the slide rails.

[0018] In one or more embodiments of the present invention, the tray has an extension portion protruding from the first window, and a slot for applying force by a finger is formed on the extension portion.

[0019] In one or more embodiments of the present invention, a third window is formed on the tray, and the wafer support table is arranged to cover the third window.

[0020] In one or more embodiments of the present invention, the lithography workbench further includes:

[0021] A two-dimensional displacement table, arranged in the installation space;

[0022] A rotation and lifting assembly, arranged on the two-dimensional displacement table and located below the wafer carrier. The rotation and lifting assembly can horizontally move under the action of the two-dimensional moving table. The rotation and lifting assembly includes a lifting structure and a rotation structure for driving the lifting structure to rotate. The lifting structure can pass through the third window and act on the wafer support table, and drive the wafer support table to rotate under the action of the rotation structure.

[0023] In one or more embodiments of the present invention, a plurality of vacuum adsorption holes are arranged in the wafer support table.

[0024] A lithography machine includes the above-mentioned lithography workbench.

[0025] Compared with the prior art, the lithography workbench and the lithography machine of the present invention have a simple structure and convenient operation. The setting of the horizontally push-pull type wafer carrier and the method of vacuum adsorbing the wafer greatly improve the working efficiency.

[0026] The lithography workbench and lithography machine of the present utility model, through the setting of the two-dimensional displacement stage and the rotary lifting assembly, realize the multi-degree-of-freedom movement of the wafer stage relative to the mask holder, greatly improving the alignment accuracy and speed of the mask-wafer. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a three-dimensional structure diagram of a lithography machine in an embodiment of the present utility model;

[0029] Figure 2 It is an exploded view of a lithography workbench in an embodiment of the present utility model;

[0030] Figure 3 It is another perspective exploded view of a lithography workbench in an embodiment of the present utility model. Detailed Embodiments

[0031] In order to enable those skilled in the art to better understand the technical solutions in the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0032] As Figure 1 shown, a lithography machine in an embodiment of the present utility model includes a carrier 10, a lithography workbench 20, an exposure device 30, and a control device 40 provided on the carrier 10. The lithography workbench 20 is used to place a mask and a wafer to be exposed. The exposure device 30 is disposed adjacent to the lithography workbench 20 to provide a light source to the wafer to be exposed on the lithography workbench 20. The control device 40 is connected to the lithography workbench 20 and the exposure device 30 to control the two to cooperate to complete the exposure of the sample.

[0033] Among them, the exposure device 30 and the control device 40 can both adopt the structures in the prior art. Since they are not the innovative points of this application, this application will not elaborate on them in detail here.

[0034] Refer to Figures 1 to 3As shown, the lithography workbench 20 and the exposure device 30 are arranged in alignment in the first direction, and the first direction is the Figure 1 x direction shown in Figure 1 . The lithography workbench 20 includes a housing 21, a wafer carrier 22 disposed within the housing 21, a mask holder assembly 23 disposed on the housing 21, a two-dimensional displacement stage 24 disposed within the housing 21, and a rotary lifting assembly 25.

[0035] The housing 21 is disposed on the carrier 10. The housing 21 has a bottom plate 211 and side plates 212 surrounding the periphery of the bottom plate 211. The bottom plate 211 and the side plates 212 together enclose an installation space. Among them, an upper portion of the side plate 212 located in the first direction and away from the exposure device 30 (the direction away from the carrier 10 is the upper) is provided with a first window 2121, and the first window 2121 is strip-shaped in the second direction. The first window 2121 is used for the wafer carrier 22 to pass through.

[0036] The wafer carrier 22 can be horizontally movably inserted into the installation space of the housing 21 through the first window 2121. The wafer carrier 22 includes a tray 221 and a wafer chuck 222 for placing a wafer. The tray 221 is horizontally movably inserted between the housing 21.

[0037] Exemplarily, one of the inner wall of the side plate 212 of the housing 21 and the tray 221 is provided with symmetric slide rails 223, and the other of the inner wall of the side plate 212 of the housing 21 and the tray 221 is provided with corresponding sliders. Through the cooperation of the sliders and the slide rails, the tray 221 can be movably inserted into the housing 21 in the first direction. The length of the tray 221 in the second direction is less than the length of the first window 2121 in the second direction.

[0038] In order to facilitate the operator to manually push and pull the wafer carrier 22, the tray 221 has an extension 2211 protruding from the first window 2121, and the extension 2211 is provided with a slot 2212 for applying force by a finger. A third window (not shown in the figure) through which some components of the rotary lifting assembly 25 can pass is formed on the tray 221.

[0039] The wafer chuck 222 is disposed on the tray 221 and covers the third window. Exemplarily, a circular protrusion (not shown in the figure) is formed on the edge of the wafer chuck 222. When the wafer chuck 222 is disposed in the third window, the circular protrusion is supported on the tray 221 at the edge of the third window, so that the wafer chuck 222 is mounted on the tray 221. When some components of the rotary lifting assembly 25 pass through the third window, they can act on the bottom of the wafer chuck 222 and drive the wafer chuck 222 to move upward to separate from the tray 221.

[0040] A plurality of vacuum adsorption holes (not shown in the figure) are provided on the wafer stage 222. By connecting an external negative pressure device (such as a vacuum pump or a negative pressure pipeline), the wafer placed on the wafer stage 222 can be vacuum adsorbed.

[0041] The mask frame assembly 23 is disposed on the housing 21 and covers the installation space. The mask frame assembly 23 includes a mask frame 231 for placing a mask plate, a frame 232 for carrying the mask frame 231, and a pressing member 233.

[0042] The frame 232 is generally U-shaped, including a first frame body, a second frame body, and a third frame body connected end to end ( Figure 3 in the direction from right to left in the shown drawing). The frame 232 is fixed on the side plate 212 of the housing 21. The open end of the frame 232 faces the direction where the first window 2121 is located. Both the first frame body and the second frame body of the frame 232 have a bearing portion parallel to the surface of the pallet 221 and a limiting portion 2321 extending perpendicular to the bearing portion. The third frame body of the frame 232 only has a bearing portion parallel to the surface of the pallet 221. The bearing portion is used to receive the mask frame 231, and the limiting portion is used to abut against the side surface of the mask frame 231.

[0043] The pressing member 233 is movably disposed on the third frame body of the frame 232 and is correspondingly disposed with the limiting portion 2321 of the first frame body. A tightening handwheel 2331 is provided on the pressing member 233. The tightening handwheel 2331 is in threaded cooperation with the third frame body of the frame 232. The tightening handwheel 2331 can drive the pressing member 233 to approach or move away from the limiting portion 2321. The pressing member 233 has a pressing surface. The pressing member 233 cooperates with the corresponding limiting portion 2321 to realize the locking and releasing of the mask frame 231 on the frame 232.

[0044] The mask frame 231 is detachably placed on the bearing portion of the frame 232. A second window 2311 corresponding to the wafer stage 222 is formed on the mask frame 231. The second window 2311 exposes the wafer stage 222. A plurality of vacuum adsorption holes (not shown in the figure) are provided on the mask frame 231. By connecting an external negative pressure device (such as a vacuum pump or a negative pressure pipeline), the mask plate placed on the mask frame 231 can be vacuum adsorbed.

[0045] The two-dimensional displacement stage 24 is disposed in the installation space and fixed to the bottom plate 211. The two-dimensional displacement stage 24 can adopt the structure in the prior art as long as it can realize the movement in the first direction and the second direction. Since it is not the innovation point of this application, this application will not be elaborated in detail here.

[0046] The rotary lifting assembly 25 is disposed on the two-dimensional displacement stage 24 and is located below the wafer carrier 22. The rotary lifting assembly 25 can move horizontally under the action of the two-dimensional moving stage 24. The rotary lifting assembly 25 includes a lifting structure 251 and a rotary structure 252 for driving the lifting structure 251 to rotate. The lifting structure 251 can pass through the third window on the pallet 221 and act on the wafer chuck 222, and drive the wafer chuck 222 to rotate under the action of the rotary structure 252.

[0047] In one embodiment, the rotary structure 252 can be a rotary cylinder. The lifting structure 251 can be a lifting cylinder. A vacuum adsorption table (not shown in the figure) is provided at the output end of the lifting cylinder. A plurality of vacuum adsorption holes (not shown in the figure) are also provided on the vacuum adsorption table. By connecting an external negative pressure device (such as a vacuum pump or a negative pressure pipeline), the wafer chuck 222 can be vacuum-adsorbed, and the wafer chuck 222 can be driven to move or rotate under the action of the rotary lifting assembly 25.

[0048] The working process of the lithography workbench of the present application is as follows:

[0049] Open the tightening handwheel 2331, take out the mask holder 231, and place the mask plate on the mask holder 231. Before placing, it should be confirmed that the glass surface (non-graphic surface) of the mask plate is in contact with the surface of the mask holder 231. Control the external negative pressure device (such as a vacuum pump or a negative pressure pipeline) through the control device 40 to lock the mask plate and the mask holder 231, and then place the whole on the frame 232. After being installed in place, lock the mask holder 231 through the side tightening handwheel 2331.

[0050] The wafer chuck 222 is smoothly pulled out through the push-pull type wafer carrier 22. During this process, the wafer chuck 222 on the wafer carrier 22 is in the low position - the wafer chuck 222 is carried by the pallet 221 and the rotary lifting assembly 25 does not act on the wafer chuck 222. At this time, the pallet 221 together with the wafer chuck 222 can be directly pulled out, and the wafer to be etched is placed in the center of the wafer chuck 222, and then the wafer carrier 22 is smoothly pushed into the lithography workbench 20. (Note: Before pulling out the pallet 221 of the wafer chuck 222, the rotary lifting assembly 25 should be in the lowest position state, that is, the wafer chuck 222 has fallen onto the pallet 221. Note: The wafer to be etched should be placed as close to the center of the wafer chuck 222 as possible, and it is ensured that the line connecting the two alignment marks on the wafer to be etched is parallel to the second direction, which is convenient for finding the alignment marks during alignment.

[0051] After placing the mask plate and the wafer to be etched, the control device 40 is started to control an external negative pressure device (such as a vacuum pump or a negative pressure pipeline), so as to vacuum-adsorb and lock the wafer to be etched and the wafer chuck 222. At the same time, the control rotating lifting assembly 25 acts on the wafer chuck 222 to make it automatically rise, contact with the mask plate, and automatically level, and then an exposure process is performed. After the exposure is completed, the shutter is closed, and the wafer chuck 222 automatically descends to a low position under the action of the rotating lifting assembly 25. The tray 221 and the wafer chuck 222 are manually pulled out, and the sample is taken away.

[0052] The lithography workbench of the present application can select and install a mask holder 231 and a wafer chuck 222 with corresponding sizes according to different mask plate sizes, and insert the mask holder 231 and the wafer chuck 222 into a vacuum tube.

[0053] Among them, the operation of the rotating lifting assembly 25 on the lithography workbench 20 can be automatically controlled by the control device 40. Of course, it can also be manually operated by an operator.

[0054] Compared with the prior art, the lithography workbench and the lithography machine of the present utility model have a simple structure and convenient operation. The setting of the horizontally push-pull type wafer carrier and the way of vacuum-adsorbing the wafer greatly improve the working efficiency.

[0055] The lithography workbench and the lithography machine of the present utility model realize the multi-degree-of-freedom movement of the wafer chuck relative to the mask holder through the setting of the two-dimensional displacement table and the rotating lifting assembly, so that the alignment accuracy and speed of the mask-wafer are greatly improved.

[0056] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0057] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A photolithography workbench, characterized in that: include: A housing having an installation space therein, and a first window on a side of the housing; A wafer support seat can be inserted into the installation space through the first window in a horizontal manner, and the wafer support seat includes a wafer table for placing the wafer; The mask frame assembly is arranged on the shell and covers the installation space. The mask frame assembly includes a mask frame for placing a mask plate. A second window is formed on the mask frame, and the second window exposes the wafer stage.

2. The photolithography workbench according to claim 1, characterized in that: The mask frame assembly also includes: A frame for carrying the mask frame, wherein the frame has a limiting portion abutting against a side surface of the mask frame; A pressing member is movably arranged on the frame and can be close to or away from the limiting portion. The pressing member cooperates with the limiting portion to achieve locking and releasing of the mask frame on the frame.

3. The photolithography workbench according to claim 1, characterized in that: The mask frame is provided with a plurality of vacuum adsorption holes.

4. The photolithography workbench according to claim 1, characterized in that: The wafer support seat also includes a support plate, which is horizontally movably plugged into the shell, and the wafer support table is arranged on the support plate and can be separated from the support plate under the action of force.

5. The photolithography workbench according to claim 4, characterized in that: Symmetrical slide rails are arranged on the inner wall of the shell and one of the support plates, and corresponding sliders are arranged on the inner wall of the shell and the other of the support plates, and the movable plug-in between the support plate and the shell is realized by the cooperation of the slider and the slide rails.

6. The photolithography workbench according to claim 4, characterized in that: The support plate has an extension portion protruding from the first window, and a slot hole for finger force application is formed on the extension portion.

7. The photolithography workbench according to claim 4, characterized in that: A third window is formed on the support plate, and the wafer carrier is arranged to cover the third window.

8. The photolithography workbench according to claim 7, characterized in that: The photolithography workbench also includes: A two-dimensional displacement stage is arranged in the installation space; A rotary lifting assembly is arranged on the two-dimensional translation stage and is located below the wafer support seat. The rotary lifting assembly can move horizontally under the action of the two-dimensional translation stage. The rotary lifting assembly includes a lifting structure and a rotating structure driving the lifting structure to rotate. The lifting structure can act on the wafer stage through the third window and drive the wafer stage to rotate under the action of the rotating structure.

9. The photolithography workbench according to claim 1, characterized in that: The sheet-carrying platform is provided with a plurality of vacuum adsorption holes.

10. A photolithography machine, characterized in that: Comprising a photolithography workbench as described in any one of claims 1-9.

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