Intelligent temperature control system of sintering furnace for efficient molecular sieve production

Abstract

The utility model discloses an intelligent temperature control system of a sintering furnace for efficient molecular sieve production, which comprises a temperature acquisition module, a master control module and an execution module, and the temperature acquisition module specifically comprises a plurality of temperature sensors distributed at different positions of the sintering furnace and a signal conditioning unit. The preprocessing unit is used for preprocessing original signals output by the temperature sensors, and the data gating unit is used for selectively transmitting data from the plurality of temperature sensors to the main control module; the signal conditioning unit is adopted to preprocess original signals output by the temperature sensor, interference factors such as high-frequency noise and temperature drift are effectively filtered out, the quality of the temperature signals transmitted to the controller is ensured, and the control precision and stability are improved. The main control module monitors the current temperature of each area in the furnace in real time, dynamic adjustment and optimization of the system are achieved through a temperature feedback mechanism, accurate control over the temperature in the sintering furnace is achieved, and powerful guarantee is provided for production of efficient molecular sieves.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, in particular to an intelligent temperature control system for a sintering furnace used in the production of high-efficiency molecular sieves. Background Technique

[0002] In the production process of molecular sieves, the sintering furnace is one of the key equipment, and the uniformity and stability of the internal temperature distribution directly affect the crystal structure, porosity and final performance of the molecular sieves. In recent years, with the rapid development of industrial automation technology, intelligent temperature control systems have gradually become the mainstream trend of sintering furnace temperature control. For example, the utility model patent with the authorization announcement number CN207702985 U discloses a sintering furnace temperature control system, which proposes a solution for sintering furnace temperature control. This system realizes the monitoring and regulation of the sintering furnace temperature by integrating temperature sensors, controllers and actuators. However, although this technical solution improves the automation level of temperature control to a certain extent, there are still the following deficiencies and limitations: First, this sintering furnace temperature control system only arranges temperature sensors at limited positions in the sintering furnace, resulting in insufficient comprehensive monitoring of the temperature distribution in the furnace. In large or complex-structured sintering furnaces, this single-point or few-point temperature measurement method is difficult to accurately reflect the true temperature situation in the furnace, thus affecting the accuracy of temperature control. Second, this technical solution may only adopt basic filtering and amplification circuits in signal conditioning, and has limited processing ability for interference factors such as high-frequency noise and temperature drift in complex industrial environments, resulting in low-quality temperature signals transmitted to the controller, affecting control accuracy and stability.

[0003] Therefore, the utility model provides a new solution to solve this problem. Content of the Utility Model

[0004] In view of the above situation, to overcome the defects of the prior art, the purpose of the utility model is to provide an intelligent temperature control system for a sintering furnace used in the production of high-efficiency molecular sieves.

[0005] The technical solution it adopts is: an intelligent temperature control system for a sintering furnace used in the production of high-efficiency molecular sieves, including a temperature acquisition module, a main control module and an execution module. The temperature acquisition module specifically includes:

[0006] A plurality of temperature sensors distributed at different positions of the sintering furnace, used for real-time measurement of temperature data in different areas of the furnace;

[0007] A signal conditioning unit, used for preprocessing the original signal output by the temperature sensor to ensure that the signal quality meets the requirements of subsequent processing; and

[0008] A data strobe unit, configured to selectively connect one of multiple input channels to an output channel according to a control signal of the main control module, so as to selectively transmit data from multiple temperature sensors to the main control module;

[0009] The main control module includes:

[0010] An A / D converter, configured to convert the temperature data output by the temperature acquisition module into a digital signal;

[0011] A DCS controller, configured to identify and analyze the digital signal, and adjust the working state of the execution module in real time according to the analysis result.

[0012] Preferably, the signal conditioning unit includes:

[0013] A high-impedance second-order filter circuit, configured to filter out high-frequency noise in the output signal of the temperature sensor and improve the signal-to-noise ratio of the signal;

[0014] An amplitude stabilization circuit, connected to the output end of the high-impedance second-order filter circuit, configured to perform amplitude stabilization processing on the signal; and

[0015] A reference shaping circuit, connected to the output end of the amplitude stabilization circuit, configured to perform reference comparison processing on the signal and adjust the signal waveform.

[0016] Preferably, the high-impedance second-order filter circuit includes an amplifier U1 and an amplifier U2. The inverting input terminal of the amplifier U1 is connected to one ends of a resistor R1 and a capacitor C1, and is connected to the output terminal of the amplifier U1 through a resistor R3. The other end of the resistor R1 is connected to the signal output terminal of the temperature sensor. The other end of the capacitor C1 is grounded through a resistor R2 and is connected to one end of a resistor R5 through a capacitor C2. The non-inverting input terminal of the amplifier U1 is connected to the adjusting terminal of a variable resistor RP1. The output terminal of the amplifier U1 is connected to one end of the variable resistor RP1. The other end of the variable resistor RP1 is connected to the non-inverting input terminal of the amplifier U2 and is grounded through a resistor R4. The inverting input terminal of the amplifier U2 is connected to the other end of the resistor R5 at the output terminal.

[0017] Preferably, the amplitude stabilization circuit includes an amplifier U3. The non-inverting input terminal of the amplifier U3 is connected to the output terminal of the amplifier U1 through a resistor R6. The inverting input terminal of the amplifier U3 is connected to one ends of a resistor R7, a resistor R8, a capacitor C3 and a bidirectional voltage regulator diode D1. The other ends of the resistor R8 and the capacitor C3 are grounded. The other ends of the resistor R7 and the bidirectional voltage regulator diode D1 are connected to the output terminal of the amplifier U3.

[0018] Preferably, the reference shaping circuit includes an amplifier U4 and a reference voltage source. The inverting input terminal of the amplifier U4 is connected to the output terminal of the amplifier U3 through a resistor R9 and grounded through a capacitor C4. The non-inverting input terminal of the amplifier U4 is connected to the reference voltage source and grounded through a resistor R10. The output terminal of the amplifier U4 is connected to the A / D converter.

[0019] Preferably, the amplifier U1, the amplifier U2, and the amplifier U3 all use LM318 operational amplifier chips; the amplifier U4 uses an LMV393 operational amplifier chip.

[0020] Preferably, the data strobe unit uses an ADG1408 analog multiplexer.

[0021] Preferably, the A / D converter uses an ADC0832 analog-to-digital conversion chip.

[0022] Preferably, the execution module includes:

[0023] A heating element, which is distributed in the sintering furnace and converts electrical energy into heat energy to increase the temperature in the furnace;

[0024] A thyristor element, which is arranged in the main power supply circuit of the heating element and is used to adjust the power output of the heating element according to the control signal of the DCS controller.

[0025] Through the above technical solutions, the beneficial effects of the present utility model are as follows:

[0026] 1. By distributing temperature sensors at multiple positions in the sintering furnace, the present application realizes the comprehensive monitoring of the temperature distribution in the furnace, and uses a signal conditioning unit to preprocess the original signals output by the temperature sensors, effectively filtering out interference factors such as high-frequency noise and temperature drift, ensuring the quality of the temperature signals transmitted to the controller, and improving the control accuracy and stability.

[0027] 2. The data strobe unit can selectively connect one of the multiple temperature sensor input channels that have been signal-conditioned to the output channel according to the control signal of the main control module. This design enables the system to flexibly select the area to be monitored, improves the efficiency and pertinence of data acquisition, and also ensures the overall control of the temperature field in the entire furnace.

[0028] 3. The main control module monitors the temperature of each area in the furnace in real time, and through the temperature feedback mechanism, realizes the dynamic adjustment and optimization of the system, realizes the precise control of the temperature in the sintering furnace, and provides a strong guarantee for the production of high-efficiency molecular sieves. Description of the Drawings

[0029] Figure 1 It is a system module structure diagram of the present utility model.

[0030] Figure 2 This is the structural block diagram of the temperature acquisition module in the present utility model.

[0031] Figure 3 This is the connection schematic diagram of the high-impedance second-order filter circuit and the amplitude stabilization circuit in the present utility model.

[0032] Figure 4 This is the schematic diagram of the reference shaping circuit in the present utility model.

[0033] Figure 5 This is the circuit schematic diagram of the execution module in the present utility model. Detailed implementation manners

[0034] Regarding the foregoing and other technical contents, features and effects of the present utility model, they will be clearly presented in the following detailed description of the embodiments in conjunction with the attached Figure 1 to attached Figure 5 In the detailed description of the embodiments below, the structural contents mentioned in the following embodiments are all with reference to the accompanying drawings of the specification.

[0035] The following will describe the exemplary embodiments of the present utility model with reference to the drawings.

[0036] As Figure 1 and Figure 2 shown, an intelligent temperature control system for a sintering furnace used in the production of high-efficiency molecular sieves includes a temperature acquisition module, a main control module, and an execution module. Among them, the temperature acquisition module specifically includes:

[0037] A plurality of temperature sensors distributed at different positions of the sintering furnace, used to measure the temperature data of different areas in the furnace in real time. Specifically, it includes the furnace top, furnace bottom, furnace wall, and key process areas to achieve comprehensive monitoring of the temperature in the furnace;

[0038] A signal conditioning unit, used to preprocess the original signal output by the temperature sensor to ensure that the signal quality meets the requirements of subsequent processing; and

[0039] A data gating unit, used to selectively connect one of the multiple input channels to the output channel according to the control signal of the main control module to achieve selective transmission of data from multiple temperature sensors to the main control module.

[0040] The main control module includes:

[0041] An A / D converter, used to convert the temperature data output by the temperature acquisition module into a digital signal;

[0042] A DCS controller, used to identify and analyze the digital signal, and adjust the working state of the execution module in real time according to the analysis result.

[0043] In the specific implementation process, in order to ensure the accuracy of temperature data measurement in the sintering furnace, a signal conditioning unit is used to preprocess the original signal output by the temperature sensor. Specifically, it includes:

[0044] A high-impedance second-order filter circuit, which is used to filter out high-frequency noise in the output signal of the temperature sensor and improve the signal-to-noise ratio of the signal;

[0045] An amplitude stabilization circuit, which is connected to the output end of the high-impedance second-order filter circuit and is used to perform stabilization processing on the amplitude of the signal; and

[0046] A reference shaping circuit, which is connected to the output end of the amplitude stabilization circuit and is used to perform reference comparison processing on the signal and adjust the signal waveform.

[0047] Since the temperature sensor is easily affected by the internal environment, power supply or electromagnetic interference in the sintering furnace system, if these interference signals are not processed, they may seriously affect the accuracy of temperature measurement. Therefore, first, a high-impedance second-order filter circuit is used to process the output signal of the temperature sensor. Specifically, as Figure 3 shown, the high-impedance second-order filter circuit includes amplifier U1 and amplifier U2. The inverting input terminal of amplifier U1 is connected to one end of resistor R1 and capacitor C1, and is connected to the output terminal of amplifier U1 through resistor R3. The other end of resistor R1 is connected to the signal output terminal of the temperature sensor. The other end of capacitor C1 is grounded through resistor R2 and is connected to one end of resistor R5 through capacitor C2. The non-inverting input terminal of amplifier U1 is connected to the adjustment terminal of adjustable resistor RP1. The output terminal of amplifier U1 is connected to one end of adjustable resistor RP1. The other end of adjustable resistor RP1 is connected to the non-inverting input terminal of amplifier U2 and is grounded through resistor R4. The inverting input terminal of amplifier U2 is connected to the other end of resistor R5.

[0048] Among them, amplifier U1 is used as the main amplifier to quickly amplify the output signal of the temperature sensor. During the signal amplification process, the second-order RC filter composed of resistor R1, capacitor C1, resistor R2, and capacitor C2 filters out the high-frequency noise in the signal. At the same time, in order to ensure the filter effect, amplifier U2 is used to continuously sample, follow and feedback the output signal of amplifier U1, and the high-impedance characteristic of amplifier U2 makes the frequency characteristic of the second-order RC filter more stable, thus realizing the effective processing and optimization of the output signal of the temperature sensor.

[0049] Since the output of the temperature sensor may be affected by factors such as temperature drift and power supply voltage fluctuation, resulting in unstable signal amplitude, therefore, the temperature measurement signal after amplification and filtering is sent to the amplitude stabilization circuit for stabilization processing. Specifically, as Figure 3As shown, the amplitude stabilization circuit includes an amplifier U3. The non-inverting input terminal of the amplifier U3 is connected to the output terminal of the amplifier U1 through a resistor R6. The inverting input terminal of the amplifier U3 is connected to one end of a resistor R7, a resistor R8, a capacitor C3, and a bidirectional voltage regulator diode D1. The other ends of the resistor R8 and the capacitor C3 are grounded. The other ends of the resistor R7 and the bidirectional voltage regulator diode D1 are connected to the output terminal of the amplifier U3.

[0050] In the amplitude stabilization circuit, the inverting input terminal of the amplifier U3 is connected to the output terminal of U3 through a resistor R7 and a bidirectional voltage regulator diode D1, forming a negative feedback loop. The bidirectional voltage regulator diode D1 plays a role in limiting the output amplitude here, ensuring that the signal maintains a constant amplitude during transmission, thereby improving the stability and accuracy of temperature measurement. At the same time, the capacitor C3 plays a role in eliminating the thermal noise of the circuit, further improving the stability of the signal.

[0051] The signal processed by the amplitude stabilization circuit is sent into the reference shaping circuit. Specifically, as Figure 4 shown, the reference shaping circuit includes an amplifier U4 and a reference voltage source. The inverting input terminal of the amplifier U4 is connected to the output terminal of the amplifier U3 through a resistor R9 and grounded through a capacitor C4. The non-inverting input terminal of the amplifier U4 is connected to the reference voltage source and grounded through a resistor R10. The output terminal of the amplifier U4 is connected to an A / D converter. Among them, the amplifier U4 acts as a comparator in the circuit, used to compare the received temperature signal with the reference voltage provided by the reference voltage source, and then adjust the waveform of the signal to ensure that the signal is not distorted during transmission and analog-to-digital conversion.

[0052] In the above, the amplifier U1, the amplifier U2, and the amplifier U3 all select the LM318 type operational amplifier chip. The high gain and low noise characteristics of this operational amplifier chip help to ensure the precise amplification and stability of the signal. The amplifier U4 selects the LMV393 type operational amplifier chip. The LMV393 is a low-power and high-precision comparator, using its high-precision and fast response characteristics to compare the input signal with the reference voltage, so as to output a shaped signal for the A / D converter to use.

[0053] The data strobe unit selectively connects one of multiple signal-conditioned temperature sensor input channels to the output channel according to the control signal from the main control module. In the specific implementation process, the ADG1408 analog multiplexer is selected for the data strobe unit. The ADG1408 provides 8 independent single-pole single-throw switches, allowing one of the 8 input channels to be selected and connected to the output channel. The ADG1408 selectively closes a switch according to the control signal provided by the main control module, connecting the selected input channel to the output channel. The main control module obtains the data sent by the selected temperature sensor by reading the output channel of the ADG1408. Through the above temperature acquisition control process, the system can flexibly select the area to be monitored, improving the efficiency and pertinence of data acquisition. At the same time, when needed, the system can quickly switch to other areas for monitoring, ensuring a comprehensive control of the temperature field inside the entire furnace.

[0054] When the temperature acquisition module completes the signal acquisition and preprocessing of each temperature sensor, it transmits the analog temperature signal to the main control module. In the specific implementation process, the ADC0832 analog-to-digital conversion chip is selected for the A / D converter. This chip has the characteristics of high precision, low power consumption and easy integration, and can convert the analog temperature signal into a digital signal with sufficient resolution. The DCS controller receives the digital temperature signal from the A / D converter, and monitors the temperature of each area inside the furnace in real time, and compares it with the preset temperature set value to judge whether the current temperature deviates from the target range.

[0055] Based on the analysis result of the temperature data, the DCS controller formulates corresponding control strategies to adjust the working state of the execution module in real time. Specifically, the execution module includes:

[0056] Heating elements, which are distributed inside the sintering furnace and convert electrical energy into heat energy to increase the temperature inside the furnace;

[0057] Thyristor elements, which are arranged in the main power supply circuit of the heating elements and are used to adjust the power output of the heating elements according to the control signal of the DCS controller.

[0058] Such as Figure 5As shown, after the thyristor components (Q1 - Qn) in the execution module receive the control signal from the DCS controller, they will adjust the power output of the heating elements (RM1 - RMn) according to the requirements of the signal. When the control signal requires an increase in power, the conduction angle of the thyristor increases, enabling the heating elements to obtain more electrical energy, thereby enhancing the heating effect; conversely, when the control signal requires a decrease in power, the conduction angle of the thyristor decreases, reducing the electrical energy input to the heating elements, thus lowering the heating effect. At the same time, the DCS controller will adjust the control strategy in real-time based on the new temperature data, and through the temperature feedback mechanism, it realizes the dynamic adjustment and optimization of the system, ensuring that the system can continuously and accurately control the temperature inside the sintering furnace.

[0059] In summary, this application realizes the comprehensive monitoring of the temperature distribution inside the furnace by distributing temperature sensors at multiple positions in the sintering furnace, and uses a signal conditioning unit to preprocess the original signals output by the temperature sensors, effectively filtering out interference factors such as high-frequency noise and temperature drift, ensuring the quality of the temperature signals transmitted to the controller, and improving the control accuracy and stability. The data gating unit can selectively connect one of the multiple temperature sensor input channels that have undergone signal conditioning to the output channel according to the control signal of the main control module. This design enables the system to flexibly select the areas to be monitored, improves the efficiency and pertinence of data acquisition, and also ensures the overall control of the temperature field inside the entire furnace. The main control module monitors the temperature of each area inside the furnace in real-time, and through the temperature feedback mechanism, it realizes the dynamic adjustment and optimization of the system, achieving precise control of the temperature inside the sintering furnace, providing a strong guarantee for the production of high-efficiency molecular sieves.

[0060] The above is a further detailed description of the present utility model in combination with specific embodiments, and it cannot be determined that the specific implementation of the present utility model is only limited to this; for those skilled in the art of the present utility model and related technical fields, based on the premise of the technical solution idea of the present utility model, the expansions, operation methods, and data replacements should all fall within the protection scope of the present utility model.

Claims

1. An intelligent temperature control system for a sintering furnace for the production of high-efficiency molecular sieves, comprising a temperature acquisition module, a main control module and an execution module, characterized in that: The temperature acquisition module specifically includes: A plurality of temperature sensors distributed at different positions of the sintering furnace are used to measure the temperature data of different areas in the furnace in real time; A signal conditioning unit, used for preprocessing the original signal output by the temperature sensor to ensure that the signal quality meets the subsequent processing requirements; and A data strobe unit, used to selectively connect one of the multiple input channels to the output channel according to the control signal of the main control module, so as to selectively transmit data from the multiple temperature sensors to the main control module; The main control module comprises: An A / D converter, used for converting the temperature data output by the temperature acquisition module into a digital signal; The DCS controller is used to identify and analyze the digital signal and adjust the working state of the execution module in real time according to the analysis result.

2. According to claim 1, an intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve, characterized in that: The signal conditioning unit comprises: High impedance second-order filter circuit, used to filter out high-frequency noise in the output signal of the temperature sensor and improve the signal-to-noise ratio; an amplitude stabilization circuit, connected to the output end of the high-impedance second-order filter circuit, and used for stabilizing the amplitude of the signal; and The reference shaping circuit is connected to the output end of the amplitude stabilization circuit and is used for performing reference comparison processing on the signal and adjusting the signal waveform.

3. According to claim 2, an intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve, characterized in that: The high-impedance second-order filter circuit includes an amplifier U1 and an amplifier U2, the inverting input end of the amplifier U1 is connected to the resistor R1 and one end of the capacitor C1, and is connected to the output end of the amplifier U1 through the resistor R3, the other end of the resistor R1 is connected to the signal output end of the temperature sensor, the other end of the capacitor C1 is grounded through the resistor R2, and is connected to one end of the resistor R5 through the capacitor C2, the non-inverting input end of the amplifier U1 is connected to the adjustment end of the adjustable resistor RP1, the output end of the amplifier U1 is connected to one end of the adjustable resistor RP1, the other end of the adjustable resistor RP1 is connected to the non-inverting input end of the amplifier U2, and is grounded through the resistor R4, and the inverting input end and the output end of the amplifier U2 are connected to the other end of the resistor R5.

4. According to claim 3, an intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve, characterized in that: The amplitude stabilization circuit includes an amplifier U3, the in-phase input terminal of the amplifier U3 is connected to the output terminal of the amplifier U1 through a resistor R6, the inverting input terminal of the amplifier U3 is connected to a resistor R7, a resistor R8, a capacitor C3 and one end of a bidirectional voltage regulator D1, the other end of the resistor R8 and the capacitor C3 is grounded, and the other end of the resistor R7 and the bidirectional voltage regulator D1 is connected to the output terminal of the amplifier U3.

5. According to claim 4, an intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve, characterized in that: The reference shaping circuit includes an amplifier U4 and a reference voltage source. The inverting input terminal of the amplifier U4 is connected to the output terminal of the amplifier U3 through a resistor R9 and is grounded through a capacitor C4. The non-inverting input terminal of the amplifier U4 is connected to the reference voltage source and is grounded through a resistor R10. The output terminal of the amplifier U4 is connected to the A / D converter.

6. An intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve according to any one of claims 3 to 5, characterized in that: The amplifier U1, the amplifier U2 and the amplifier U3 all use LM318 operational amplifier chips; the amplifier U4 uses LMV393 operational amplifier chips.

7. According to claim 1, an intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve, characterized in that: The data selection unit uses ADG1408 analog multiplexer.

8. According to claim 1, an intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve, characterized in that: The A / D converter uses ADC0832 analog-to-digital conversion chip.

9. The intelligent temperature control system for a sintering furnace for producing a high-efficiency molecular sieve according to claim 1, characterized in that: The execution module includes: Heating elements are distributed in the sintering furnace to increase the temperature in the furnace by converting electrical energy into thermal energy; The thyristor element is arranged in the main power supply circuit of the heating element and is used to adjust the power output of the heating element according to the control signal of the DCS controller.

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