Plate dismounting mechanism for resistor substrate

Abstract

The utility model provides a plate disassembling mechanism for resistor substrates, which is used for taking out the resistor substrates from a mother plate and is characterized by comprising a plate fixing device for fixing the mother plate and a material taking device for taking out a plurality of resistor substrates from the mother plate simultaneously, and the material taking device comprises a plurality of material taking claws which are arranged in parallel and are used for taking out the single resistor substrate, and a material claw driving device which is used for driving the material taking claws to integrally lift and translate. The mother board is fixed through the board fixing device, then the multiple resistor substrates are taken out of the mother board at the same time through the multiple material taking claws, and compared with an existing manual board disassembling mode, the efficiency is obviously improved, the resistor substrates cannot be damaged or conductive layers cannot be scratched, and therefore the stability of the quality of potentiometer products can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of potentiometer production equipment, in particular to a board removal mechanism for a resistor substrate. Background Art

[0002] Potentiometers are precision electronic devices with many parts, small size, and high precision requirements, which makes their production and assembly costs relatively high. How to improve production efficiency and quality and reduce product costs is the core of manufacturers' competitiveness.

[0003] Among them, the rotary potentiometer is equipped with one or more sets of resistor substrates, and the resistor substrates are connected to three conductive terminals for soldering the potentiometer to the circuit board. During the production process, the conductive layer of the resistor substrate is printed in a matrix on the surface of the insulating motherboard, and then cut and formed. When cutting, only the slots are cut out of each motherboard to keep the motherboard intact and facilitate storage and transportation. It will be separated in subsequent production to be riveted and fixed with the terminals punched and formed by the metal strip.

[0004] At present, in this production process, each resistor substrate on the motherboard is manually folded and removed, and then stacked and loaded into the feed slot of the riveting equipment, and then continuously riveted and fixed with the material strip with terminals; however, manually removing the resistor substrate from the motherboard is not only inefficient, but also easy to damage the resistor substrate or scratch the conductive layer, thus affecting the quality and stability of the potentiometer product. Therefore, it is necessary to improve this. Utility Model Content

[0005] The utility model aims to provide a board disassembly mechanism for a resistor substrate, so as to improve production efficiency and product quality stability.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A board removal mechanism for a resistor substrate, used for removing the resistor substrate from a motherboard, characterized in that it includes a board fixing device for fixing the motherboard, and a material removal device for simultaneously removing a plurality of the resistor substrates from the motherboard, the material removal device includes a plurality of material removal claws arranged in parallel for removing a single resistor substrate, and a material claw driving device for driving each of the material removal claws to rise, fall and translate as a whole.

[0008] In a preferred embodiment, the plate fixing device comprises two clamping plates arranged in parallel, a clamping gap adapted to the thickness of the mother board is formed between the two clamping plates, and both the two clamping plates have through holes for vertically taking out the resistor substrate.

[0009] In a preferred embodiment, the through holes of the clamping plate on the top surface correspond to the positions of the resistor substrate one by one.

[0010] A preferred solution is that the material taking claw includes a spreading rod with an axial groove at the lower end, a fixing block with a through hole for passing through the spreading rod, a sliding block for installing the spreading rod, and a first cylinder for pulling the sliding block to axially move the spreading rod along the through hole of the fixing block; the diameter of the through hole of the fixing block is slightly smaller than the diameter of the lower end of the spreading rod, so that the spreading rod radially bounces open when it extends out of the fixing block.

[0011] A preferred solution is that the material taking device further includes a support base arranged below the fixing plate device, and the support base includes support columns corresponding to the material taking claws, a lifting device for driving the lifting of the support columns, and a translation driving device for driving the overall translation of the support columns and the lifting device. The top end of the support column has an axial hole for avoiding the spreading rod.

[0012] A preferred solution is that the plate removing mechanism is further provided with a mother plate feeding mechanism for stepwise feeding the mother plate into the clamping gap, and the mother plate feeding mechanism includes a carrier plate table linearly butted with the fixing plate device, a plate moving device for stepwise moving the mother plate along the carrier plate table into the clamping gap, a mother plate storage device for stacking and storing the mother plates, and a plate placing device for transferring the mother plates from the mother plate storage device to the carrier plate table.

[0013] A preferred solution is that the plate moving device includes a thimble vertically inserted into a mother plate positioning block, a second cylinder for driving the lifting of the thimble, and a servo linear device for driving the overall stepwise translation of the thimble and the second cylinder.

[0014] The beneficial effect of the present utility model is that the mother plate is fixed by the fixing plate device, and then multiple resistor substrates are taken out from the mother plate by multiple material taking claws at the same time. Compared with the existing manual plate removing method, not only the efficiency is significantly improved, but also the resistor substrates will not be damaged or the conductive layer will not be scratched, thereby ensuring the stability of the potentiometer product quality. Description of the Drawings

[0015] The following further describes the present utility model in detail with reference to the drawings and specific embodiments.

[0016] Figure 1 It is a schematic diagram of the overall structure of the plate removing mechanism in the embodiment;

[0017] Figure 2 It is Figure 1 a partial structure schematic diagram of;

[0018] Figure 3 It is Figure 2 a schematic diagram of the structure of the material taking claw in;

[0019] Figure 4 It is Figure 1 a schematic diagram of the structure of the fixing plate device in;

[0020] Figure 5 For Figure 1 Schematic diagram of the structure of the middle support base Specific implementation manner

[0021] The present utility model will be further described below in conjunction with the accompanying drawings:

[0022] The embodiments described by referring to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. In addition, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense, and those of ordinary skill in the art can understand the specific meanings of the above terms in the present application according to specific circumstances.

[0023] Refer to Figures 1 to 5 As shown, a board removing mechanism for a resistor substrate in this embodiment is used to take out the resistor substrate 100 from the mother board 1. It is characterized in that: it includes a fixing plate device 2 for fixing the mother board 1, and a material taking device 3 for simultaneously taking out a plurality of the resistor substrates 100 from the mother board 1. The material taking device 3 includes a plurality of material taking claws 31 arranged in parallel for taking out a single resistor substrate 100, and a material claw driving device 32 for driving the overall lifting and translation of each material taking claw 31. During production, the mother board 1 is fixed by the fixing plate device 2, and then a plurality of resistor substrates 100 are simultaneously taken out from the mother board 1 by a plurality of material taking claws 31. Compared with the existing manual board removing method, not only is the efficiency significantly improved, but also the resistor substrate 100 will not be damaged or the conductive layer will not be scratched, thus ensuring the stability of the potentiometer product quality.

[0024] In a preferred solution, the fixing plate device 2 of this embodiment includes two clamping plates 21 arranged in parallel. A clamping gap adapted to the thickness of the mother board 1 is formed between the two clamping plates 21, and through holes 211 for vertically taking out the resistor substrate 100 are provided on both clamping plates 21. The clamping plates 21 can fix the mother board 1 to prevent the mother board 1 from deforming up and down when removing the resistor substrate 100.

[0025] In a preferred solution, the through holes 211 of the top clamping plate 21 in this embodiment correspond to the positions of the resistor substrates 100 one by one. Each through hole 211 makes the top clamping plate 21 form a grid shape, which can further strengthen the fixation of the mother board 1 and prevent the mother board 1 around each resistor substrate 100 from deforming.

[0026] A preferred solution is that the material taking claw 31 in this embodiment includes a spreading rod 311 with an axial groove at the lower end, a fixing block 312 having a through hole for passing through the spreading rod 311, a sliding block 313 for installing the spreading rod 311, and a first cylinder 314 for pulling the sliding block 313 to axially move the spreading rod 311 along the through hole of the fixing block 312; the diameter of the through hole of the fixing block 312 is slightly smaller than the diameter of the lower end of the spreading rod 311, so that the spreading rod 311 radially expands when it extends out of the fixing block 312. The material taking claw 31 inserts the spreading rod 311 into the central hole of the resistor substrate 100, and after the spreading rod 311 expands, it fixes the resistor substrate 100. When placing, the first cylinder 314 pulls the spreading rod 311 to retract into the through hole of the fixing block 312. In other embodiments, the material taking principle of the material taking claw 31 can also be realized by a variety of conventional mechanical structures. For example, the material taking claw 31 can be set as a clamping structure corresponding up and down to clamp the resistor substrate 100 up and down and then push it out from the mother board 1, and then the material taking claw 31 on one side fixes the resistor substrate 100 and moves it to the next process. The material taking claw 31 on this side can be provided with a negative pressure suction cup and other structures to fix the resistor substrate 100; those skilled in the art can also adopt other methods in the prior art to take out the resistor substrate 100 from the mother board 1 and move it to the next process according to needs, so they will not be listed one by one.

[0027] A preferred solution is that the material taking device 3 in this embodiment further includes a support seat 33 arranged below the fixing plate device 2. The support seat 33 includes a support column 331 corresponding to the material taking claw 31, a lifting device 332 for driving the support column 331 to lift, and a translation driving device 333 for driving the whole support column 331 and the lifting device 332 to translate. The top end of the support column 331 has an axial hole 3311 for avoiding the spreading rod 311. When disassembling the board, the support seat 33 provides a supporting force for the bottom surface of the resistor substrate 100, and at the same time can form a clamping force on the resistor substrate 100 with the material taking claw 31 and lift it up, which is convenient for the resistor substrate 100 to be separated from the mother board 1. The translation driving device 333 drives the support column 331 to translate to cooperate with the material taking claw 31 to sequentially take out each row of resistor substrates 100 on the mother board 1; in other embodiments, the support seat 33 can also be realized by a variety of conventional technical means in the mechanical field according to needs. For example, a fixed support plate is directly arranged on the bottom surface of the clamping plate 21 below, and the support columns 331 corresponding to each resistor substrate 100 protrude in a matrix on the support plate.

[0028] In a preferred solution, the board separating mechanism in this embodiment is further provided with a mother board feeding mechanism 4 for stepwise feeding the mother board 1 into the clamping gap. The mother board feeding mechanism 4 includes a carrier plate table 41 that is linearly butted with the fixed plate device 2, a plate moving device 42 for stepwise moving the mother board 1 along the carrier plate table 41 into the clamping gap, a storage plate device 43 for stacking and storing the mother board 1, and a plate placing device 44 for transferring the mother board 1 from the storage plate device 43 to the carrier plate table 41. During operation, the plate placing device 44 takes out the mother board 1 from the storage plate device 43 and places it on the carrier plate table 41, and then the plate moving device 42 stepwise pushes the mother board 1 along the carrier plate table 41 to the clamping gap.

[0029] In a preferred solution, the plate moving device 42 in this embodiment includes a thimble 421 that vertically inserts into the positioning block of the mother board 1, a second air cylinder 422 for driving the lifting of the thimble 421, and a servo linear device 423 for driving the overall stepwise translation of the thimble 421 and the second air cylinder 422. During operation, the second air cylinder 422 drives the thimble 421 to lift and insert into the positioning hole of the mother board 1, and then the servo linear device 423 drives it to move forward by a step distance. In other embodiments, other conventional technical solutions in the art can also be used to achieve this.

[0030] In addition, it should be understood that although this specification is described according to embodiments, not each embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A board removal mechanism for a resistor substrate, used to remove the resistor substrate from a motherboard, characterized in that: It includes a plate fixing device for fixing the motherboard, and a material taking device for simultaneously taking out a plurality of the resistor substrates from the motherboard. The material taking device includes a plurality of material taking claws arranged in parallel for taking out a single resistor substrate, and a material claw driving device for driving each of the material taking claws to rise, fall and translate as a whole.

2. A board disassembly mechanism for a resistor substrate according to claim 1, characterized in that: The plate fixing device comprises two clamping plates arranged in parallel, a clamping gap adapted to the thickness of the mother plate is formed between the two clamping plates, and both the two clamping plates have through holes for the resistor substrate to be taken out vertically.

3. A board disassembly mechanism for a resistor substrate according to claim 2, characterized in that: The through holes of the clamping plate on the top surface correspond to the positions of the resistor substrate one by one.

4. The board disassembling mechanism for a resistor substrate according to claim 2, characterized in that: The material picking claw includes a spreading rod with an axial groove at the lower end, a fixing block with a through hole for passing the spreading rod, a sliding block for installing the spreading rod, and a first cylinder for pulling the sliding block to make the spreading rod move axially along the through hole of the fixing block; the diameter of the through hole of the fixing block is slightly smaller than the diameter of the lower end of the spreading rod, so that the spreading rod bounces radially when extending out of the fixing block.

5. The board disassembling mechanism for a resistor substrate according to claim 4, characterized in that: The material picking device also includes a support seat arranged below the fixing plate device, the support seat includes a support column arranged corresponding to the material picking claw, a lifting device for driving the support column to rise and fall, and a translation drive device for driving the support column and the lifting device to translate as a whole, and the top end of the support column has an axial hole that avoids the support rod.

6. A board disassembling mechanism for a resistor substrate according to claim 2, characterized in that: The board removal mechanism is also provided with a motherboard feeding mechanism for stepping the motherboard into the clamping gap. The motherboard feeding mechanism includes a board carrier connected to the board fixing device in a straight line, a board moving device for stepping the motherboard into the clamping gap along the board carrier, a board storage device for stacking and storing the motherboards, and a board placing device for transferring the motherboard from the board storage device to the board carrier.

7. A board disassembly mechanism for a resistor substrate according to claim 6, characterized in that: The plate moving device comprises a pin inserted vertically into the motherboard positioning block, a second cylinder driving the pin to rise and fall, and a servo linear device driving the pin and the second cylinder to step and translate as a whole.

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