Hermetically sealed microswitch

Abstract

The utility model relates to an air-tight seal microswitch, which comprises a shell, a conductive column and a first insulating part, and is characterized in that the shell is hollow and is provided with an upper cover and a bottom plate; the conductive column is arranged on the bottom plate, and one end of the conductive column penetrates through the bottom plate and extends into the shell; the first insulating part is arranged between the conductive column and the bottom plate and is used for separating the conductive column from the bottom plate, and the thermal expansion coefficients of the first insulating part, the conductive column and the bottom plate are the same. And the quality of the microswitch is improved, so that the microswitch can resist high and low temperatures.

Description

Technical Field

[0001] The utility model relates to the technical field of switches, in particular to a hermetically sealed microswitch. Background Art

[0002] A microswitch is a contact mechanism with a small contact interval and a quick-acting mechanism, which performs switch actions with a specified stroke and a specified force, and is covered with a housing and has a transmission element on the outside. Because the contact spacing of its switch is relatively small, it is named a microswitch. As a high-precision and high-reliability switch device, microswitches have been widely used in many fields such as aviation, automobiles, household appliances, and industrial control.

[0003] Existing microswitches usually adopt a metal housing and are provided with conductive posts penetrating into the housing. Due to the influence of the conductivity of the conductive posts, in order to ensure the insulation of the housing, an insulating member is provided between the conductive post and the housing. Existing insulating members are usually made of insulating materials such as plastics. At high and low temperatures, they are prone to thermal expansion and contraction, resulting in shell detachment and affecting the quality of the microswitch. Summary of the Utility Model

[0004] In view of this, the purpose of the present utility model is to provide a hermetically sealed microswitch to solve the technical problem in the prior art that at high and low temperatures, it is prone to thermal expansion and contraction, resulting in shell detachment and affecting the quality of the microswitch.

[0005] The present utility model provides a hermetically sealed microswitch, including:

[0006] A housing, which is hollow and provided with an upper cover and a bottom plate;

[0007] A conductive post, which is arranged on the bottom plate and has one end passing through the bottom plate and extending into the housing;

[0008] A first insulating member, which is arranged between the conductive post and the bottom plate and is used to separate the conductive post and the bottom plate. The first insulating member, the conductive post and the bottom plate have the same coefficient of thermal expansion.

[0009] Optionally, the first insulating member is set to be glass sintered, and the bottom plate and the conductive post are made of kovar.

[0010] Optionally, it further includes a push-button type pressing mechanism, which is arranged on the upper cover. The conductive post includes a first conductive post, a second conductive post and a third conductive post. An upper contact piece is connected to the first conductive post, a static contact is connected to the second conductive post, and a movable contact is arranged on the third conductive post. The movable contact is located between the upper contact piece and the static contact. The push-button type pressing mechanism is used to drive the movable contact to contact the upper contact piece and the static contact.

[0011] Optionally, both the static contact and the upper contact piece are composed of a silver layer and a copper layer, and the silver layer is arranged towards the direction of the moving contact.

[0012] Optionally, a gold layer is covered on the outer surface of the silver layer.

[0013] Optionally, the push-button type pressing mechanism includes a connecting rod arranged on the upper cover. One end of the connecting rod extending out of the housing is connected with a lever. A gap for the lever to move is left between the lever and the upper cover. A swing rod is arranged at one end of the connecting rod located inside the housing. The connecting rod is connected with the upper cover through an elastic diaphragm. When the lever is pressed, the swing rod swings in the same direction as the lever, thereby driving the moving contact to move.

[0014] Optionally, an arc spring piece structure is connected to the third conductive post, and the moving contact is arranged on the arc spring piece structure. When the lever is pressed, the swing of the swing rod deforms the arc spring piece structure, thereby pushing the moving contact to move until it contacts the static contact.

[0015] Optionally, it further includes an air extraction pipe. The air extraction pipe is arranged on the bottom plate and one end extends into the housing, and is adapted to input inert gas into the housing.

[0016] Optionally, it further includes at least two round tube sleeves. The round tube sleeves are arranged on the side wall of the housing and penetrate through the side wall of the housing, and the round tube sleeves are brazed with the side wall of the housing.

[0017] Optionally, a second insulating part is arranged in the housing at the position of the round tube sleeve. The second insulating part is arranged between the round tube sleeve and the conductive post to separate the round tube sleeve and the conductive post.

[0018] The technical solution of the present utility model has the following advantages:

[0019] For the hermetically sealed microswitch provided by the present utility model, a first insulating part is arranged between the conductive post and the bottom plate, and the first insulating part, the conductive post and the bottom plate have the same coefficient of thermal expansion. Therefore, when the microswitch is in high and low temperature conditions, thermal expansion and contraction will not occur between the first insulating part, the conductive post and the bottom plate, resulting in shelling, improving the quality of the microswitch and enabling the microswitch to be more resistant to high and low temperatures. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0021] Figure 1 This is a schematic diagram of the overall structure of the hermetically sealed microswitch of the present utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the hermetically sealed microswitch of the present utility model.

[0023] Explanation of reference numerals:

[0024] 1. Outer shell; 2. Upper cover; 3. Bottom plate; 4. Exhaust pipe; 5. First insulating member; 6. Push-button type pressing mechanism; 61. Connecting rod; 62. Elastic diaphragm; 63. Lever; 64. Swing rod; 65. Button; 66. Third insulating member; 7. First conductive column; 8. Second conductive column; 9. Third conductive column; 10. Circular tube sleeve; 11. Second insulating member; 12. Moving contact; 13. Static contact; 131. Copper layer; 132. Silver layer; 14. Bow spring structure; 141. Support seat; 142. Driving piece; 143. Bent spring piece; 144. Moving contact piece. Specific embodiments

[0025] Next, specific embodiments of the present utility model will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the description of the present utility model without creative efforts shall fall within the scope of protection of the present utility model.

[0026] Embodiment

[0027] Referring to Figure 1 and Figure 2 As shown, the present utility model provides a hermetically sealed microswitch, including an outer shell 1, a conductive column, and a first insulating member 5. The outer shell 1 is hollow, and an upper cover 2 is provided at the top of the outer shell 1, and a bottom plate 3 is provided at the bottom of the outer shell 1. The upper cover 2 is welded and sealed to the top of the outer shell 1, and the bottom plate 3 is welded and sealed to the bottom of the outer shell 1. The upper cover 2, the outer shell 1, and the bottom plate 3 enclose a cavity for accommodating the internal structure of the microswitch. The conductive column is provided on the bottom plate 3 and is vertically arranged. The bottom plate 3 is provided with an opening at the position of the conductive column. One end of the conductive column passes through the opening in the bottom plate 3 and extends into the outer shell 1. The first insulating member 5 is also provided in the opening and is arranged in a cylindrical shape. The first insulating member 5 is provided between the conductive column and the bottom plate 3. The conductive column penetrates into the first insulating member 5 and abuts and is fixed to the first insulating member 5. The first insulating member 5 abuts and is fixed to the inner wall of the bottom plate 3 at the opening. The first insulating member 5 separates the conductive column and the bottom plate 3, and the first insulating member 5, the conductive column, and the bottom plate 3 have the same coefficient of thermal expansion.

[0028] A first insulating member 5 is provided between the conductive post and the bottom plate 3, and the first insulating member 5, the conductive post and the bottom plate 3 have the same coefficient of thermal expansion. Thus, when the microswitch is under high and low temperatures, there will be no shelling caused by thermal expansion and contraction between the first insulating member 5, the conductive post and the bottom plate 3, improving the quality of the microswitch and enabling the microswitch to be more resistant to high and low temperatures.

[0029] Specifically, in this embodiment, the first insulating member 5 is set as glass sintering, the bottom plate 3 and the conductive post are made of kovar, and the coefficients of thermal expansion of glass sintering and kovar are the same. For the first insulating member 5, in other embodiments, other insulating materials can also be used as long as they can ensure the same coefficient of thermal expansion as the bottom plate 3 and the conductive post and have insulating properties. For the conductive post, in this embodiment, there are three conductive posts, namely the first conductive post 7, the second conductive post 8 and the third conductive post 9. One end of the first conductive post 7 located inside the housing 1 is connected with an upper contact piece. One end of the upper contact piece is fixedly connected to the first conductive post 7, and the other end extends towards the second conductive post 8 until it is above the second conductive post 8 and there is a gap between it and the second conductive post 8. One end of the second conductive post 8 located inside the housing 1 is connected with a static contact 13, and the static contact 13 is spot-welded to the second conductive post 8. The third conductive post 9 is provided with a movable moving contact 12, and the moving contact 12 is located between the upper contact piece and the static contact 13.

[0030] As a specific implementation manner, both the static contact 13 and the upper contact piece are composed of a silver layer 132 and a copper layer 131, and the silver layer 132 is arranged towards the direction of the moving contact 12. Specifically, the static contact 13 includes the silver layer 132 and the copper layer 131, the silver layer 132 is arranged on the upper surface of the copper layer 131, and both the silver layer 132 and the copper layer 131 are spot-welded to the second conductive post 8, which not only ensures the conduction efficiency but also saves costs. In addition, a gold layer (not shown in the figure) is plated on the outer surface of the silver layer 132, thereby improving the overall durability and contact performance of the microswitch.

[0031] In order to make the moving contact 12 movable, a bow spring structure 14 is connected to the third conductive post 9. The bow spring structure 14 includes a support base 141. A transmission piece 142 is provided on the support base 141. The support base 141 extends towards the second conductive post 8 to form a first end, and a bent spring piece 143 is arranged on the first end. A moving contact piece 144 is arranged between the bent spring piece 143 and the transmission piece 142. One end of the moving contact piece 144 extends towards the second conductive post 8 and the moving contact 12 is located at one end of the moving contact piece 144 facing the second conductive post 8, so that the moving contact 12 is located between the static contact 13 and the upper contact piece.

[0032] In order to enable the moving contact 12 to move and contact the upper contact piece and the stationary contact 13, so as to realize the start and closing of the microswitch, the microswitch further includes a push-piece pressing mechanism 6. The push-piece pressing mechanism 6 is arranged on the upper cover 2 and is used to drive the moving contact 12 to contact the upper contact piece and the stationary contact 13.

[0033] Specifically, the push-piece pressing mechanism 6 includes a connecting rod 61 connected to the upper cover 2. The connecting rod 61 is vertically arranged and penetrates through the upper cover 2. The connecting rod 61 is connected to the upper cover 2 through an elastic diaphragm 62. One end of the connecting rod 61 extends out of the housing 1, and the other end extends into the housing 1. A lever 63 is connected to the end of the connecting rod 61 extending out of the housing 1. The lever 63 is horizontally arranged, and a button 65 is connected to the end of the lever 63 facing away from the connecting rod 61. A gap for the lever 63 to move is left between the lever 63 and the upper cover 2. When the button 65 is pressed, the button 65 will cause the lever 63 at the button 65 to move downward, so that the swing rod 64 swings in the same direction as the lever 63, causing the end of the swing rod 64 facing away from the connecting rod 61 to move downward, pushing the bow spring piece structure 14 to deform, and further pushing the moving contact 12 to move until it contacts the stationary contact 13. In addition, a third insulating member 66 is provided at the connection between the swing rod 64 and the moving contact 12. The swing rod 64 contacts the bow spring piece structure 14 through the third insulating member 66 to drive the moving contact 12 to move, so as to insulate the push-piece pressing mechanism 6 from the conductive column.

[0034] Specifically, a hole is provided on the upper cover 2. The elastic diaphragm 62 is a bowl-shaped iron diaphragm. During installation, first place the elastic diaphragm 62 in the hole of the upper cover 2, and connect and seal the elastic diaphragm 62 and the upper cover 2 by soldering. During use, first press the button 65, and the button 65 will drive the end of the lever 63 facing away from the connecting rod 61 to move downward, that is, toward the upper cover 2, so that the elastic diaphragm 62 deforms, and then drives the end of the swing rod 64 facing away from the connecting rod 61 to move downward, that is, away from the upper cover 2, until the third insulating member 66 contacts the upper surface of the transmission piece 142, and then pushes the moving contact piece 144 and the moving contact 12 to move to contact the stationary contact 13.

[0035] As another implementation manner, an air extraction pipe 4 is further included. The air extraction pipe 4 is arranged on the bottom plate 3 and one end extends into the housing 1, and is adapted to input inert gas into the housing 1 to achieve airtightness. At the same time, after the air extraction pipe 4 passes the inert gas into the cavity inside the housing 1, the end of the air extraction pipe 4 outside the housing 1 is sealed.

[0036] As another implementation, it further includes two circular tube sleeves 10. The two circular tube sleeves 10 are horizontally arranged and are located between the first conductive column 7 and the third conductive column 9. The circular tube sleeves 10 are arranged on the side wall of the housing 1 and pass through the side wall of the housing 1. The circular tube sleeves 10 are welded to the side wall of the housing 1, which can not only realize the installation of the microswitch through the circular tube sleeves 10, but also play a role in increasing the structural strength of the microswitch.

[0037] A second insulating member 11 is arranged at the position of the circular tube sleeve 10 inside the housing 1. The second insulating member 11 is made of insulating material. The second insulating member 11 is arranged between the circular tube sleeve 10 and the conductive column to separate the circular tube sleeve 10 and the conductive column to avoid contact. One end of the second insulating member 11 is located between the first circular tube sleeve 10 and the first conductive column 7 and starts to extend from between the two, extends around the first circular tube sleeve 10 to wrap the first circular tube sleeve 10 and extends in the direction of the second circular tube sleeve 10. When it extends to the second circular tube sleeve 10, it bypasses the second circular tube sleeve 10 until it extends between the second circular tube sleeve 10 and the third conductive column 9 to wrap the second circular tube sleeve 10.

[0038] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A hermetic micro switch, characterized in that: include: A shell, wherein the shell is hollow and is provided with an upper cover and a bottom plate; A conductive column, which is disposed on the bottom plate and has one end extending through the bottom plate into the housing; The first insulating member is disposed between the conductive column and the bottom plate to separate the conductive column from the bottom plate. The first insulating member, the conductive column and the bottom plate have the same thermal expansion coefficient.

2. The hermetic micro switch according to claim 1, characterized in that: The first insulating member is configured to be glass sintered, and the bottom plate and the conductive column are made of Kovar.

3. The hermetic micro switch according to claim 1, characterized in that: It also includes a pressing sheet type pressing mechanism, which is arranged on the upper cover, and the conductive column includes a first conductive column, a second conductive column and a third conductive column, wherein the first conductive column is connected to an upper contact sheet, the second conductive column is connected to a static contact, and the third conductive column is provided with a movable moving contact, the moving contact is located between the upper contact sheet and the static contact, and the pressing sheet type pressing mechanism is used to drive the moving contact to contact the upper contact sheet and the static contact.

4. The hermetic micro switch according to claim 3, characterized in that: The static contact and the upper contact sheet are both composed of a silver layer and a copper layer, and the silver layer is arranged toward the moving contact.

5. The hermetic micro switch according to claim 4, characterized in that: A gold layer is arranged on the surface of the silver layer.

6. The hermetic micro switch according to claim 3, characterized in that: The push-piece pressing mechanism includes a connecting rod arranged on the upper cover, a lever is connected to the end of the connecting rod extending out of the outer shell, a gap is left between the lever and the upper cover for the lever to move, a rocker is arranged at one end of the connecting rod located in the outer shell, the connecting rod is connected to the upper cover through an elastic diaphragm, and when the lever is pressed, the rocker swings in the same direction as the lever, thereby driving the moving contact to move.

7. The hermetic micro switch according to claim 6, characterized in that: The third conductive column is connected to a bow spring structure, and the moving contact is arranged on the bow spring structure. When the lever is pressed, the swing rod swings to deform the bow spring structure, thereby pushing the moving contact to move until it contacts the static contact.

8. The hermetic micro switch according to claim 1, characterized in that: It also includes an exhaust pipe, which is arranged on the bottom plate and has one end extending into the shell, and is suitable for inputting inert gas into the shell.

9. The hermetic micro switch according to any one of claims 1 to 8, characterized in that: It also includes at least two round tube sleeves, which are arranged on the side wall of the shell and pass through the side wall of the shell, and the round tube sleeves and the side wall of the shell are welded.

10. The hermetic micro switch according to claim 9, characterized in that: A second insulating member is arranged in the shell at the position of the circular tube sleeve. The second insulating member is arranged between the circular tube sleeve and the conductive column to separate the circular tube sleeve from the conductive column.

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