Microwave plasma processing device and machine cover thereof

Abstract

The utility model provides a microwave plasma processing device and a machine cover thereof. The machine cover is used for being matched with a reaction cavity shell of the microwave plasma processing device in a covering mode. The machine cover comprises a cover body and at least two microwave sources which are distributed at intervals. The cover body comprises a top plate and side plates, and the top plate and the side plates are connected to define a containing cavity. The microwave source is located in the containing cavity and movably installed on the cover body, and the side, away from the top plate, of the microwave source is connected with a feed component used for outputting microwaves. According to the microwave plasma processing device provided by the utility model, the microwave source is directly integrated on the cover body of the machine cover, so that the microwave transmission path is shortened, the use of waveguide devices is reduced, the microwave transmission loss can be effectively reduced, the structure of the microwave plasma processing device is more compact, and the occupied space is reduced; and secondly, at least two microwave sources are arranged and can move in the accommodating cavity respectively, so that the flexibility of the microwave plasma processing device is improved.

Description

Technical Field

[0001] The present utility model generally relates to the technical field of semiconductor device manufacturing, and more specifically relates to a microwave plasma processing device. The present utility model also relates to a cover of a microwave plasma processing device. Background Art

[0002] The microwave plasma technology is a technology that uses microwave electromagnetic fields to excite gases to generate plasma. In the plasma state, free electrons and ions in the gas are highly activated, with high energy and activity. This technology is widely used in plasma processing (deposition, etching, cleaning, etc.), plasma diagnostics, material surface modification and other fields. Existing microwave plasma processing devices have problems such as unstable signals, large microwave transmission losses, large occupied space, and poor flexibility.

[0003] Therefore, it is necessary to provide a microwave plasma processing device and its cover to at least partially solve the above problems. Summary of the Utility Model

[0004] A series of simplified concepts are introduced in the Summary of the Utility Model section, which will be further described in detail in the Detailed Implementation section. The Summary of the Utility Model section of the present utility model does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0005] To at least partially solve the above problems, a first aspect of the present utility model provides a cover of a microwave plasma processing device for cover matching with a reaction chamber housing of the microwave plasma processing device. The cover includes:

[0006] A cover body, the cover body includes a top plate and side plates, and an accommodation cavity is formed by connecting and enclosing the top plate and the side plates; and

[0007] A microwave source, the microwave source is located in the accommodation cavity and is movably mounted to the cover body. A feeding member is connected to the side of the microwave source facing away from the top plate for outputting microwaves;

[0008] Wherein, at least two of the microwave sources are spaced apart.

[0009] Optionally, a telescopic device is provided in the accommodation cavity, and the telescopic device is connected to the top plate and / or the side plates;

[0010] The telescopic device is used to connect to the microwave source so that the microwave source can move between a first position close to the top plate and a second position away from the top plate along the thickness direction of the top plate.

[0011] Optionally, a moving component is provided in the accommodating cavity. The moving component includes a sliding rail and a sliding member that match each other. The sliding rail is fixedly provided on the inner surface of the top plate, and the sliding member is connected to the microwave source;

[0012] The sliding member moves along the sliding rail so that the microwave source moves along the sliding rail parallel to the top plate.

[0013] Optionally, the moving component further includes a telescopic member. The telescopic member is connected to the sliding member and is used to connect to the microwave source so that the microwave source can move between a third position close to the top plate and a fourth position away from the top plate in the thickness direction of the top plate.

[0014] Optionally, the machine cover further includes a sealing member. The sealing member is provided on the bottom surface of the side plate and is used for sealing connection to the reaction chamber housing of the microwave plasma processing device.

[0015] Optionally, the machine cover includes a plurality of the microwave sources, and the plurality of microwave sources are distributed in a rectangular array or a circular array.

[0016] The microwave plasma processing device according to the second aspect of the present invention includes:

[0017] A reaction chamber housing; and

[0018] The machine cover of the microwave plasma processing device according to the first aspect of the present invention, and the machine cover is connectably covered to the reaction chamber housing.

[0019] Optionally, the microwave plasma processing device further includes:

[0020] A microwave power supply for supplying electric energy to the microwave plasma processing device; and / or

[0021] A cooling device provided on the machine cover and / or the reaction chamber housing.

[0022] Optionally, the microwave plasma processing device further includes a dielectric plate located on the side of the microwave source facing away from the top plate;

[0023] Wherein, the dielectric plate is hermetically connected to the reaction chamber housing and forms a plasma reaction chamber with the reaction chamber housing; or the dielectric plate is hermetically connected to the machine cover, and when the machine cover is hermetically connected to the reaction chamber housing, the dielectric plate, the machine cover and the reaction chamber housing form a plasma reaction chamber.

[0024] Optionally, the microwave plasma processing device further includes:

[0025] A gas delivery device, comprising an intake passage and an outlet passage, the intake passage and the outlet passage are respectively communicated with the plasma reaction chamber; and / or

[0026] A vacuum pumping device, the vacuum pumping device is communicated with the plasma reaction chamber.

[0027] The present utility model provides a microwave plasma processing device and a machine cover thereof. The machine cover is used for covering and cooperating with the reaction chamber housing of the microwave plasma processing device. The machine cover includes a cover body and a microwave source. The microwave source includes at least two spaced apart. The cover body includes a top plate and a side plate. The top plate and the side plate are connected and enclosed to form a receiving cavity. The microwave source is located in the receiving cavity and is movably mounted to the cover body. A feeding member is connected to the side of the microwave source facing away from the top plate for outputting microwaves. By directly integrating and arranging the microwave source on the cover body of the machine cover, the microwave transmission path is shortened, the use of waveguide devices is reduced, the microwave transmission loss can be effectively reduced, the structure of the microwave plasma processing device is more compact, the space occupation is reduced, and the cost is lowered; secondly, the number of microwave sources is at least two, and they can move in the receiving cavity respectively, improving the flexibility of the microwave plasma processing device. Description of the Drawings

[0028] The following drawings of the embodiments of the present utility model are used as a part of the present utility model to understand the present utility model. The embodiments and descriptions of the present utility model are shown in the drawings to explain the principles of the present utility model. In the drawings,

[0029] Figure 1 FIG. 16 is a schematic three-dimensional structure diagram of a microwave plasma processing device according to a preferred embodiment of the present utility model, in which the machine cover is shown;

[0030] Figure 2 is Figure 1 A schematic three-dimensional structure diagram of the machine cover of the microwave plasma processing device in FIG. 16;

[0031] Figure 3 is Figure 2 A schematic bottom view structure diagram of the machine cover in FIG. 16;

[0032] Figure 4 is Figure 1 Another schematic three-dimensional structure diagram of the machine cover of the microwave plasma processing device in FIG. 16, in which the moving assembly is shown;

[0033] Figure 5 is Figure 4 A schematic cross-sectional structure diagram of the machine cover in FIG. 16, in which only a single microwave source is shown; and

[0034] Figure 6A cross-sectional structural schematic diagram of a microwave plasma processing device according to a preferred embodiment of the present utility model.

[0035] Description of reference numerals:

[0036] 100: Microwave plasma processing device 110: Machine cover

[0037] 111: Top plate 112: Side plate

[0038] 113: Accommodation cavity 114: Microwave source

[0039] 114a: Body 114b: Feeding member

[0040] 120: Reaction chamber housing 121: Plasma reaction chamber

[0041] 122: Inlet 123: Outlet

[0042] 124: Connection port 130: Dielectric plate

[0043] 131: Support block 140: Telescopic device

[0044] 150: Moving assembly 151: Slide rail

[0045] 152: Sliding member 153: Telescopic member

[0046] 160: Sealing member D: Thickness direction Detailed implementation manners

[0047] In the following description, a large number of specific details are given to provide a more thorough understanding of the present utility model. However, it is obvious to those skilled in the art that the embodiments of the present utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the embodiments of the present utility model, some well-known technical features in the art are not described.

[0048] In order to thoroughly understand the embodiments of the present utility model, detailed structures will be presented in the following description. Obviously, the implementation of the embodiments of the present utility model is not limited to the specific details familiar to those skilled in the art. The preferred embodiments of the present utility model are described in detail as follows. However, in addition to these detailed descriptions, the present utility model can also have other embodiments and should not be construed as limited to the embodiments presented here.

[0049] It should be understood that the purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present utility model. The singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. When the terms "comprising" and / or "including" are used in this specification, they specify the presence of the described features, wholes, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations. The terms "upper", "lower", "front", "rear", "left", "right" and similar expressions used in the present utility model are for illustrative purposes only and are not limiting.

[0050] The ordinal numbers such as "first" and "second" cited in the present utility model are merely identifiers and do not have any other meanings, such as a specific order, etc. Moreover, for example, the term "first component" itself does not imply the existence of a "second component", and the term "second component" itself does not imply the existence of a "first component".

[0051] In this article, "equal", "same", etc. are not strict mathematical and / or geometric limitations, and also include the allowable errors that can be understood by those skilled in the art and are allowed in manufacturing or using, etc.

[0052] Unless otherwise specified, the numerical ranges herein include not only the entire range within its two endpoints, but also several sub-ranges contained therein.

[0053] Hereinafter, the specific embodiments of the present utility model will be described in more detail with reference to the accompanying drawings, which show representative embodiments of the present utility model and do not limit the present utility model.

[0054] The present utility model provides a microwave plasma processing device 100. The microwave plasma processing device 100 includes a machine cover 110 and a reaction chamber housing 120. The machine cover 110 can be covered and mated with the reaction chamber housing 120 of the microwave plasma processing device 100. Generally, the machine cover 110 and the reaction chamber housing 120 form a plasma reaction chamber 121.

[0055] The machine cover 110 of the microwave plasma processing device 100 according to the present utility model includes a cover body and a microwave source 114, and the number of microwave sources 114 is at least two. The cover body includes a top plate 111 and a side plate 112. The top plate 111 and the side plate 112 are connected and enclosed to form an accommodation cavity 113, and the microwave source 114 is located in the accommodation cavity 113. Among them, the microwave source 114 can move relative to the top plate 111. Thus, the number and position of the microwave source 114 can be adjusted according to actual usage requirements.

[0056] Specifically, the microwave source 114 generally includes a main body 114a and a feeding member 114b connected to each other. When the microwave source 114 moves relative to the top plate 111, the main body 114a and the feeding member 114b move synchronously. The feeding member 114b can be a feeding antenna or a waveguide for outputting microwaves. The feeding member 114b is located on the side of the main body 114a away from the top plate 111. In other words, the feeding member 114b extends toward the direction of the plasma reaction chamber 121 (see Figure 1 , Figure 5 and Figure 6 ). Adjusting the position of the microwave source 114 mainly involves adjusting the position of the feeding member 114 b relative to the plasma reaction chamber 121 .

[0057] First combine Figures 1 to 6 The illustrated embodiment describes the specific structure of a cover 110 of a microwave plasma processing device 100 of the present invention.

[0058] See also Figure 1 In the embodiment shown, the cover body of the machine cover 110 is square, and correspondingly, the reaction chamber housing 120 is also square. The cover body of the machine cover 110 can also be round.

[0059] The main body 114a of the microwave source 114 is connected to the top plate 111, and the feeding member 114b is located on the side away from the top plate 111 for outputting microwaves. The feeding member 114b is selected as a coaxial antenna. The microwave source 114 in the following text refers to the part of the main body 114a.

[0060] The microwave sources 114 include four, and the four microwave sources 114 are distributed in a rectangular array. In other embodiments not shown in the present invention, the number of microwave sources 114 can be selected to be 3, 5, 6, 7, or 8, and can also be flexibly adjusted according to actual needs.

[0061] The microwave sources 114 in the accommodating cavity 113 may also be distributed in a circular array. It is understood that the use of multiple microwave sources 114 distributed in an array can realize the input of higher-power microwaves into the plasma reaction cavity 121 through multiple coaxial antennas to ensure the excitation of a larger area of ​​plasma, and can also improve the uniformity of microwave output, thereby improving the overall performance of the microwave plasma processing device 100.

[0062] A telescopic device 140 may be provided in the accommodating cavity 113. The telescopic device 140 may be installed on at least one of the top plate 111 and the side plate 112. The telescopic device 140 is used to connect to the microwave source 114, and the microwave source 114 may be moved along the thickness direction D (see FIG. 1 ) of the top plate 111 through the telescopic device 140. Figure 2)It moves between a first position close to the top plate 111 and a second position far from the top plate 111. It can be understood that the "first position" and "second position" represent the movable range of this microwave source 114 in the thickness direction D. Exemplarily, referring to Figure 2 and Figure 3 , the telescopic device 140 can be set to the top plate 111. Thus, the distance between the coaxial antenna and the plasma reaction chamber 121 can be adjusted to achieve the tuning effect and ensure the efficient utilization of microwave energy.

[0063] Exemplarily, the telescopic device 140 can include a motor. The motor can be fixed on the top plate 111, and the output end of the motor can be connected to the microwave source 114. There are various ways to realize the function of the telescopic device 140, and those skilled in the art can flexibly select according to actual needs. For example, a cylinder can also be selected as the telescopic device 140. Further, in order to improve the stability of the movement of the microwave source 114, the telescopic device 140 can further include a guiding structure, such as a sleeve or a slide rail.

[0064] Referring to Figure 4 the shown embodiment, taking a single microwave source 114 as an example for illustration, a moving component 150 is arranged in the accommodation cavity 113. The moving component 150 includes a matching slide rail 151 and a sliding member 152. The slide rail 151 is fixedly arranged on the inner surface of the top plate 111, and the sliding member 152 is connected to the microwave source 114. The sliding member 152 moves along the slide rail 151 so that the microwave source 114 can move parallel to the top plate 111 along the slide rail 151. Specifically, the sliding member 152 can be a slider or a pulley. Figure 4 In

[0065] Referring to Figure 5 , in the illustrated embodiment, the slide rail 151 is set as a straight track, and two microwave sources 114 are arranged on each straight track. It should be noted that in other embodiments not shown in the present invention, the slide rail 151 can also be a broken line track, a curved track or multiple tracks distributed crosswise, so as to better adjust the position of the microwave source 114.

[0066] Furthermore, the moving component 150 further includes a telescopic member 153. The telescopic member 153 is connected to the sliding member 152 and is used to connect to the microwave source 114, so that the microwave source 114 can move between a third position close to the top plate 111 and a fourth position far from the top plate 111 in the thickness direction D of the top plate 111. Similarly, the third position and the fourth position represent the movable range of the microwave source 114. Thus, the microwave source 114 can not only move along the slide rail 151 in the plane parallel to the top plate 111, but also move in the direction perpendicular to the top plate 111.

[0067] It can be understood that the moving component 150 according to the present utility model may further include a rotating device (not shown) for rotationally adjusting the position of the microwave source 114.

[0068] Furthermore, the machine cover 110 may further include a driving device (not shown). The driving device is connected to the moving component 150 and is used to control and adjust the position movement of the microwave source 114 within the accommodation cavity 113. Exemplarily, the driving device may be connected to the slider and drive the slider to move along the slide rail. The driving device in this embodiment may be a motor or a cylinder. Those skilled in the art know that the driving device may be electrically connected to the processor of the host computer, so that the movement of the microwave source 114 can be flexibly controlled and adjusted according to actual needs.

[0069] Optionally, the machine cover 110 further includes a seal 160. The seal 160 is disposed on the bottom surface of the side plate 112 and is used for sealing connection to the reaction chamber housing 120 of the microwave plasma processing device 100. A groove structure for installing the seal 160 may also be provided on the bottom surface of the side plate 112.

[0070] See Figure 1 and Figure 6 , the microwave plasma processing device 100 according to the present utility model includes a reaction chamber housing 120, a machine cover 110, and a dielectric plate 130. Among them, the machine cover 110 is detachably connected to the reaction chamber housing 120.

[0071] The dielectric plate 130 is hermetically installed on the reaction chamber housing 120 and forms a plasma reaction chamber 121 with the reaction chamber housing 120. Figure 6 In, support blocks 131 for supporting and installing the dielectric plate 130 are provided on the inner wall of the reaction chamber housing 120.

[0072] Specifically, the material of the dielectric plate 130 may be made of materials such as quartz, ceramic, SiC, etc.

[0073] Figure 1 and Figure 6 In, the reaction chamber housing 120 is of an integral structure, which includes a bottom and a side wall portion. The bottom and the side wall portion are hermetically connected to form a housing structure with an inner cavity. In other embodiments not shown in the present utility model, the reaction chamber housing 120 may also adopt a split structure, and the side wall portion and the bottom may be separable. In this embodiment, separating the side wall portion and the bottom can better place items into and take items out of the inner cavity of the reaction chamber housing.

[0074] In other embodiments not shown in the present utility model, the dielectric plate may also be hermetically installed on the machine cover. Specifically, the dielectric plate may be hermetically connected to the side plate of the machine cover. It can be understood that at this time, the plasma reaction chamber is jointly enclosed by the reaction chamber housing, the machine cover (referring to a part of the side plate), and the dielectric plate.

[0075] Optionally, the microwave plasma processing apparatus 100 further includes a microwave power supply (not shown), which is used to supply electrical energy to the microwave plasma processing apparatus. The microwave power supply can be installed outside the machine cover 110 or inside the accommodation cavity 113 of the machine cover 110.

[0076] In order to dissipate heat and cool the accommodation cavity 113 and the plasma reaction chamber 121, the microwave plasma processing apparatus 100 may further include a cooling device (not shown). The cooling device can be disposed on at least one of the machine cover 110 and the reaction chamber housing 120.

[0077] Furthermore, the microwave plasma processing apparatus 100 may further include a gas delivery device and a vacuum pumping device. Specifically, the gas delivery device at least includes an intake channel and an outlet channel, and the intake channel and the outlet channel are respectively connected to the plasma reaction chamber 121. The vacuum pumping device is connected to the plasma reaction chamber 121 for pumping out the gas in the plasma reaction chamber 121.

[0078] See Figure 6 , an inlet 122 and an outlet 123 for connecting the gas delivery device are provided on the reaction chamber housing 120. A connection port 124 for connecting the vacuum pumping device is also provided on the reaction chamber housing 120.

[0079] Specifically, the microwave plasma processing apparatus 100 may be a microwave plasma cleaner, a microwave plasma etching device, etc.

[0080] Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the technical field of the present invention. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Terms such as "disposed" as used herein may mean that one component is directly attached to another component or that one component is attached to another component through an intermediate member. The features described in one embodiment herein can be applied to another embodiment alone or in combination with other features, unless the feature is not applicable or otherwise stated in that other embodiment.

[0081] The present invention has been described by the above embodiments, but it should be understood that the above embodiments are only for the purpose of illustration and example, and are not intended to limit the present invention within the scope of the described embodiments. Those skilled in the art can understand that more variations and modifications can be made according to the teachings of the present invention, and these variations and modifications all fall within the scope of protection required by the present invention.

Claims

1. A cover of a microwave plasma processing device, used to cooperate with a reaction chamber housing of the microwave plasma processing device, characterized in that: The cover comprises: A cover body, the cover body comprising a top plate and side plates, the top plate and the side plates are connected and enclosed to form a receiving cavity; and A microwave source, the microwave source is located in the accommodating cavity and is movably mounted to the cover body, and a feeding member is connected to a side of the microwave source facing away from the top plate for outputting microwaves; Wherein, the microwave sources include at least two microwave sources that are spaced apart from each other.

2. The cover of the microwave plasma processing device according to claim 1, characterized in that: A telescopic device is provided in the accommodating cavity, and the telescopic device is connected to the top plate and / or the side plate; The telescopic device is used to be connected to the microwave source so that the microwave source can move along the thickness direction of the top plate between a first position close to the top plate and a second position far from the top plate.

3. The cover of the microwave plasma processing device according to claim 1, characterized in that: A moving assembly is arranged in the accommodating cavity, and the moving assembly comprises a matching slide rail and a sliding member, the slide rail is fixedly arranged on the inner surface of the top plate, and the sliding member is connected to the microwave source; The slide member moves along the slide rail so that the microwave source moves along the slide rail parallel to the top plate.

4. The cover of the microwave plasma processing device according to claim 3, characterized in that: The moving assembly further includes a telescopic member connected to the sliding member and used to be connected to the microwave source so that the microwave source can move along the thickness direction of the top plate between a third position close to the top plate and a fourth position away from the top plate.

5. The cover of the microwave plasma processing device according to claim 1, characterized in that: The cover further includes a sealing member, which is disposed on a bottom surface of the side plate and is used for sealingly connecting to a reaction chamber housing of the microwave plasma processing device.

6. The cover of the microwave plasma processing device according to any one of claims 1 to 5, characterized in that: The machine cover includes a plurality of microwave sources, and the plurality of microwave sources are distributed in a rectangular array or a circular array.

7. A microwave plasma processing device, characterized in that: The microwave plasma processing device comprises: a reaction chamber housing; and The cover of the microwave plasma processing device according to any one of claims 1 to 6, wherein the cover can be connected to the reaction chamber housing in a coverable manner.

8. The microwave plasma processing device according to claim 7, characterized in that: The microwave plasma processing device also includes: a microwave power supply, the microwave power supply being used to provide electrical energy to the microwave plasma processing device; and / or A cooling device is provided on the machine cover and / or the reaction chamber shell.

9. The microwave plasma processing device according to claim 7, characterized in that: The microwave plasma processing device further comprises a dielectric plate, wherein the dielectric plate is located on a side of the microwave source away from the top plate; The medium plate is sealed and connected to the reaction chamber shell and forms a plasma reaction chamber with the reaction chamber shell; or the medium plate is sealed and connected to the machine cover, and when the machine cover is closed and connected to the reaction chamber shell, the medium plate, the machine cover and the reaction chamber shell form a plasma reaction chamber.

10. The microwave plasma processing device according to claim 9, characterized in that: The microwave plasma processing device also includes: A gas delivery device, comprising an inlet channel and an outlet channel, wherein the inlet channel and the outlet channel are connected to the plasma reaction chamber respectively; and / or A vacuum pumping device is connected to the plasma reaction chamber.

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