Chip adsorption head and chip adsorption feeding device
By using chip adsorption heads in chip packaging equipment and using the design of air guide holes and adsorption ports, efficient adsorption and release of the chip are achieved, solving the problem of low chip packaging efficiency in the prior art.
Patent Information
- Application Number
- CN202422448726.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The prior art is difficult to efficiently move chips, which limits the packaging efficiency of the chip.
A chip adsorption head is provided, with a gas guide hole inside, and the air inlet and air outlet of the air guide hole are arranged in the lateral direction of the chip adsorption head and extending to the end to form an adsorption port. When the chip adsorption head slides into the adsorption state in the through-hole, the chip is adsorbed by negative pressure; when it slides into the pressure relief state, the chip is released.
The chip is slid through the chip adsorption head to adsorb or relieve pressure, improving the chip adsorption efficiency and facilitating high-efficiency packaging.
Smart Images
Figure CN223038929U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of chip packaging equipment, and more specifically, to a chip suction head and a chip suction and loading device. Background Art
[0002] With the rapid development of wireless communication technology, the application fields of radio frequency (RF) chips and antennas have been continuously expanding, covering multiple industries such as mobile communication, Internet of Things, automotive electronics, and medical devices. RF chips are also widely used in logistics, warehousing, inventory management, and access control. For example, RF chips can be combined with RFID tags for item tracking and identification, enabling data reading without contact. Due to the extremely wide application range and large application volume of RF chips, higher requirements are also put forward for the packaging efficiency of RF chips.
[0003] In the prior art, during the process of chip and antenna packaging, generally three steps of antenna preparation, chip bonding, and lamination need to be carried out separately. Among them, antenna preparation refers to the process of manufacturing an antenna on a substrate through an etching process or a die-cutting process. Chip bonding is the process of physically connecting an RF chip and an antenna. Lamination is the process of re-arranging and recombining the bonded chip and antenna in a specific layout. Dividing the chip packaging process into multiple steps will result in a complex process flow of the chip packaging process, and during the process of packaging the chip, it is necessary to move the chip. It is difficult for the prior art to move the chip efficiently, which limits the packaging efficiency of the chip. Summary of the Utility Model
[0004] The purpose of this application is to provide a chip suction head and a chip suction and loading device, which solve the technical problem of difficult to move the chip efficiently, and achieve the technical effect of moving the chip efficiently.
[0005] A chip suction head provided by an embodiment of this application has a gas guide hole inside. The air inlet and outlet of the gas guide hole are both arranged on the side of the chip suction head, and the gas guide hole extends to the end of the chip suction head to form a suction port for sucking the chip. When the chip suction head slides to the suction state in the through hole, the air inlet is blocked by the side wall of the through hole, the air outlet slides out of the through hole, and the suction port sucks the chip through negative pressure. When the chip suction head slides to the pressure relief state in the through hole, the air inlet slides out of the through hole for pressure relief, the air outlet is blocked by the side wall of the through hole, and the suction port releases the chip.
[0006] In a possible implementation manner, the two ends of the chip suction head are respectively provided with a first limiting structure and a second limiting structure, and the first limiting structure and the second limiting structure are used to limit the sliding stroke of the chip suction head in the through hole.
[0007] In another possible implementation, the first limiting structure includes a limiting claw, which can elastically yield to facilitate the insertion of the chip suction head into the through hole, and the limiting claw can also limit the chip suction head in the opposite direction outside the through hole.
[0008] In another possible implementation, the limiting claw is provided on the plug, and the plug is hermetically inserted into the air guide hole.
[0009] In another possible implementation, the cross-section of the second limiting structure is rectangular, and the second limiting structure is a stepped structure on the chip suction head.
[0010] In another possible implementation, a first sealing ring is sleeved on the chip suction head, and the first sealing ring is provided between the first limiting structure and the air outlet.
[0011] In another possible implementation, a second sealing ring is sleeved on the chip suction head, and the second sealing ring is provided between the second limiting structure and the air inlet.
[0012] In another possible implementation, a chamfered portion is provided at the end edge of the chip suction head, and the suction port is provided at the center point of the end of the chip suction head.
[0013] In another possible implementation, the length of the chip suction head is 5 mm to 6 mm, the diameter of the suction port is 0.1 mm to 0.2 mm, the cross-section of the end of the chip suction head is rectangular, and the length and width of the cross-section of the end of the chip suction head are both 2 mm to 3 mm.
[0014] The embodiment of the present application also provides a chip suction and loading device, including the chip suction head described in any one of the above, and the chip suction and loading device further includes a chip loading roller, on which a plurality of through holes are arranged in an array, and the chip suction head is slidably connected in the through holes.
[0015] The beneficial effects of the embodiment of the present application compared with the prior art are as follows:
[0016] The embodiment of the present application provides a chip suction head, in which an air guide hole is provided. The air inlet and air outlet of the air guide hole are both provided on the side of the chip suction head, and the air guide hole extends to the end of the chip suction head to form a suction port for sucking the chip; when the chip suction head slides in the through hole to the suction state, the air inlet is closed by the side wall of the through hole, the air outlet slides out of the through hole, and the suction port sucks the chip through negative pressure; when the chip suction head slides in the through hole to the pressure relief state, the air inlet slides out of the through hole for pressure relief, the air outlet is closed by the side wall of the through hole, and the suction port releases the chip. The chip suction head in the embodiment of the present application can suck or relieve the pressure on the chip by sliding the chip suction head in the through hole, improving the chip suction efficiency and facilitating high-efficiency packaging of the chip. Description of the Drawings
[0017] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.
[0018] Figure 1 Schematic structural diagram of a chip suction head provided by an embodiment of the present application;
[0019] Figure 2 Schematic diagram of the working state of a chip suction head provided by an embodiment of the present application;
[0020] Figure 3 Schematic diagram of the working state of a chip suction head for chip loading provided by an embodiment of the present application;
[0021] Figure 4 Schematic diagram of the top view of the end of a chip suction head provided by an embodiment of the present application;
[0022] Figure 5 Schematic structural diagram of a chip suction and loading device provided by an embodiment of the present application;
[0023] Figure 6 Schematic diagram of the partial structure at position A of a chip suction and loading device provided by an embodiment of the present application;
[0024] In the figure, 101, self-adhesive; 301, chip; 31, chip loading roller; 31a, loading roller cavity; 311, chip suction head; 311a, air guide hole; 311b, air inlet; 311c, air outlet; 311d, suction port; 311e, first limit structure; 311f, second limit structure; 311g, limit claw; 311h, first sealing ring; 311i, second sealing ring; 311j, plug; 312, through hole. Detailed implementation manners
[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0026] It should be noted that when a component or structure is referred to as "fixed to" or "arranged on" another component or structure, it can be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as "connected to" another component or structure, it can be directly connected to the other component or structure or indirectly connected to the other component or structure.
[0027] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.
[0029] The prior art is difficult to move the chip efficiently, which limits the packaging efficiency of the chip.
[0030] For the above reasons, the embodiment of the present application provides a chip suction head. An air guide hole is provided in the chip suction head. The air inlet and the air outlet of the air guide hole are both arranged on the side of the chip suction head, and the air guide hole extends to the end of the chip suction head to form a suction port for sucking the chip. When the chip suction head slides to the suction state in the through hole, the air inlet is closed by the side wall of the through hole, the air outlet slides out of the through hole, and the suction port sucks the chip through negative pressure. When the chip suction head slides to the pressure relief state in the through hole, the air inlet slides out of the through hole for pressure relief, the air outlet is closed by the side wall of the through hole, and the suction port releases the chip. The chip suction head in the embodiment of the present application can suck or relieve the pressure on the chip by sliding the chip suction head in the through hole, improving the chip suction efficiency and facilitating the high-efficiency packaging of the chip.
[0031] In some scenarios, a chip suction head in the embodiment of the present application can be applied to the transfer packaging of RFID chips, which can improve the transfer packaging efficiency of RFID chips.
[0032] The following specifically describes a chip suction head provided by the embodiment of the present application with specific examples.
[0033] Figure 1 The structural schematic diagram of a chip suction head provided by an embodiment of the present application is as follows. Figure 1 As shown, an air guide hole 311a is provided in the chip suction head 311. The air inlet 311b and the air outlet 311c of the air guide hole 311a are both provided on the side of the chip suction head 311, and the air guide hole 311a extends to the end of the chip suction head 311 to form a suction port 311d, and the suction port 311d is used to suck the chip 301.
[0034] As Figure 1 shown, an air guide hole 311a is provided in the chip suction head 311, and the air guide hole 311a is used to circulate air flow in the chip suction head 311 to form a negative pressure.
[0035] As Figure 1 shown, the air inlet 311b and the air outlet 311c of the air guide hole 311a are both provided on the side of the chip suction head 311. The air inlet 311b is used to introduce air flow into the air guide hole 311a, and the air outlet 311c is used to discharge air flow from the air guide hole 311a.
[0036] As Figure 1 shown, the air guide hole 311a extends to the end of the chip suction head 311 to form a suction port 311d, and the suction port 311d is used to suck the chip 301 to realize the suction and moving loading of the chip 301.
[0037] In some implementation manners, when the chip suction head 311 slides to the suction state in the through hole 312, the air inlet 311b is blocked by the side wall of the through hole 312, the air outlet 311c slides out of the through hole 312, and the suction port 311d sucks the chip 301 through negative pressure. When the chip suction head 311 slides to the pressure relief state in the through hole 312, the air inlet 311b slides out of the through hole 312 for pressure relief, the air outlet 311c is blocked by the side wall of the through hole 312, and the suction port 311d releases the chip 301.
[0038] Figure 2 The schematic diagram of the working state of a chip suction head provided by an embodiment of the present application is as follows. Figure 2 As shown by the structure of the chip suction head 311 that does not protrude from the through hole 312, when the chip suction head 311 slides to the suction state in the through hole 312, the air inlet 311b is blocked by the side wall of the through hole 312, the air outlet 311c slides out of the through hole 312, and a negative pressure is formed in the upper feeding roller cavity 31a under the vacuum suction of the vacuum suction component at the end of the chip feeding roller 31, so that the air flow sequentially passes through the suction port 311d and enters the air inlet 311b, and the suction port 311d can suck the chip 301 through negative pressure.
[0039] As Figure 2As shown in the structure of the chip suction head 311 protruding from the through hole 312, when the chip suction head 311 slides to the pressure relief state within the through hole 312, the air inlet 311b slides out of the through hole 312 for pressure relief, and the air outlet 311c is blocked by the side wall of the through hole 312, preventing air flow from entering the feeding roller cavity 31a through the air outlet 311c. The air inlet 311b is also blocked, releasing the negative pressure at the suction port 311d, enabling the suction port 311d to release the chip 301. The chip 301 can be packaged with the cooperation of other chip packaging equipment.
[0040] Exemplarily, Figure 3 FIG. is a schematic diagram of the working state of a chip suction head for chip feeding provided by an embodiment of the present application. As Figure 3 shown, a through hole 312 can be provided on the chip feeding roller 31. Through the chip suction head 311 in the through hole 312, the chip 301 can be fed onto the transfer roller of the transfer assembly, achieving the purpose of feeding the chip 301 onto the adhesive 101 on the transfer roller.
[0041] The beneficial effect brought by the above implementation is that the chip suction head can adsorb or relieve pressure on the chip by sliding the chip suction head in the through hole, improving the chip adsorption efficiency and facilitating high-efficiency packaging of the chip.
[0042] In some implementation manners, first limiting structures 311e and second limiting structures 311f are respectively provided at two ends of the chip suction head 311. The first limiting structure 311e and the second limiting structure 311f are used to limit the sliding stroke of the chip suction head 311 within the through hole 312.
[0043] As Figure 1 shown, first limiting structures 311e and second limiting structures 311f are respectively provided at two ends of the chip suction head 311. The first limiting structure 311e and the second limiting structure 311f are used to limit the sliding stroke of the chip suction head 311 within the through hole 312, enabling the sliding stroke of the chip suction head 311 within the through hole 312 to be limited, achieving the limitation of the stroke of the chip suction head 311 and preventing the chip suction head 311 from sliding out of the through hole 312.
[0044] The beneficial effect brought by the above implementation is that it can limit the stroke of the chip suction head within the through hole, preventing the chip suction head from sliding out of the through hole.
[0045] In some implementation manners, the first limiting structure 311e includes a limiting claw 311g. The limiting claw 311g can elastically yield to facilitate the insertion of the chip suction head 311 into the through hole 312, and the limiting claw 311g can also limit the chip suction head 311 in the reverse direction outside the through hole 312.
[0046] As Figure 1 shown, the first limiting structure 311e includes a limiting claw 311g which extends from the end of the chip suction head 311 towards the middle of the chip suction head 311 in a direction away from the side wall of the chip suction head 311, such that the limiting claw 311g can elastically yield to facilitate the insertion of the chip suction head 311 into the through hole 312, and the limiting claw 311g can also limit the chip suction head 311 in the reverse direction outside the through hole 312, so that when installing the chip suction head 311, only by inserting the chip suction head 311 into the through hole 312, the simple and rapid installation of the chip suction head 311 can be completed.
[0047] The beneficial effect brought by the above implementation manner is that when installing, only by inserting the chip suction head into the through hole, the simple and rapid installation of the chip suction head can be completed.
[0048] In some implementation manners, the limiting claw 311g is provided on the plug 311j, and the plug 311j is hermetically inserted into the air guide hole 311a.
[0049] As Figure 1 shown, in terms of structure, the limiting claw 311g is provided on the plug 311j, and the plug 311j is hermetically inserted into the air guide hole 311a, such that it is convenient to independently install the limiting claw 311g by inserting and removing the plug 311j.
[0050] Exemplarily, the plug 311j and the limiting claw 311g can be integrally formed.
[0051] The beneficial effect brought by the above implementation manner is that it is convenient for the production and manufacturing of the limiting claw and the plug, and it is also convenient for the rapid installation and disassembly of the limiting claw and the plug.
[0052] In some implementation manners, the cross-section of the second limiting structure 311f is rectangular, and the second limiting structure 311f is a stepped structure on the chip suction head 311.
[0053] In terms of structure, the cross-section of the second limiting structure 311f is rectangular, and the through hole 312 can also be rectangular, such that the second limiting structure 311f can cooperate with the through hole 312 to position the chip suction head 311.
[0054] In terms of structure, the second limiting structure 311f is a stepped structure on the chip suction head 311, such that the second limiting structure 311f can effectively limit the chip suction head 311.
[0055] The beneficial effect brought by the above implementation manner is that the second limiting structure with a rectangular cross-section can guide the chip suction head, and the second limiting structure in the form of a stepped structure can effectively limit the chip suction head.
[0056] In some implementations, a first sealing ring 311h is sleeved on the chip suction head 311, and the first sealing ring 311h is disposed between the first limiting structure 311e and the air outlet 311c.
[0057] As Figure 1 shown, structurally, the first sealing ring 311h is disposed between the first limiting structure 311e and the air outlet 311c, so that the first sealing ring 311h can seal between the first limiting structure 311e and the air outlet 311c, avoiding gas leakage at the air outlet 311c.
[0058] The beneficial effect brought by the above implementation is that the first sealing ring is between the first limiting structure and the air outlet, avoiding gas leakage at the air outlet.
[0059] In some implementations, a second sealing ring 311i is sleeved on the chip suction head 311, and the second sealing ring 311i is disposed between the second limiting structure 311f and the air inlet 311b.
[0060] As Figure 2 shown, structurally, the second sealing ring 311i is disposed between the second limiting structure 311f and the air inlet 311b, and the second sealing ring 311i can seal between the second limiting structure 311f and the air inlet 311b, avoiding gas leakage at the air inlet 311b.
[0061] The beneficial effect brought by the above implementation is that the second sealing ring seals between the second limiting structure and the air inlet, avoiding gas leakage at the air inlet.
[0062] In some implementations, a chamfered portion is provided at the end edge of the chip suction head 311, and the suction port 311d is disposed at the center point of the end of the chip suction head 311.
[0063] As Figure 1 shown, a chamfered portion is provided at the end edge of the chip suction head 311, which can avoid damaging the chip by the chip suction head 311.
[0064] At the same time, the suction port 311d is disposed at the center point of the end of the chip suction head 311, facilitating accurate suction of the chip 301.
[0065] The beneficial effect brought by the above implementation is that while avoiding damage to the chip by the chip suction head, accurate suction of the chip can be achieved.
[0066] In some implementations, the length of the chip suction head 311 is 5 mm to 6 mm, the diameter of the suction port 311d is 0.1 mm to 0.2 mm, the cross-section at the end of the chip suction head 311 is rectangular, and the length and width of the cross-section at the end of the chip suction head 311 are both 2 mm to 3 mm.
[0067] As Figure 1 shown, the length L of the chip suction head 311 can be 5 mm to 6 mm.
[0068] As Figure 4 shown, the diameter d of the suction port 311d is 0.1 mm to 0.2 mm, which can generate negative pressure to effectively adsorb the chip.
[0069] Figure 4 This is a schematic top view structure of the end of a chip suction head provided by an embodiment of the present application. As Figure 4 shown, the cross-section at the end of the chip suction head 311 is rectangular, and the length L1 and width K of the cross-section at the end of the chip suction head 311 are both 2 mm to 3 mm, which can effectively fit with the chip for chip suction.
[0070] The embodiment of the present application also provides a chip suction and loading device, including the chip suction head described in any one of the above. This chip suction and loading device further includes a chip loading roller 31. A plurality of through holes 312 are arranged in an array on the chip loading roller 31, and the chip suction head 311 is slidably connected in the through holes 312.
[0071] Figure 5 This is a schematic structural diagram of a chip suction and loading device provided by an embodiment of the present application. Figure 6 This is a partial structural schematic diagram of part A of a chip suction and loading device provided by an embodiment of the present application. As Figure 5 and Figure 6 shown, in terms of structure, the chip suction head 311 is slidably connected in the through holes 312, and a plurality of through holes 312 are arranged in an array on the chip loading roller 31, which can efficiently load the chip suction head 311.
[0072] Exemplarily, the chip suction head 311 can be lifted by a top ejector to achieve the top-up pressure relief of the chip suction head 311 to release the chip.
[0073] Exemplarily, multiple rows and columns of chips 301 can be arranged in an array on the chip loading roller 31. For example, the number of chips 301 on the chip loading roller 31 can be 420 rows, 132 columns, a total of 55,440 pieces, which can simultaneously perform high-efficiency packaging on a huge number of chips.
[0074] The beneficial effect brought by the above implementation is that a plurality of through holes are arranged in an array on the chip loading roller, and the chip suction head is slidably connected in the through holes, which can efficiently load and package the chips.
[0075] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.
Claims
1. A chip adsorption head, characterized in that: An air guide hole is provided in the chip adsorption head, and the air inlet and the air outlet of the air guide hole are both arranged on the side of the chip adsorption head, and the air guide hole extends to the end of the chip adsorption head to form an adsorption port, which is used to adsorb the chip; When the chip adsorption head slides in the through hole to the adsorption state, the air inlet is closed by the side wall of the through hole, the air outlet slides out of the through hole, and the adsorption port adsorbs the chip through negative pressure; when the chip adsorption head slides in the through hole to the pressure relief state, the air inlet slides out of the through hole to relieve pressure, the air outlet is closed by the side wall of the through hole, and the adsorption port releases the chip.
2. The chip adsorption head according to claim 1, characterized in that: A first limiting structure and a second limiting structure are respectively provided at both ends of the chip adsorption head, and the first limiting structure and the second limiting structure are used to limit the sliding stroke of the chip adsorption head in the through hole.
3. The chip adsorption head according to claim 2, characterized in that: The first limiting structure includes a limiting claw, which can elastically give way to facilitate the chip adsorption head to be inserted into the through hole. The limiting claw can also reversely limit the chip adsorption head outside the through hole.
4. The chip adsorption head according to claim 3, characterized in that: The limiting claw is arranged on the plug, and the plug is sealed and plugged on the air guide hole.
5. The chip adsorption head according to claim 4, characterized in that: The cross section of the second limiting structure is rectangular, and the second limiting structure is a step structure on the chip adsorption head.
6. The chip adsorption head according to claim 5, characterized in that: A first sealing ring is provided on the chip adsorption head, and the first sealing ring is arranged between the first limiting structure and the air outlet.
7. The chip adsorption head according to claim 6, characterized in that: A second sealing ring is provided on the chip adsorption head, and the second sealing ring is arranged between the second limiting structure and the air inlet.
8. The chip adsorption head according to claim 7, characterized in that: The end edge of the chip adsorption head is provided with a chamfered portion, and the adsorption port is arranged at the center point of the end of the chip adsorption head.
9. The chip adsorption head according to claim 8, characterized in that: The length of the chip adsorption head is 5mm to 6mm, the diameter of the adsorption port is 0.1mm to 0.2mm, the cross-section of the end of the chip adsorption head is rectangular, and the length and width of the cross-section of the end of the chip adsorption head are both 2mm to 3mm.
10. A chip adsorption loading device, characterized in that: The chip adsorption head comprises any one of claims 1 to 9, and further comprises a chip loading roller, wherein a plurality of through holes are arranged in an array on the chip loading roller, and the chip adsorption head is slidably connected in the through holes.