Earmuff and headphone

Abstract

The utility model relates to an earmuff and a headphone. The earmuff comprises a sound insulation support pad and a soft support pad. The sound insulation supporting pad comprises a sound insulation base ring and a plurality of sound insulation protruding blocks arranged on the upper surface of the sound insulation base ring at intervals, and a plurality of grooves are formed in the intervals between the sound insulation protruding blocks. The soft supporting pad comprises a soft base ring and a plurality of soft protruding blocks arranged on the upper surface of the soft base ring at intervals, and the soft protruding blocks are correspondingly clamped with the grooves of the sound insulation supporting pad respectively. The density of the soft supporting pad is smaller than that of the sound insulation supporting pad. According to the earmuff and the headphone provided by the utility model, external noise is not easy to enter human ears, so that a user can hear pure and clear sound, and comfortable wearing experience is provided for the user. In addition, the earmuff and the headphone of the present application have the advantage of low cost.

Description

Technical Field

[0001] The utility model relates to the technical field of earphones, in particular to an ear cup and a head-mounted earphone. Background Art

[0002] With the rapid development of technology, especially the continuous breakthroughs and innovations in audio technology, and the increasing requirements for sounds such as music quality and game sound effects, people are beginning to choose to use head-mounted Bluetooth earphones more often to obtain a comfortable wearing experience and a more immersive sound experience.

[0003] The ear cup is the main structure of a head-mounted earphone. When in use, the ear cup closely fits around the user's ears, forming a relatively enclosed space to enable more sound to enter the ears. The ear cup of the prior art is composed of a receiving plate connected to the main body of the head-mounted earphone, a ring-shaped soft sponge pad provided on the receiving plate, and an outer cover wrapping the sponge pad. When in use, the ear cup is facing the ear, and the side with the outer cover faces the ear. The soft sponge pad reduces the pressure of the receiving plate on the ear, enabling the user to comfortably wear the head-mounted earphone; the sound emitted by the earphone passes through the inside of the soft sponge pad and enters the user's ears.

[0004] However, when using the ear cup of the prior art to listen to sounds, users still encounter a significant problem, that is, the purity and clarity of the sound do not reach the ideal state. Summary of the Utility Model

[0005] Based on this, the purpose of the present utility model is to overcome the defects or deficiencies of the prior art and provide an ear cup for a head-mounted earphone with pure and clear sound and comfortable wearing.

[0006] The ear cup of the head-mounted earphone is used for a head-mounted earphone and includes: a sound insulation support pad and a soft support pad;

[0007] The sound insulation support pad includes a sound insulation base ring and a plurality of sound insulation bumps spaced on the upper surface of the sound insulation base ring. The intervals between the sound insulation bumps form a plurality of grooves; the soft support pad includes a soft base ring and a plurality of soft bumps spaced on the upper surface of the soft base ring. The soft bumps are respectively engaged with the grooves of the sound insulation support pad; the density of the soft support pad is less than the density of the sound insulation support pad.

[0008] The ear cup of the head-mounted earphone of the present utility model can prevent external noise from easily entering the human ear, thereby ensuring that users can hear pure and clear sounds. At the same time, it provides a comfortable wearing experience for users. In addition, the ear cup of the present application has the advantage of low cost.

[0009] Further, the sound insulation base ring is elliptical, and the number of sound insulation bumps thereon is three. The intervals between the sound insulation bumps respectively form a first groove, a second groove, and a third groove. The first groove is located at the position of the minor axis of the sound insulation base ring. The second groove and the third groove are located on the sound insulation base ring opposite to the first groove and are symmetric with respect to the minor axis.

[0010] The flexible base ring is elliptical, and the number of flexible bumps thereon is three. The flexible bumps are respectively engaged with the first groove, the second groove, and the third groove in a corresponding manner.

[0011] Further, the sound insulation support pad is a porous sponge, and its density is 80 kg / m 3 。

[0012] Further, the flexible support pad is a porous sponge, and its density is 25 kg / m 3 。

[0013] Further, taking two straight lines passing through the two foci of the inner ellipse of the flexible base ring and perpendicular to the major axis as the dividing lines, the area between the two dividing lines is the A area, and the areas on both sides of the A area are the B areas. The cross-sectional shape of the flexible bumps located in each B area is a sector.

[0014] Further, the cross-sectional shape of the flexible bumps located in the A area is a square.

[0015] Further, the curvature of the endpoints of the major axis of the outer ellipse of the flexible base ring is less than the curvature of the endpoints of the major axis of its inner ellipse.

[0016] Further, the included angle between the sound insulation bump and the sound insulation base ring, and the included angle between the surface of the sound insulation bump and its two end sides are both arc angles.

[0017] Further, it further includes a microfiber leather outer cover, and the microfiber leather outer cover wraps the sound insulation support pad and the flexible support pad.

[0018] Further, a head-mounted earphone is provided. The head-mounted earphone includes an earphone body and two such ear cups. The ear cups are connected to the earphone body through a receiving plate of the earphone body, and the sides of the two ear cups each provided with a flexible support pad face each other.

[0019] For better understanding and implementation, the present utility model will be described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is an exploded view of the ear cup of the head-mounted earphone of the present utility model;

[0021] Figure 2 is a schematic view of the sound insulation support pad of the present utility model in the A-A direction;

[0022] Figure 3 It is a schematic diagram of the B-B direction of the soft support pad of the present utility model;

[0023] Figure 4 It is a schematic diagram of the headphone of the present utility model;

[0024] Figure 5 It is a schematic diagram of the crack generation and its causes of the soft support pad of the present utility model;

[0025] Figure 6 It is a schematic structural diagram of the soft support pad in the B-B direction of Embodiment 2 of the present application;

[0026] Figure 7 It is a schematic structural diagram of the sound insulation support pad in the A-A direction of Embodiment 2 of the present application.

[0027] Description of the drawings: The receiving plate 1, the sound insulation support pad 20, the sound insulation base ring 21, the sound insulation bump 22, the first groove 23a, the second groove 23b, the third groove 23c, the soft support pad 30, the soft base ring 31, the first soft bump 33a, the second soft bump 33b, the third soft bump 33c, the outer sleeve 40, the headphone main body 100, the connecting section P. Detailed implementation manners

[0028] Regarding the problem that the purity and clarity of the sound heard by users through headphones in the prior art are insufficient, the technical personnel of the present application analyzed as follows: The sound may be mixed with unnecessary noise, background noise, or the frequency response of the audio signal is not balanced enough, so that some sound segments are overemphasized or weakened, or the audio signal may also generate certain distortion or loss due to technical limitations during transmission and conversion. Among them, the background noise cannot be completely blocked by the earcups because part of the noise is absorbed by the soft sponge pad, and the other part of the unabsorbed noise directly enters the human ear. In this regard, the technical personnel tried to increase the density of the soft sponge pad to enhance its noise absorption ability. Tests found that after the sponge density increased to a certain value, the noise entering the ear was reduced to the minimum, but when the density was continuously increased subsequently, the corresponding noise level increased again. However, even when using the density parameter that can minimize noise the most, it still cannot meet the user's pursuit of sound purity and clarity. The technical personnel further analyzed and found that there is an imperceptible gap between the earcup and the ear after wearing the headphones. This is because as the sponge density increases, its hardness also increases, and the relatively hard sponge is not easy to deform. Therefore, the earcup and the ear cannot fit closely to form a gap. Noise can enter the ear through this gap, thereby affecting the purity and clarity of the sound heard by the user through the headphones.

[0029] Based on the above analysis, the technical personnel of the present application redesigned the structure of the sponge pad inside the earcup. The following introduces the earcup of the headphone of the present application through specific embodiments.

[0030] Example 1

[0031] Please refer to Figure 1 , which is an exploded view of the earcup of the headphone of the present utility model. The earcup includes a sound insulation support pad 20, a soft support pad 30, and an outer cover 40. The earcup is connected to the headphone body 100 through the receiving plate 1 of the headphone body 100; specifically, the sound insulation support pad 20 is fixedly arranged on the receiving plate 1; the soft support pad 30 is fixedly arranged on the sound insulation support pad 20; the outer cover 40 wraps the sound insulation support pad 20 and the soft support pad 30. The density of the soft support pad is less than the density of the sound insulation support pad.

[0032] Specifically, please refer to Figure 2 , which is a schematic view of the sound insulation support pad of the present utility model in the A-A direction. The sound insulation support pad 20 includes a sound insulation base ring 21 and a plurality of sound insulation bumps 22 spaced on the upper surface of the sound insulation base ring 21. In this embodiment, the sound insulation base ring 21 is elliptical, and the foci of its inner ellipse and outer ellipse are on the same straight line. The line segment passing through the two foci and intersecting the outer ellipse forms the major axis cc. The curvature of the endpoints of the major axis cc of the outer ellipse of the sound insulation base ring 21 is less than the curvature of the endpoints of the major axis cc of its inner ellipse; the number of the sound insulation bumps 22 is 3, and the intervals between the sound insulation bumps respectively form a first groove 23a, a second groove 23b, and a third groove 23c. Preferably, the line segment connecting the two vertices with a relatively short distance in the ellipse forms the minor axis aa. The first groove 23a is arranged on the sound insulation base ring 21 on one side of the major axis cc and is located at the position of the minor axis aa of the elliptical sound insulation base ring 21; the second groove 23b and the third groove 23c are arranged on the sound insulation base ring 21 on the other side of the major axis cc, so that the second groove 23b and the third groove 23c are located on the sound insulation base ring 21 opposite to the first groove 23a; and the second groove 23b and the third groove 23c are symmetric with respect to the minor axis aa. Further, the cross-sectional shape of the first groove 23a is symmetric with respect to the minor axis aa. Preferably, the included angle between the sound insulation bump 22 and the sound insulation base ring 21, and the included angle between the surface of the sound insulation bump 22 and its two end sides are both arc angles; the sound insulation base ring 21 and the sound insulation bump 22 are integrally formed, and the material thereof can be selected from silicone or porous sponge, preferably porous sponge with a density of 80 kg / m 3 and is fixed on the receiving plate 1 through a hot pressing process.

[0033] Please refer to Figure 3, which is a schematic view of the soft support pad of the present utility model in the B-B direction. The soft support pad 30 includes a soft base ring 31 and a plurality of soft bumps 33 spaced on the upper surface of the soft base ring 31. In this embodiment, the soft base ring 31 is elliptical, and the foci of its inner ellipse and outer ellipse are on the same straight line. The line segment passing through the two foci and intersecting the outer ellipse forms the major axis c'c'. Among them, the curvature of the endpoints of the major axis c'c' of the outer ellipse of the soft base ring 31 is less than the curvature of the endpoints of the major axis c'c' of its inner ellipse; the number of the soft bumps 33 is 3, namely the first soft bump 33a, the second soft bump 33b and the third soft bump 33c, and they are respectively engaged with the first groove 23a, the second groove 23b and the third groove 23c. Specifically, the line connecting the two vertices with a relatively short distance in the ellipse of the soft base ring 31 forms the minor axis a'a'. The first soft bump 33a is arranged on the soft base ring 31 on one side of its major axis c'c' and is located at the position of the minor axis a'a' of the elliptical soft base ring 31; the second soft bump 33b and the third soft bump 33c are arranged on the soft base ring 31 on the other side of its major axis c'c', so that the second soft bump 33b and the third soft bump 33c are located on the soft base ring 31 opposite to the first soft bump 33a; and the second soft bump 33b and the third soft bump 33c are symmetric with respect to the minor axis a'a'. Further, the cross-sectional shape of the first soft bump 33a is symmetric with respect to the minor axis a'a'.

[0034] Preferably, the included angle between the soft bump 33 and the soft base ring 31 and the included angle between the surface of the soft bump 33 and its two end sides are both arc angles; the soft base ring 31 and the soft bump 33 are integrally formed, and the material thereof can be selected from silicone or porous sponge, preferably sponge with a density of 25 kg / m 3 and is fixed on the sound insulation support pad 20 by a hot pressing process.

[0035] The outer cover 40 wraps the material sound insulation support pad 20 and the soft support pad 30 to reinforce them. In addition, the outer cover 40 can further improve the sound insulation effect and prevent dirt from adhering to the earphone. The material of the outer cover 40 is preferably ultra-fine leather, and the outer cover 40 has a small frictional force on the human ear and has the advantage of improving the comfort of the user.

[0036] Please refer to Figure 4, which is a schematic diagram of the head-mounted earphone of the present utility model. The above earcups can be further applied to a head-mounted earphone. The head-mounted earphone includes an earphone body 100 and two of the earcups. The earcups are respectively arranged on the earphone body 100 through a receiving plate 1, and the sides of the two earcups each provided with a soft support pad 30 face each other, that is, the soft support pad surface of one earcup faces the soft support pad of the other earcup, so that the soft support pad 30 is close to the ear. Specifically, the receiving plate 1 is provided with through holes, and the through holes are mutually matched and clamped with a buckle (not shown in the figure) provided on the earphone body 100, and the receiving plate 1 is fixed on the earphone body 100 through the through holes and the buckle.

[0037] The working principle of the earcup of the present application when used in a head-mounted earphone:

[0038] During use, the earcup can prevent external noise from entering the human ear, enabling the user to hear pure and clear sounds. Specifically, the sound insulation bumps 22 of the sound insulation support pad 20 can absorb most of the external noise, allowing the human ear to hear pure and clear sounds. In particular, since the distance between the human ear auricle and the brain is relatively large, forming a relatively large gap, noise is likely to enter the human ear at this position. The sound insulation bump 22 provided between the second groove 23b and the third groove 23c of the earcup of the present application corresponds to the position of the human ear auricle, and can fill the relatively large gap between the human ear auricle and the brain, fully absorbing external noise. The soft support pad 30 is located between the human ear and the sound insulation support pad 20, and its soft property enables it to tightly fill the gap between the human ear and the sound insulation support pad 20, further preventing external noise from entering the human ear.

[0039] It can be understood that although the sound insulation support pad 20 absorbs the music that should have entered the human ear, reducing the total volume, the volume will not be reduced to an unacceptable level for people; at the same time, the sound insulation support pad 20 also absorbs the external environmental sounds, so the sounds that the human ear can feel are clearer; in addition, the sound insulation support pad 20 has a relatively strong ability to absorb medium and high-frequency sounds, and noise is generally medium and high-frequency sounds, so the sound insulation support pad 20 absorbs more external noise, making the sounds heard by the human ear clearer and purer.

[0040] In addition, during use, the earcups can provide a comfortable wearing experience for users. Specifically, the porous structure of the soft cushion 30 offsets part of the pressure exerted by the support plate 1 on the ears, enabling users to wear the headset comfortably. Further, the first soft bump 33a, the second soft bump 33b, and the third soft bump 33c of the soft cushion 30 respectively correspond to the top of the helix, the middle of the helix, and the position of the earlobe of the human ear, and cooperate with the physiological curve of the human auricle, which can bring a more comfortable experience to users. At the same time, the sound insulation support pad 20 also offsets part of the pressure exerted by the support plate 1 on the human ear and supports the soft cushion 30 to prevent the soft cushion 30 from forming local collapse, resulting in users clearly feeling the direct extrusion of the support plate 1 on the human ear. In addition, the curvature of the outer ellipse major axis end point of the sound insulation base ring 21 is less than the curvature of its inner ellipse major axis end point, and the curvature of the outer ellipse major axis end point of the soft base ring 31 is less than the curvature of its inner ellipse major axis end point. Such a setting avoids discomfort caused by the user being squeezed by the upper and lower tip parts of the earcups. The outer cover 40 has a small friction force on the human ear and can prevent the user's ears from being worn after wearing the headset for a long time.

[0041] In addition, for some people who need to wear glasses at the same time, the positions of the soft bumps of the soft cushion 30 are exactly opposite to the positions of the temple bars of the glasses, and the temple bars can sink into the soft cushion 30, avoiding the earcups pressing on the temple bars and further pressing on the human ear.

[0042] Compared with the prior art, the present application provides two types of support pad structures, namely, a sound insulation support pad and a soft support pad, and a number of grooves and protrusions are respectively provided on the two types of support pads, making it difficult for external noise to enter the human ear, so as to ensure that users can hear pure and clear sounds. At the same time, the setting of the soft support pad in the present application can reduce the pressure of the support plate on the user's ears, and the outer cover has a small friction force on the human ear, providing a comfortable wearing experience for users. In addition, the present application mainly improves from the structure of the support pads to prevent the human ear from hearing noise, and has the advantage of low cost.

[0043] Example 2

[0044] Technicians detected the earcups of the above-mentioned Embodiment 1 and found that some earcups would have uncomfortable wearing and slight sound leakage. Technicians further disassembled the earcups for inspection and found that there would be cracks on some soft cushions 30, resulting in noise entering the ears from the cracks. In addition, the ears opposite to the cracks are directly pressed by the relatively dense sound insulation support pads, resulting in uncomfortable wearing. Please refer to Figure 5, technicians analyzed the reasons for the cracks in the soft support pad 30 and found that the positions where the cracks occurred were mainly at the connection section P (indicated by the bold line segment in the figure) between the second soft bump 33b and the third soft bump 33c and the soft base ring 31. The reasons for the cracks in the connection section P may be as follows: The soft base ring 31 is integrally formed with the second soft bump 33b and the third soft bump 33c. The bending arc of the outer ellipse of the soft base ring 31 is relatively large at the connection section P, and the corresponding angle α between the connection section P and the outer ellipse is an acute angle, resulting in relatively large corresponding stress. Moreover, the thickness of the soft base ring 31 is relatively thin, and the soft support pad 30 is further squeezed by external forces during transportation or assembly. Therefore, the connection section P of the soft support pad 30 is prone to break and form cracks.

[0045] Based on the above analysis, the technicians of this application improved the soft support pad 30. Please refer to Figure 6 , which is a schematic structural diagram of the soft support pad 30 according to Embodiment 2 of this application. Embodiment 2 is basically the same as Embodiment 1, except that: Two straight lines perpendicular to the major axis c'c' are drawn through the two foci of the inner ellipse of the soft base ring 31 respectively. Taking these two straight lines as the dividing lines, the area between the two dividing lines is Area A; the areas on both sides of Area A are Area B. The cross-sectional shape of the soft bumps located in Area A is set to be square for easy manufacturing; the cross-sectional shape of each soft bump located in Area B is set to be fan-shaped, so that the angle between the corresponding connection section P and the outer ellipse is close to 90°, to prevent cracks from forming, thereby avoiding the discomfort during wearing and slight sound leakage caused by the cracks. In this embodiment, the first soft bump 33a is located in Area A, and the second soft bump 33b and the third soft bump 33c are located in Area B.

[0046] Correspondingly, please refer to Figure 7 , which is a schematic structural diagram of the sound insulation support pad 20 according to Embodiment 2 of this application. Two straight lines perpendicular to the major axis cc are drawn through the two foci of the inner ellipse of the sound insulation base ring 21 respectively. Taking these two straight lines as the dividing lines, the area between the two dividing lines is Area A; the areas on both sides of Area A are Area B. The cross-sectional shape of the groove located in Area A is set to be square for easy manufacturing; the cross-sectional shape of the groove located in Area B is set to be fan-shaped, so that the groove formed between the sound insulation bumps is correspondingly engaged with the soft bump 33. In this embodiment, the first groove 23a is located in Area A, and the second groove 23b and the third groove 23c are located in Area B.

[0047] It can be understood that the angle between the connection section between some sound insulation bumps 22 and the sound insulation base ring 21 of the sound insulation support pad 20 and the outer ellipse is an acute angle. However, since the sound insulation support pad 20 needs to be set with a relatively large density to ensure that it can absorb external noise, the corresponding hardness is relatively large. Therefore, it is not easy to have the same cracks as the soft support pad 30.

[0048] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and the present utility model also intends to include these modifications and variations.

Claims

1. An earmuff for a headset, characterized in that: include: A sound insulation support pad comprises a sound insulation base ring and a plurality of sound insulation convex blocks arranged at intervals on the upper surface of the sound insulation base ring, wherein the intervals between the sound insulation convex blocks form a plurality of grooves; A soft support pad, comprising a soft base ring and a plurality of soft convex blocks arranged at intervals on the upper surface of the soft base ring, wherein the soft convex blocks are respectively engaged with the grooves of the sound insulation support pad; The density of the soft support pad is less than the density of the sound insulation support pad.

2. The earmuff according to claim 1, characterized in that: The sound insulation base ring is elliptical, and has three sound insulation protrusions thereon. The intervals between the sound insulation protrusions form a first groove, a second groove, and a third groove respectively; the first groove is located at the position of the short axis of the sound insulation base ring; the second groove and the third groove are located on the sound insulation base ring opposite to the first groove, and are symmetrical relative to the short axis; The soft base ring is oval in shape and has three soft protrusions thereon, which are respectively engaged with the first groove, the second groove and the third groove.

3. The earmuff according to any one of claims 1-2, characterized in that: The sound insulation support pad is a porous sponge with a density of 80kg / m 3 .

4. The earmuff according to claim 3, characterized in that: The soft support pad is a porous sponge with a density of 25 kg / m 3 .

5. The earmuff according to claim 1, characterized in that: Two straight lines passing through the two foci of the inner ellipse of the soft base ring and perpendicular to the major axis are used as dividing lines, the area between the two dividing lines is area A, and the areas on both sides of area A are area B; the cross-sectional shape of the soft protrusion located in each area B is a sector.

6. The earmuff according to claim 5, characterized in that: The cross-sectional shape of the soft bump located in the A area is square.

7. The earmuff according to claim 6, characterized in that: The curvature of the endpoint of the major axis of the outer ellipse of the soft base ring is smaller than the curvature of the endpoint of the major axis of the inner ellipse.

8. The earmuff according to claim 7, characterized in that: The angle between the sound insulation protrusion and the sound insulation base ring, and the angle between the surface of the sound insulation protrusion and the side surfaces at both ends are arc angles.

9. The earmuff according to claim 8, characterized in that: It also includes a microfiber leather jacket, which wraps the sound insulation support pad and the soft support pad.

10. A headset, characterized in that: It comprises an earphone body and two earmuffs according to any one of claims 1 to 9, wherein the earmuffs are connected to the earphone body via a receiving plate of the earphone body, and the two earmuffs are respectively provided with one side of a soft support pad facing each other.

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