Earmuff structure with improved sealing performance and headphone

Abstract

The utility model discloses an earmuff structure with improved sealing performance and a headphone, and the earmuff structure with improved sealing performance comprises a housing, one side of the housing is provided with an accommodation cavity, the other side of the housing is provided with an installation groove which is integrally formed with the housing, and one side, facing the accommodation cavity, of the interior of the installation groove is recessed; the cover plate is detachably buckled at the opening of the mounting groove; the loudspeaker is arranged in the accommodating cavity; and the circuit board is arranged in the mounting groove. According to the utility model, the integrally formed mounting groove is arranged on the shell, the circuit board is arranged in the mounting groove, and the loudspeaker is arranged in the accommodating cavity of the shell, so that the arrangement of a traditional baffle plate is eliminated, the integrity and the sealing performance of the accommodating cavity are ensured, the noise insulation effect is improved by reducing mounting gaps, and the mounting groove is buckled and covered by the cover plate, so that the noise is reduced. And a second noise isolation mechanism is formed, so that the noise isolation performance is further improved while the attractive appearance of the earmuff is guaranteed, and the noise isolation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of head-mounted noise-canceling headphones, in particular to an earcup structure for improving sealing performance and a head-mounted headphone. Background Art

[0002] A head-mounted headphone, as the name implies, is a type of headphone worn on the head, different from in-ear earbuds. It consists of two parts, a signal transmitter and a headphone with a signal receiving and amplifying device (usually a dynamic driver). The transmitter is connected to the signal source, and a preamplifier or headphone amplifier can also be connected in front of the transmitter to improve the sound quality and adjust the tone color. With the continuous development of technology and the increasing improvement of people's living standards, the functional requirements for head-mounted headphones are getting higher and higher, and head-mounted headphones tend to develop in the direction of multi-functional features such as noise reduction and multiple playback mode adjustments.

[0003] In the prior art, taking the head-mounted headphone and earcup disclosed in CN112511936A as an example, the circuit board is arranged inside the headphone housing. On both sides of the baffle member, the housing and the earpad are respectively received. The housing is fixed to the baffle by a snap-fit method, and there are certain gaps at the snap-fit parts. In addition, in headphones with button adjustment functions, the buttons provided on the housing also need to be installed through holes, which results in multiple gaps corresponding to the sound cavity, causing the problem of poor noise isolation effect of the earcup structure.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the Utility Model

[0005] In order to solve the problem that in the prior art, the circuit board of the head-mounted headphone is arranged inside the headphone shell, the circuit board is arranged on the inner side of the headphone housing, the housing is fixed to the baffle by a snap-fit method during installation, there are gaps at the snap-fit parts, and the buttons provided on the housing also need to be opened to form gaps, and multiple gaps correspond to the sound cavity, resulting in poor noise isolation effect of the earcup structure, the utility model provides an earcup structure for improving sealing performance and a head-mounted headphone.

[0006] The utility model is realized through the following technical solutions:

[0007] An earcup structure for improving sealing performance, wherein the earcup structure for improving sealing performance comprises:

[0008] A housing, one side of the housing is provided with a receiving cavity, the other side of the housing is provided with a mounting groove integrally formed with the housing, and the inner side of the mounting groove is recessed towards the receiving cavity;

[0009] A cover plate, the cover plate is detachably snapped at the opening of the mounting groove;

[0010] A speaker, the speaker is arranged in the receiving cavity;

[0011] A circuit board, which is arranged in the installation groove.

[0012] The earphone cup structure for improving airtightness, wherein the installation groove includes a flat installation plate;

[0013] The substrate of the loudspeaker is fixedly arranged on one side of the installation plate corresponding to the accommodation cavity;

[0014] The circuit board is fixedly arranged on one side of the installation plate corresponding to the cover plate;

[0015] The circuit board is electrically / signal-connected to the loudspeaker.

[0016] The earphone cup structure for improving airtightness, wherein a snap ring is arranged on one side of the installation plate corresponding to the accommodation cavity, and the loudspeaker is fitted in the snap ring.

[0017] The earphone cup structure for improving airtightness, wherein a support block is arranged on one side of the installation plate corresponding to the accommodation cavity, and the support block is located inside the snap ring and fixedly connected to the snap ring;

[0018] A plurality of the support blocks are arranged in a circular array; or, the support block is circular.

[0019] The earphone cup structure for improving airtightness, wherein a plurality of first air flow micropores are formed through the installation plate;

[0020] A plurality of second air flow micropores are formed through the substrate of the loudspeaker;

[0021] A plurality of the first air flow micropores and a plurality of the second air flow micropores are arranged in one-to-one correspondence.

[0022] The earphone cup structure for improving airtightness, wherein the shape of the installation plate is adapted to the shape of the circuit board, and the circuit board is fitted on the installation plate;

[0023] The length and width dimensions of the opening of the installation groove are larger than the length and width dimensions of the installation plate.

[0024] The earphone cup structure for improving airtightness, wherein fixing studs are arranged on the circuit board, one end of each fixing stud penetrates through the circuit board and is in threaded rotational connection with the installation plate.

[0025] The earphone cup structure for improving airtightness, wherein the cover plate is arranged along a radian adapted to the housing;

[0026] A control panel and a power interface are fitted on the cover plate, and the control panel includes a plurality of control buttons;

[0027] The control panel and the power interface are electrically connected to the circuit board.

[0028] The earcup structure for improving the sealing performance, wherein the earcup structure for improving the sealing performance further includes:

[0029] An earpad, which is sleeved on the edge of the housing corresponding to the side of the accommodation cavity, and the earpad covers the speaker.

[0030] A headphone, wherein the headphone includes the above-mentioned earcup structure for improving the sealing performance.

[0031] The beneficial effects of the present utility model are as follows: by providing an integrally formed mounting groove on the housing, placing a circuit board in the mounting groove, and placing a speaker in the accommodation cavity of the housing, the setting of the traditional baffle is cancelled, ensuring the integrity and sealing performance of the accommodation cavity. The noise isolation effect is improved by reducing the mounting gap. The mounting groove is covered by a cover plate to form a second noise isolation mechanism, which further improves the noise isolation performance while ensuring the aesthetic appearance of the earcup and improves the noise isolation effect. Description of the Drawings

[0032] Figure 1 is a cross-sectional view of the earcup structure for improving the sealing performance of the present utility model;

[0033] Figure 2 is a front view of the earcup structure for improving the sealing performance of the present utility model.

[0034] In Figures 1 to 2 : 100, housing; 110, accommodation cavity; 120, mounting groove; 130, mounting plate; 131, snap ring; 132, support block; 133, first air micropores; 200, cover plate; 210, control panel; 211, control buttons; 220, power interface; 300, speaker; 310, substrate; 311, second air micropores; 400, circuit board; 410, fixing studs; 500, earpad. Detailed Embodiments

[0035] To make the objectives, technical solutions and effects of the present utility model clearer and more definite, the following further describes the present utility model in detail with reference to the accompanying drawings and by way of examples. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0036] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture (as shown in the attached drawings). If the specific posture changes, the directional indications will also change accordingly.

[0037] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the said features. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0038] In the prior art, taking the publicly disclosed CN112511936A - head - mounted earphone and ear cup as an example, the circuit board is arranged inside the earphone housing. The baffle member receives the housing and the ear pad on both sides respectively. The housing is fixed on the baffle by a snap - fit method, and there are certain gaps at the snap - fit parts. In addition, in earphones with a button adjustment function, the buttons arranged on the housing also need to be installed through holes, which leads to multiple gaps corresponding to the sound cavity, resulting in a poor noise isolation effect of the ear cup structure.

[0039] Based on the above problems in the prior art, the present utility model provides an ear cup structure for improving the sealing performance, as Figure 1 shown. The ear cup structure for improving the sealing performance includes: a housing 100, on one side of the housing 100, there is a receiving cavity 110, on the other side of the housing 100, there is an installation groove 120 integrally formed with the housing 100, and the inner side of the installation groove 120 is recessed towards the side of the receiving cavity 110; a cover plate 200, the cover plate 200 is detachably snapped at the opening of the installation groove 120; a speaker 300, the speaker 300 is arranged in the receiving cavity 110; a circuit board 400, the circuit board 400 is arranged in the installation groove 120.

[0040] The present utility model sets an integrally formed installation groove 120 on the housing 100, places the circuit board 400 in the installation groove 120, and places the speaker 300 in the receiving cavity 110 of the housing 100, cancels the setting of the traditional baffle, ensures the integrity and sealing performance of the receiving cavity 110, improves the noise isolation effect by reducing the installation gaps. The installation groove 120 is covered by the cover plate 200 in a snap - fit manner to form a second noise isolation mechanism, further improves the noise isolation performance while ensuring the aesthetic appearance of the ear cup, and improves the noise isolation effect.

[0041] In the above embodiments, as Figure 1 shown, the main body of the earcup structure for improving the sealing performance of the present utility model is composed of a housing 100, a cover plate 200, a speaker 300, and a circuit board 400. Among them, the housing 100 is an integrally formed member, specifically a semi-elliptical bowl shape, and can be made of plastic or synthetic metal materials during actual setting. The interior of the housing 100 is hollowly arranged. For the convenience of description, in this embodiment, this hollow part is named the accommodation cavity 110. On the other side of the housing 100, there is an installation groove 120 provided. The installation groove 120 is a pre-set plastic structure when the housing 100 is formed, and its groove wall and bottom are integrally formed with the housing 100. The interior of the installation groove 120 is recessed toward the side of the accommodation cavity 110.

[0042] In this embodiment, the earcup structure for improving the sealing performance of the present utility model is applied to a multifunctional headphone, so it should have the functions of sound generation and function adjustment. Specifically, the speaker 300, as the sound generation function component of the earcup, should be arranged in the accommodation cavity 110 of the housing 100, so that the accommodation cavity 110 forms a sound cavity corresponding to the human ear; the circuit board 400, as the control function component, is arranged in the installation groove 120 of the housing 100, and the circuit board 400 is electrically connected or signal-connected to the speaker 300, so as to form the adjustment of the function parameters of the speaker 300 and circuit support, etc.

[0043] In this embodiment, in order to ensure the aesthetic appearance of the earcup structure for improving the sealing performance and further improve the sealing performance of the above-mentioned sound cavity, a cover plate 200 is also provided that is buckled at the opening of the installation groove 120. The cover plate 200 covers the circuit board 400 in the installation groove 120 and makes the installation groove 120 form a sound insulation cavity. Since the installation groove 120 is integrally formed with the housing 100, the installation gap between the cover plate 200 and the installation groove 120 does not affect the sealing performance of the accommodation cavity 110. Instead, a sound insulation cavity structure is formed through the installation groove 120 and the cover plate 200, which can achieve a better noise isolation effect.

[0044] In another feasible embodiment of the present utility model, as Figure 1As shown in the figure, for ease of description, the bottom plate structure of the inner bottom of the installation groove 120 is named the installation plate 130. The installation plate 130 is arranged flat. When specifically assembling, the substrate 310 of the above-mentioned speaker 300 is fixedly arranged on one side of the installation plate 130 corresponding to the accommodation cavity 110, while the circuit board 400 is fixedly arranged on one side of the installation plate 130 corresponding to the cover plate 200. In some embodiments, the circuit board 400 and the speaker 300 can be electrically connected. In this case, a wire passing hole needs to be opened on the installation plate 130. Since the circuit board 400 is fixed on the installation plate 130, the wire passing hole can be covered after the assembly is completed, and the sealing performance of the above-mentioned accommodation cavity 110 is not affected. In other embodiments, the circuit board 400 and the speaker 300 can be signal-connected to control the parameter change of the speaker 300 correspondingly when adjusting the signal through the control circuit board 400. Those skilled in the art can set according to the actual situation, and the present application does not limit this.

[0045] Further, as Figure 1 shown, for the production and assembly of the earphone structure for improving the sealing performance as described above, in this embodiment, a snap ring 131 is further arranged on one side of the installation plate 130 corresponding to the accommodation cavity 110. The snap ring 131 and the installation plate 130 can be integrally formed, or installed by means of bonding, clamping, etc. The inner hole of the snap ring 131 is adapted to the shape of the substrate 310 of the speaker 300. During actual assembly, the substrate 310 of the speaker 300 can be directly sleeved inside the snap ring 131 to realize the installation and fixation of the speaker 300. This installation method is not only convenient for accurately positioning the speaker 300, but also convenient for rapid assembly, which is beneficial to improving production efficiency.

[0046] More specifically, as Figure 1 shown, since most of the speakers 300 in the head-mounted earphones are moving coil speakers 300, the sound quality of such speakers 300 is closely related to the space and air pressure on both sides of the speakers 300. Therefore, in order to realize more accurate position installation of the speakers 300, in this embodiment, a support block 132 is further arranged on one side of the installation plate 130 corresponding to the accommodation cavity 110. The support block 132 is located inside the snap ring 131 and is fixedly connected to the snap ring 131. During actual installation, the staff pushes the substrate 310 of the speaker 300 into the snap ring 131 until it reaches the position corresponding to the abutment with the support block 132, forming a limit on the installation position and installation angle of the speaker 300, and the effects of rapid installation and accurate installation can be achieved, which is beneficial to improving product quality.

[0047] In this embodiment, the shape of the support block 132 can be set in various ways according to actual installation requirements. For example, a plurality of support blocks 132 arranged in a circular array can be set. In this embodiment, a corresponding anti-fooling structure can also be set on the substrate 310 of the speaker 300 to achieve a more accurate installation effect. The support block 132 can also be set in a circular structure to form a stepped installation structure with the snap ring 131. In this embodiment, the substrate 310 of the speaker 300 can have a larger contact area with the support block 132 to ensure the stability of the installation of the speaker 300.

[0048] In another feasible implementation manner of the present utility model, as Figure 1 shown, in order to enable the diaphragm of the speaker 300 to obtain a larger vibration amplitude and thus achieve a better sound effect, in this embodiment, a number of first air micropores 133 are also provided through the mounting plate 130. Correspondingly, a number of second air micropores 311 are provided through the substrate 310 of the above-mentioned speaker 300. The first air micropores 133 and the second air micropores 311 are arranged in one-to-one correspondence. During actual operation, the first air micropores 133 and the second air micropores 311 are used to improve the air pressure on both sides of the diaphragm of the speaker 300, thereby avoiding the situation where the vibration amplitude of the diaphragm is affected by air pressure, resulting in sound distortion.

[0049] In another feasible implementation manner of the present utility model, as Figure 1 and Figure 2 shown, the shape of the mounting plate 130 in the mounting groove 120 is preferably set to be adapted to the shape of the circuit board 400, and the length and width dimensions of the opening of the mounting groove 120 should be greater than the length and width dimensions of the mounting plate 130. The wall plate between the opening of the mounting groove 120 and the position of the mounting plate 130 is smoothly transitioned with a certain arc. Such a setting can facilitate the installation of the circuit board 400. Since the shape of the mounting plate 130 is adapted to the shape of the circuit board 400, the installer can directly push the circuit board 400 along the opening of the mounting groove 120 to the position where it fits with the mounting plate 130. Under the guiding action of the smoothly transitioned wall plate, the relative positions of the circuit board 400 and the mounting plate 130 are finally determined, thereby achieving the effects of accurate installation and rapid installation.

[0050] In this embodiment, fixing studs 410 are also provided on the above-mentioned circuit board 400. Correspondingly, screw holes are preset at the corresponding positions on the mounting plate 130. One end of the fixing stud 410 penetrates through the circuit board 400 and is then screwed together with the screw hole. The other end of the fixing stud 410 forms a limit for the circuit board 400, and the circuit board 400 can be firmly locked on the mounting plate 130, thereby avoiding the circuit board 400 from shaking during the use of the earphone structure for improving the sealing performance and preventing abnormal noise from affecting the sound effect of the speaker 300.

[0051] In another feasible implementation manner of the present utility model, asFigure 1 As shown, when the cover plate 200 is actually installed, the shape of the cover plate 200 should be preset so that the radian of the cover plate 200 matches the outer radian of the housing 100, thereby improving the integrated appearance effect of the earphone after the cover plate 200 is buckled and making the product more beautiful.

[0052] In addition, for earphone products with multiple functions, such as Figure 2 As shown, a control panel 210 and a power supply structure are also embedded on the cover plate 200. Among them, several control buttons 211 are arranged on the control panel 210. The control panel 210 is electrically connected to the circuit board 400 arranged in the installation groove 120. By operating the control buttons 211, different current signals on the circuit board 400 can be adjusted, and then the speaker 300 electrically connected to the circuit board 400 can be controlled to perform corresponding function adjustments; the power interface 220 is used for electrical connection with the power supply to provide electrical energy support for the above-mentioned functional components. In some wireless products, a storage battery can also be arranged in the installation groove 120. The storage battery is connected to the circuit board 400 and the power interface 220. In this embodiment, the power interface 220 is used to charge the storage battery.

[0053] In another feasible implementation manner of the present utility model, as Figure 1 As shown, the above-mentioned earphone structure for improving the sealing performance further includes an ear pad 500. The ear pad 500 is a component that actually contacts the user's ear. The ear pad 500 can be specifically set with materials such as cloth and leather, and an elastic sponge structure is filled inside. When specifically set, the ear pad 500 is sleeved on the edge of the housing 100 corresponding to the accommodation cavity 110, and the ear pad 500 covers the speaker 300. During actual use, the ear pad 500 isolates the speaker 300 from the user's ear, which not only does not affect the user's hearing but also can protect the speaker 300.

[0054] Based on the above embodiments, the installation process of the earphone structure for improving the sealing performance of the present utility model is as follows:

[0055] As Figure 1 As shown, first, the installer installs the speaker 300 from the side of the accommodation cavity 110 of the housing 100 into the snap ring 131 and pushes it to the position where the substrate 310 of the speaker 300 abuts against the support block 132 to form a snap fixation of the speaker 300;

[0056] Then, the installer pushes the circuit board 400 from the opening part of the installation groove 120 to the bottom to form a fit with the installation plate 130, and then electrically connects the installation plate 130 to the speaker 300 and further locks it through the fixing stud 410.

[0057] Finally, install other functional components, such as a storage battery, etc., in the installation groove 120, fasten the cover plate 200, so that the cover plate 200 is snap-fitted and fixed to the housing 100, and then install the ear pad 500 on one side of the accommodation cavity 110, thus completing the installation of the earphone cup structure for improving the sealing performance.

[0058] Compared with the prior art, the earphone cup structure for improving the sealing performance of the present utility model improves the sealing performance of the sound cavity (accommodation cavity 110) in the housing 100, reduces the gaps formed by structural installation and button openings, etc., thereby improving the performance of the sound cavity in isolating noise. Components such as the circuit board 400, the control panel 210, and the power interface 220 are arranged on the installation groove 120 and the cover plate 200, which not only does not affect the installation but also enables the cavity structure formed by the installation groove 120 and the cover plate 200 to further form a noise isolation barrier, effectively enhancing the noise isolation effect of the earphone cup.

[0059] Based on the above embodiments, the present utility model further provides a headphone, which includes the earphone cup structure for improving the sealing performance in the above embodiments. The earphone cup structure for improving the sealing performance includes: a housing, on one side of the housing is provided an accommodation cavity, on the other side of the housing is provided an installation groove integrally formed with the housing, and the interior of the installation groove is recessed towards the side of the accommodation cavity; a cover plate, the cover plate is detachably fastened at the opening of the installation groove; a speaker, the speaker is arranged in the accommodation cavity; a circuit board, the circuit board is arranged in the installation groove. The present utility model sets an integrally formed installation groove on the housing, places the circuit board in the installation groove, and places the speaker in the accommodation cavity of the housing, cancels the setting of the traditional baffle, ensures the integrity and sealing performance of the accommodation cavity, improves the noise isolation effect by reducing the installation gaps, and the installation groove is covered by fastening the cover plate, forming a second noise isolation mechanism, further improving the noise isolation performance while ensuring the beautiful appearance of the earphone cup, and improving the noise isolation effect.

[0060] In summary, the present utility model provides an earphone cup structure for improving the sealing performance and a headphone. Among them, the earphone cup structure for improving the sealing performance includes: a housing, on one side of the housing is provided an accommodation cavity, on the other side of the housing is provided an installation groove integrally formed with the housing, and the interior of the installation groove is recessed towards the side of the accommodation cavity; a cover plate, the cover plate is detachably fastened at the opening of the installation groove; a speaker, the speaker is arranged in the accommodation cavity; a circuit board, the circuit board is arranged in the installation groove. The present utility model sets an integrally formed installation groove on the housing, places the circuit board in the installation groove, and places the speaker in the accommodation cavity of the housing, cancels the setting of the traditional baffle, ensures the integrity and sealing performance of the accommodation cavity, improves the noise isolation effect by reducing the installation gaps, and the installation groove is covered by fastening the cover plate, forming a second noise isolation mechanism, further improving the noise isolation performance while ensuring the beautiful appearance of the earphone cup, and improving the noise isolation effect.

[0061] It should be understood that the application of the present utility model is not limited to the above examples. For those of ordinary skill in the art, improvements or modifications can be made according to the above description, and all such improvements and modifications shall fall within the protection scope of the appended claims of the present utility model.

Claims

1. An earmuff structure for improving sealing performance, characterized in that: The earmuff structure for improving sealing performance comprises: A housing, wherein a receiving cavity is disposed on one side of the housing, and a mounting groove is disposed on the other side of the housing, wherein the interior of the mounting groove is recessed toward one side of the receiving cavity; A cover plate, the cover plate is detachably buckled at the opening of the mounting groove; A speaker, wherein the speaker is disposed in the accommodating cavity; A circuit board is arranged in the mounting groove.

2. The earmuff structure for improving sealing performance according to claim 1, characterized in that: The installation groove includes a straight installation plate; The base plate of the speaker is fixedly arranged on a side of the mounting plate corresponding to the accommodating cavity; The circuit board is fixedly arranged on a side of the mounting plate corresponding to the cover plate; The circuit board is connected to the speaker via a circuit / signal.

3. The earmuff structure for improving sealing performance according to claim 2, characterized in that: A clamping ring is arranged on one side of the mounting plate corresponding to the accommodating cavity, and the speaker is embedded in the clamping ring.

4. The earmuff structure for improving sealing performance according to claim 3, characterized in that: A support block is provided on one side of the mounting plate corresponding to the accommodating cavity, and the support block is located inside the clamping ring and fixedly connected to the clamping ring; The support blocks are provided in a plurality of annular arrays; or, the support blocks are annular.

5. The earmuff structure for improving sealing performance according to claim 2, characterized in that: The mounting plate is provided with a plurality of first air flow micro-holes; The substrate of the speaker is provided with a plurality of second air flow micro holes; The plurality of first air flow micro-holes and the plurality of second air flow micro-holes are arranged in one-to-one correspondence.

6. The earmuff structure for improving sealing performance according to claim 2, characterized in that: The shape of the mounting plate is adapted to the shape of the circuit board, and the circuit board is fitted on the mounting plate; The length and width of the opening of the mounting groove are greater than the length and width of the mounting plate.

7. The earmuff structure for improving sealing performance according to claim 6, characterized in that: A fixing stud is arranged on the circuit board, one end of which passes through the circuit board and is rotatably connected with the mounting plate through a thread.

8. The earmuff structure for improving sealing performance according to claim 1, characterized in that: The cover plate is arranged along an arc adapted to the shell; A control panel and a power interface are embedded on the cover plate, and the control panel includes a plurality of control buttons; The control panel and the power interface are connected to the circuit board through a circuit.

9. The earmuff structure for improving sealing performance according to claim 1, characterized in that: The earmuff structure for improving sealing performance further comprises: An ear pad, wherein the ear pad cover is arranged on an edge of the shell corresponding to one side of the accommodating cavity, and the ear pad covers the speaker arrangement.

10. A headset, characterized in that: The headset comprises the earmuff structure with improved sealing performance as claimed in any one of claims 1 to 9.

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