Spliced circuit board with blind holes and buried holes

Abstract

The utility model discloses a combined circuit board with blind holes and buried holes, which relates to the technical field of circuit boards and comprises a circuit board body, a connecting block is arranged on one side of the circuit board body, the circuit board body is fixedly connected with another circuit board body through the connecting block, and a first stamp hole and a second stamp hole are arranged on two sides of the connecting block. The circuit board body comprises a top-layer circuit board, an inner-layer circuit board and a bottom-layer circuit board, the inner-layer circuit board is arranged between the top-layer circuit board and the bottom-layer circuit board, a blind hole part is formed in the top of the top-layer circuit board, and a buried hole part is formed in the inner-layer circuit board; according to the utility model, the circuit board body can be ensured to have certain bearing strength after being jointed, the condition that the jointed board is broken during subsequent processing is avoided, and meanwhile, only three groups of stamp holes are arranged at the joint of the circuit board, so that the generation quantity of burrs during subsequent board splitting is reduced, and the quality of the circuit board body after board splitting is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a combined circuit board with blind vias and buried vias. Background Art

[0002] For circuit boards with relatively small internal dimensions in electronic products, a splicing type circuit board is generally used. Circuit board splicing is a common circuit board manufacturing process. Its main purpose is to form an overall board combination by arranging multiple circuit boards on a large-sized board, so as to improve the space utilization rate of materials, improve production efficiency and reduce costs.

[0003] Currently, for small-sized PCB boards with irregular shapes, a splicing structure with a postage hole structure is usually used for processing to reduce processing costs and material costs. However, when the postage holes are used for separating the combined circuit board, the position of the fracture surface is difficult to control, and burr structures will be generated on the side of the circuit board after separation, thus having a certain impact on the finished product quality of the circuit board. Therefore, there is an urgent need for a combined circuit board with blind vias and buried vias to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the disadvantages existing in the prior art, and to provide a combined circuit board with blind vias and buried vias. Its advantages are that it can ensure that the circuit board body has a certain bearing strength after splicing, avoiding the situation of broken combined boards during subsequent processing. At the same time, the number of postage holes at the connection of the circuit boards is only three groups, thus reducing the generation amount of burrs during subsequent separation and ensuring the quality of the circuit board body after separation.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A combined circuit board with blind vias and buried vias includes a circuit board body. A connecting block is arranged on one side of the circuit board body. The circuit board body is fixedly connected to another circuit board body through the connecting block. First postage holes and second postage holes are arranged on both sides of the connecting block.

[0007] The circuit board body includes a top-layer circuit board, an inner-layer circuit board and a bottom-layer circuit board. The inner-layer circuit board is arranged between the top-layer circuit board and the bottom-layer circuit board. A blind via part is opened at the top of the top-layer circuit board, and a buried via part is opened in the inner-layer circuit board.

[0008] Through the above technical scheme: it can ensure that the circuit board body has a certain bearing strength after splicing, avoiding the situation of broken combined boards during subsequent processing.

[0009] The utility model is further arranged such that the number of the second postage holes is two groups, and the two groups of second postage holes are arranged on both sides of the first postage holes.

[0010] Through the above technical solutions, the stress point can be concentrated on the thinnest connection part around the first perforation in the middle, making the board splitting more labor-saving.

[0011] The present utility model is further configured such that the circuit board body is fixedly connected with a connection board through a connection block, and positioning holes are formed in the outer wall of the top of the connection board.

[0012] Through the above technical solutions, multiple groups of small circuit board bodies can be combined into a combined board with a larger specification, thereby facilitating subsequent SMT chip mounting processing of the combined circuit board.

[0013] The present utility model is further configured such that the first perforations and the second perforations are equally divided and arranged on one side of the circuit board body and the connection block.

[0014] Through the above technical solutions, since the side of the circuit board body is the same as the midlines of the first perforations and the second perforations, during the subsequent board splitting process, the first perforations and the second perforations can be easily broken and separated.

[0015] The present utility model is further configured such that the first perforations and the second perforations both include arc edges and arcuate edges, and the arcuate edges are arranged in the middle of two groups of arc edges.

[0016] Through the above technical solutions, the length of a single group of perforations is thus enlarged, the contact area between the perforations and the connection block and the circuit board body is made larger, and the connection strength between the circuit board body and the connection block is ensured.

[0017] The present utility model is further configured such that the inner diameter lengths of the first perforations and the second perforations both gradually decrease from both ends to the center direction.

[0018] Through the above technical solutions, the connection area between both sides of the perforations and the connection block and the circuit board body is further improved, and the stability of the entire combined circuit board is further enhanced.

[0019] The present utility model is further configured such that one group of arc edges of the second perforations is semi-open, and the connection block is separated from the circuit board body through the semi-open arc edges.

[0020] Through the above technical solutions, the semi-open arc edges in the second perforations do not generate burrs during the board splitting process, thereby reducing the generation amount of burrs.

[0021] The present utility model is further configured such that the total number of the first perforations and the second perforations is three groups, and two groups of connection blocks are arranged on one side of the circuit board body.

[0022] Through the above technical solutions, the two sets of connecting blocks can play a strengthening role, enabling the connection between the two sets of circuit board bodies to be more firm.

[0023] The beneficial effects of the present utility model are as follows:

[0024] For the present utility model, it can ensure that the circuit board body has a certain bearing strength after the panel is assembled, avoiding the situation of the panel breaking during subsequent processing. Specifically, by providing connecting blocks, first postage stamp holes, and second postage stamp holes, since both the first postage stamp holes and the second postage stamp holes include arc edges and curved edges, and the curved edges are arranged in the middle of the two sets of arc edges, the length of a single set of postage stamp holes is expanded, making the contact area between the postage stamp holes, the connecting blocks, and the circuit board body larger, ensuring the connection strength between the circuit board body and the connecting blocks. Moreover, the inner diameter lengths of the first postage stamp holes and the second postage stamp holes gradually decrease from both ends to the center direction, further enhancing the connection area between the two sides of the postage stamp holes, the connecting blocks, and the circuit board body, and further improving the stability of the entire combined circuit board.

[0025] For the present utility model, it reduces the generation amount of burrs during subsequent panel separation, ensuring the quality of the circuit board body after panel separation. Specifically, by providing first postage stamp holes, second postage stamp holes, arc edges, and curved edges, since the total number of the first postage stamp holes and the second postage stamp holes provided on both sides of the connecting block is three, and one set of arc edges of the two sets of second postage stamp holes is semi-open, during the subsequent panel separation process, the semi-open arc edges in the second postage stamp holes will not generate burrs, thereby reducing the generation amount of burrs. At the same time, during the panel separation process, the stress point is concentrated on the thinnest connection part around the first postage stamp hole in the middle, making the panel separation more labor-saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. 1 is a schematic diagram of the overall front structure of a combined circuit board with blind vias and buried vias proposed by the present utility model;

[0027] Figure 2 FIG. 2 is a schematic diagram of the overall front structure of a combined circuit board with blind vias and buried vias proposed by the present utility model; Figure 1 FIG. 3 is an enlarged schematic diagram of the structure at A in FIG. 2 of a combined circuit board with blind vias and buried vias proposed by the present utility model;

[0028] Figure 3 FIG. 4 is a schematic diagram of the structure of a single circuit board body of a combined circuit board with blind vias and buried vias proposed by the present utility model after the board is separated;

[0029] Figure 4 FIG. 5 is a schematic diagram of the semi-sectional view structure of a single circuit board body of a combined circuit board with blind vias and buried vias proposed by the present utility model.

[0030] In the figure: 1. Circuit board body; 1001. Top-layer circuit board; 1002. Inner-layer circuit board; 1003. Bottom-layer circuit board; 2. Connection board; 3. Connection block; 4. First postage hole; 4001. Arc edge; 4002. Curved edge; 5. Second postage hole; 6. Blind hole part; 7. Buried hole part; 8. Positioning hole. Specific embodiments

[0031] The technical solutions of this patent will be further described in detail below in combination with specific embodiments.

[0032] The embodiments of this patent will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain this patent and should not be construed as a limitation of this patent.

[0033] In the description of this patent, it should be understood that the orientation or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing this patent and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this patent.

[0034] In the description of this patent, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected to", "set" should be understood in a broad sense. For example, it can be fixedly connected and set, or detachably connected and set, or integrally connected and set. For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood according to specific circumstances. Embodiment 1

[0035] Referring to Figures 1-4 , a combined circuit board with blind holes and buried holes, includes a circuit board body 1. A connection block 3 is provided on one side of the circuit board body 1. The circuit board body 1 is fixedly connected to another circuit board body 1 through the connection block 3. First postage holes 4 and second postage holes 5 are provided on both sides of the connection block 3;

[0036] The circuit board body 1 includes a top layer circuit board 1001, an inner layer circuit board 1002, and a bottom layer circuit board 1003. The inner layer circuit board 1002 is disposed between the top layer circuit board 1001 and the bottom layer circuit board 1003. A blind hole portion 6 is formed at the top of the top layer circuit board 1001, and a buried hole portion 7 is formed in the inner layer circuit board 1002, which can ensure that the circuit board body 1 has a certain bearing strength after the panel is assembled, and avoid the situation of the assembled panel breaking during subsequent processing.

[0037] In order to facilitate people to perform the panel splitting work more easily, referring to Figure 2 , the number of the second perforations 5 is two groups, and the two groups of second perforations 5 are arranged on both sides of the first perforation 4, which can make the stress points concentrate on the thinnest connection part around the first perforation 4 located in the middle, making the panel splitting more labor-saving.

[0038] In order to facilitate the subsequent SMT soldering processing of the assembled circuit board, referring to Figure 1 , the circuit board body 1 is fixedly connected with a connecting plate 2 through a connecting block 3. A positioning hole 8 is formed in the top outer wall of the connecting plate 2, which can assemble multiple small circuit board bodies 1 into a larger assembled panel, thus facilitating the subsequent SMT soldering processing of the assembled circuit board.

[0039] In order to ensure the neatness of the side wall of the circuit board body 1 after panel splitting, referring to Figure 2 , the first perforation 4 and the second perforation 5 are equally divided and arranged on one side of the circuit board body 1 and the connecting block 3. Since the side of the circuit board body 1 is the same as the midline of the first perforation 4 and the second perforation 5, during the subsequent panel splitting process, it is very labor-saving to break and separate the first perforation 4 and the second perforation 5. Embodiment 2

[0040] Referring to Figures 1-4 , for a combined circuit board with blind holes and buried holes, compared with Embodiment 1, this embodiment further includes that both the first perforation 4 and the second perforation 5 include an arc edge 4001 and an arc-shaped edge 4002. The arc-shaped edge 4002 is disposed in the middle of the two groups of arc edges 4001. Since both the first perforation 4 and the second perforation 5 include an arc edge 4001 and an arc-shaped edge 4002, and at the same time the arc-shaped edge 4002 is disposed in the middle of the two groups of arc edges 4001, the length of a single group of perforations is expanded, and the contact area between the perforations and the connecting block 3 and the circuit board body 1 is larger, ensuring the connection strength between the circuit board body 1 and the connecting block 3.

[0041] In order to ensure the strength of the entire combined circuit board, referring to Figures 1-2, the inner diameter lengths of the first perforation 4 and the second perforation 5 both gradually decrease from both ends to the central direction, further enhancing the connection area between both sides of the perforations and the connection block 3 and the circuit board body 1, and further improving the stability of the entire combined circuit board.

[0042] In order to reduce the generation amount of burrs during the circuit board splitting process, referring to Figure 2 , one set of arc edges 4001 of the second perforation 5 is semi-open. The connection block 3 is separated from the circuit board body 1 through the semi-open arc edges 4001. The semi-open arc edges 4001 in the second perforation 5 will not generate burrs during the circuit board splitting process, thereby reducing the generation amount of burrs.

[0043] In order to ensure the connection stability between the circuit board body 1 and the connection block 3, referring to Figure 1 , the total number of the first perforations 4 and the second perforations 5 is three groups. Two groups of connection blocks 3 are arranged on one side of the circuit board body 1. The two groups of connection blocks 3 can play a strengthening role and enable the connection between the two groups of circuit board bodies 1 to be more firm.

[0044] Working principle: In this combined circuit board, since both the first perforation 4 and the second perforation 5 include arc edges 4001 and arc-shaped edges 4002, and at the same time the arc-shaped edges 4002 are arranged in the middle of the two groups of arc edges 4001, the length of a single group of perforations is thus expanded, making the contact area between the perforations and the connection block 3 and the circuit board body 1 larger, ensuring the connection strength between the circuit board body 1 and the connection block 3. Moreover, the inner diameter lengths of the first perforation 4 and the second perforation 5 both gradually decrease from both ends to the central direction, further enhancing the connection area between both sides of the perforations and the connection block 3 and the circuit board body 1, and further improving the stability of the entire combined circuit board. Since the total number of the first perforations 4 and the second perforations 5 arranged on both sides of the connection block 3 is three groups, and one set of arc edges 4001 of the two groups of second perforations 5 are all semi-open, during the subsequent circuit board splitting process, the semi-open arc edges 4001 in the second perforation 5 will not generate burrs, thereby reducing the generation amount of burrs. At the same time, during the circuit board splitting process, the stress point is concentrated on the thinnest connection part around the first perforation 4 located in the middle, making the circuit board splitting more labor-saving.

[0045] The above is only the preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. A combined circuit board with blind and buried vias, comprising a circuit board body (1), characterized in that: A connection block (3) is provided on one side of the circuit board body (1), the circuit board body (1) is fixedly connected to another circuit board body (1) via the connection block (3), and a first stamp hole (4) and a second stamp hole (5) are provided on both sides of the connection block (3); The circuit board body (1) comprises a top circuit board (1001), an inner circuit board (1002) and a bottom circuit board (1003); the inner circuit board (1002) is arranged on the top circuit board (1001) and the bottom circuit board (1003); a blind hole portion (6) is provided on the top of the top circuit board (1001); and a buried hole portion (7) is provided in the inner circuit board (1002).

2. A combined circuit board with blind and buried vias according to claim 1, characterized in that: The number of the second stamp holes (5) is two groups, and the two groups of the second stamp holes (5) are arranged on both sides of the first stamp hole (4).

3. A combined circuit board with blind and buried vias according to claim 1, characterized in that: The circuit board body (1) is fixedly connected to a connecting plate (2) via the connecting block (3); a positioning hole (8) is provided on the top outer wall of the connecting plate (2).

4. A combined circuit board with blind and buried vias according to claim 1, characterized in that: The first stamp hole (4) and the second stamp hole (5) are equally spaced and arranged on one side of the circuit board body (1) and the connecting block (3).

5. The combined circuit board with blind and buried vias according to claim 1, characterized in that: The first stamp hole (4) and the second stamp hole (5) both comprise arc edges (4001) and arc-shaped edges (4002), and the arc-shaped edges (4002) are arranged in the middle of the two groups of arc edges (4001).

6. The combined circuit board with blind and buried vias according to claim 1, characterized in that: The inner diameter lengths of the first stamp hole (4) and the second stamp hole (5) both gradually decrease from both ends to the center.

7. The combined circuit board with blind and buried vias according to claim 5, characterized in that: A group of arc edges (4001) of the second stamp hole (5) are semi-open, and the connection block (3) is separated from the circuit board body (1) by the semi-open arc edges (4001).

8. The combined circuit board with blind and buried vias according to claim 5, characterized in that: The number of the first stamp holes (4) and the second stamp holes (5) is three groups in total, and two groups of the connection blocks (3) are provided on one side of the circuit board body (1).

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