Electronic component fast assembly module and flexible circuit board

Abstract

The utility model relates to an electronic component quick-assembly module and a flexible circuit board. The quick-assembly module comprises an electronic component; the quick mounting seat comprises a body, a mounting part and a fixing groove, the body is provided with a first side face, a second side face and a peripheral side face, the mounting part is arranged on the peripheral side face of the body, the body is detachably connected with the circuit board through the mounting part, and the fixing groove is formed in the first side face and used for mounting an electronic element; after the quick-mounting base is connected with the circuit board, the first side face is in butt joint with the circuit board, the second side face is arranged away from the circuit board, and the electronic element can be electrically connected with the circuit board. The electronic component can be quickly disassembled, the electronic component cannot be damaged in the mounting process of quick disassembly, electric connection between the electronic component and the circuit board is directly achieved, the mounting process is simple, the electronic component can be conveniently disassembled for maintenance, and the stability of a product is improved; and after disassembly, the fast assembly module and the FPC are independent modules, and can be independently processed and produced and then assembled, so that the overall cost is saved.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to a quick installation module for electronic components and a flexible printed circuit board. Background Art

[0002] In recent years, as electronic devices have become smaller and more compact, both in the field of industrial equipment and consumer equipment, circuit boards and electronic components have been designed to be thinner, lighter, and smaller. A flexible printed circuit board (FPC for short), made of polyimide or polyester film as the substrate, is a highly reliable and extremely flexible printed circuit board, with characteristics such as high wiring density, light weight, thin thickness, and good bendability. It can be arranged arbitrarily according to the requirements of the spatial layout. The FPC can greatly reduce the volume and weight of electronic products and meet the needs of the development of electronic products towards high density, miniaturization, and high reliability. Therefore, the FPC has been widely used in fields or products such as aerospace, military, and mobile communications. In related technologies, electronic components are installed on the FPC by welding. After the welded electronic components fail, they can only be replaced and the replacement process is complex, making the repair of parts on the FPC cumbersome and increasing the use cost. Summary of the Utility Model

[0003] Based on this, in view of the above technical problems, it is necessary to provide a quick installation module for electronic components and a flexible printed circuit board, which are convenient for the inspection and replacement of electronic components, optimize the process, and reduce the cost of the flexible printed circuit board.

[0004] On the one hand, a quick installation module for electronic components is provided. The quick installation module includes:

[0005] An electronic component; and

[0006] A quick installation seat, including a body, an installation part, and a fixing groove. The body has a first side surface, a second side surface opposite to the first side surface, and a circumferential side surface disposed between the first side surface and the second side surface. The installation part is disposed on the circumferential side surface of the body. The body is detachably connected to the circuit board through the installation part. The fixing groove is disposed on the first side surface and is used for installing the electronic component;

[0007] Wherein, after the quick installation seat is connected to the circuit board, the first side surface is docked with the circuit board, the second side surface faces away from the circuit board, and the electronic component can be electrically connected to the circuit board.

[0008] In one of the embodiments, the electronic component is a temperature sensing component.

[0009] In one embodiment, an operation part is provided on the second side surface, and the operation part is used to receive an external force to connect or disconnect the installation part from the circuit board.

[0010] In one embodiment, the quick installation module further includes an adhesive layer provided on the second side surface. The adhesive layer is made of a material that melts when heated, and the melting temperature of the adhesive layer is lower than the maximum temperature that the circuit board can withstand.

[0011] In one embodiment, the quick installation module further includes at least two contact members. At least two of the contact members are provided on the side of the electronic component facing the circuit board, and the contact members are used to electrically connect the electronic component to the circuit board.

[0012] On the other hand, a flexible circuit board is provided, including:

[0013] A board body with an installation position provided thereon; and

[0014] The quick installation module as described above, and the quick installation module is detachably provided at the installation position.

[0015] In one embodiment, the flexible circuit board further includes a support disk and a quick installation frame connected to the support disk. The support disk is used to support the quick installation module. The quick installation frame is provided with a docking part, and the docking part is detachably connected to the installation part. After the quick installation module is connected to the flexible circuit board, the quick installation frame is sleeved outside the quick installation module, and the support disk abuts against the first side surface.

[0016] In one embodiment, an electrical connection part is provided on the board body or the support disk. The main body can be detachably connected to the flexible circuit board by rotation. The shape of the electrical connection part matches that of the first side surface, and the electronic component can be electrically connected to the electrical connection part at any rotation angle.

[0017] In one embodiment, the electrical connection part includes at least two electrical contact rings, and the electrical contact rings correspond to at least two contact members provided on one side of the electronic component one by one. In the radial direction, each of the electrical contact rings is nested with each other at intervals.

[0018] In one embodiment, the electrical connection part uses a single-sided double-contact material; the electrical connection part further includes at least two leads, and each lead corresponds to each electrical contact ring one by one. The leads are used to connect the electrical contact rings and external components.

[0019] The electronic component is installed on the quick - mounting base. The detachable mounting part is arranged on the circumferential side surface. The quick disassembly of the electronic component is realized through the detachable connection between the quick - mounting base and the FPC. Since the electronic component is arranged in the fixing groove on the first side surface, the installation and disassembly processes of the quick - mounting base and the FPC will not damage the electronic component. After the electronic component is arranged in the fixing groove on the first side surface, it is electrically connected to the circuit board, directly realizing the electrical connection between the electronic component and the circuit board. The installation process is simple, facilitating the disassembly of the electronic component for maintenance and improving the stability of the product. At the same time, after disassembly, the quick - mounting module and the FPC are independent modules respectively, which can be processed and produced independently and then assembled, saving the overall cost. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of the traditional technology.

[0021] Figure 2 It is a schematic diagram of the quick - mounting module arranged on the flexible circuit board in an embodiment of the present application.

[0022] Figure 3 It is a first - perspective exploded structural diagram of the quick - mounting module and the flexible circuit board in an embodiment of the present application.

[0023] Figure 4 It is a second - perspective exploded structural diagram of the quick - mounting module and the flexible circuit board in an embodiment of the present application.

[0024] Figure 5 It is a schematic structural diagram of the electrical connection part in an embodiment of the present application.

[0025] Explanation of the reference numerals in the drawings:

[0026] 100, quick - mounting module; 200, FPC; 110, quick - mounting base; 111, first side surface; 112, second side surface; 113, mounting part; 114, circumferential side surface; 115, operation part; 116, fixing groove; 120, NTC component; 130, glue - mounting layer; 121, contact part; 210, support plate; 211, electrical connection part; 2111, electrical contact; 2112, loop lead; 220, quick - mounting frame; 221, docking part. Detailed Description of the Embodiment

[0027] To make the above - mentioned objects, features, and advantages of the present application more obvious and understandable, the following detailed description of the specific embodiments of the present application is provided in conjunction with the drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0029] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0030] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "coupled", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0032] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0033] Refer to Figure 2 , Figure 2 Fig. shows a schematic diagram of the quick-installation module 100 provided in an embodiment of the present application disposed on a flexible circuit board. The quick-installation module 100 provided in an embodiment of the present application can be integrally detachably connected to the circuit board, especially a flexible circuit board (Flexible Printed Circuit board, hereinafter referred to as FPC, and described by taking FPC as an example).

[0034] Refer to Figure 3 、 4 , Figure 3 、 4 Fig. shows an exploded structural schematic diagram of the quick-installation module 100 provided in an embodiment of the present application disposed on a flexible circuit board. The quick-installation module 100 includes an electronic component and a quick-installation seat 110. The quick-installation seat 110 includes a body, a mounting portion 113 and a fixing groove 116. The body has a first side surface 111, a second side surface 112 disposed opposite to the first side surface 111, and a peripheral side surface 114 disposed between the first side surface 111 and the second side surface 112. The mounting portion 113 is disposed on the peripheral side surface 114 of the body. The body is detachably connected to the FPC 200 through the mounting portion 113. The fixing groove 116 is disposed on the first side surface 111 and is used for mounting the electronic component. Wherein, after the quick-installation seat 110 is connected to the FPC 200, the first side surface 111 is docked with the FPC 200, the second side surface 112 is disposed away from the FPC 200, and the electronic component can be electrically connected to the FPC 200.

[0035] The electronic component is installed on the quick-installation seat 110. The mounting portion 113 is disposed on the peripheral side surface 114. The quick disassembly of the electronic component is realized through the detachable connection between the quick-installation seat 110 and the FPC 200. Since the electronic component is disposed in the fixing groove 116 on the first side surface 111, the installation and disassembly process of the quick-installation seat 110 and the FPC 200 will not damage the electronic component. After the electronic component is disposed in the fixing groove 116 on the first side surface 111 and then electrically connected to the circuit board, the installation process is simple, it is convenient to disassemble the electronic component for maintenance, and the stability of the product is improved; at the same time, after disassembly, the quick-installation module 100 and the FPC 200 are respectively independent modules, and can be independently processed and produced and then assembled, saving the overall cost.

[0036] Specifically, the quick - mounting base 110 is cylindrical. The quick - mounting base 110 is detachably connected to the FPC 200 by rotation. The first side 111 and the second side 112 are two opposite sides of the cylindrical quick - mounting base 110, and the circumferential side 114 is arranged around the outer periphery connecting the first side 111 and the second side 112. In an alternative embodiment, the mounting portion 113 is an external thread arranged in a spiral shape on the circumferential side 114. Correspondingly, an internal thread is provided on the FPC 200 or on an external structure docked with the mounting portion 113.

[0037] The quick - mounting base 110 can be a cylinder, and the quick - mounting base 110 has a center line. When the quick - mounting base 110 is disassembled, it rotates around the center line. The fixing groove 116 is located at the middle position of the first side 111. Preferably, the middle position is the position where the above - mentioned center line can pass through, so that after the quick - mounting base 110 rotates and is installed, the fixing groove 116 and the electronic component are basically located at the middle position after rotation.

[0038] In one embodiment, the electronic component is a temperature - sensing component. As a preferred embodiment, the electronic component is an NTC (Negative Temperature Coefficient) component. In the traditional technology, as Figure 1 shown, when connecting the NTC component 120 to the FPC 200, the installation method is to solder - fix the NTC component 120 on the pad of the FPC 200, for example, by the way of reflow soldering, and finally complete the temperature acquisition function through the circuit aggregation to the sampling module of the BMS. Since the circuit of the NTC component 120 and the FPC 200 is connected by solder wire, when the NTC component 120 is damaged or fails, it cannot be quickly and conveniently disassembled for fault troubleshooting. The destructive disassembly process is likely to damage the component. In most cases, the entire FPC 200 needs to be replaced, making the part repair very cumbersome and the repair cost high. In this application, the electronic component is the NTC component 120, the NTC component 120 is arranged on the quick - mounting base 110, and the quick - disassembly installation process operates the quick - mounting base 110, adopting non - destructive disassembly, which will not damage the NTC component 120 and also makes the setting position of the NTC component 120 on the FPC 200 more flexible. The following takes the electronic component as the NTC component 120 as an example for description.

[0039] In one embodiment, the quick - mounting module 100 further includes at least two contact members 121. The at least two contact members 121 are arranged on the side of the electronic component facing the circuit board, and the contact members 121 are used to electrically connect the electronic component and the circuit board.

[0040] The NTC component 120 can be wholly or partly received in the fixing groove 116. The NTC component 120 received in the fixing groove 116 has at least one docking surface exposed at the opening of the fixing groove 116. Two contact members 121 are connected to the docking surface. The contact members 121 are used to electrically connect the NTC component 120 to the FPC 200. As an alternative embodiment, the contact members 121 are metal sheets attached to the docking surface. The docking surface is the lower surface of the NTC component 120. The two metal sheets are spaced apart on both sides of the docking surface. After attachment, the metal sheets are flush with or slightly protrude from the outer surface of the first side surface 111, improving the tightness after the electrical connection between the NTC component 120 and the FPC 200.

[0041] In one embodiment, an operation part 115 is provided on the second side surface 112. The operation part 115 is used to receive an external force to connect or disconnect the mounting part 113 from the circuit board. During installation, the external force can enable the first side surface 111 to achieve a zero-gap fit with the FPC 200. The operation part 115 can be operated by a user or a tool. After the operation part 115 receives an external force, it can be detached from or mounted to the FPC 200. For example, when the operation part 115 receives an external force, the main body rotates forward or backward along the thread to be connected to or disconnected from the FPC 200.

[0042] The operation part 115 is located at the middle position of the second side surface 112. Preferably, the middle position is the position through which the above-mentioned center line can pass, facilitating the docking and operation of the operation part 115 by a tool or a user. After the main body rotates and the installation is completed, the operation part 115 is basically located at the middle position after rotation, which also facilitates the docking and operation of the operation part 115 when the quick-installation base 110 is disassembled next time.

[0043] As an alternative embodiment, as Figure 3 shown, the operation part 115 is a groove-shaped structure. The shape of the groove matches the shape of the end of the tool, such as a flat-slot or a cross-slot, so that the end of the tool is connected to the groove-shaped operation part 115 in a matching manner.

[0044] Specifically, the groove-shaped operation part 115 is not communicated with the fixing groove 116, that is, the sum of the depths of the groove-shaped operation part 115 and the fixing groove 116 is less than the height of the main body, preventing the electronic components in the fixing groove 116 from being affected when the operation part 115 is operated.

[0045] As an alternative embodiment, the operation part 115 is a convex structure. The convex part can be clamped by a clamping tool or operated by a user. In particular, the convex structure can be folded and flush with the surface of the second side surface 112 to avoid interfering with other external structures.

[0046] As Figures 2 to 4As shown in the figure, the FPC 200 includes a board body and the above-mentioned quick installation module 100. An installation position is provided on the board body, and the quick installation module 100 is detachably arranged at the installation position. In one embodiment, the FPC 200 further includes a support disk 210 and a quick installation frame 220 connected to the support disk 210. The support disk 210 is used to support the quick installation module 100. The quick installation frame 220 is provided with a docking portion 221, and the docking portion 221 is detachably connected to the installation portion 113. After the quick installation module 100 is connected to the FPC 200, the quick installation frame 220 is sleeved outside the quick installation module 100, and the support disk 210 abuts against the first side surface 111. The support disk 210 and the quick installation frame 220 form the above-mentioned installation position.

[0047] As an alternative embodiment, corresponding to the main body shape of the quick installation seat 110, the quick installation frame 220 is cylindrical. A through hole with the same shape as the main body outline is provided in the center of the quick installation frame 220, and the quick installation seat 110 is detachably arranged in the through hole. Preferably, the docking portion 221 is arranged on the inner surface of the through hole, and the docking portion 221 is an internal thread structure, and the internal thread is used to connect with the external thread of the installation portion 113.

[0048] The quick installation frame 220 and the support disk 210 can be fixedly connected or detachably connected. As a preferred embodiment, the quick installation frame 220 and the support disk 210 are connected into an integrated structure by a hot pressing process. The hot pressing process can also achieve electrical connection, and the requirements for equipment are relatively low. It only needs to ensure that the extrusion pressure meets the requirements, which can save the investment in redundant equipment and reduce the production time. In other embodiments, the quick installation frame 220 and the support disk 210 can be connected by welding, especially by reflow soldering.

[0049] As Figure 3 、 4 shown in the figure, as an alternative embodiment, the support disk 210 can be a part externally connected to the board body. When the support disk 210 is externally connected to the board body, the support disk 210 and the board body are connected by a circuit. Docking terminals for connecting the NTC element 120 are provided on the surface of the support disk 210, and the contact member 121 of the NTC element 120 is electrically connected to the docking terminals. Optionally, the docking terminals are solder pads, and the contact member 121 is connected to the docking terminals by welding.

[0050] In other embodiments, the support disk 210 can be a part belonging to the board body, and the circuit is formed on the board body, and the NTC element 120 is directly docked on the board body. Surface electrodes for electrical connection are provided on the FPC 200 board body, and the contact member 121 of the NTC element 120 can be electrically connected to the surface electrodes.

[0051] In one embodiment, an electrical connection portion 211 is provided on the plate body or the support disk 210. The main body can be detachably connected to the FPC 200 by rotation. The shape of the electrical connection portion 211 matches that of the first side surface 111. The NTC element 120 can be electrically connected to the electrical connection portion 211 at any rotation angle.

[0052] When the quick mounting seat 110 is a cylinder, the first side surface 111 of the quick mounting seat 110 is circular. The shape of the interface between the electrical connection portion 211 and the first side surface 111 is the same, and the electrical connection portion 211 is also circular. After the quick mounting seat 110 is connected to the PFC, no matter what angle the NTC element 120 is located at, the contact member 121 on the NTC element 120 can be within the range of the circular electrical connection portion 211.

[0053] In one embodiment, the electrical connection portion 211 includes at least two electrical contact rings 2111. The electrical contact rings 2111 correspond one-to-one to at least two contact members 121 provided on one side of the electronic component. In the radial direction, each electrical contact ring 2111 is nested and arranged at intervals.

[0054] It can be understood that the innermost electrical contact ring 2111 can be annular or circular, and the electrical contact rings 2111 nested in the outer ring are annular.

[0055] Specifically, the NTC element 120 has at least two contact members 121. Each contact member 121 is correspondingly connected to an electrical contact ring 2111 of an electrical connection portion 211. Each electrical contact ring 2111 is located on the same layer of the support disk 210 and is arranged at intervals, so that each electrical contact ring 2111 can be docked with the contact member 121 at the same time and do not contact or communicate with each other. The diameters of each electrical contact ring 2111 are different, so that the electrical contact rings 2111 are nested in the radial direction. Correspondingly, each contact member 121 is located at a position at a different distance from the rotation center line and rotates around a circumference with a different radius.

[0056] In one embodiment, the electrical connection portion 211 uses a single-sided double-contact material; the electrical connection portion 211 further includes at least two leads 2112. Each lead 2112 corresponds one-to-one to each electrical contact ring 2111. The leads 2112 are used to connect the electrical contact rings 2111 and external components. Preferably, the electrical connection portion 211 uses a single-sided double-contact aluminum foil material.

[0057] When the conductive layer of the electrical connection portion 211 uses a single-sided double-contact material, the electrical connection portion 211 is at least composed of one layer of conductive layer in the vertical direction.

[0058] When the electrical connection part 211 is composed of a single conductive layer, at this time, the conductive layer includes a first contact surface and a second contact surface arranged opposite to each other. The first contact surface is provided with two electrical contact rings 2111 and a lead connected to the outermost electrical contact ring 2111, and the second contact surface is provided with a lead connected to the inner electrical contact ring 2111.

[0059] When the electrical connection part 211 is composed of at least two conductive layers, the first conductive layer faces the first side surface 111. The first conductive layer is provided with at least two electrical contact rings 2111. The first conductive layer is made of a single-sided double-contact material, so that the first conductive layer includes a first contact surface and a second contact surface arranged opposite to each other. At least two electrical contact rings 2111 are provided on the first contact surface, and a lead 2112 is provided on the second contact surface. The lead 2112 is connected to the outermost electrical contact ring 2111. The remaining leads 2112 are sequentially arranged on each of the remaining conductive layers. The electrical connection part 211 is further provided with a vertically arranged connecting line for vertically passing through each conductive layer to connect the lead 2112 of the current conductive layer and the electrical contact ring 2111 of the first conductive layer. Since the first conductive layer is made of a single-sided double-contact material, the lead 2112 connecting the outermost electrical contact ring 2111 can be directly formed on the first conductive layer, saving the number of conductive layers of the electrical connection part 211, and the above structure enables each lead 2112 to be arranged avoiding the electrical contact ring 2111, ensuring the integrity of each electrical contact ring 2111.

[0060] Specifically, as Figure 5 shown, taking the electrical connection part 211 having two electrical contact rings 2111 as an example, two electrical contact rings 2111 are provided on the first contact surface, including a circular electrical contact ring 2111 arranged on the inner circle and an annular electrical contact ring 2111 arranged on the outer circle. A lead 2112 is provided on the second contact surface to connect the electrical contact ring 2111 arranged on the outer circle with an external circuit. A cross-layer connecting line is provided between the first conductive layer and the second conductive layer. The second conductive layer is provided with another lead 2112. The electrical contact ring 2111 arranged on the inner circle of the first conductive layer is connected to the lead 2112 of the second conductive layer through the connecting line and finally connected to the external circuit.

[0061] It can be understood that each layer further includes an insulating material to isolate the circuits in each conductive layer from the circuits in adjacent conductive layers.

[0062] In other embodiments, the electrical connection part 211 adopts a single-sided single-contact material. At this time, the electrical connection part 211 is composed of at least two conductive layers. The first conductive layer is provided with at least two electrical contact rings 2111. The leads 2112 are sequentially arranged on each of the remaining conductive layers. Each lead 2112 is correspondingly provided with a vertically arranged connecting line for vertically passing through each layer to connect the lead 2112 of the current conductive layer and each electrical contact ring 2111 of the first conductive layer.

[0063] In one of the embodiments, as Figure 3 , 4 shown, the quick-installation module 100 further includes a glue layer 130. The glue layer 130 is disposed on the second side surface 112. The glue layer 130 is made of a material that can be melted by heating, and the melting temperature of the glue layer 130 is lower than the maximum temperature that the circuit board can withstand.

[0064] Specifically, after the quick-installation base 110 is connected to the FPC 200 and the electrical connection is completed, the first side surface 111 and the FPC 200 achieve a zero-gap fit, and the second side surface 112 is exposed from the through hole. It is necessary to set the glue layer 130 to isolate the quick-installation module 100 from the external environment. The glue layer 130 is used to block external contaminants or water. Therefore, the glue layer 130 should be set after the quick-installation module 100 is installed.

[0065] In order to match the quick-installation and quick-disassembly characteristics of the quick-installation module 100, the glue layer 130 is made of a material that can be melted by heating. After the glue layer 130 is heated to a preset temperature, it can be melted and does not affect the normal use of the FPC 200 and the electronic components on the FPC 200. After the glue layer 130 is melted, the operation part 115 can be operated, and operating the operation part 115 can detach the quick-installation base 110 from the quick frame.

[0066] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0067] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. An electronic component quick-install module, characterized in that: The quick-install module comprises: Electronic components; and A quick-release mount, comprising a body, a mounting portion and a fixing groove, wherein the body has a first side surface, a second side surface disposed opposite to the first side surface, and a peripheral side surface disposed between the first side surface and the second side surface, the mounting portion is disposed on the peripheral side surface of the body, the body is detachably connected to a circuit board through the mounting portion, the fixing groove is disposed on the first side surface, and the fixing groove is used to mount the electronic component; Wherein, after the quick-release seat is connected to the circuit board, the first side surface is butted against the circuit board, and the second side surface is arranged away from the circuit board, so that the electronic component can be electrically connected to the circuit board.

2. The electronic component quick-install module according to claim 1, characterized in that: The electronic component is a temperature sensing element.

3. The electronic component quick-install module according to claim 1, characterized in that: The second side surface is provided with an operating portion, and the operating portion is used to receive an external force to connect or separate the mounting portion from the circuit board.

4. The electronic component quick-install module according to claim 1, characterized in that: The quick-release module further includes a glue layer, which is disposed on the second side surface. The glue layer is made of a heat-melting material, and the melting temperature of the glue layer is lower than the maximum withstand temperature of the circuit board.

5. The electronic component quick-install module according to claim 1, characterized in that: The quick-release module further includes at least two contacts, at least two of which are disposed on a side of the electronic component facing the circuit board, and the contact is used to electrically connect the electronic component to the circuit board.

6. A flexible circuit board, characterized in that: include: A plate body, wherein a mounting position is provided on the plate body; as well as The quick-release module according to any one of claims 1 to 5, wherein the quick-release module is detachably disposed at the installation position.

7. The flexible circuit board according to claim 6, characterized in that: The flexible circuit board also includes a support plate and a quick-release frame connected to the support plate, the support plate is used to support the quick-release module, the quick-release frame is provided with a docking portion, the docking portion is detachably connected to the mounting portion, after the quick-release module is connected to the flexible circuit board, the quick-release frame is sleeved on the outside of the quick-release module, and the support plate abuts against the first side surface.

8. The flexible circuit board according to claim 7, characterized in that: An electrical connection portion is provided on the plate body or the support plate, and the body can be detachably connected to the flexible circuit board by rotation. The electrical connection portion matches the shape of the first side surface, and the electronic component can be electrically connected to the electrical connection portion at any rotation angle.

9. The flexible circuit board according to claim 8, characterized in that: The electrical connection portion includes at least two electrical contact rings, which correspond one to one with at least two contact pieces arranged on one side of the electronic component. In the radial direction, each of the electrical contact rings is nested and spaced from each other.

10. The flexible circuit board according to claim 9, characterized in that: The electrical connection part adopts a single-sided double-contact material; the electrical connection part also includes at least two leads, each of which corresponds to each of the electrical contact rings one by one, and the leads are used to connect the electrical contact rings and external elements.

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