Material transferring and overturning mechanism for SMT (Surface Mount Technology) processing

Abstract

The utility model discloses a material transferring and overturning mechanism for SMT processing, which comprises a workbench, the upper end of the workbench is rotatably connected with a turntable, the upper end of the turntable is provided with a mechanical arm, the upper side of the mechanical arm is rotatably connected with an adjusting plate, the center of the bottom end of the adjusting plate is fixedly connected with a vacuum pump, and the output end of the vacuum pump is fixedly connected with a connecting pipe. A connecting pipe is arranged on the workbench, a fixing sleeve is connected to the connecting pipe in a sleeved mode, a suction cup is fixedly connected to the upper end of the fixing sleeve, a positioning rod is connected to the fixing sleeve in a threaded mode, the positioning rod is connected with the connecting pipe in an inserted mode, and the connecting pipe is communicated with the interior of the suction cup. Meanwhile, four groups of rotating plates and bulges which are opposite and can rotate are arranged, the PCBs are limited by utilizing pull rods, clamping plates, springs and triangular strips in the bulges, and fixing rods and the rotating plates are separated and replaced by disassembling positioning bolts, so that the purpose of adapting to overturning and clamping of the PCBs of different models is achieved, and the processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB processing, and particularly relates to a material transfer and flipping mechanism for SMT patch processing. Background Technique

[0002] The material transfer and flipping mechanism in SMT iron sheet processing is one of the important devices on the SMT production line, mainly used to realize the flipping and transfer of PCB boards or other processing materials during the processing process to meet the requirements of double-sided processing or other special processing needs. During the processing of PCB, batch processing needs to be carried out according to the model size of the PCB board to improve work efficiency.

[0003] According to the "material transfer and flipping mechanism for SMT patch processing" with the Chinese patent publication number CN221283458U, it mainly describes the combined use of a longitudinal frame, a longitudinal cylinder, and a longitudinal slider, the combined use of a transverse frame, a transverse cylinder, and a transverse slider, the combined use of a mounting plate and a pneumatic suction nozzle, and the combined use of a flipping mechanism. It changes from the original single flipping mechanism to segmented suction, can be compatible with the operation of multiple types of test board assemblies. After the pneumatic suction nozzle adsorbs the workpiece and transfers it to the sponge suction cup, the sponge suction cup adsorbs the non-component position on the back of the workpiece, and stable suction can be achieved. During the processing of PCB circuit boards, the sizes and models of PCB boards are different, and processing needs to rely on the production line during processing, which will reduce the processing efficiency.

[0004] Therefore, a material transfer and flipping mechanism for SMT patch processing is proposed to solve the problem that during the processing of PCB circuit boards, the sizes and models of PCB boards are different, and processing needs to rely on the production line during processing, which will reduce the processing efficiency. Content of the Utility Model

[0005] The technical problem to be solved by the utility model: During the processing of PCB circuit boards, the sizes and models of PCB boards are different, and processing needs to rely on the production line during processing, which will reduce the processing efficiency. Therefore, a material transfer and flipping mechanism for SMT patch processing is proposed.

[0006] The technical solution adopted by the present utility model to solve the technical problem is as follows: A material transfer and flipping mechanism for SMT patch processing, including a workbench. A turntable is rotatably connected to the upper end of the workbench. A robotic arm is arranged on the upper end of the turntable. An adjusting plate is rotatably connected to the upper side of the robotic arm. A vacuum pump is fixedly connected to the center of the bottom end of the adjusting plate. The output end of the vacuum pump is fixedly connected to a connecting pipe. A fixing sleeve is inserted into the connecting pipe, and a suction cup is fixedly connected to the upper end of the fixing sleeve. A positioning rod is threadedly connected to the fixing sleeve and the positioning rod is inserted into the connecting pipe. The connecting pipe is internally communicated with the suction cup. Limiting grooves are respectively opened on four sides of the upper end of the workbench that are far away from each other. A bidirectional screw is rotatably connected to the workbench within the limiting grooves. Moving plates are threadedly connected to both sides of the bidirectional screw that are far away from each other. A driving motor is fixedly connected to one side of the moving plate, and the output end of the driving motor is fixedly connected to a connecting sleeve. A rotating plate is arranged on one side of the connecting sleeve. Raised portions are fixedly connected to both ends of the rotating plate. Through holes are opened in the raised portions. A pull rod is inserted into the through holes. A clamping plate is fixedly connected to the pull rod within the through holes. A spring is in contact with one side of the clamping plate, and the spring is sleeved on the pull rod. A triangular strip is fixedly connected to one side of the pull rod.

[0007] As a preferred technical solution of the present utility model, hidden grooves are respectively opened on the opposite sides of the two raised portions, and the hidden grooves correspond to the triangular strips. By providing the hidden grooves, the triangular strips can be contracted into the raised portions when the pull rod is pulled.

[0008] As a preferred technical solution of the present utility model, an electric push rod is in contact with the bottom side of the raised portion, and the electric push rod is fixedly connected to the workbench. By providing the electric push rod, the stability of the rotating plate during rotation can be improved.

[0009] As a preferred technical solution of the present utility model, support balls are rotatably embedded on four sides of one end of the rotating plate, and the support balls are in contact with the moving plate. By providing the support balls, support is provided on one side of the rotating plate, and at the same time, the friction between the rotating plate and the moving plate is reduced.

[0010] As a preferred technical solution of the present utility model, a fixing rod is fixedly connected to one side of the rotating plate, the fixing rod is inserted into the connecting sleeve, and a positioning bolt is threadedly connected to the connecting sleeve, and the positioning bolt is inserted into the fixing rod. By providing the positioning bolt and the connecting sleeve, rotating plates and raised portions of different sizes can be replaced.

[0011] The present utility model has the following advantages: By arranging a robotic arm on the workbench and cooperating with a detachable and replaceable suction cup to adaptively adsorb the PCB board, and at the same time arranging four groups of opposite and rotatable rotating plates and raised portions, the pull rod, clamping plate, spring and triangular strip in the raised portion are used to limit the PCB board, and by removing the positioning bolt, the fixing rod and the rotating plate are detached and replaced, so as to achieve the flipping and clamping of PCB boards of different models, and improve the processing efficiency. Brief Description of the Drawings

[0012] Figure 1 Fig. 1 is a three-dimensional structure schematic diagram of a material transfer and flipping mechanism for SMT chip mounting processing according to a preferred embodiment of the present utility model;

[0013] Figure 2 Fig. 2 is a schematic side sectional structure diagram of the convex part of a material transfer and flipping mechanism for SMT chip mounting processing according to a preferred embodiment of the present utility model;

[0014] Figure 3 Fig. 3 is a schematic side structure diagram of the moving plate of a material transfer and flipping mechanism for SMT chip mounting processing according to a preferred embodiment of the present utility model;

[0015] Figure 4 Fig. 4 is a three-dimensional structure schematic diagram of the adjusting plate of a material transfer and flipping mechanism for SMT chip mounting processing according to a preferred embodiment of the present utility model.

[0016] Description of the reference numerals: 1, workbench; 2, robotic arm; 3, suction cup; 4, limiting groove; 5, bidirectional screw; 6, moving plate; 7, connecting sleeve; 8, rotating plate; 9, convex; 10, through hole; 11, pull rod; 12, clamping plate; 13, spring; 14, triangular strip; 15, hidden groove; 16, supporting ball; 17, fixing rod; 18, positioning bolt; 19, electric push rod; 20, adjusting plate; 21, vacuum pump; 22, connecting pipe; 23, positioning rod. Detailed Description of the Invention

[0017] The present utility model will be further described below with reference to the accompanying drawings.

[0018] Please refer to Figures 1-4A material transfer and flipping mechanism for SMT chip mounting processing as shown, including a workbench 1. A turntable is rotatably connected to the upper end of the workbench 1. A robotic arm 2 is arranged on the upper end of the turntable. An adjusting plate 20 is rotatably connected to the upper side of the robotic arm 2. A vacuum pump 21 is fixedly connected to the center of the bottom end of the adjusting plate 20. The vacuum pump 21 includes a vacuum generator. By means of the vacuum pump 21, the suction cup 3 is in a vacuum state, thereby adsorbing the PCB board. The output end of the vacuum pump 21 is fixedly connected to a connecting pipe 22. A fixing sleeve is inserted into the connecting pipe 22, and the upper end of the fixing sleeve is fixedly connected to the suction cup 3. The inside of the suction cup 3 is hollow, and air holes are evenly arranged on the surface of the suction cup 3 in contact with the PCB board. A positioning rod 23 is threadedly connected to the fixing sleeve, and the positioning rod 23 is inserted into the connecting pipe 22. By removing the positioning rod 23, the suction cup 3 and the fixing sleeve can be separated. The connecting pipe 22 is internally connected to the suction cup 3. Limiting grooves 4 are opened on the upper end of the workbench 1 at four sides far away from each other. A bidirectional screw rod 5 is rotatably connected to the workbench 1 within the limiting grooves 4. By manually rotating the bidirectional screw rod 5, the moving plates 6 can move relatively, and the two rotating plates 8 can approach relatively. Moving plates 6 are threadedly connected to both sides far away from each other on the bidirectional screw rod 5. A driving motor is fixedly connected to one side of the moving plate 6, and the output end of the driving motor is fixedly connected to a connecting sleeve 7. A rotating plate 8 is arranged on one side of the connecting sleeve 7. Protrusions 9 are fixedly connected to both ends of the rotating plate 8. Through holes 10 are opened in the protrusions 9. A pull rod 11 is inserted into the through holes 10. A clamping plate 12 is fixedly connected to the pull rod 11 within the through holes 10. When the pull rod 11 is pulled or the triangular strips 14 are subjected to external forces, the four triangular strips 14 on the upper side can enter into the hidden grooves 15, and one side of the clamping plate 12 can contact a spring 13, and the spring 13 is sleeved on the pull rod 11. A triangular strip 14 is fixedly connected to one side of the pull rod 11.

[0019] Among them, the triangular strips 14 correspond to the hidden grooves 15. The hidden grooves 15 are located on the side opposite to the two protrusions 9. By providing the hidden grooves 15, the triangular strips 14 can be contracted into the hidden grooves 15.

[0020] Among them, an electric push rod 19 is fixedly connected to the workbench 1. The electric push rod 19 contacts the bottom side of the protrusion 9. By providing the electric push rod 19, support can be provided for the protrusion 9, so that when the triangular strips 14 limit the PCB board, stable contact can be achieved, thus facilitating processing.

[0021] Among them, the moving plate 6 contacts the support balls 16. The support balls 16 are rotatably embedded on the four sides of one end of the rotating plate 8. By providing the support balls 16, the stability between the rotating plate 8 and the moving plate 6 is increased, and the friction when the rotating plate 8 rotates is reduced.

[0022] Among them, a positioning bolt 18 is inserted into the fixing rod 17. The positioning bolt 18 is threadedly connected to the connecting sleeve 7. The connecting sleeve 7 is inserted with the fixing rod 17. The fixing rod 17 is fixedly connected to one side of the rotating plate 8. By removing the positioning bolt 18, the rotating plate 8 can be detached, and the rotating plate 8 and the protrusion 9 with a suitable PCB board width can be replaced.

[0023] Working principle: According to the size and diameter of the PCB board, the positioning bolt 18 and the positioning rod 23 can be removed, and the appropriate rotating plate 8 and protrusion 9 can be replaced. Then, the suction cup 3 with a suitable size can be replaced. Then, the robotic arm 2 is used to drive the suction cup 3 to adsorb the PCB board. Adjusting the bidirectional screw rod 5 can make the two relative moving plates 6 move relatively, and the distance between the two relative moving plates 6 corresponds to the length of the PCB board. Then, the PCB board is moved to one of the limiting grooves 4. Under the action of the robotic arm 2, the suction cup 3 and the PCB board are aligned with the triangular strip 14. At this time, the suction cup 3 continuously applies pressure to the upper triangular strip 14, and the upper triangular strip 14 enters the hidden groove 15. Then, the driving motor on the moving plate 6 can drive the connecting sleeve 7 and the fixing rod 17 to rotate, so as to perform flipping. And the PCB board contacts the bottom triangular strip 14. And by setting four groups, separate processing can be carried out, and it can cooperate with the suction cup 3 to be adsorbed from between one group of relative moving plates 6 to between another group of relative moving plates 6, so that the workbench 1 provides flipping and transfer for the processing of the PCB board, achieving flipping and clamping of PCB boards of different models and improving the processing efficiency.

[0024] The above is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and retouches can be made, and these improvements and retouches should also be regarded as the protection scope of the present invention.

[0025] The other parts not detailed in the present invention belong to the prior art, so they will not be elaborated here.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A material transfer and flipping mechanism for SMT patch processing, comprising a workbench (1), characterized in that: The upper end of the workbench (1) is rotatably connected to a turntable, the upper end of the turntable is provided with a mechanical arm (2), the upper side of the mechanical arm (2) is rotatably connected to an adjustment plate (20), the lower center of the adjustment plate (20) is fixedly connected to a vacuum pump (21), the output end of the vacuum pump (21) is fixedly connected to a connecting pipe (22), a fixing sleeve is plugged into the connecting pipe (22), and a suction cup (3) is fixedly connected to the upper end of the fixing sleeve, a positioning rod (23) is threadedly connected to the fixing sleeve, and the positioning rod (23) is plugged into the connecting pipe (22), the connecting pipe (22) is communicated with the inside of the suction cup (3), four sides of the upper end of the workbench (1) that are away from each other are provided with limiting grooves (4), and the workbench (1) is located in the limiting grooves (4) and rotates. A bidirectional screw rod (5) is connected, and two sides of the bidirectional screw rod (5) that are away from each other are both threadedly connected with a movable plate (6), one side of the movable plate (6) is fixedly connected with a driving motor and the output end of the driving motor is fixedly connected with a connecting sleeve (7), one side of the connecting sleeve (7) is provided with a rotating plate (8), both ends of the rotating plate (8) are fixedly connected with protrusions (9), a through hole (10) is opened in the protrusion (9), a pull rod (11) is inserted in the through hole (10), the pull rod (11) is located in the through hole (10) and is fixedly connected with a clamping plate (12), one side of the clamping plate (12) contacts with a spring (13) and the spring (13) is sleeved on the pull rod (11), and one side of the pull rod (11) is fixedly connected with a triangular bar (14).

2. A material transfer and flipping mechanism for SMT patch processing as claimed in claim 1, characterized in that: A hidden groove (15) is provided on one side opposite to the two protrusions (9), and the hidden groove (15) corresponds to the triangular bar (14).

3. A material transfer and flipping mechanism for SMT patch processing as claimed in claim 2, characterized in that: The bottom side of the protrusion (9) contacts an electric push rod (19), and the electric push rod (19) is fixedly connected to the workbench (1).

4. A material transfer and flipping mechanism for SMT patch processing as claimed in claim 1, characterized in that: Support balls (16) are rotatably embedded on four sides of one end of the rotating plate (8), and the support balls (16) are in contact with the moving plate (6).

5. A material transfer and flipping mechanism for SMT patch processing as claimed in claim 4, characterized in that: A fixing rod (17) is fixedly connected to one side of the rotating plate (8), the fixing rod (17) is plugged into the connecting sleeve (7), a positioning bolt (18) is threadedly connected to the connecting sleeve (7), and the positioning bolt (18) is plugged into the fixing rod (17).

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