Heat dissipation device for intelligent unit control screen

Abstract

The utility model discloses a heat dissipation device for an intelligent unit control screen, and the device comprises a support, an axial flow fan, a heat dissipation unit, and an air duct plate, the heat dissipation unit is installed on the support and is adjacent to a position where a silicon controlled rectifier generating heat is located, and the air duct plate is enclosed to form a vertical 90-degree air duct. The heat dissipation unit is arranged at an air inlet of the vertical 90-degree air duct, and the axial flow fan is arranged at an air outlet of the vertical 90-degree air duct. According to the heat dissipation device for the intelligent unit control screen, through the design of the vertical 90-degree air channel, the heat dissipation requirement can be met, and later maintenance can be facilitated.

Description

Technical Field

[0001] This application relates to the technical field of unit heat dissipation, and particularly to a heat dissipation device for an intelligent unit control panel. Background Art

[0002] In the past, the thyristors and heat dissipation screen structures of intelligent unit control panels were all parallel to the fans. The thyristors and connecting copper bars were all inward. To maintain the thyristors, it was necessary to remove the external fans and brackets of the cabinet, then remove the thyristor brackets, and also remove the copper bars. The removal and maintenance were extremely complicated. How to provide a device that can both meet heat dissipation requirements and meet the later maintenance of thyristors is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0003] To solve the above technical problems, the present utility model provides a heat dissipation device for an intelligent unit control panel. Through the design of a vertical 90° air duct, it can both meet the heat dissipation requirements and facilitate later maintenance.

[0004] The technical solution provided by the present utility model is as follows:

[0005] A heat dissipation device for an intelligent unit control panel includes a bracket, an axial flow fan, a heat dissipation unit, and an air duct plate. The heat dissipation unit is installed on the bracket and is adjacent to the position where the thyristor that generates heat is located. The air duct plate encloses to form a vertical 90° air duct. The heat dissipation unit is arranged at the air inlet of the vertical 90° air duct, and the axial flow fan is arranged at the air outlet of the vertical 90° air duct.

[0006] Preferably, the heat dissipation unit includes a mounting frame and a plurality of heat dissipation fins arranged on the mounting frame.

[0007] Preferably, the arrangement gap of the heat dissipation fins faces the direction where the thyristor that generates heat is located.

[0008] Preferably, the air duct plate is of an L-shaped structure. The heat dissipation unit is buckled on the air duct plate, and mounting holes for installing the bracket are provided on the side of the air duct plate.

[0009] Preferably, baffles are provided on both sides of the lower end of the air duct plate, and the width of the baffles is the same as the width of the heat dissipation unit.

[0010] This application has the following advantages compared with the prior art:

[0011] Compared with the traditional heat dissipation method, the heat dissipation device for an intelligent unit control panel of this application uses a vertical 90° air duct for suction heat dissipation, with a higher heat dissipation effect, making the later maintenance of the thyristor more convenient to operate and greatly reducing the removal time. Brief Description of the Drawings

[0012] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0013] Figure 1 Structural schematic diagram of the heat dissipation device for the intelligent unit control panel in the embodiment of the present utility model;

[0014] Figure 2 Structural schematic diagram of the heat dissipation unit in the embodiment of the present utility model;

[0015] Figure 3 Structural schematic diagram of the heat dissipation process of the heat dissipation device for the intelligent unit control panel in the embodiment of the present utility model;

[0016] Figure 4 Structural schematic diagram of the air duct plate in the embodiment of the present utility model;

[0017] Figure 5 Structural schematic diagram of the heat dissipation device for the intelligent unit control panel in the embodiment of the present utility model installed on the GGD profile cabinet.

[0018] Reference numerals:

[0019] 1, support; 2, axial flow fan; 3, heat dissipation unit; 301, mounting frame; 302, heat sink; 4, air duct plate; 401, mounting hole; 402, baffle; 5, thyristor generating heat. Detailed implementation manners

[0020] In order to enable those skilled in the art to better understand the technical solutions in the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of them. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0021] As Figures 1-4 shown, the embodiment of the present utility model provides a heat dissipation device for an intelligent unit control panel, including a support 1, an axial flow fan 2, a heat dissipation unit 3, and an air duct plate 4. The heat dissipation unit 3 is installed on the support 1 and is adjacent to the position where the thyristor 5 generating heat is located. The air duct plate 4 encloses to form a vertical 90° air duct. The heat dissipation unit 3 is arranged at the air inlet of the vertical 90° air duct, and the axial flow fan 2 is arranged at the air outlet of the vertical 90° air duct.

[0022] In this embodiment, the heat dissipation unit 3 includes a mounting bracket 301 and a plurality of heat sinks 302 disposed on the mounting bracket 301. The arrangement gap of the heat sinks 302 faces the direction where the thyristor 5 generating heat is located, facilitating heat dissipation.

[0023] In this embodiment, the air duct plate 4 is of an L-shaped structure. The heat dissipation unit 3 is buckled on the air duct plate 4, and the side portion of the air duct plate 4 is provided with mounting holes 401 for mounting the bracket 1.

[0024] In this embodiment, baffles 402 are provided on both sides of the lower end of the air duct plate 4. The width of the baffles 402 is the same as the width of the heat dissipation unit 3, facilitating the discharge of heat from the air duct formed by the air duct plate 4.

[0025] The working principle of the heat dissipation device for the intelligent unit control panel in this embodiment is as follows: The heat dissipation device for the intelligent unit control panel in this embodiment is installed in a closed GGD cabinet. The heat dissipation unit 3 is installed on the air duct plate 4 from the bottom of the GGD cabinet. The heat is dissipated from the cabinet by the suction of the axial flow fan 2. Then, due to the wrapping of the air duct plate 4, the heat can be better absorbed, and the heat dissipation effect is better.

[0026] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation device for an intelligent unit control panel, characterized in that: The invention comprises a bracket (1), an axial flow fan (2), a heat dissipation unit (3), and an air duct plate (4); the heat dissipation unit (3) is mounted on the bracket (1) and is located adjacent to a thyristor (5) that generates heat; the air duct plate (4) encloses a vertical 90° air duct; the heat dissipation unit (3) is arranged at the air inlet of the vertical 90° air duct; and the axial flow fan (2) is arranged at the air outlet of the vertical 90° air duct.

2. The heat dissipation device for the intelligent unit control panel according to claim 1 is characterized in that: The heat dissipation unit (3) comprises a mounting frame (301) and a plurality of heat dissipation fins (302) arranged on the mounting frame (301).

3. The heat dissipation device for the intelligent unit control panel according to claim 2 is characterized in that: The arrangement gap of the heat sink (302) is directly facing the direction of the thyristor (5) that generates heat.

4. The heat dissipation device for the intelligent unit control panel according to claim 1, 2 or 3, characterized in that: The air duct plate (4) is an L-shaped structure, the heat dissipation unit (3) is buckled onto the air duct plate (4), and a mounting hole (401) for mounting the bracket (1) is provided on the side of the air duct plate (4).

5. The heat dissipation device for the intelligent unit control panel according to claim 1, 2 or 3, characterized in that: Baffles (402) are provided on both sides of the lower end of the air duct plate (4), and the width of the baffles (402) is the same as the width of the heat dissipation unit (3).

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