Tool for cleaning inner cavity of semiconductor IC shell

Abstract

The utility model discloses a tool for cleaning an inner cavity of a semiconductor IC (integrated circuit) shell, which comprises a base, a positioning frame, a limiting plate and a cover plate, the base is provided with a sinking groove, a plurality of concave-like positioning tables for placing the semiconductor IC shell are arranged in the sinking groove at intervals, and each positioning table comprises a groove part and platform parts at two ends of the groove part; the positioning frame is buckled on the upper surface of the base, the limiting plate is buckled with the back face of the positioning frame, limiting holes used for limiting semiconductor IC shells on the positioning tables and limiting plate through holes opposite to ceramic inner cavities in the groove parts are formed in the limiting plate at intervals, and the cover plate is buckled with the limiting plate. A plurality of cover plate through holes are formed in the cover plate at intervals, and the cover plate through holes are opposite to the limiting plate through holes. The structure is simple, machining is easy, the assembling process of workers is simplified, production efficiency is improved, and the product percent of pass is effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a tooling for cleaning the inner cavity of a semiconductor IC housing. Background Art

[0002] Keeping the inner cavity of a semiconductor IC housing clean and free of particulate matter is one of the important methods to improve the stability and reliability of the semiconductor IC. During the production process of a ceramic integrated circuit housing, processes such as printing, sintering, and high-temperature welding are involved, so there will be impurities, particulate matter, etc. on the housing. In particular, it is very difficult to clean the particulate matter in the inner cavity and dead corners.

[0003] The cleaning methods of semiconductor chips usually include mechanical cleaning, chemical cleaning, dry ice cleaning, etc. Among them, dry ice cleaning can effectively remove surface particle dirt and tiny pollutants by using physical impact, heat exchange, and gasification. Specifically, when dry ice particles impact the surface, dirt can be removed; at the same time, dry ice particles rapidly sublimate during the impact process, absorbing a large amount of heat, causing the surface temperature to drop sharply, resulting in the embrittlement and shedding of pollutants; finally, the carbon dioxide gas formed after dry ice sublimation can further push and carry away the surface pollutants. This cleaning method is not only environmentally friendly and pollution-free, but also residue-free, cost-saving, and improves production efficiency and product quality. During the process of using dry ice equipment for cleaning, the semiconductor IC housing cannot move during the cleaning. If the housing moves, it will result in unclean inner cavity cleaning. In addition, the lead welding layer outside the inner cavity needs to be protected and cannot be directly sprayed by dry ice particles. If the lead welding layer is damaged and the housing is scratched. To ensure the cleaning efficiency, it is urgent to develop a tooling dedicated to cleaning the inner cavity of a semiconductor IC housing. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a tooling for cleaning the inner cavity of a semiconductor IC housing.

[0005] The technical solution for achieving the purpose of the present utility model is as follows: A tooling for cleaning the inner cavity of a semiconductor IC housing, which includes a base, a positioning frame, a limiting plate, and a cover plate sequentially arranged from bottom to top. A sunken groove is formed on the upper surface of the base, and several "concave"-shaped positioning platforms for placing the semiconductor IC housing are arranged at intervals in the sunken groove. The semiconductor IC housing includes a lead frame and two pin arrays fixed on the lead frame. A ceramic sheet with a ceramic inner cavity is fixed between the bottoms of the two pin arrays. The lead frames on both sides of the two pin arrays are bent downward from the side of the ceramic sheet; the positioning platform includes a groove part for limiting the ceramic sheet, and both ends of the groove part are platform parts; the positioning frame has a front side of the positioning frame and a back side of the positioning frame. The positioning frame is buckled on the upper surface of the base, the front side of the positioning frame is attached to the upper surface of the base, the limiting plate is buckled with the back side of the positioning frame. Limiting holes for limiting the semiconductor IC housing on each positioning platform and limiting plate through holes opposite to the ceramic inner cavity on the groove part are arranged at intervals on the limiting plate. The cover plate is buckled with the limiting plate, and several cover plate through holes are arranged at intervals on the cover plate. The cover plate through holes are opposite to the limiting plate through holes.

[0006] Further, the horizontal position of the platform part is higher than the horizontal position of the upper surface of the base, and the positioning frame is sleeved outside the space surrounded by each platform part.

[0007] Further, several positioning columns are arranged at intervals on the edge of the back side of the positioning frame, several first positioning holes are formed on the edge of the limiting plate, and several second positioning holes are formed on the edge of the cover plate. The positioning columns correspond to the first positioning holes and the second positioning holes one by one.

[0008] Further, a magnet column groove is formed on the platform part, and a magnet column is embedded in the magnet column groove. The magnet column attracts the lead frame.

[0009] The tooling for cleaning the inner cavity of the semiconductor IC housing realized by the present utility model has a simple structure and is easy to process. The design of multiple limiting structures can effectively play a positioning role, simplify the assembly process of employees, improve production efficiency, effectively improve the product qualification rate, and increase the product aesthetics. Description of the Drawings

[0010] Figure 1 It is an assembly structure schematic diagram of the tooling for cleaning the inner cavity of the semiconductor IC housing according to the embodiment of the present utility model;

[0011] Figure 2 It is a combined structure schematic diagram of the semiconductor IC housing, the base, and the positioning frame according to the embodiment of the present utility model;

[0012] Figure 3 This is a schematic structural view of the limit plate described in the embodiments of the present utility model. Detailed implementation manners

[0013] The following will describe in detail the preferred embodiments of the present utility model with reference to the accompanying drawings.

[0014] Figure 2 The structure of the semiconductor IC housing 10 described in this embodiment is shown. The semiconductor IC housing 10 includes a lead frame 101 and two pin arrays 102 fixed on the lead frame 101. A ceramic sheet 103 is fixed between the bottoms of the two pin arrays 102. A ceramic inner cavity 1031 is provided in the middle of the ceramic sheet 103. The lead frames 101 on both sides of the two pin arrays 102 are bent downward from the side of the ceramic sheet 103.

[0015] As Figure 1 and Figure 2 shown, a tool for cleaning the inner cavity of a semiconductor IC housing includes a base 1, a positioning frame 2, a limit plate 3, and a cover plate 4 arranged in sequence from bottom to top. A sink 12 is provided on the upper surface 11 of the base 1. Thirty-eight "concave"-shaped positioning platforms 13 for placing the semiconductor IC housing 10 are arranged at intervals in the sink 12. The positioning platform 13 includes a groove portion 131 for limiting the ceramic sheet 103. Both ends of the groove portion 131 are platform portions 132. A magnet post groove 1321 is provided in the platform portion 132. A magnet post 14 is embedded in the magnet post groove 1321. The magnet post 14 attracts the lead frame 101. The horizontal position of the platform portion 132 is higher than the horizontal position of the upper surface 11 of the base 1. The positioning frame 2 is sleeved outside the space surrounded by the platform portions 132.

[0016] As Figure 1 and Figure 3 shown, the positioning frame 2 has a positioning frame front surface 21 and a positioning frame back surface 22. The positioning frame front surface 21 is attached to the upper surface 11 of the base 1. The limit plate 3 is buckled with the positioning frame back surface 22. Limit holes 31 for limiting the semiconductor IC housing 10 on each positioning platform 13 and a limit plate through hole 32 opposite to the ceramic inner cavity 1031 on the groove portion 131 are provided at intervals on the limit plate 3. The limit plate through hole 32 and the adjacent limit hole 31 are integrally formed. The cover plate 4 is buckled with the limit plate 2. A plurality of cover plate through holes 41 are provided at intervals on the cover plate 4. The cover plate through holes 41 are opposite to the limit plate through holes 32.

[0017] A plurality of positioning posts 23 are arranged at intervals along the edge of the back surface 22 of the positioning frame. A plurality of first positioning holes 33 are formed along the edge of the limiting plate 3, and a plurality of second positioning holes 42 are formed along the edge of the cover plate 4. The positioning posts 23 correspond to the first positioning holes 33 and the second positioning holes 42 one by one.

[0018] During assembly, first place the magnet post 14 into the magnet post groove 1321, and then place the semiconductor IC housing 10 on the positioning table 13, where the ceramic sheet 103 is placed in the groove portion 131. The magnet post 14 is attracted to the lead frame 101 above the magnet post. Then, sleuth the positioning frame 2 outside the space surrounded by each platform portion 132. Next, snap the limiting plate 3 onto the back surface 22 of the positioning frame. The first positioning holes 33 are nested on the positioning posts 23. The part of the semiconductor IC housing 10 protruding from the positioning table 13 is embedded in the limiting holes 31. Finally, align and snap the cover plate 4 with the limiting plate 3, and the second positioning holes 42 are also nested on the positioning posts 23. After assembly, dry ice can be aligned with the cover plate through hole 41 to clean the ceramic inner cavity 1031 below.

[0019] The matching structure between the positioning frame and the base of the present invention is not limited to that shown in the embodiment. Protrusions can also be provided on the edge of the base, and grooves matching the protrusions can be formed on the positioning frame to limit the positioning frame. The magnet posts are provided as needed. Adding magnet posts can further limit the lead frame and improve the stability of the semiconductor IC housing during the cleaning process. The limiting holes and the through holes of the limiting plate can be processed separately. In this embodiment, the through hole of the limiting plate and the limiting hole adjacent to the through hole of the limiting plate are formed integrally, which has the advantage of easy processing and alignment. The buckling structure of the positioning frame, the limiting plate, and the cover plate is not limited to that shown in the embodiment. Positioning posts can also be provided on the cover plate, and positioning holes can be formed on the positioning frame, the limiting plate, and the base, as long as the buckling of the positioning frame, the limiting plate, and the cover plate can be achieved.

[0020] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent process transformation made using the content of the specification of the present invention, directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A tool for cleaning the inner cavity of a semiconductor IC housing, characterized in that: It comprises a base, a positioning frame, a limiting plate and a cover plate which are arranged in sequence from bottom to top. A sink groove is provided on the upper surface of the base, and a plurality of "concave"-shaped positioning platforms for placing a semiconductor IC shell are arranged at intervals in the sink groove; the semiconductor IC shell comprises a lead frame and two pin arrays fixed on the lead frame, a ceramic sheet with a ceramic inner cavity is fixed between the bottoms of the two pin arrays, and the lead frames on both sides of the two pin arrays are bent downward from the side of the ceramic sheet; the positioning platform comprises a groove portion for limiting the ceramic sheet, and the groove portion The two ends of the positioning frame are platform parts; the positioning frame has a front side of the positioning frame and a back side of the positioning frame, the positioning frame is buckled on the upper surface of the base, the front side of the positioning frame is in contact with the upper surface of the base, the limiting plate is buckled with the back side of the positioning frame, the limiting plate is provided with limiting holes for limiting the semiconductor IC housing on each positioning platform and limiting plate through holes arranged opposite to the ceramic inner cavity on the groove part, the cover plate is buckled with the limiting plate, a plurality of cover plate through holes are provided on the cover plate at intervals, and the cover plate through holes are arranged opposite to the limiting plate through holes.

2. The tool for cleaning the inner cavity of a semiconductor IC housing according to claim 1, characterized in that: The horizontal position of the platform portion is higher than the horizontal position of the upper surface of the base, and the positioning frame is sleeved on the outside of the space enclosed by each of the platform portions.

3. The tool for cleaning the inner cavity of a semiconductor IC housing according to claim 1, characterized in that: A plurality of positioning posts are arranged at intervals on the edge of the back of the positioning frame, a plurality of first positioning holes are opened on the edge of the limiting plate, a plurality of second positioning holes are opened on the edge of the cover plate, and the positioning posts correspond to the first positioning holes and the second positioning holes one by one.

4. The tool for cleaning the inner cavity of a semiconductor IC housing according to claim 1, characterized in that: The platform portion is provided with a magnet column groove, in which a magnet column is embedded, and the magnet column is attracted to the lead frame.

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