Chip receiving assembly and stamping device

Abstract

The utility model provides a chip receiving assembly and a stamping device, and belongs to the technical field of stamping. The chip receiving assembly comprises a stamping assembly and a collecting assembly, a collecting box is connected with an elastic clamping base in a clamped mode, a flow guide plate is correspondingly arranged on one side of a frame plate, the flow guide plate makes contact with a die, and firstly scattered powder raw materials generated in the die stamping process can directly enter the collecting box through the flow guide plate; the collecting boxes can play a role in collecting the powder raw materials, the powder raw materials can better enter the collecting boxes due to the fact that one face of each flow guide plate is designed to be inclined, and the collecting boxes on the two sides of the frame plate are directly pulled out of the frame plate, so that the powder raw materials can be conveniently treated in a unified mode; and the collecting box can be fixed through the elastic clamping base, so that the situation that gaps exist between the collecting box and the mold for a long time can be prevented, powder raw materials are scattered on the base can be prevented, and therefore the practicability is improved.

Description

Technical Field

[0001] This application relates to the field of stamping, and more particularly, to a chip receiving component and a stamping device. Background Art

[0002] During the processing of diamond abrasive products, a stamping machine is required to press metal powder raw materials to form a workpiece blank. Specifically, the powder raw materials are loaded into a workpiece mold, and then the workpiece mold together with the powder raw materials is placed on a stamping device. The stamping device is started to make a pressing plate cooperating with the workpiece mold press into the workpiece mold, and then the pressing plate is driven to withdraw from the workpiece mold. For example, a chip receiving component and a stamping device of a stamping device with the Chinese patent application number CN202320359500.9 include a load-bearing platform. The chip receiving component includes a lining sleeve sleeved outside the load-bearing platform. An outer cylinder body fixedly connected to the outside of the lining sleeve and enclosing a ring groove structure with the lining sleeve is also provided. An annular inclined wall connected to the upper end of the lining sleeve and a horizontal ring wall connected to the lower end of the outer cylinder body are arranged between the outer cylinder body and the lining sleeve. A plurality of magnetic attraction blocks are placed on the horizontal ring wall. Among them, the lower side of the annular inclined wall faces outward and is close to the horizontal ring. The present utility model also provides a stamping device including the chip receiving component, which solves the problem that the cleaning of the powder raw materials scattered on the stamping device in the prior art reduces the operation efficiency to a certain extent.

[0003] However, the above solution still has certain defects: First, when cleaning the powder raw materials inside the ring groove, it is necessary to separate the outer cylinder body and the horizontal retaining ring from the workpiece mold. Friction occurs between the horizontal retaining ring and the workpiece mold. After long-term use, there will be a gap between the horizontal retaining ring and the workpiece mold, and the powder raw materials will fall on the base along the gap, affecting the collection effect and thus reducing the practicability. Summary of the Utility Model

[0004] To make up for the above deficiencies, this application provides a chip receiving component and a stamping device, aiming to improve the problem that friction occurs between the horizontal retaining ring and the workpiece mold in the related art. After long-term use, there will be a gap between the horizontal retaining ring and the workpiece mold, and the powder raw materials will fall on the base along the gap, affecting the collection effect and thus reducing the practicability.

[0005] In a first aspect, an embodiment of this application provides a chip receiving component including a stamping component and a collection component.

[0006] The stamping component includes a base and a mold. The mold is arranged on one side of the base. The collection component includes a frame plate, a collection box, elastic clamping seats, and a diversion plate. The frame plate is sleeved on one side of the mold. The collection box is slidably connected to both sides of the frame plate. The elastic clamping seats are correspondingly arranged on both sides of the frame plate. The collection box is clamped with the elastic clamping seats. The diversion plates are correspondingly arranged on one side of the frame plate. The diversion plates are in contact with the mold.

[0007] In a specific embodiment, chutes are provided on both sides of the frame plate.

[0008] In the above implementation process, chutes are provided on both sides of the frame plate, and the chutes can play a role in limiting.

[0009] In a specific embodiment, the collection box includes a concave shell and a baffle. The concave shell is slidably connected to the chute, and the baffle is fixedly connected to the concave shell.

[0010] In the above implementation process, the powder raw material can be collected through the concave shell, and the baffle can play a role in connection.

[0011] In a specific embodiment, a handle is provided on one side of the baffle.

[0012] In the above implementation process, a handle is provided on one side of the baffle, and the handle facilitates pulling the concave shell.

[0013] In a specific embodiment, grooves are correspondingly provided at both ends of the baffle.

[0014] In the above implementation process, grooves are correspondingly provided at both ends of the baffle, and the grooves can play a role in connection.

[0015] In a specific embodiment, the elastic clamping seat includes a vertical plate, a spring and a cambered surface block. The spring is correspondingly arranged inside the vertical plate. The cambered surface block is slidably connected to the vertical plate. The cambered surface block is fixedly connected to the spring, and the cambered surface block is in contact with the groove.

[0016] In the above implementation process, the spring and the cambered surface block can play a role in clamping.

[0017] In a specific embodiment, limiting grooves are correspondingly arranged inside the vertical plate, and the cambered surface block is slidably connected to the limiting grooves.

[0018] In the above implementation process, when the powder raw material inside the concave shell needs to be processed, the user can pull the handle, and then drive the baffle and the concave shell to move. The cambered surface block can be extruded through the grooves at both ends of the baffle, so that the cambered surface block moves into the limiting groove. The groove and the cambered surface block are misaligned, and the concave shell can be pulled. Conversely, the concave shell can be fixed.

[0019] In a second aspect, the present utility model further provides a stamping device, including the above-mentioned chip receiving component.

[0020] Compared with the prior art, the beneficial effects of the present application are as follows: Firstly, the scattered powder raw materials generated during the die stamping process will directly enter the interior of the collection box through the diversion plate, and the collection box can collect the powder raw materials. One side of the diversion plate is inclined, which can enable the powder raw materials to enter the interior of the collection box better. By directly pulling out the collection boxes on both sides of the frame plate from the interior of the frame plate, it is convenient to uniformly process the powder raw materials, which can avoid generating gaps with the die and affecting the collection effect. The collection box can be fixed through the elastic clamping seat, thereby preventing the existence of gaps with the die for a long time and preventing the powder raw materials from scattering on the base, thus improving the practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can also be obtained based on these drawings without creative efforts.

[0022] Figure 1 FIG. 9 is a schematic structural diagram of a chip receiving component and a stamping device from a first perspective provided by an embodiment of the present application;

[0023] Figure 2 FIG. 13 is a schematic structural diagram of a frame plate provided by an embodiment of the present application;

[0024] Figure 3 FIG. 17 is a schematic structural diagram of a collection box provided by an embodiment of the present application;

[0025] Figure 4 FIG. 21 is a schematic structural diagram of an elastic clamping seat from a second perspective provided by an embodiment of the present application.

[0026] In the figure: 100 - stamping component; 110 - base; 120 - die; 200 - collection component; 210 - frame plate; 211 - chute; 220 - collection box; 221 - concave shell; 222 - baffle; 2221 - handle; 2222 - groove; 230 - elastic clamping seat; 231 - vertical plate; 2311 - limiting groove; 232 - spring; 233 - arc-shaped block; 240 - diversion plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0029] Please refer to Figures 1-4 , this application provides a chip collection component including a stamping component 100 and a collection component 200. The collection component 200 can collect scattered powder raw materials.

[0030] Please refer to Figure 1 , the stamping component 100 includes a base 110 and a mold 120. The mold 120 is disposed on one side of the base 110.

[0031] Please refer to Figures 1-4 , the collection component 200 includes a frame plate 210, a collection box 220, elastic clamping seats 230, and a diversion plate 240. The frame plate 210 is sleeved on one side of the mold 120. The collection box 220 is slidably connected to both sides of the frame plate 210. The elastic clamping seats 230 are correspondingly disposed on both sides of the frame plate 210. The collection box 220 is clamped with the elastic clamping seats 230. The diversion plate 240 is correspondingly disposed on one side of the frame plate 210. The diversion plate 240 is in contact with the mold 120. Chute grooves 211 are provided on both sides of the frame plate 210. Providing the chute grooves 211 can play a role in limiting.

[0032] In some specific embodiments, the collection box 220 includes a concave shell 221 and a baffle 222. The concave shell 221 is slidably connected to the chute grooves 211. The baffle 222 is fixedly connected to the concave shell 221. The powder raw materials can be collected through the concave shell 221. The baffle 222 can play a role in connection. A handle 2221 is provided on one side of the baffle 222. Providing the handle 2221 facilitates pulling the concave shell 221. Grooves 2222 are correspondingly provided at both ends of the baffle 222. Providing the grooves 2222 can play a role in connection. The elastic clamping seat 230 includes a vertical plate 231, a spring 232, and a cambered surface block 233. The spring 232 is correspondingly disposed inside the vertical plate 231. The cambered surface block 233 is slidably connected to the vertical plate 231. The cambered surface block 233 is fixedly connected to the spring 232. The cambered surface block 233 is in contact with the grooves 2222. The spring 232 and the cambered surface block 233 can play a role in clamping.

[0033] In some specific embodiments, corresponding limiting grooves 2311 are provided inside the vertical plate 231, and the arc-shaped block 233 is slidably connected to the limiting groove 2311. When it is necessary to process the powder raw material inside the concave shell 221, the user can pull the handle 2221, and then drive the baffle 222 and the concave shell 221 to move. The arc-shaped block 233 can be squeezed through the grooves 2222 at both ends of the baffle 222, so that the arc-shaped block 233 moves into the limiting groove 2311. The groove 2222 is misaligned with the arc-shaped block 233, and the concave shell 221 can be pulled. Conversely, the concave shell 221 can be fixed.

[0034] The present utility model further provides a stamping device, including the above-mentioned chip receiving component.

[0035] The working principle of the chip receiving component and the stamping device: Firstly, the scattered powder raw materials generated during the stamping process of the mold 120 will directly enter the inside of the collection box 220 through the diversion plate 240, and the collection box 220 can collect the powder raw materials. One side of the diversion plate 240 is inclined, which can make the powder raw materials better enter the inside of the collection box 220. When it is necessary to process the powder raw material inside the concave shell 221, the user can pull the handle 2221, and then drive the baffle 222 and the concave shell 221 to move. The arc-shaped block 233 can be squeezed through the grooves 2222 at both ends of the baffle 222, so that the arc-shaped block 233 moves into the limiting groove 2311. The groove 2222 is misaligned with the arc-shaped block 233, and the concave shell 221 can be pulled. Conversely, the concave shell 221 can be fixed. By directly pulling out the concave shells 221 on both sides of the frame plate 210 from the inside of the frame plate 210, it is convenient to uniformly process the powder raw materials, which can avoid generating gaps with the mold 120 and affecting the collection effect. Furthermore, it can prevent the existence of gaps with the mold 120 for a long time and prevent the powder raw materials from scattering on the base 110, thereby improving the practicability.

[0036] The above are only the embodiments of the present application and are not used to limit the protection scope of the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0037] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A chip receiving assembly, characterized in that: include A stamping assembly (100), the stamping assembly (100) comprising a base (110) and a die (120), the die (120) being arranged on one side of the base (110); A collecting assembly (200), the collecting assembly (200) comprising a frame plate (210), a collecting box (220), an elastic clamping seat (230) and a guide plate (240), the frame plate (210) being sleeved on one side of the mold (120), the collecting box (220) being slidably connected to both sides of the frame plate (210), the elastic clamping seat (230) being correspondingly arranged on both sides of the frame plate (210), the collecting box (220) being clamped with the elastic clamping seat (230), the guide plate (240) being correspondingly arranged on one side of the frame plate (210), the guide plate (240) being in contact with the mold (120), and slide grooves (211) being arranged on both sides of the frame plate (210).

2. A chip-collecting assembly according to claim 1, characterized in that: The collection box (220) comprises a concave shell (221) and a baffle (222); the concave shell (221) is slidably connected to the slide groove (211); and the baffle (222) is fixedly connected to the concave shell (221).

3. A chip-collecting assembly according to claim 2, characterized in that: A handle (2221) is provided on one side of the baffle (222).

4. A chip-collecting assembly according to claim 3, characterized in that: Grooves (2222) are correspondingly arranged at two ends of the baffle (222).

5. A chip-collecting assembly according to claim 4, characterized in that: The elastic holder (230) comprises a vertical plate (231), a spring (232) and a curved surface block (233); the spring (232) is arranged correspondingly inside the vertical plate (231); the curved surface block (233) is slidably connected to the vertical plate (231); the curved surface block (233) is fixedly connected to the spring (232); and the curved surface block (233) is in contact with the groove (2222).

6. A chip-catching assembly according to claim 5, characterized in that: A limiting groove (2311) is correspondingly arranged inside the vertical plate (231), and the arc surface block (233) is slidably connected to the limiting groove (2311).

7. A punching device, characterized in that: include A chip collecting assembly as claimed in any one of claims 1 to 6.

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