Cleaning structure and polishing device
By introducing a moisturizing groove and a wet nozzle system into the polishing device, the problem of crystallized residue scratching the polishing pad during the polishing process is solved, and a more efficient cleaning and protection effect is achieved.
Patent Information
- Application Number
- CN202421818024.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-07-29
AI Technical Summary
During chemical mechanical polishing, crystal residues on the polishing pad trimmer and swing arms are prone to fall off, causing scratching of the product.
A cleaning structure is designed, including a moisturizing groove, a first wet spray nozzle and a second wet spray nozzle, for spraying the trimming disc and swing arms separately, ensuring that the components are sufficiently wet during the clean-up state and preventing crystallized residue from falling onto the polishing pad.
It effectively avoids scratching the polishing pad by crystal residues, improves product quality and production efficiency of the polishing process, and reduces the defect rate.
Smart Images
Figure CN223044337U_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the technical field of cleaning and washing equipment, and particularly to a cleaning structure and a polishing device. Background Art
[0002] During the gap between chemical mechanical polishing of two polishing pads and the maintenance of chemical mechanical polishing equipment, the polishing pad conditioner and part of the swing arm passing over the polishing pad will become dry, resulting in the shedding of residual products such as crystallization, which may scratch the product. Summary of the Utility Model
[0003] To overcome the problems existing in the related art, this specification provides a method and a device.
[0004] According to the first aspect of the embodiments of this specification, a cleaning structure is provided. The cleaning structure includes a moisturizing tank, a first wetting nozzle, and a second wetting nozzle; a cleaning space is provided inside the moisturizing tank, and both the first wetting nozzle and the second wetting nozzle are fixed to the moisturizing tank and enter the cleaning space; the swing structure includes a swing arm and a dressing disc for contacting the polishing pad, the dressing disc is rotatably connected to the side of the swing arm facing the polishing pad, the first wetting nozzle is used to spray the dressing disc, and the second wetting nozzle is used to spray the swing arm. The first wetting nozzle and the second wetting nozzle are respectively used to clean the residues on the dressing disc and the swing arm. By spraying water to cover the lower surface of the dressing disc and the part of the swing arm not blocked by the dressing disc, the crystal residues at the spraying positions are washed away, preventing the crystal residues and other products from falling onto the polishing pad or on the polishing pad when the equipment cleans the polishing pad, and further preventing the residues from scratching the product during the polishing process.
[0005] Further, the cleaning space includes a first space unit for cleaning the dressing disc; the number of the first wetting nozzles is multiple, and multiple first wetting nozzles are all located in the first space unit and are uniformly arranged along the central axis of the first space unit; the spraying surface of the first wetting nozzle is inclined towards the central axis of the first space unit. The first space unit is the space area covered by the dressing disc vertically downward in the cleaning space. The first wetting nozzles are located in the first space unit and are uniformly arranged to achieve uniform wetting of the dressing disc and ensure that the dressing disc can be fully wetted. And the inclination of the spraying surface of the first wetting nozzle with respect to the central axis of the first space unit can increase the spraying area of a single first wetting nozzle and better play the role of wetting.
[0006] Further, the rotation speed of the dressing disc is greater than or equal to 20 r / min and less than or equal to 40 r / min. When the rotation speed of the dressing disc is too fast and exceeds 40 r / min, the water sprayed on the dressing disc will be thrown off too quickly, reducing the wetting time of the dressing disc and resulting in more frequent wetting. Setting it below 40 r / min allows the dressing disc to have just the right rotation speed to evenly distribute the water sprayed onto it. Setting the lower limit of the rotation speed is to increase the speed of even distribution and reduce costs.
[0007] Further, the moisturizing tank includes a tank wall and an opening, and the opening is located at the top of the moisturizing tank; a limiting plate is provided at the top of the moisturizing tank, one end of the limiting plate is connected to the tank wall, and the other end extends in a direction away from the bottom of the moisturizing tank; along the direction away from the bottom of the moisturizing tank, the inside of the limiting plate converges inwards. The opening of the moisturizing tank is arranged upwards. The swing arm can rotate above the moisturizing tank, and then the first wetting nozzle and the second wetting nozzle start to spray water. The limiting plate can be used to prevent the water sprayed from the parts of the first wetting nozzle and the second wetting nozzle close to the edge of the moisturizing tank from spraying out of the moisturizing tank and affecting the working environment.
[0008] Further, the first wetting nozzle includes: a water supply part, passing through the bottom wall of the moisturizing tank and entering the cleaning space; a platform part, located in the cleaning space and rotatably connected to the water supply part; a nozzle part, fixed to the platform part; wherein, a water supply channel is arranged inside the water supply part, a water guiding channel is arranged inside the platform part, a water spraying channel is arranged inside the nozzle part, and both ends of the water guiding channel are respectively communicated with the water supply channel and the water spraying channel. The water supply part is installed in a through hole provided at the bottom of the moisturizing tank and passes through the through hole to enter the cleaning space; one end of the platform part is connected to the end of the water supply part located in the cleaning space, and the other end is connected to the end of the nozzle part close to the bottom of the moisturizing tank. Through the above arrangement, the liquid sprayed by the first wetting nozzle can sequentially pass through the water supply channel, the water guiding channel and the water spraying channel and leave the first wetting nozzle. Among them, both the nozzle part and the platform part are fixed to a platform, and the platform can rotate around the axis of the part of the water supply part located in the cleaning space. Both the nozzle part and the water supply part are made of rigid materials. The nozzle part is fixed on the platform and will rotate with the platform. The platform part is made of flexible material and can maintain the connection between the nozzle part and the water supply part when the nozzle part rotates with the platform.
[0009] The height of the first wetting nozzle is lower than the height of the second wetting nozzle. The first wetting nozzle needs to clean the lower surface of the dressing disc with a lower height, while the height of the swing arm that the second wetting nozzle needs to clean is greater than the height of the lower surface of the dressing disc. Therefore, the height of the first wetting nozzle needs to be lower than the height of the second wetting nozzle.
[0010] According to the second aspect of the embodiments of the present specification, a polishing device is provided. The polishing device includes: the polishing device includes a cleaning state and a working state; when the polishing device is in the cleaning state, the swinging structure moves above the cleaning space, the first wetting nozzle faces the dressing disc, and the second wetting nozzle faces the swing arm; when the polishing device is in the working state, the swinging structure is away from the moisturizing tank. When the polishing device is in the cleaning state, the swinging device enters the moisturizing tank, and the first wetting nozzle wets and cleans the swing arm and the dressing disc, preventing residues from remaining on the swing arm and the dressing disc, ensuring that no residues fall into the space where the polishing pad is located when the swinging structure cleans the polishing pad, and protecting the polishing pad from being scratched. When the polishing device is in the working state, the swinging structure swings above the polishing pad, the dressing disc cleans the polishing pad, and the moisture on the dressing disc takes away the hard residues during the polishing process, realizing the protection of the product, reducing the defect rate of the product, and improving the production quality.
[0011] Further, it includes a polishing pad, and the cleaning structure is used to clean the polishing pad; the moisturizing tank includes a tank wall and an opening, and the opening is located at the top of the moisturizing tank; when the polishing device is in the working state, at least a part of the swinging structure is located above the polishing pad, and the maximum length of the projection of the swinging structure on the polishing pad in the vertical direction is a first length d1, and the maximum length of the projection of the dressing disc on the polishing pad in the vertical direction is a second length d2; when the polishing device is in the cleaning state, the length of the spraying range of the second wetting nozzle along the extension direction of the swing arm is d3, and d3 ≥ the difference between d1 and d2. The second wetting nozzle is responsible for spraying and wetting the part of the swing arm that does not include the dressing disc. Therefore, the spraying range of the second wetting nozzle needs to be greater than the length of the part of the swing arm that does not include the dressing disc. One end of this part is the projection position of the dressing disc on the swing arm, and the other end is the position farthest from the projection position of the dressing disc in the space above the polishing pad when the swinging structure is in the working state. By ensuring that the size of the opening of the moisturizing tank is greater than the length of the corresponding position of the swing arm, it is ensured that the part of the swinging structure that will enter the space above the polishing pad can be fully wetted and cleaned, reducing the possibility of scratching the polishing pad in the working state.
[0012] Further, when the polishing device is in the cleaning state, the dressing disc is connected to the swing arm through a rotating shaft, and the dressing disc rotates around the rotating shaft. In the cleaning state, when the first wetting nozzle wets and cleans the dressing disc, the dressing disc rotates by itself, improving the moisturizing and cleaning efficiency and reducing the cost.
[0013] Further, the minimum distance from the first wetting nozzle to the dressing disc is a first distance, and the minimum distance from the second wetting nozzle to the swing arm is a second distance, and the first distance is less than or equal to the second distance; and / or, when the polishing device is in the cleaning state, the number of the second wetting nozzles is multiple, the second wetting nozzles are arranged along the extending direction of the swing arm, and the distance between adjacent second wetting nozzles is equal; and / or, when the polishing device is in the cleaning state, the area sprayed by the second wetting nozzles on the swing arm at least partially coincides with or the boundaries overlap with the projected area of the dressing disc on the swing arm in the vertical direction. The distance from the first wetting nozzle to the dressing disc is closer than the distance from the second wetting nozzle to the swing arm, which can enable the dressing disc to obtain a stronger moisturizing and cleaning effect. The number of the second wetting nozzles is multiple and they are evenly arranged along the extending direction of the swing arm. When spraying water, the swing arm within the spraying range can be evenly wetted, achieving the effect of cleaning the crystallization. The spraying range of the second wetting nozzles overlaps or the boundaries overlap with the projection of the dressing disc on the swing arm, so that there is no space between the swing arm and the dressing disc that cannot be cleaned, avoiding residues from falling onto the polishing pad when the polishing device is in the working state.
[0014] Further, when the polishing device is in the cleaning state, the number of the first wetting nozzles is multiple, at least one of which is a first nozzle and at least another is a second nozzle. The area sprayed by the first nozzle on the dressing disc is a first spraying surface, and the area sprayed by the second nozzle on the dressing disc is a second spraying surface. The first spraying surface and the second spraying surface at least partially overlap, and the overlapping part of the first spraying surface and the second spraying surface is a re-spraying area, and the central axis of the dressing disc is located within the re-spraying area. The first wetting nozzle includes at least two nozzles to fully wet the central area with a relatively low rotational linear velocity of the dressing disc. Since the first spraying surface and the second spraying surface have an overlapping area, and the overlapping area is located in the middle of the dressing disc or at least includes the middle of the dressing disc, during the rotation of the dressing disc, even if the water in the central area flows outward due to centrifugal force, the central area can still be fully moisturized and cleaned.
[0015] Further, the ratio of the area of the re-spraying area to the lower surface area of the dressing disc is greater than or equal to 0.15 and less than or equal to 0.5; and / or, the surface of the first nozzle with water spray openings is inclined towards the direction close to the second nozzle; and / or, the surface of the second nozzle with water spray openings is inclined towards the direction close to the first nozzle. The overlapping area of the first spraying surface and the second spraying surface needs to be at least greater than 15% of the entire lower surface of the dressing disc, so as to provide sufficient water for the middle area during rotation to ensure that the middle part of the dressing disc can still remain wet after rotation. Specifically, the first nozzle and the second nozzle are inclined towards the rotation axis of the dressing disc, so that the spraying surfaces of the first nozzle and the second nozzle have an overlapping area.
[0016] The technical solutions provided by the embodiments of this specification may include the following beneficial effects:
[0017] In the cleaning state, the bottom surface of the dressing disc is fully wetted by the first wetting nozzle to ensure that no crystallization exists on the bottom surface of the dressing disc, preventing the crystallization on the bottom surface of the dressing disc from scratching the polishing pad during the working state. And in the cleaning state, the swing arm is fully wetted and rinsed by the second wetting nozzle to ensure that no crystallization residue remains on the swing arm, avoiding the crystallization on the swing arm from falling onto the polishing pad and scratching the polishing pad during the working state.
[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. Description of the Drawings
[0019] The drawings here are incorporated into the specification and form a part of this specification, showing the embodiments consistent with this specification, and are used together with the specification to explain the principles of this specification.
[0020] Figure 1 It is a structural diagram of a polishing device shown in an embodiment of this specification.
[0021] Figure 2 It is a top view of a polishing device shown in an embodiment of this specification.
[0022] Figure 3 It is a cross-sectional view of the first wetting nozzle of a cleaning structure shown in an embodiment of this specification.
[0023] Figure 4 It is a structural diagram of a polishing device shown in an embodiment of this specification.
[0024] In the figure: 1. Cleaning structure, 2. Swing structure, 3. Polishing pad, 4. Cleaning state, 5. Working state, 10. Humidity preservation tank, 11. Tank wall, 12. Opening, 20. First wetting nozzle, 21. First nozzle, 22. First spraying surface, 23. Second nozzle, 24. Second spraying surface, 30. Second wetting nozzle, 40. Cleaning space, 41. First space unit, 50. Water supply part, 51. Water supply channel, 60. Platform part, 61. Water guiding channel, 62. Platform, 70. Nozzle head, 71. Water spraying channel, 80. Swing arm, 81. Dressing disc, 82. Rotating shaft, 83. Re-spraying area, d1. First length, d2. Second length, d3. Third length, d4. Fourth length. Detailed Embodiments
[0025] Such as Figure 1 - Figure 2As shown, a cleaning structure 1 is provided in the first aspect of the present application. The cleaning structure 1 includes a moisturizing tank 10, a first wetting nozzle 20, and a second wetting nozzle 30. The cleaning structure 1 cooperates with a swinging structure 2, and the swinging structure 2 includes a swing arm 80 and a dressing disc 81 for contacting the polishing pad 3. A cleaning space 40 is provided inside the moisturizing tank 10. The first wetting nozzle 20 and the second wetting nozzle 30 are both fixed to the moisturizing tank 10 and enter the cleaning space 40. The first wetting nozzle 20 and the second wetting nozzle 30 clean the swinging structure 2 in the cleaning space 40, thus avoiding cleaning and polishing simultaneously and saving the usage cost.
[0026] The dressing disc 81 is rotatably connected to one side of the swing arm 80 facing the polishing pad 3. The first wetting nozzle 20 is used to spray the dressing disc 81, and the second wetting nozzle 30 is used to spray the swing arm 80. The first wetting nozzle 20 and the second wetting nozzle 30 are respectively used to clean the residues on the dressing disc 81 and the swing arm 80. By spraying water to cover the lower surface of the dressing disc 81 and the part of the swing arm 80 not blocked by the dressing disc 81, the crystal residues at the spraying positions are washed away, preventing the generation products such as crystal residues from falling onto the polishing pad 3 or on the polishing pad 3 when the device cleans the polishing pad 3, and further preventing the residues from scratching the product during the polishing process.
[0027] The first wetting nozzle 20 is closer to the bottom of the moisturizing tank 10 than the second wetting nozzle 30. In other words, in this embodiment, the height of the first wetting nozzle 20 is lower than the height of the second wetting nozzle 30 because the first wetting nozzle 20 needs to clean the lower surface of the dressing disc 81 with a lower height, and the lowest height of the swing arm 80 that the second wetting nozzle 30 needs to clean is greater than the height of the lower surface of the dressing disc 81. Therefore, the height of the first wetting nozzle 20 needs to be lower than the height of the second wetting nozzle 30.
[0028] The cleaning space 40 includes a first space unit 41 for cleaning the dressing disc 81. The first space unit 41 is a space area covered by the dressing disc 81 vertically downward in the cleaning space 40, for accommodating the dressing disc 81. The horizontal cross-sectional area of the first space unit 41 is greater than or equal to the horizontal cross-sectional area of the dressing disc 81. The number of the first wetting nozzles 20 is multiple, and multiple first wetting nozzles 20 are all located in the first space unit 41 and are uniformly arranged along the central axis of the first space unit 41. The first wetting nozzles 20 are located in the first space unit 41 and are uniformly arranged to achieve uniform wetting of the dressing disc 81 and ensure that the dressing disc 81 can be fully wetted. The spraying surface of the first wetting nozzle 20 is inclined towards the central axis of the first space unit 41. The inclined setting of the spraying surface of the first wetting nozzle 20 and the central axis of the first space unit 41 can make the spraying surface of a single first wetting nozzle 20 larger and better play the role of wetting. In this embodiment, the included angle between the spraying surface of the first wetting nozzle 20 and the central axis of the first space unit 41 is 15°.
[0029] The rotation speed of the dressing disc 81 is greater than or equal to 20 r / min and less than or equal to 40 r / min. When the rotation speed of the dressing disc 81 is too fast and exceeds 40 r / min, the water sprayed on the dressing disc 81 will be thrown off too quickly, reducing the wetting time of the dressing disc 81 and resulting in more frequent wetting. Setting it below 40 r / min can enable the dressing disc 81 to have just the right rotation speed to evenly distribute the water sprayed on it. Setting the lower limit of the rotation speed is to increase the speed of uniform distribution and reduce costs.
[0030] The moisturizing tank 10 includes a tank wall 11 and an opening 12, and the opening 12 is located at the top of the moisturizing tank 10. The opening 12 of the moisturizing tank 10 faces upward. The swing arm 80 can rotate above the moisturizing tank 10, and the first wetting nozzle 20 and the second wetting nozzle 30 start to spray water. A limiting plate is provided at the top of the moisturizing tank 10. One end of the limiting plate is connected to the tank wall 11, and the other end extends in a direction away from the bottom of the moisturizing tank 10. Along the direction away from the bottom of the moisturizing tank 10, the inside of the limiting plate converges. The limiting plate can be used to prevent the water sprayed by the parts of the first wetting nozzle 20 and the second wetting nozzle 30 close to the edge of the moisturizing tank 10 from spraying out of the moisturizing tank 10 and affecting the working environment.
[0031] The first wetting nozzle 20 includes a water supply part 50 that penetrates the bottom wall of the moisture preservation tank 10 and enters the cleaning space 40. The water supply part 50 is installed in a through hole provided at the bottom of the moisture preservation tank 10 and penetrates the through hole to enter the cleaning space 40. A platform part 60 is located in the cleaning space 40 and is rotatably connected to the water supply part 50. One end of the platform part 60 is connected to one end of the water supply part 50 located in the cleaning space 40, and the other end is connected to one end of the nozzle part 70 close to the bottom of the moisture preservation tank 10. The nozzle part 70 is fixed to the platform part 60. After the nozzle part 70 is fixed to the platform part 60, it can rotate with the rotation of the platform 62.
[0032] As Figure 3 shown, wherein, a water supply channel 51 is provided inside the water supply part 50, a water guiding channel 61 is provided inside the platform part 60, a water spraying channel 71 is provided inside the nozzle part 70, and both ends of the water guiding channel 61 communicate with the water supply channel 51 and the water spraying channel 71 respectively. Through the above arrangement, the liquid sprayed by the first wetting nozzle 20 can sequentially pass through the water supply channel 51, the water guiding channel 61 and the water spraying channel 71 and leave the first wetting nozzle 20. Among them, both the nozzle part 70 and the platform part 60 are fixed to a platform 62, and the platform 62 can rotate around the axis of the part of the water supply part 50 located in the cleaning space 40. Both the nozzle part 70 and the water supply part 50 are made of rigid materials. The nozzle part 70 is fixed on the platform 62 and will rotate with the rotation of the platform 62. The platform part 60 is made of flexible material and can maintain the connection between the nozzle part 70 and the water supply part 50 when the nozzle part 70 rotates with the platform 62.
[0033] As Figure 1 、 Figure 2 and Figure 4As shown, the second aspect of the present application provides a polishing device. The polishing device includes a cleaning state 4 and a working state 5, and the polishing device can switch between the cleaning state and the working state. The cleaning state 4 is used to clean the swinging structure 2, and the working state 5 is used to clean the polishing pad 3. When the polishing device is in the cleaning state 4, the swinging structure 2 moves above the cleaning space 40, the first wetting nozzle 20 faces the dressing disc 81, and the second wetting nozzle 30 faces the swing arm 80; the first wetting nozzle 20 is closer to the bottom of the moisturizing tank 10 than the second wetting nozzle 30. The first wetting nozzle 20 is closer to the bottom of the moisturizing tank 10 than the second wetting nozzle 30. In other words, in this embodiment, the height of the first wetting nozzle 20 is lower than the height of the second wetting nozzle 30 because the first wetting nozzle 20 needs to clean the lower surface of the dressing disc 81 with a lower height, and the lowest height of the swing arm 80 that the second wetting nozzle 30 needs to clean is greater than the height of the lower surface of the dressing disc 81. Therefore, the height of the first wetting nozzle 20 needs to be lower than the height of the second wetting nozzle 30. When the polishing device is in the cleaning state 4, the swinging device enters the moisturizing tank 10, and the first wetting nozzle 20 wets and cleans the swing arm 80 and the dressing disc 81 to prevent residues from remaining on the swing arm 80 and the dressing disc 81, ensuring that no residues fall into the space where the polishing pad 3 is located when the swinging structure 2 cleans the polishing pad 3 and protecting the product from being scratched. When the polishing device is in the working state 5, the swinging structure 2 moves away from the moisturizing tank 10. When the polishing device is in the working state 5, the swinging structure 2 swings above the polishing pad 3, the dressing disc 81 cleans the polishing pad 3, and the moisture on the dressing disc 81 takes away the hard residues during the polishing process to protect the product, reduce the defect rate of the product, and improve the production quality.
[0034] The polishing device further includes a polishing pad 3, and the cleaning structure 1 is used to clean the polishing pad 3. Specifically, when the polishing device is in the working state 5, the swing arm 80 drives the dressing disc 81. When the polishing device is in the working state 5, at least a part of the swinging structure 2 is located above the polishing pad 3. The maximum length of the projection of the swinging structure 2 on the polishing pad 3 in the vertical direction is the first length d1, and the maximum length of the projection of the dressing disc 81 on the polishing pad 3 in the vertical direction is the second length d2. When the polishing device is in the cleaning state 4, the length of the spraying range of the second wetting nozzle 30 along the extension direction of the swing arm 80 is d3, and d3 ≥ the difference between d1 and d2. The second wetting nozzle 30 is responsible for spraying and wetting the part of the swing arm 80 that does not include the dressing disc 81. Therefore, the spraying range of the second wetting nozzle 30 needs to be greater than the length of the part of the swing arm 80 that does not include the dressing disc 81. One end of this part is the projection position of the dressing disc 81 on the swing arm 80, and the other end is the position farthest from the projection position of the dressing disc 81 in the space above the polishing pad 3 when the swinging structure 2 is in the working state 5. By ensuring that the size of the opening 12 of the moisturizing tank 10 is greater than the length of the corresponding position of the swing arm 80, it is ensured that the part of the swinging structure 2 that enters the space above the polishing pad 3 can be fully wetted and cleaned, reducing the possibility of scratching the polishing pad 3 in the working state 5. In this embodiment, the number of the second wetting nozzles 30 is multiple. At this time, the "spraying range of the second wetting nozzle 30" mentioned above should be understood as the sum of the ranges that all the second wetting nozzles 30 can spray, rather than the range that a single second wetting nozzle 30 can spray. Of course, in other embodiments, the number of the second wetting nozzles 30 can also be one. At this time, the "spraying range of the second wetting nozzle 30" shown above should be understood as the range that this second wetting nozzle 30 can spray.
[0035] When the polishing device is in the cleaning state 4, the dressing disc 81 is connected to the swing arm 80 through a rotating shaft 82, and the dressing disc 81 rotates around the rotating shaft 82. In the cleaning state 4, when the first wetting nozzle 20 wets and cleans the dressing disc 81, the dressing disc 81 rotates by itself, improving the moisturizing and cleaning efficiency and reducing the cost.
[0036] The minimum distance from the first wetting nozzle 20 to the dressing disc 81 is a first distance, and the minimum distance from the second wetting nozzle 30 to the swing arm 80 is a second distance. The first distance is less than or equal to the second distance. The closer distance between the first wetting nozzle 20 and the dressing disc 81 than between the second wetting nozzle 30 and the swing arm 80 can achieve a better moisturizing and cleaning effect on the dressing disc 81. When the polishing device is in the cleaning state 4, the number of the second wetting nozzles 30 is multiple, and the second wetting nozzles 30 are arranged along the extending direction of the swing arm 80, and the distance between adjacent second wetting nozzles 30 is equal. The number of the second wetting nozzles 30 is multiple and evenly arranged along the extending direction of the swing arm 80. When spraying water, the swing arm 80 within the spraying range can be evenly wetted, achieving the effect of cleaning the crystallization. In other embodiments, the number of the second wetting nozzles 30 can also be one. At this time, the installation position of the second wetting nozzle 30 is at a position with a fourth distance d4 from the dressing disc 81. The maximum length of the projection of the swing structure 2 on the polishing pad 3 in the vertical direction is a first length d1, and the maximum length of the projection of the dressing disc 81 on the polishing pad 3 in the vertical direction is a second length d2, and d4 = (d1 - d2) / 2.
[0037] When the polishing device is in the cleaning state 4, the area sprayed by the second wetting nozzles 30 on the swing arm 80 at least partially overlaps or has a boundary overlap with the projected area of the dressing disc 81 on the swing arm 80 in the vertical direction. The overlapping or boundary overlapping of the spraying range of the second wetting nozzles 30 and the projection of the dressing disc 81 on the swing arm 80 can prevent the space between the swing arm 80 and the dressing disc 81 from not being cleaned, avoiding residues from falling onto the polishing pad 3 when the polishing device is in the working state 5. It should be noted that in this embodiment, the number of the second wetting nozzles 30 is multiple. At this time, the "area sprayed by the second wetting nozzles 30 on the swing arm 80" mentioned above should be understood as the range that all the second wetting nozzles 30 can spray to, rather than the range that a single second wetting nozzle 30 can spray to. Of course, in other embodiments, the number of the second wetting nozzles 30 can also be one. At this time, the "spraying range of the second wetting nozzle 30" shown above should be understood as the range that this second wetting nozzle 30 can spray to.
[0038] When the polishing device is in the cleaning state 4, the number of the first wet nozzles 20 is multiple, at least one of which is the first nozzle 21 and at least another is the second nozzle 23. The area of the first nozzle 21 spraying on the dressing disc 81 is the first spraying surface 22, and the area of the first nozzle 21 spraying on the dressing disc 81 is the second spraying surface 24. The first spraying surface 22 and the second spraying surface 24 at least partially overlap, and the overlapping part of the first spraying surface 22 and the second spraying surface 24 is the re-spraying area 83. The central axis of the dressing disc 81 is located within the re-spraying area 83. The first wet nozzle 20 includes at least two nozzles to fully wet the central area with a relatively low rotational linear velocity of the dressing disc 81. Since the first spraying surface 22 and the second spraying surface 24 have an overlapping area, and the overlapping area is located in the middle of the dressing disc 81, or at least includes the middle of the dressing disc 81, during the rotation of the dressing disc 81, even if the water in the central area flows outwards due to centrifugal force, the central area can be fully moisturized and cleaned.
[0039] The ratio of the area of the re-spraying area 83 to the lower surface area of the dressing disc 81 is greater than or equal to 0.15 and less than or equal to 0.5. The overlapping area of the first spraying surface 22 and the second spraying surface 24 needs to be at least greater than 15% of the entire lower surface of the dressing disc 81 to provide sufficient water for the middle area during rotation to ensure that the middle part of the dressing disc 81 can still remain wet after rotation. The surface of the first nozzle 21 with a water spraying opening is inclined towards the direction close to the second nozzle 23, and the surface of the second nozzle 23 with a water spraying opening is inclined towards the direction close to the first nozzle 21. The first nozzle 21 and the second nozzle 23 are inclined towards the rotation axis 82 of the dressing disc 81, so that the spraying surfaces of the first nozzle 21 and the second nozzle 23 have an overlapping area to form the re-spraying area 83.
[0040] It should be understood that the present specification is not limited to the precise structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present specification is only limited by the appended claims.
[0041] The above are only the preferred embodiments of the present specification and are not intended to limit the present specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present specification shall be included within the scope of protection of the present specification.
Claims
1. A cleaning structure for cleaning a swing structure for cleaning a polishing pad, characterized in that: The cleaning structure comprises a moisturizing tank (10), a first moistening nozzle (20) and a second moistening nozzle (30); A cleaning space (40) is provided inside the moisturizing tank (10); the first moisturizing nozzle (20) and the second moisturizing nozzle (30) are both fixed to the moisturizing tank (10) and enter the cleaning space (40); The swing structure comprises a swing arm (80) and a dressing disc (81) for contacting the polishing pad (3); the dressing disc (81) is rotatably connected to a side of the swing arm (80) facing the polishing pad (3); the first wetting nozzle (20) is used to spray the dressing disc (81); and the second wetting nozzle (30) is used to spray the swing arm (80).
2. The cleaning structure according to claim 1, characterized in that: The cleaning space (40) comprises a first space unit (41) for cleaning a trimming disc (81); The number of the first wetting nozzles (20) is multiple, and the multiple first wetting nozzles (20) are all located in the first space unit (41) and are evenly arranged along the central axis of the first space unit (41); The spraying surface of the first wetting nozzle (20) is arranged to be inclined toward the central axis of the first space unit (41).
3. The cleaning structure according to claim 1, characterized in that: The rotation speed of the trimming disc (81) is greater than or equal to 20 r / min and less than or equal to 40 r / min.
4. The cleaning structure according to claim 1, characterized in that: The moisturizing groove (10) comprises a groove wall (11) and an opening (12), wherein the opening (12) is located at the top of the moisturizing groove (10); A limiting plate is provided at the top of the moisturizing groove (10), one end of the limiting plate is connected to the groove wall (11), and the other end of the limiting plate extends in a direction away from the bottom of the moisturizing groove (10); Along the direction away from the bottom of the moisturizing groove (10), the limiting plate converges inwardly.
5. The cleaning structure according to claim 1, characterized in that: The first wetting nozzle (20) comprises: A water supply portion (50) passes through the bottom wall of the moisturizing tank (10) and enters the cleaning space (40); A platform portion (60) is located in the cleaning space (40) and is rotatably connected to the water supply portion (50); A spray head (70) fixed to the platform (60); The water supply portion (50) is provided with a water supply channel (51), the platform portion (60) is provided with a water guide channel (61), the nozzle portion (70) is provided with a water spray channel (71), and the two ends of the water guide channel (61) are respectively connected to the water supply channel (51) and the water spray channel (71).
6. The cleaning structure according to claim 1, characterized in that: The first wetting nozzle (20) is closer to the bottom of the moisturizing tank (10) than the second wetting nozzle (30).
7. A polishing device, characterized in that: It comprises a swing structure and a cleaning structure as claimed in any one of claims 1 to 6; The swing structure comprises a swing arm (80) and a dressing disc (81) for contacting the polishing pad (3); The polishing device comprises a cleaning state (4) and a working state (5); When the polishing device is in a cleaning state (4), the swing structure moves to above the cleaning space (40), the first wetting nozzle (20) faces the trimming disc (81), and the second wetting nozzle (30) faces the swing arm (80); When the polishing device is in a working state (5), the swing structure is away from the moisturizing groove (10).
8. The polishing device according to claim 7, characterized in that: It comprises a polishing pad (3), wherein the cleaning structure is used for cleaning the polishing pad (3); The moisturizing groove (10) comprises a groove wall (11) and an opening (12), wherein the opening (12) is located at the top of the moisturizing groove (10); When the polishing device is in the working state (5), the swing structure is at least partially located above the polishing pad (3), the maximum length of the projection of the swing structure on the polishing pad (3) in the vertical direction is a first length d1, and the maximum length of the projection of the dressing disc (81) on the polishing pad (3) in the vertical direction is a second length d2; When the polishing device is in the cleaning state (4), the length of the spraying range of the second wet nozzle (30) along the extension direction of the swing arm (80) is d3, and d3≥the difference between d1 and d2.
9. The polishing device according to claim 7, characterized in that: When the polishing device is in the cleaning state (4), the dressing disc (81) is connected to the swing arm (80) via a rotating shaft (82), and the dressing disc (81) rotates around the rotating shaft (82).
10. The polishing device according to claim 7, characterized in that: The minimum distance from the first wetting nozzle (20) to the trimming disc (81) is a first distance, the minimum distance from the second wetting nozzle (30) to the swing arm (80) is a second distance, and the first distance is less than or equal to the second distance; and / or, When the polishing device is in the cleaning state (4), the number of the second wetting nozzles (30) is plural, the second wetting nozzles (30) are arranged along the extension direction of the swing arm (80), and the distances between adjacent second wetting nozzles (30) are equal; and / or, When the polishing device is in the cleaning state (4), the area sprayed by the second wet nozzle (30) on the swing arm (80) at least partially overlaps with the projection area of the dressing disc (81) on the swing arm (80) in the vertical direction, or the boundaries overlap.
11. The polishing device according to claim 7, characterized in that: When the polishing device is in the cleaning state (4), the number of the first wetting nozzles (20) is multiple, at least one of which is a first nozzle (21), and at least another one is a second nozzle (23); the area of the first nozzle (21) spraying on the trimming disc (81) is a first spraying surface (22); the area of the first nozzle (21) spraying on the trimming disc (81) is a second spraying surface (24); the first spraying surface (22) and the second spraying surface (24) at least partially overlap, and the overlapping portion of the first spraying surface (22) and the second spraying surface (24) is a heavy spraying area (83); and the central axis of the trimming disc (81) is located in the heavy spraying area (83).
12. The polishing device according to claim 11, characterized in that: The ratio of the area of the heavy spraying area (83) to the lower surface area of the trimming disc (81) is greater than or equal to 0.15 and less than or equal to 0.5; and / or, The surface of the first nozzle (21) with the water spray outlet is tilted toward the direction close to the second nozzle (23); and / or the surface of the second nozzle (23) with the water spray outlet is tilted toward the direction close to the first nozzle (21).