Automatic feeding and discharging equipment for storage chips
By designing a flip-type test seat and a memory chip automatic loading and unloading equipment with a folding return structure, the problems of high cost and poor applicability of traditional equipment are solved, and low-cost and efficient automatic loading and unloading are achieved.
Patent Information
- Application Number
- CN202422038823.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-21
AI Technical Summary
Traditional automatic loading and unloading equipment is not suitable for one-way interface test trays, which are expensive and cannot be suitable for multiple memory chips, resulting in low popularity of automation.
An automated loading and unloading equipment for memory chips including cabinets, test module mechanisms and robot components is designed. It adopts a flip-type test seat and folding return structure, combined with a chip position spacing correction table to achieve automated loading and unloading, reducing costs and improving efficiency.
It realizes low-cost, convenient and fast automatic loading and unloading, and is suitable for a variety of chip testing, improving testing efficiency and equipment life.
Smart Images
Figure CN223046699U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of storage test equipment, and particularly relates to an automatic loading and unloading device for storage chips. Background Art
[0002] Due to process reasons, there are differences in the performance consistency of storage chips. Before producing storage products, it is necessary to conduct test screening first, and classify and grade according to the differences in the applications of storage products. The conventional test screening and grading method for storage chips is divided into three steps: K1 test (pre-opening card, burning RDT self-running program), RDT (high and low temperature bad block screening), and K2 (identifying after bad block screening, secondary opening card). Among them, for the RDT test, the storage chips need to be loaded into a test tray with a controller and a power supply peripheral circuit, and then the power is turned on in a high and low temperature test chamber. The RDT program runs automatically. By wiping, writing, high temperature storage, reading and comparing with the written data, the physical storage blocks that fail in wiping, writing, high temperature storage, reading and comparing with the written data are recorded. Finally, through the K2 secondary opening card, the records are read, and the damaged blocks are identified and masked. With the development of technology, the reading and writing speed and frequency of storage chips are getting higher and higher. The new test tray must meet the high-frequency requirements, adopt a unidirectional interface, avoid antenna effect and signal reflection, and cannot operate at high frequency.
[0003] The traditional automatic loading and unloading equipment adopts a single-line operation mode, which is not suitable for the test tray with a unidirectional interface. Secondly, the traditional automatic loading and unloading equipment is adapted to a test socket with a pressing frame. The cost of the test socket with a pressing frame is expensive, which greatly increases the test cost and cannot be applied to all storage chips, resulting in low automation popularity.
[0004] Therefore, it is necessary to provide an automatic loading and unloading device for storage chips to solve the above problems. Summary of the Utility Model
[0005] In order to overcome the deficiencies of the prior art, the utility model provides an automatic loading and unloading device for storage chips, which has low cost, convenient and fast operation, realizes automatic loading and unloading, and effectively improves the loading and unloading efficiency of chip testing.
[0006] The technical solution adopted by the utility model to solve its technical problems is:
[0007] An automated loading and unloading device for a storage chip, comprising a cabinet body, a test module mechanism and a manipulator assembly. The test module mechanism is slidably connected inside the cabinet body. A chip loading and unloading mechanism is arranged on one side of the test module mechanism. The manipulator assembly spans across the cabinet body and is arranged above the test module mechanism and the chip loading and unloading mechanism. The chip loading and unloading mechanism is used for loading and unloading chip trays. The manipulator assembly is used for transferring chips to the test module mechanism. A test tray loading and unloading mechanism is further arranged at one end of the test module mechanism, and the test tray loading and unloading mechanism is used for loading and unloading test trays.
[0008] As a further improvement of the above technical solution, the test module mechanism includes a linear transmission member, a test tray and a flip cover assembly. The lower end of the test tray is slidably connected to the cabinet body through the linear transmission member, and the flip cover assembly spans across the test tray.
[0009] As a further improvement of the above technical solution, the test tray includes a plurality of test seats, and the plurality of test seats are arranged at intervals in multiple rows. The test seat includes a seat body, an upper cover and a trigger buckle. One end of the upper cover is hinged to the seat body, and the other end of the upper cover is snap-connected to the seat body through the trigger buckle.
[0010] As a further improvement of the above technical solution, the flip cover assembly includes a transmission screw, a transmission plate and a plurality of pressure wheel groups. The plurality of pressure wheel groups are connected at intervals below the transmission plate, and the positions of the pressure wheel groups correspond to the positions of the test seats. Transmission screws are arranged at both ends of the transmission plate.
[0011] As a further improvement of the above technical solution, the pressure wheel group includes a front wheel, a rear wheel and an elastic mounting member. The front wheel and the rear wheel are both connected to the transmission plate through the elastic mounting member. The front wheel and the rear wheel are respectively arranged at both ends of the test seat. Two front wheels are provided, and the distance between the two front wheels is less than or equal to the width of the test seat. The rear wheel is arranged between the two front wheels and is used for pressing the trigger buckle.
[0012] As a further improvement of the above technical solution, a chip position and pitch correction table is arranged below the test module mechanism, and the chip position and pitch correction table divides the test module mechanism into a tray transfer area and a chip placement area. The flip cover assembly is arranged in the tray transfer area, and the test tray loading and unloading mechanism is communicated with the tray transfer area.
[0013] As a further improvement of the above technical solution, the chip position spacing correction platform includes a first horizontal screw, a first vertical screw and a chip placement block, a plurality of the chip placement blocks are arranged in parallel on the first vertical screw, and the chip placement blocks on both sides of the first vertical screw are sleeved on the first horizontal screw.
[0014] As a further improvement of the above technical solution, the manipulator assembly includes a first manipulator, a second manipulator, a second transverse screw, a second longitudinal screw and a third longitudinal screw. The first manipulator and the second manipulator are respectively arranged on the second longitudinal screw and the third longitudinal screw. The second transverse screw is arranged at both ends of the cabinet. The second longitudinal screw and the third longitudinal screw are both transmission-connected to the second transverse screw. The second manipulator is arranged in the chip placement area, and the first manipulator and the second manipulator are both provided with telescopic suction cups, which are used to pull chips.
[0015] As a further improvement of the above technical solution, the chip loading and unloading mechanism includes a chip tray and a transmission assembly. The chip tray is arranged on the transmission assembly, and a plurality of chips are placed on the chip tray.
[0016] As a further improvement of the above technical solution, the test tray loading and unloading mechanism includes a lifting transmission assembly, and the lifting transmission assembly is provided with a plurality of conveying positions, and the test tray is arranged on the conveying positions.
[0017] The beneficial effects of the utility model are:
[0018] The utility model realizes automatic loading and unloading of the test module by setting the test module mechanism into a folding return structure, and the test seat adopts a flip-cover structure, which has low cost and high applicability; the provision of a flip-cover closing component solves the problem of automated application of the flip-cover test seat, greatly reduces the overall cost of the automated loading and unloading equipment solution, and is convenient and quick to operate; a chip position spacing correction table is provided below the test module, which not only corrects the chip spacing and position, but also realizes short-distance transmission, avoids operating interference between manipulators, reduces the complexity and operating actions of the manipulators, reduces costs, and improves efficiency and equipment life. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0020] Figure 1 This is a front view structural diagram of the loading and unloading equipment of the utility model;
[0021] Figure 2 It is a side view structural diagram of the loading and unloading equipment of the utility model;
[0022] Figure 3 yes Figure 2Enlarged view of location A
[0023] Figure 4 is a schematic top view structure diagram of the loading and unloading equipment of the present utility model.
[0024] Reference numerals: 1, cabinet; 2, test module mechanism; 21, linear transmission member; 22, test tray; 23, flip cover closing assembly; 231, transmission screw; 232, transmission plate; 233, pressure wheel group; 24, test seat; 241, seat body; 242, upper cover; 243, trigger buckle; 25, tray transfer area; 26, chip placement area; 3, manipulator assembly; 31, first manipulator; 32, second manipulator; 33, second cross screw; 34, second longitudinal screw; 35, third longitudinal screw; 4, chip loading and unloading mechanism; 41, chip tray; 5, test tray loading and unloading mechanism; 6, chip position and spacing correction table; 61, first cross screw; 62, first longitudinal screw; 63, chip placement block. Detailed implementation manners
[0025] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and the drawings, so as to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts shall fall within the scope of protection of the present utility model. In addition, all the connection / connection relationships involved in the patent do not refer only to the direct connection of components, but refer to the more optimal connection structure that can be formed by adding or reducing connection accessories according to the specific implementation situation. For example, fixed connection / fixed installation can be selected from screw connection, bolt connection, pin connection, key connection, bonding, tenon and mortise connection, welding, riveting, etc. as required. For example, detachable connection can be selected from screw connection, bolt connection, threaded connection, snap connection, tenon and mortise connection, magic tape connection, etc. as required. The various technical features in the creation of the present utility model can be combined with each other without conflict.
[0026] Refer to Figure 1 、 Figure 2, An automated loading and unloading device for a storage chip, comprising a cabinet 1, a test module mechanism 2 and a manipulator assembly 3. The test module mechanism 2 is slidably connected inside the cabinet 1, so that the test module mechanism 2 forms a foldable return system for circulation inside the cabinet 1 to realize automatic circulation, loading and unloading of the test tray. A chip loading and unloading mechanism 4 is arranged on one side of the test module mechanism 2. The manipulator assembly 3 spans inside the cabinet 1 and is arranged above the test module mechanism 2 and the chip loading and unloading mechanism 4. After the chip loading and unloading mechanism 4 transports the tray filled with chips to one side of the test module, the manipulator assembly 3 then transfers the chips to the test module mechanism 2. At the same time, the chip loading and unloading mechanism 4 can also transport the emptied chip tray 41 out to realize automatic loading and unloading of the chip tray. And a test tray loading and unloading mechanism 5 is further arranged at one end of the test module mechanism 2. The test tray loading and unloading mechanism 5 first transports the empty test tray 22 into the test module mechanism 2 for placing chips, and then transports the test tray 22 out after the chips are filled, so that loading and unloading are completed on the same device, reducing the turnover of the test tray 22. And the loading and unloading are alternately operated in two lines, reducing the ineffective repeated actions of the moving mechanical components and improving the efficiency.
[0027] Referring to Figures 2 to 4 , In an embodiment of the present invention, the test module mechanism 2 includes a linear transmission member 21, a test tray 22 and a flip cover assembly 23. The lower end of the test tray 22 is slidably connected to the cabinet 1 through the linear transmission member 21 to form a foldable return system to realize automatic loading and unloading of the test tray 22. The flip cover assembly 23 spans above the test tray 22 and can perform automatic opening and closing operations on the test seat 221 on the test tray 22.
[0028] Specifically, the test tray 22 includes a plurality of test seats 24, and the plurality of test seats 24 are arranged at intervals in multiple rows. And the test seats in this embodiment are arranged in a flip structure. The flip test seat can ensure the stability and accuracy during the test process, improve the reliability of the test results, and the flip test seat is suitable for testing various types and specifications of chips, having strong versatility and flexibility. Among them, the test seat 24 includes a seat body 241, an upper cover 242 and a trigger buckle 243. One end of the upper cover 242 is hinged to the seat body 241, and the other end of the upper cover 242 is snap-connected to the seat body 241 through the trigger buckle 243. A chip test position is arranged on the seat body 241. The upper cover 242 pops open to place the chip, and the upper cover 242 closes to fix the chip. The flip cover assembly 23 is used for opening and closing the upper cover 242.
[0029] Referring to Figure 4, in the embodiment of the present utility model, the flip cover assembly 23 includes a transmission screw 231, a transmission plate 232, and a plurality of press wheel groups 233. The plurality of press wheel groups 233 are connected to the lower side of the transmission plate 232 at intervals, and the positions of the press wheel groups 233 correspond to the positions of the test seats 221, so as to ensure that the test seat 24 can be covered or uncovered simultaneously. Transmission screws 231 are provided at both ends of the transmission plate 232, and the transmission screws 231 are arranged on both sides of the test module mechanism 2, so that the flip cover assembly 23 can perform the operations of opening and closing the test seats in different rows.
[0030] Specifically, the press wheel group 233 includes a front wheel, a rear wheel, and an elastic mounting member. The front wheel and the rear wheel are both connected to the transmission plate 232 through the elastic mounting member, and can tolerate slight deformation and positive and negative errors of the test seat and the test tray. The front wheel and the rear wheel are respectively arranged at both ends of the test seat 24, and there are two front wheels. The distance between the two front wheels is not greater than the width of the test seat 24. The rear wheel is arranged between the two front wheels, and the rear wheel is used to press the trigger buckle. When the front wheel rises and the rear wheel descends, the flip cover arm moves horizontally. The rear wheel slides horizontally to trigger the buckle 243, and the upper cover pops up. The flip cover arm continues to move horizontally, and the upper cover is limited by the front wheel and the rear wheel up and down, preventing the upper cover from popping up quickly and causing damage. While the flip cover arm moves horizontally with the front wheel and the rear wheel, it slowly rises until the upper cover is completely opened. When the front wheel descends and the rear wheel rises, and the rear wheel is higher than the trigger buckle 243, the flip cover arm moves horizontally in the opposite direction. The front wheel slides horizontally to push the upper cover down until the upper cover is completely covered and locked by the buckle.
[0031] Refer to Figures 2 to 4 , in the embodiment of the present utility model, a chip position pitch correction table 6 is provided below the test module mechanism 2, and the chip position pitch correction table 6 divides the test module mechanism 2 into a tray transfer area 25 and a chip placement area 26. The flip cover assembly 23 is arranged in the tray transfer area 25, and the test tray loading and unloading mechanism 5 is communicated with the tray transfer area 25 to facilitate the loading and unloading of the test tray. The manipulator assembly is arranged in the chip placement area 26 to transfer the chips from the chip tray 41 of the chip loading and unloading mechanism 4 to the test seats.
[0032] Specifically, the chip position and pitch correction table 6 includes a first horizontal screw 61, a first vertical screw 62, and a chip placement block 63. A plurality of the chip placement blocks 63 are arranged in parallel on the first vertical screw 62, and the chip placement blocks 63 on both sides of the first vertical screw 62 are sleeved on the first horizontal screw 61. The first manipulator assembly picks up chips from the chip tray and places them on the chip position and pitch correction table 6. The chip position and pitch correction table 6 moves through the first horizontal screw 61 and the first vertical screw 62, and starts position correction. The pitch and position between the chips are consistent with the pitch of the test socket. The second manipulator 32 sucks up the chips from the chip position and pitch correction table 6 and places them in the test socket, completing the loading operation.
[0033] By correcting the position and pitch of the chips through the chip position and pitch correction table 6, the manipulator does not need to rotate to adjust the angle and pitch, reducing the complexity and operating actions of the manipulator, lowering costs, and improving efficiency and the service life of the equipment. The first manipulator and the second manipulator are both moving mechanical components on the same plane and directly transfer materials alternately, which may cause collisions. However, the chip position and pitch correction table 6 is a moving mechanical component on another plane. It not only corrects the chip pitch and position but also conveys materials over a short distance, avoiding the operating interference between the first manipulator and the second manipulator.
[0034] Refer to Figure 2 、 Figure 4 Referring to
[0035] Refer to Figure 1, in an embodiment of the present utility model, the chip loading and unloading mechanism 4 includes a chip tray 41 and a transmission assembly. The chip tray 41 is disposed on the transmission assembly, and a plurality of chips are placed on the chip tray 41. An operator places the chip tray filled with chips on the transmission assembly. The transmission assembly is arranged as a circular circulating transmission mechanism. The chip tray 41 is transmitted to the picking position of the first manipulator 31 through the transmission assembly. After all the chips are transferred by the first manipulator 31, the chip tray 41 is then transmitted out through the transmission assembly to realize automatic chip loading.
[0036] Refer to Figure 2 , in an embodiment of the present utility model, the test tray loading and unloading mechanism 5 includes a lifting transmission assembly. A plurality of transfer positions are provided on the lifting transmission assembly, and the test tray 22 is disposed on the transfer positions. The lifting transmission assembly is also arranged as a circular circulating transmission mechanism. An operator places the test tray 22 without chips on the lifting transmission assembly. When the test tray 22 without chips is transmitted to the end of the tray transfer area, the test tray 22 without chips is then transmitted to the lower part of the flip cover closing assembly 23 through the linear transfer member 21. The test seat 24 is opened by the pressing wheel group 233. After the test tray 22 is opened, it is then transmitted to the chip placement area through the linear transfer member 21. The manipulator assembly 3 transfers the chips on the chip tray to the test seat 24. After the chips are placed, the linear transfer member 21 reversely transmits the test tray 22 filled with chips to the tray transfer area, and finally the lifting transmission assembly transmits the test tray 22 filled with chips out to realize automatic loading and unloading of the test tray 22.
[0037] The above is a specific description of the preferred embodiment of the present utility model, but the present utility model is not limited to the above embodiment. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A memory chip automatic loading and unloading device, characterized in that: It includes a cabinet, a test module mechanism and a manipulator assembly, wherein the test module mechanism is slidably connected to the inside of the cabinet, a chip loading and unloading mechanism is arranged on one side of the test module mechanism, the manipulator assembly spans the cabinet, and the manipulator assembly is arranged above the test module mechanism and the chip loading and unloading mechanism, the chip loading and unloading mechanism is used for loading and unloading chip trays, the manipulator assembly is used for transferring chips to the test module mechanism, and a test tray loading and unloading mechanism is also arranged at one end of the test module mechanism, and the test tray loading and unloading mechanism is used for loading and unloading test trays.
2. The automatic loading and unloading equipment for memory chips according to claim 1, characterized in that: The test module mechanism comprises a linear transmission member, a test tray and a flip cover and cover assembly, the lower end of the test tray is slidably connected to the cabinet through the linear transmission member, and the flip cover and cover assembly spans over the test tray.
3. The automatic loading and unloading equipment for memory chips according to claim 2 is characterized in that: The test tray includes a plurality of test seats, and the plurality of test seats are arranged in multiple rows at intervals. The test seat includes a seat body, an upper cover and a trigger buckle. One end of the upper cover is hinged to the seat body, and the other end of the upper cover is snap-connected to the seat body through the trigger buckle.
4. The automatic loading and unloading equipment for memory chips according to claim 3 is characterized in that: The flip cover closing assembly includes a transmission screw, a transmission plate and a plurality of pressure wheel groups. The plurality of pressure wheel groups are connected at intervals below the transmission plate, and the positions of the pressure wheel groups correspond to the positions of the test seat. Transmission screws are provided at both ends of the transmission plate.
5. The automatic loading and unloading equipment for memory chips according to claim 4, characterized in that: The pressure wheel group includes a front wheel, a rear wheel and an elastic mounting member, the front wheel and the rear wheel are connected to the transmission plate through the elastic mounting member, the front wheel and the rear wheel are respectively arranged at two ends of the test seat, and there are two front wheels, the spacing between the two front wheels is less than or equal to the width of the test seat, the rear wheel is arranged between the two front wheels, and the rear wheel is used to press the trigger buckle.
6. The automatic loading and unloading equipment for memory chips according to claim 2, characterized in that: A chip position spacing correction platform is arranged below the test module mechanism, and the chip position spacing correction platform divides the test module mechanism into a tray conveying area and a chip placement area. The flip cover and closing cover assembly is arranged in the tray conveying area, and the test tray loading and unloading mechanism is connected to the tray conveying area.
7. The automatic loading and unloading equipment for memory chips according to claim 6, characterized in that: The chip position spacing correction platform includes a first transverse screw, a first longitudinal screw and a chip placement block. A plurality of chip placement blocks are arranged in parallel on the first longitudinal screw, and the chip placement blocks on both sides of the first longitudinal screw are sleeved on the first transverse screw.
8. The automatic loading and unloading equipment for memory chips according to claim 6, characterized in that: The manipulator assembly includes a first manipulator, a second manipulator, a second transverse screw, a second longitudinal screw and a third longitudinal screw. The first manipulator and the second manipulator are respectively arranged on the second longitudinal screw and the third longitudinal screw. The second transverse screw is arranged at both ends of the cabinet. The second longitudinal screw and the third longitudinal screw are both connected to the second transverse screw in a transmission manner. The second manipulator is arranged in the chip placement area, and the first manipulator and the second manipulator are both provided with telescopic suction cups, which are used to pull chips.
9. The automatic loading and unloading equipment for memory chips according to claim 1, characterized in that: The chip loading and unloading mechanism comprises a chip tray and a transmission assembly. The chip tray is arranged on the transmission assembly, and a plurality of chips are placed on the chip tray.
10. The automatic loading and unloading equipment for memory chips according to claim 1, characterized in that: The test tray loading and unloading mechanism comprises a lifting transmission assembly, and a plurality of conveying positions are arranged on the lifting transmission assembly, and the test tray is arranged on the conveying positions.