Silicon wafer drying device

Abstract

The utility model discloses a silicon wafer drying device which comprises a drying oven, a basket and a laser heater, the basket is used for bearing a silicon wafer, the laser heater emits laser and irradiates the basket and the silicon wafer to heat the silicon wafer, two partition plates are arranged in the drying oven, and the two partition plates are arranged in the drying oven. The drying oven is divided into an air inlet cavity, a heating cavity and an air outlet cavity by the two partition plates, a plurality of ventilation holes are formed in the two partition plates, an air inlet and an air outlet are formed in the drying oven, the air inlet is communicated with the air inlet cavity, the air outlet is communicated with the air outlet cavity, a circulating fan is arranged outside the drying oven, and the air inlet is communicated with the heating cavity. And the circulating fan is communicated with the air inlet and the air outlet through a pipeline. According to the utility model, hot air circulation can be realized, silicon wafers are uniformly heated, the drying efficiency is greatly improved, the cost is reduced, and meanwhile, moisture generated when the silicon wafers are heated can be quickly discharged out of the drying oven to keep the interior of the drying oven dry.

Description

Technical Field

[0001] The utility model relates to the technical field of drying equipment, and particularly relates to a silicon wafer drying device. Background Art

[0002] In the process of preparing photovoltaic cells, a chain cleaning machine is generally used to clean silicon wafers. After the cleaning is completed, the silicon wafers need to be dried. Currently, common drying equipment includes a drying tank and a flower basket arranged in the drying tank. The silicon wafers are placed on the flower basket, and hot air is blown into the drying tank by combining a heater and a blower to dry the silicon wafers with hot air.

[0003] The existing drying equipment takes a long time for one-time drying, and the drying efficiency is low, seriously affecting the production capacity.

[0004] In order to improve the drying efficiency, generally, the number of tank bodies of the drying tank is increased, and the silicon wafers on multiple flower baskets are dried simultaneously. However, multiple drying tanks occupy a large space and greatly increase the cost of the equipment. Summary of the Utility Model

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a silicon wafer drying device, which can realize hot air circulation, make the silicon wafers evenly heated, greatly improve the drying efficiency, reduce the cost, and at the same time, can quickly discharge the moisture generated when the silicon wafers are heated outside the oven, keeping the inside of the oven dry.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A silicon wafer drying device includes an oven, a flower basket arranged in the oven, and a laser heater arranged on the oven. The flower basket is used to carry silicon wafers. The laser heater emits laser and irradiates the flower basket and the silicon wafers to heat the silicon wafers. Two partition plates are arranged in the oven, and the two partition plates divide the oven into an air inlet chamber, a heating chamber and an air outlet chamber. A plurality of ventilation holes are opened in both of the two partition plates. The oven is provided with an air inlet and an air outlet. The air inlet is communicated with the air inlet chamber, and the air outlet is communicated with the air outlet chamber. A circulating fan is arranged outside the oven. The air inlet is communicated with the air outlet end of the circulating fan through a pipeline, and the air outlet is communicated with the air inlet end of the circulating fan through a pipeline.

[0008] As a further improvement of the above technical solution, an infrared heating plate is further arranged in the oven, and the infrared heating plate emits infrared rays and irradiates the flower basket and the silicon wafers.

[0009] As a further improvement of the above technical solution, the laser heater is arranged outside the bottom of the oven, the infrared heating plate is arranged inside the bottom of the oven, the infrared heating plate is provided with an avoidance hole, and the avoidance hole allows the laser emitted by the laser heater to pass through.

[0010] As a further improvement of the above technical solution, the oven includes a box body and a cover plate. The box body includes a bottom plate, a plurality of side plates and two top plates. The plurality of side plates are enclosed around the edge of the bottom plate, and the two top plates are respectively covered on the tops of the air inlet chamber and the air outlet chamber. The top of the heating chamber is covered or opened through the cover plate.

[0011] As a further improvement of the above technical solution, the edge of the cover plate extends downward to form a frame, and the frame is used to limit the cover plate.

[0012] As a further improvement of the above technical solution, the bottom plate is provided with a liquid discharge port, and the liquid discharge port is located at the bottom of the heating chamber.

[0013] As a further improvement of the above technical solution, the bottom plate includes an inclined portion and flat portions arranged on both sides of the inclined portion. The inclined portion is located at the bottom of the heating chamber, and the two flat portions are respectively located at the bottoms of the air inlet chamber and the air outlet chamber. The liquid discharge port is arranged on the lower side of the inclined portion.

[0014] As a further improvement of the above technical solution, it further includes a support frame for supporting the oven, and the liquid discharge port is communicated with a liquid discharge pipe.

[0015] As a further improvement of the above technical solution, a temperature sensor is arranged on the oven.

[0016] As a further improvement of the above technical solution, the number of the temperature sensors is two, and the two temperature sensors are respectively located on both sides of the oven, and the two temperature sensors are respectively used to detect the temperatures of different components.

[0017] The beneficial effects of the present utility model are as follows:

[0018] 1. The present utility model provides a silicon wafer drying device. By arranging a laser heater, the laser heater emits laser and irradiates the flower basket and the silicon wafers. After being irradiated by the laser, the silicon wafers quickly heat up and raise the temperature of the entire heating chamber, thereby greatly improving the drying efficiency and reducing the cost.

[0019] 2. The present utility model provides a silicon wafer drying device. By setting an air inlet chamber, an air outlet chamber, a circulation fan and a pipeline, when the circulation fan works, the air flow generated by the circulation fan enters the air inlet chamber through the pipeline. The air flow in the air inlet chamber enters the heating chamber through a plurality of ventilation holes on one of the partitions. And the air flow entering the heating chamber forms a transverse air flow, then enters the air outlet chamber through a plurality of ventilation holes on the other partition, and finally returns to the air inlet end of the circulation fan through the pipeline, so that the circulation fan blows out hot air flow. Thus, hot air circulation can be realized, the silicon wafers are heated evenly, and at the same time, the moisture generated when the silicon wafers are heated can be quickly discharged outside the drying oven, keeping the inside of the drying oven dry. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present utility model will be further described below with reference to the drawings and embodiments.

[0021] Figure 1 is a schematic structural diagram provided by an embodiment of the present utility model;

[0022] Figure 2 is Figure 1 the schematic structural diagram of the drying oven and the laser heater in

[0023] Figure 3 is Figure 2 the sectional view of

[0024] Reference numerals: 100 - drying oven, 110 - flower basket, 120 - laser heater, 130 - silicon wafer, 140 - partition, 150 - air inlet chamber, 160 - heating chamber, 170 - air outlet chamber, 180 - ventilation hole, 190 - air inlet, 200 - air outlet, 210 - circulation fan, 220 - pipeline, 230 - infrared heating plate, 240 - box body, 250 - cover plate, 260 - bottom plate, 270 - side plate, 280 - top plate, 290 - frame, 300 - liquid discharge port, 310 - inclined part, 320 - straight part, 330 - support frame, 340 - liquid discharge pipe, 350 - temperature sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with embodiments and drawings to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model. In addition, all connection / connection relationships involved in the patent do not simply refer to direct connection of components, but refer to more optimal connection structures that can be formed by adding or reducing connection accessories according to specific implementation situations. Each technical feature in the creation of the present utility model can be interactively combined without mutual contradiction and conflict.

[0026] Referring to Figures 1 to 3 , a wafer drying device provided by an example of the present utility model includes an oven 100, a flower basket 110 arranged in the oven 100, and a laser heater 120 arranged on the oven 100. The flower basket 110 is used to carry wafers 130. The laser heater 120 irradiates the flower basket 110 and the wafers 130 with laser to heat the wafers 130. Two partition plates 140 are arranged in the oven 100. The two partition plates 140 divide the oven 100 into an air inlet chamber 150, a heating chamber 160 and an air outlet chamber 170. A plurality of ventilation holes 180 are opened on both partition plates 140. The oven 100 is provided with an air inlet 190 and an air outlet 200. The air inlet 190 is communicated with the air inlet chamber 150, and the air outlet 200 is communicated with the air outlet chamber 170. A circulation fan 210 is arranged outside the oven 100. The air inlet 190 is communicated with the air outlet end of the circulation fan 210 through a pipeline 220, and the air outlet 200 is communicated with the air inlet end of the circulation fan 210 through a pipeline 220.

[0027] During drying, the laser heater 120 emits laser and irradiates the flower basket 110 and the wafers 130. After being irradiated by the laser, the wafers 130 quickly heat up and cause the temperature in the entire heating chamber 160 to rise. At the same time, the circulation fan works. The air flow generated by the circulation fan 210 enters the air inlet chamber 150 through the pipeline 220. The air flow in the air inlet chamber 150 enters the heating chamber 160 through a plurality of ventilation holes 180 on one of the partition plates 140. And the air flow entering the heating chamber 160 forms a transverse air flow, then enters the air outlet chamber 170 through a plurality of ventilation holes 180 on the other partition plate 140, and finally returns to the air inlet end of the circulation fan 210 through the pipeline 220, so that the circulation fan 210 blows out hot air flow. Thus, hot air circulation can be realized, the wafers 130 are evenly heated, the drying efficiency is greatly improved, the cost is reduced, and at the same time, the moisture generated when the wafers 130 are heated can be quickly discharged outside the oven 100 to keep the inside of the oven 100 dry.

[0028] In some preferred embodiments, an infrared heating plate 230 is further disposed in the oven 100. The infrared heating plate 230 emits infrared rays and irradiates them onto the flower basket 110 and the silicon wafer 130. The laser and the infrared rays are simultaneously irradiated onto the flower basket 110 and the silicon wafer 130. Thus, the flower basket 110 and the silicon wafer 130 can be heated simultaneously, the heating speed of the flower basket 110 and the silicon wafer 130 is increased, and the drying efficiency is further improved.

[0029] Further, the laser heater 120 is disposed outside the bottom of the oven 100, and the infrared heating plate 230 is disposed inside the bottom of the oven 100. The infrared heating plate 230 is provided with an avoidance hole through which the laser emitted by the laser heater can pass.

[0030] It can be understood that the cleaning liquid adheres to the surface of the silicon wafer 130 after cleaning. Under the action of gravity, the cleaning liquid will flow along the surface of the silicon wafer 130 to the bottom, keeping the bottom of the silicon wafer 130 wet for a long time. The laser heater 120 and the infrared heating plate 230 located below the silicon wafer 130 are directly opposite to the bottom of the silicon wafer 130, so that the bottom of the silicon wafer 130 is heated first, further improving the drying efficiency. Moreover, the avoidance hole provided in the infrared heating plate 230 can prevent interference with the laser emitted by the laser heater 120.

[0031] In some preferred embodiments, the oven 100 includes a box body 240 and a cover plate 250. The box body 240 includes a bottom plate 260, a plurality of side plates 270, and two top plates 280. The plurality of side plates 270 surround the edge of the bottom plate 260. The two top plates 280 are respectively disposed on the tops of the air inlet cavity 150 and the air outlet cavity 170. The top of the heating cavity 160 is sealed or opened by the cover plate 250; before drying the silicon wafer 130 or after drying the silicon wafer 130, the cover plate 250 is opened to expose the top of the heating cavity 160, thus facilitating the operator to take and place the silicon wafer 130; when drying the silicon wafer 130, the cover plate 250 is covered to keep the heating cavity 160 in a closed state, thereby preventing the gas in the oven 100 from flowing out from the top.

[0032] Further, the edge of the cover plate 250 extends downward to form a frame 290 for limiting the cover plate 250. When the cover plate 250 is closed on the top of the box body 240, the cover plate 250 abuts against the top of the box body 240. At the same time, the inner wall of the frame 290 abuts against the outer edge of the box body 240, so that the cover plate 250 is completely closed on the top of the box body 240.

[0033] Specifically, a handle is further disposed on the top of the cover plate 250 to facilitate the operator to take the cover plate 250.

[0034] Furthermore, the bottom plate 260 is provided with a liquid discharge port 300 which is located at the bottom of the heating chamber 160. After the silicon wafer 130 is cleaned, the silicon wafer 130 is placed on the flower basket 110 in the oven 100. The residual cleaning liquid adhering to the surface of the silicon wafer 130 drips downward under the action of gravity, causing the residual cleaning liquid to drip onto the bottom plate 260 of the oven 100 and then discharged from the liquid discharge port 300 on the bottom plate 260 outside the oven 100. Thus, water accumulation inside the oven 100 can be prevented, the influence on the infrared heating plate 230 caused by water accumulation can be avoided, and at the same time, the gas humidity inside the oven 100 can be reduced.

[0035] Specifically, the bottom plate 260 includes an inclined portion 310 and flat portions 320 disposed on both sides of the inclined portion 310. The inclined portion 310 is located at the bottom of the heating chamber 160, and the two flat portions 320 are respectively located at the bottoms of the air inlet chamber 150 and the air outlet chamber 170. The liquid discharge port 300 is provided on the lower side of the inclined portion 310. The residual cleaning liquid dripping onto the bottom plate 260 of the oven 100 flows along the inclined portion 310 to the liquid discharge port 300. Thus, the residual cleaning liquid can be quickly discharged from the liquid discharge port 300, further preventing water accumulation inside the oven 100.

[0036] It should be noted that the bottom plate 260 can be integrally formed or independently spliced by an inclined portion 310 and two flat portions 320.

[0037] In some preferred embodiments, a support frame 330 is further included. The support frame 330 is used to support the oven 100. The liquid discharge port 300 is communicated with a liquid discharge pipe 340, which can lift the oven 100 off the ground, providing an installation space at the bottom of the oven 100 and facilitating the installation of the liquid discharge pipe 340.

[0038] Furthermore, the air inlet 190 and the air outlet 200 are respectively provided on the two flat portions 320, and the pipes 220 connecting the air inlet 190 and the air outlet 200 are all located at the bottom of the oven 100. Thus, the installation of the pipes 220 is facilitated.

[0039] In order to facilitate real-time monitoring of the temperature inside the oven 100, a temperature sensor 350 is provided on the oven 100.

[0040] Specifically, the number of the temperature sensors 350 is two. The two temperature sensors 350 are respectively located on both sides of the oven 100. One of the temperature sensors 350 is used to detect the temperature of the silicon wafer 130, and the other temperature sensor 350 is used to detect the temperature of the infrared heating plate 230. Thus, the heating state of the silicon wafer 130 can be monitored in real time, facilitating the adjustment of the powers of the laser heater 120 and the infrared heating plate 230. Furthermore, the heating temperature of the silicon wafer 130 can be ensured to be stably within the set range value.

[0041] The above is a specific description of the preferred embodiment of the present utility model. However, the present utility model is not limited to the described embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present utility model. These equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A silicon wafer drying device, characterized in that: The invention comprises an oven, a flower basket arranged in the oven, and a laser heater arranged on the oven, wherein the flower basket is used to carry silicon wafers, and the laser heater heats the silicon wafers by emitting laser and irradiating the flower basket and the silicon wafers. Two partitions are arranged in the oven, and the two partitions divide the oven into an air inlet chamber, a heating chamber and an air outlet chamber. Both the two partitions are provided with a plurality of ventilation holes. The oven is provided with an air inlet and an air outlet, and the air inlet is connected to the air inlet chamber, and the air outlet is connected to the air outlet chamber. A circulating fan is arranged outside the oven, and the air inlet is connected to the air outlet end of the circulating fan through a pipeline, and the air outlet is connected to the air inlet end of the circulating fan through a pipeline.

2. A silicon wafer drying device according to claim 1, characterized in that: An infrared heating plate is also arranged in the oven, and the infrared heating plate emits infrared rays and radiates them onto the flower basket and the silicon wafer.

3. A silicon wafer drying device according to claim 2, characterized in that: The laser heater is arranged on the outer side of the bottom of the oven, the infrared heating plate is arranged on the inner side of the bottom of the oven, and the infrared heating plate is provided with an avoidance hole, and the avoidance hole allows the laser emitted by the laser heater to pass through.

4. The silicon wafer drying device according to claim 1, characterized in that: The oven includes a box body and a cover plate, the box body includes a bottom plate, a plurality of side plates and two top plates, the plurality of side plates are surrounded by the edge of the bottom plate, the two top plates are respectively covered on the top of the air inlet cavity and the air outlet cavity, and the top of the heating cavity is sealed or opened by the cover plate.

5. The silicon wafer drying device according to claim 4, characterized in that: The edge of the cover plate extends downward to form a frame, and the frame is used to limit the cover plate.

6. The silicon wafer drying device according to claim 4, characterized in that: The bottom plate is provided with a liquid discharge port, and the liquid discharge port is located at the bottom of the heating chamber.

7. The silicon wafer drying device according to claim 6, characterized in that: The bottom plate includes an inclined portion and straight portions arranged on both sides of the inclined portion, the inclined portion is located at the bottom of the heating chamber, the two straight portions are respectively located at the bottom of the air inlet chamber and the air outlet chamber, and the drain port is arranged on the lower side of the inclined portion.

8. A silicon wafer drying device according to claim 6 or 7, characterized in that: It also includes a support frame, which is used to support the oven, and the drain port is connected to a drain pipe.

9. The silicon wafer drying device according to claim 1, characterized in that: The oven is provided with a temperature sensor.

10. The silicon wafer drying device according to claim 9, characterized in that: The number of the temperature sensors is two, and the two temperature sensors are respectively located at two sides of the oven, and the two temperature sensors are respectively used to detect the temperatures of different components.

Images