Baking oven

Abstract

The utility model discloses a baking furnace, and relates to the technical field of battery production. The baking furnace comprises a shell, a first air pipe and a semiconductor refrigeration part; the shell is provided with a first chamber and a second chamber which are isolated from each other; the first air pipe is communicated with the first cavity and is used for being connected with vacuumizing equipment; the semiconductor refrigeration part is provided with a hot end and a cold end which are deviated from each other, the semiconductor refrigeration part is arranged on the shell and located between the first cavity and the second cavity, the hot end faces the first cavity and is used for drying the battery in the first cavity, and the cold end faces the second cavity and is used for cooling the battery in the second cavity. The baking oven provided by the utility model has baking and cooling functions, and the occupied space of a processing place is saved.

Description

Technical Field

[0001] This application relates to the technical field of battery production, and particularly to a baking furnace. Background Art

[0002] Before injecting liquid into a lithium battery, it is necessary to dry and cool the lithium battery. However, in the prior art, baking equipment and cooling equipment are usually configured separately to bake and cool the lithium battery, resulting in a large number of production equipment and occupying a large space. Utility Model Content

[0003] This application provides a baking furnace that combines baking and cooling functions to reduce the space occupied by equipment.

[0004] This application provides: A baking furnace, comprising:

[0005] A housing configured with a first chamber and a second chamber that are isolated from each other;

[0006] A first air pipe communicating with the first chamber, and the first air pipe is used to connect to a vacuum pumping device;

[0007] A thermoelectric cooling element configured with a heat end and a cold end facing away from each other. The thermoelectric cooling element is disposed on the housing and is located between the first chamber and the second chamber. The heat end faces the first chamber and is used to dry the battery in the first chamber, and the cold end faces the second chamber and is used to cool the battery in the second chamber.

[0008] In some possible implementation manners, the baking furnace has a first direction, the second chamber has an inlet and an outlet, the inlet and the outlet are oppositely arranged along the first direction, the baking furnace further includes a conveying assembly, the conveying assembly is connected to the housing and is located in the second chamber, and the conveying assembly is used to transfer the battery from the inlet to the outlet.

[0009] In some possible implementation manners, the conveying assembly includes a plurality of transmission rollers, the transmission rollers are rotatably disposed on the housing, and the plurality of transmission rollers are arranged along the first direction.

[0010] In some possible implementation manners, the baking furnace further includes at least one air inlet pipe communicating with the second chamber, and the air inlet pipe is used to supply air to the second chamber.

[0011] In some possible implementation manners, the baking furnace further has a second direction and a third direction, and the second direction and the third direction intersect with the first direction;

[0012] The air inlet pipe is inclined with respect to the second direction;

[0013] Along the third direction, one end of the air inlet pipe close to the second chamber is arranged close to the conveying assembly.

[0014] In some possible embodiments, the baking oven includes a plurality of the air inlet pipes, and the plurality of air inlet pipes are symmetrically arranged on both sides of the housing along the second direction.

[0015] In some possible embodiments, the baking oven further includes a power storage unit, and the semiconductor refrigeration element is electrically connected to the power storage unit to form a charging circuit.

[0016] In some possible embodiments, the baking oven further includes a second air pipe, which is communicated with the first chamber, and the second air pipe is used for communicating with a drying air source.

[0017] In some possible embodiments, the baking oven further includes a partition board, the partition board divides the housing into the first chamber and the second chamber, a mounting hole penetrates through the partition board, and the semiconductor refrigeration element is mounted on the partition board and located in the mounting hole.

[0018] In some possible embodiments, one side of the first chamber is configured with an opening structure, the baking oven further includes a door panel, the door panel is rotatably connected to the housing, and the door panel is detachably connected to the housing, and the door panel is used to open or close the opening structure.

[0019] Advantages of the present application: The baking oven provided by the present application includes a first chamber for baking and a second chamber for cooling, that is, the baking oven has both baking and cooling functions at the same time, and there is no need to set up a cooling device to provide a cooling function for the battery, which can reduce the number of devices required in the battery processing process and save the occupied space of the processing site. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 Shows a schematic internal structure diagram of a baking oven in some embodiments;

[0022] Figure 2 Shows a schematic structure diagram of a baking oven in some embodiments;

[0023] Figure 3 Shows a schematic installation structure diagram of a semiconductor refrigeration element in some embodiments;

[0024] Figure 4 Shows a schematic diagram of the connection relationship during the use of a semiconductor refrigeration component in some embodiments.

[0025] Description of the main component symbols:

[0026] 1000 - baking oven;

[0027] 100 - housing; 101 - first chamber; 1011 - opening structure; 102 - second chamber; 1021 - inlet; 1022 - outlet; 110 - first side plate; 120 - second side plate; 130 - bottom plate; 140 - top plate;

[0028] 200 - semiconductor refrigeration component; 210 - hot end; 220 - cold end;

[0029] 300 - conveying assembly; 310 - conveying roller;

[0030] 400 - air inlet pipe;

[0031] 510 - first terminal; 520 - second terminal;

[0032] 610 - first air pipe; 620 - second air pipe;

[0033] 700 - electricity storage unit;

[0034] 800 - partition board; 810 - mounting hole;

[0035] 900 - door panel;

[0036] 2000 - battery;

[0037] 3000 - vacuum pumping device; 4000 - dry air source; 5000 - power supply device;

[0038] X - first direction; Y - second direction; Z - third direction. Detailed implementation manners

[0039] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0040] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0042] In the present application, unless otherwise clearly defined and limited, the terms such as "mounted", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0043] In the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0044] During the processing of a lithium battery, after placing the bare battery cell in the housing 100, it is necessary to bake and dry the lithium battery before injecting the electrolyte to remove the moisture in the lithium battery, so as to avoid the reaction between the moisture and the electrolyte and affect the performance indicators of the lithium battery. Subsequently, the lithium battery is cooled to a certain temperature for injecting the electrolyte.

[0045] Such as Figure 1As shown, in an embodiment, a baking oven 1000 is provided, which can be used for baking, drying, and cooling the battery 2000. Among them, the battery 2000 can be a lithium battery.

[0046] As Figures 1 to 3 shown, the baking oven 1000 includes a housing 100, a first air pipe 610, and a semiconductor refrigeration element 200. A first chamber 101 and a second chamber 102 are configured in the housing 100 in isolation. The first air pipe 610 is communicated with the first chamber 101, and the first air pipe 610 is used to connect a vacuum device 3000. The semiconductor refrigeration element 200 can be disposed on the housing 100 and is located between the first chamber 101 and the second chamber 102. In addition, the semiconductor refrigeration element 200 is configured with a heat end 210 and a cold end 220 facing away from each other. The heat end 210 can face the first chamber 101 and is used for drying the battery 2000 in the first chamber 101, and the cold end 220 faces the second chamber 102 and is used for cooling the battery 2000 in the second chamber 102.

[0047] In the embodiment, the semiconductor refrigeration element 200 may include a P-type semiconductor, an N-type semiconductor, a heat-end ceramic substrate, and a cold-end ceramic substrate. The P-type semiconductor and the N-type semiconductor may be alternately arranged in sequence along a horizontal direction. The heat-end ceramic substrate and the cold-end ceramic substrate may be respectively disposed on both sides of the P-type semiconductor and the N-type semiconductor in the vertical direction. That is, the heat-end ceramic substrate is located on the first side of the P-type semiconductor and the N-type semiconductor, and the cold-end ceramic substrate is located on the second side of the P-type semiconductor and the N-type semiconductor. The first-side surfaces of the P-type semiconductor and the N-type semiconductor are both connected in series with a first copper connecting piece, and the first copper connecting piece is connected to the cold-end ceramic substrate. The second-side surfaces of the P-type semiconductor and the N-type semiconductor are respectively connected to a second copper connecting piece to connect a power supply, and the second copper connecting piece is connected to the heat-end ceramic substrate. Among them, a surface of the heat-end ceramic substrate away from the cold-end ceramic substrate can be used as the heat end 210 of the semiconductor refrigeration element 200 and faces the first chamber 101. A surface of the cold-end ceramic substrate away from the heat-end ceramic substrate can be used as the cold end 220 of the semiconductor refrigeration element 200 and faces the second chamber 102. When the semiconductor refrigeration element 200 is powered on, the heat end 210 can generate heat, and the cold end 220 can refrigerate. The above semiconductor refrigeration element 200 belongs to the prior art and will not be elaborated here.

[0048] During the use process, the battery 2000 can be first placed in the first chamber 101, and the first chamber 101 is evacuated by the vacuum device 3000 through the first air pipe 610. On the one hand, the moisture content in the first chamber 101 can be reduced, and on the other hand, the boiling point of water can also be lowered to accelerate the evaporation of moisture. Connecting the vacuum device 3000 can accelerate the speed of discharging moisture and residual gas, improve the drying efficiency, and can effectively reduce the humidity inside the oven and shorten the drying time.

[0049] Start the semiconductor refrigeration component 200. The hot end 210 of the semiconductor refrigeration component 200 heats up, and can bake the battery 2000 in the first chamber 101, further accelerating the evaporation of moisture in the battery 2000. After the baking of the battery 2000 is completed, the battery 2000 can be taken out of the first chamber 101 and placed in the second chamber 102. The cold end 220 of the semiconductor refrigeration component 200 can provide a cooling function for the battery 2000 in the second chamber 102, quickly cooling the battery 2000 to the required temperature. At the same time, the hot end 210 of the semiconductor refrigeration component 200 can provide a baking function for other batteries 2000 that need to be baked.

[0050] The baking furnace 1000 provided by the present application has both baking and cooling functions, and can bake and cool the battery 2000 respectively, without the need to additionally set up a cooling device to cool the battery 2000. Thus, the number of devices required in the processing of the battery 2000 can be reduced, and the space of the processing site can be saved.

[0051] As Figure 2 shown, the baking furnace 1000 has a first direction X, a second direction Y, and a third direction Z that intersect each other. In some embodiments, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0052] As Figure 1 and Figure 2 shown, the housing 100 may include two first side plates 110, a second side plate 120, a top plate 140, and a bottom plate 130. Among them, the top plate 140 and the bottom plate 130 may be distributed along the third direction Z at both ends of the housing 100, and the bottom plate 130 may be located below the top plate 140. The second side plate 120 and the two first side plates 110 are both connected between the top plate 140 and the bottom plate 130, and are correspondingly arranged at one side position of the top plate 140. In addition, the two first side plates 110 are arranged opposite to each other.

[0053] As Figures 1 to 3 shown, the baking furnace 1000 further includes a partition plate 800, and the partition plate 800 is connected between the second side plate 120 and the two first side plates 110. The partition plate 800 can divide the interior of the housing 100 into a separated first chamber 101 and a second chamber 102. The first chamber 101 may be located between the partition plate 800 and the top plate 140, and the second chamber 102 may be located between the partition plate 800 and the bottom plate 130. In addition, the partition plate 800 is provided with an installation hole 810, and the installation hole 810 can penetrate the partition plate 800 along the third direction Z. The semiconductor refrigeration component 200 can be installed on the partition plate 800 and located in the installation hole 810.

[0054] In addition, the housing 100 further includes a door panel 900. One side of the first chamber 101 opposite to the second side plate 120 can be configured as an opening structure 1011. One side of the door panel 900 can be hinged to one side of the first side plate 110 near the opening structure 1011 through a hinge or a hinge, so that the opening structure 1011 can be opened or closed through the door panel 900. In addition, the other side of the door panel 900 away from its hinged side can be detachably connected to the other first side plate 110 through structures such as buckles.

[0055] In the embodiment, when the door panel 900 closes the opening structure 1011, the door panel 900 is hermetically connected to the first side plate 110, the top plate 140, and the partition plate 800, so that the first chamber 101 can form a closed cavity, avoiding the problem of air leakage, so as to evacuate the first chamber 101 through the vacuum pumping device 3000. Exemplarily, a ring-shaped sealing gasket (not shown in the figure) can be arranged on the side of the door panel 900 facing the opening structure 1011. When the door panel 900 closes the opening structure 1011, the sealing gasket can be compressively arranged between the door panel 900 and the first side plate 110, the top plate 140, and the partition plate 800. When the door panel 900 is opened, the operator can take and place the battery 2000 from the first chamber 101 through the opening structure 1011.

[0056] As Figure 1 and Figure 2 shown, the first chamber 101 is further connected to a second air pipe 620, and one end of the second air pipe 620 away from the first chamber 101 is used to connect to a dry gas source 4000. In some embodiments, the dry gas source 4000 can be selected from nitrogen or argon.

[0057] In other embodiments, the dry gas source 4000 can also be selected from dry air.

[0058] After the baking of the battery 2000 in the first chamber 101 is completed, dry gas can be conveyed into the first chamber 101 through the second air pipe 620 to break the vacuum environment in the first chamber 101, facilitating the operator to open the door panel 900 to take and place the battery 2000 from the first chamber 101.

[0059] As Figure 1 and Figure 2 shown, the second chamber 102 has an inlet 1021 and an outlet 1022, and the inlet 1021 and the outlet 1022 can be oppositely arranged along the first direction X. In some embodiments, the inlet 1021 can be located on the side of the housing 100 close to the door panel 900, and the outlet 1022 can be opened on the second side plate 120.

[0060] In addition, the baking oven 1000 further includes a conveying assembly 300. The conveying assembly 300 can be installed on the housing 100 and is located in the second chamber 102. In an embodiment, the conveying direction of the conveying assembly 300 can be set along the first direction X, and the conveying assembly 300 can transport the battery 2000 from the inlet 1021 to the outlet 1022. When the battery 2000 passes through the second chamber 102, the cold end 220 of the semiconductor refrigeration component 200 can cool the battery 2000 to achieve temperature reduction of the battery 2000.

[0061] The second chamber 102 is independent of the first chamber 101 and can work synchronously. The battery baked in the first chamber 101 can be taken to the second chamber 102 by means of a logistics line / robot / artificial method; at the same time, because the cooling time is relatively short, generally about 10 minutes, and the baking time is long, generally about 90 minutes, the conveying assembly 300 can also cooperate with an existing electric heating baking oven, that is, the battery cells after baking in the electric heating baking oven can also enter the second chamber 102 through the conveying assembly 300 for cooling.

[0062] In some embodiments, the conveying assembly 300 can include a transmission roller 310. The transmission roller 310 is rotatably connected to the housing 100, and a plurality of transmission rollers 310 are arranged along the first direction X. In an embodiment, the rotation axis of the transmission roller 310 can be parallel to the second direction Y.

[0063] In addition, the transmission roller 310 can be drivingly connected to a driving member (not shown in the figure). The driving member can be used to drive the transmission roller 310 to rotate so as to drive the battery 2000 to move. In some embodiments, the driving member can be selected as a motor, and the driving member can be drivingly connected to each transmission roller 310 through a gearbox (not shown in the figure). Thus, the conveying assembly 300 can transport the battery 2000 from the inlet 1021 to the outlet 1022.

[0064] In other embodiments, the conveying assembly 300 can include a conveyor belt. The conveyor belt can be laid along the first direction X, and the conveyor belt can be drivingly connected to the driving member through a belt roller. The driving member can be used to drive the belt roller to rotate, and further drive the conveyor belt to move along the first direction X to drive the battery 2000 to move from the inlet 1021 to the outlet 1022.

[0065] As Figure 1 and Figure 2 shown, the baking oven 1000 further includes at least one air inlet pipe 400. One end of the air inlet pipe 400 is communicated with the second chamber 102. The other end of the air inlet pipe 400 is used to connect structures such as a blower or a ventilator. During use, the air inlet pipe 400 can be used to supply air to the second chamber 102. Thus, the cooling of the battery 2000 can be accelerated.

[0066] In some embodiments, the baking oven 1000 may include four air inlet pipes 400, and the four air inlet pipes 400 may be symmetrically installed on two first side plates 110. The two air inlet pipes 400 on the same side may be arranged in sequence along the first direction X.

[0067] In other embodiments, the baking oven 1000 may also include one, two, three, six or other numbers of air inlet pipes 400. When the baking oven 1000 includes multiple air inlet pipes 400, the multiple air inlet pipes 400 may be respectively arranged on both sides of the second chamber 102.

[0068] As Figure 1 and Figure 2 shown, the air inlet pipe 400 may be inclined relative to the second direction Y. Along the third direction Z, one end of the air inlet pipe 400 close to the second chamber 102 may be arranged close to the conveying assembly 300, and one end of the air inlet pipe 400 far from the second chamber 102 may be arranged relatively far from the conveying assembly 300. Thus, when the air inlet pipe 400 supplies air to the second chamber 102, the cold air near the cold end 220 of the semiconductor refrigeration element 200 can be blown towards the battery 2000, so as to accelerate the cooling of the battery 2000, and further improve the processing efficiency of the battery 2000.

[0069] In some embodiments, an included angle α is configured between the axis of the air inlet pipe 400 and the second direction Y, 0° ≤ α ≤ 90°. When the air inlet pipe 400 supplies air to the second chamber 102, the cold air near the cold end 220 of the semiconductor refrigeration element 200 can be smoothly blown towards the conveying assembly 300, thereby accelerating the cooling of the battery 2000 on the conveying assembly 300 and improving the processing efficiency of the battery 2000. Exemplarily, in some embodiments, the included angle α configured between the axis of the air inlet pipe 400 and the second direction Y may be set to 15°, 30°, 45°, 50°, 60°, 65°, 75°, 80°, 90° or any other angle between 0° and 90°.

[0070] As Figure 4 shown, the semiconductor refrigeration element 200 further includes a second terminal 520, which can be used to connect to a power supply device 5000 to form a power supply loop. When the semiconductor refrigeration element 200 works, that is, when heating the first chamber 101 and refrigerating the second chamber 102, the power supply device 5000 can supply power to the semiconductor refrigeration element 200.

[0071] In addition, the baking oven 1000 further includes a power storage unit 700 for storing electrical energy. The semiconductor refrigeration component 200 further includes a first terminal 510, and the first terminal 510 can be electrically connected to the power storage unit 700 to form a charging circuit. When the operator opens the door panel 900 to place or remove the battery 2000 in the first chamber 101, since the temperature of the first chamber 101 will be significantly higher than the ambient temperature. Correspondingly, there will be a temperature difference between the hot end 210 and the cold end 220 of the semiconductor refrigeration component 200, and a thermoelectric effect will be generated, so that there will be a potential difference between the hot end 210 and the cold end 220 and electrical energy will be generated. The electrical energy can be transmitted to the power storage unit 700 through the first terminal 510 and stored in the power storage unit 700. During this process, the power supply device 5000 can stop supplying power to the semiconductor refrigeration component 200.

[0072] Among them, thermoelectric power generation utilizes the semiconductor Peltier effect. When there is a temperature difference between the hot end 210 and the cold end 220, a pressure difference can be generated, and an external power storage unit 700 (i.e., a battery) can be used for power generation and energy storage; the entire line circuit is in a parallel form, the power supply line and the charging line are separated, and the opening and closing are controlled by a controller. At the same time, the controller can monitor the current and temperature online to ensure safety.

[0073] It can be seen that the baking oven 1000 provided by the present application has both baking and cooling functions, can reduce space occupation, and save site space. In addition, the semiconductor refrigeration component 200 can bake a part of the batteries 2000 and rapidly cool another part of the batteries 2000 at the same time, which can improve the energy utilization rate. After the baking is completed, the waste heat in the first chamber 101 can be used for power generation to achieve an energy-saving effect, thereby reducing the production cost.

[0074] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0075] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A baking oven, characterized in that: include: A housing (100) is provided with a first chamber (101) and a second chamber (102) which are isolated from each other; A first air pipe (610) is connected to the first chamber (101), and the first air pipe (610) is used to connect to a vacuum pumping device (3000); A semiconductor refrigeration element (200) is provided with a hot end (210) and a cold end (220) which are spaced apart from each other. The semiconductor refrigeration element (200) is arranged on the housing (100) and is located between the first chamber (101) and the second chamber (102). The hot end (210) faces the first chamber (101) and is used to dry the battery (2000) in the first chamber (101). The cold end (220) faces the second chamber (102) and is used to cool the battery (2000) in the second chamber (102).

2. The baking oven according to claim 1, characterized in that: The baking oven has a first direction (X), and the second chamber (102) has an inlet (1021) and an outlet (1022), and the inlet (1021) and the outlet (1022) are arranged relatively to each other along the first direction (X). The baking oven also includes a conveying component (300), and the conveying component (300) is connected to the shell (100) and is located in the second chamber (102), and the conveying component (300) is used to transfer the battery (2000) from the inlet (1021) to the outlet (1022).

3. The baking oven according to claim 2, characterized in that: The conveying assembly (300) comprises a plurality of transmission rollers (310), wherein the transmission rollers (310) are rotatably disposed on the housing (100), and the plurality of transmission rollers (310) are arranged along the first direction (X).

4. The baking oven according to claim 2, characterized in that: The baking oven further comprises at least one air inlet pipe (400), wherein the air inlet pipe (400) is connected to the second chamber (102), and the air inlet pipe (400) is used to supply air to the second chamber (102).

5. The baking oven according to claim 4, characterized in that: The baking oven also has a second direction (Y) and a third direction (Z), and the second direction (Y), the third direction (Z) and the first direction (X) intersect each other; The air inlet pipe (400) is arranged obliquely relative to the second direction (Y); Along the third direction (Z), one end of the air inlet pipe (400) close to the second chamber (102) is arranged close to the conveying assembly (300).

6. The baking oven according to claim 5, characterized in that: The baking oven comprises a plurality of air inlet pipes (400), and the plurality of air inlet pipes (400) are symmetrically arranged on both sides of the shell (100) along the second direction (Y).

7. The baking oven according to claim 1, characterized in that: The baking oven further comprises an electricity storage unit (700), and the semiconductor refrigeration element (200) is electrically connected to the electricity storage unit (700) to form a charging circuit.

8. The baking oven according to claim 1, characterized in that: The baking oven further comprises a second air pipe (620) which is in communication with the first chamber (101), and the second air pipe (620) is used to be in communication with a drying air source (4000).

9. The baking oven according to claim 1, characterized in that: The baking oven further comprises a partition (150), wherein the partition (150) divides the shell (100) into the first chamber (101) and the second chamber (102), and a mounting hole (151) passes through the partition (150), and the semiconductor refrigeration element (200) is mounted on the partition (150) and is located in the mounting hole (151).

10. The baking oven according to claim 1, characterized in that: An opening structure (1011) is arranged on one side of the first chamber (101), and the baking oven further comprises a door panel (900), wherein the door panel (900) is rotatably connected to the shell (100), and the door panel (900) is detachably connected to the shell (100), and the door panel (900) is used to open or close the opening structure (1011).

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