Infrared sensor and circuit board
By designing the pins of the signal acquisition chip in the infrared sensor through the mounting holes of the base and extending to the circuit board, forming a physical isolation layer, the problem of poor thermal insulation of traditional infrared sensors is solved and detection accuracy and stability are improved.
Patent Information
- Application Number
- CN202422279165.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-18
AI Technical Summary
Traditional infrared sensors have poor thermal insulation, resulting in reduced performance and are susceptible to thermal noise interference in high temperature environments, affecting detection accuracy.
An infrared sensor is designed, and the signal acquisition chip is placed in the first cavity of the base, with multiple pins passing through the mounting holes on the base and extending to the circuit board to form a physical isolation layer to reduce heat conduction.
It significantly reduces the impact of heat generated by the circuit board on infrared sensor performance, and improves the stability and detection accuracy of the sensor.
Smart Images
Figure CN223050669U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of infrared sensors, and particularly relates to an infrared sensor and a circuit board. Background Art
[0002] The infrared sensors in the prior art usually consist of several key components: infrared sensitive elements (such as pyroelectric sensors), optical systems (lenses, etc.), signal processing circuits, etc. These sensors are widely used in various occasions, such as security monitoring, environmental monitoring, home appliance control, etc.
[0003] The traditional infrared sensors have the problem of poor heat insulation, which reduces the performance of the infrared sensors. Moreover, in a high-temperature environment, thermal noise may interfere with the infrared signal, affecting the detection accuracy. Summary of the Utility Model
[0004] The main purpose of the utility model is to propose an infrared sensor and a circuit board, aiming to improve the detection accuracy of the infrared sensor by enhancing the heat dissipation capacity of the infrared sensor.
[0005] To achieve the above purpose, the infrared sensor proposed by the utility model includes:
[0006] A base having a first cavity and a plurality of mounting holes communicating with the first cavity;
[0007] A housing having an opening and a light inlet communicating with the opening, the housing is disposed on the first surface of the base, and the opening faces the base;
[0008] A light sensing component disposed on the first surface of the base, the light sensing component is used to receive infrared light from the light inlet and output a corresponding infrared sensing signal;
[0009] A signal acquisition chip disposed in the first cavity of the base and electrically connected to the light sensing component, the signal acquisition chip is used to receive the infrared sensing signal and output a corresponding acquisition signal;
[0010] The signal acquisition chip has a plurality of pins. After the signal acquisition chip is disposed in the first cavity, the plurality of pins respectively pass through the plurality of mounting holes and extend a first height in the direction of the second surface of the base, so that after the plurality of pins are connected to the circuit board, the second surface of the base is spaced from the circuit board by a second height.
[0011] Optionally, at least one connection hole is further disposed on the first surface of the base, and the signal acquisition chip is electrically connected to the light sensing component through the connection hole.
[0012] Optionally, the infrared sensor further has at least one conductive part, and the conductive part has opposite first and second ends;
[0013] The first end of the conductive part passes through the connection hole, and at least part of the conductive part is disposed in the first cavity and is electrically connected to the signal acquisition chip, and the second end of the conductive part is electrically connected to the light sensing component.
[0014] Optionally, the number of the connection holes is two, the number of the conductive parts is two, the two connection holes are spaced apart, and the conductive parts are respectively disposed in the connection holes.
[0015] Optionally, the housing has a connection part disposed around the opening, and the connection part is connected to the edge of the first surface of the base.
[0016] Optionally, the plurality of mounting holes are spaced apart on the side surface of the base.
[0017] Optionally, the base is a cubic base.
[0018] Optionally, the cubic base has opposite first and second sides, and the plurality of mounting holes are respectively disposed on the first and second sides of the cubic base.
[0019] Optionally, the pin of the signal acquisition chip has a first part, a second part, and a third part connecting the first part and the second part;
[0020] The first part passes through the mounting hole, and the second part is used for connecting to the circuit board;
[0021] The length of the third part is the first height.
[0022] The present utility model further provides a circuit board, and the circuit board includes the infrared sensor as described above.
[0023] In summary, the infrared sensor of the present utility model aims to improve the heat dissipation capacity of the infrared sensor and improve the detection accuracy of the infrared sensor. Specifically, the signal acquisition chip is placed in the first cavity of the base, and a plurality of pins of the signal acquisition chip pass through the plurality of mounting holes on the base and extend a first height in the direction of the second surface of the base. When these pins are connected to the circuit board, a second height is maintained between the second side of the base and the circuit board, thus forming a physical isolation layer, effectively reducing the heat transfer from the circuit board to the infrared sensor. In this way, the influence of the heat generated by the circuit board on the performance of the infrared sensor can be significantly reduced, thereby improving the stability and detection accuracy of the sensor. Description of the Drawings
[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0025] Figure 1 Schematic diagram of the structure of an embodiment of the infrared sensor provided by the present invention;
[0026] Figure 2 Schematic diagram of the structure of another embodiment of the infrared sensor provided by the present invention.
[0027] Explanation of the reference numerals in the drawings:
[0028] 100, infrared sensor; 1, base; 11, mounting hole; 12, first surface; 13, second surface; 14, first side; 15, second side; 2, housing; 21, light inlet; 22, connecting portion; 3, light sensing component; 41, pin; 411, first part; 412, second part; 413, third part; 5, conductive portion; 51, second end; 6, circuit board.
[0029] The realization, functional characteristics and advantages of the object of the present invention will be further described in conjunction with the embodiments with reference to the drawings. Specific embodiments
[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.
[0031] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, such descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0033] Infrared sensors in the prior art usually consist of several key components: infrared sensitive elements (such as pyroelectric sensors), optical systems (lenses, etc.), signal processing circuits, etc. These sensors are widely used in various applications, such as security monitoring, environmental monitoring, home appliance control, etc.
[0034] Traditional infrared sensors have the problem of poor heat insulation, which reduces the performance of the infrared sensors. Moreover, in a high-temperature environment, thermal noise may interfere with the infrared signal, affecting the detection accuracy.
[0035] To alleviate the above problems and improve the detection accuracy of infrared sensors, the present utility model proposes an infrared sensor 100. As Figure 1 shown, in one embodiment, the infrared sensor 100 of the present invention includes a base 1, a housing 2, a light sensing component 3, and a signal acquisition chip.
[0036] In this embodiment, the base 1 has a first cavity and a plurality of mounting holes 11 communicating with the first cavity; thus, an installation space is provided for the signal acquisition chip, enabling the signal acquisition chip to be placed inside the base 1, facilitating the extension of the pins 41 of the signal acquisition chip.
[0037] In this embodiment, the housing 2 has an opening and a light inlet 21 communicating with the opening. The housing 2 is disposed on the first surface 12 of the base 1, and the opening faces the base 1; thus, the light inlet 21 of the housing 2 helps to focus the incident infrared light, improving the reception efficiency of the light sensing component 3.
[0038] In this embodiment, the light sensing component 3 is disposed on the first surface 12 of the base 1. The light sensing component 3 is used to receive the infrared light from the light inlet 21 and output a corresponding infrared sensing signal; the light sensing component 3 is used to receive infrared rays and convert them into corresponding infrared sensing signals.
[0039] In this embodiment, the signal acquisition chip is disposed in the first cavity of the base 1 and is electrically connected to the light sensing component 3. The signal acquisition chip is used to receive the infrared induction signal and output a corresponding acquisition signal. The electrical connection between the signal acquisition chip and the light sensing component 3 can quickly and accurately process the infrared induction signal, reducing signal delay and distortion.
[0040] It can be understood that, as Figure 2 shown, the signal acquisition chip has a plurality of pins 41. After the signal acquisition chip is disposed in the first cavity, the plurality of pins 41 respectively pass through the plurality of mounting holes 11 and extend a first height in the direction of the second surface 13 of the base 1, so that after the plurality of pins 41 are connected to the circuit board 6, a second height is spaced between the second surface 13 of the base 1 and the circuit board 6. In this way, the circuit board 6 and the infrared sensor 100 are not directly connected, but are spaced by a second height, so that the heat energy on the circuit board 6 cannot be directly conducted to the infrared sensor 100, thereby improving the heat insulation ability of the infrared sensor 100 and improving the detection accuracy of the infrared sensor 100.
[0041] The entire operation process of the infrared sensor 100 in the above embodiment is as follows: Infrared light enters through the light inlet 21 of the housing 2 and is received by the light sensing component 3. Subsequently, the generated infrared induction signal is processed by the signal acquisition chip and converted into an electrical signal for output. Due to the isolation design between the signal acquisition chip and the base 1, the influence of external temperature changes on the performance of the sensor is effectively reduced, and the stability and detection accuracy of the overall system are improved.
[0042] It should be noted that the positions of the plurality of mounting holes 11 can be disposed on the side surface or on any surface. The specific mounting position depends on the design of the signal acquisition chip. When the pins 41 of the signal acquisition chip are disposed on the bottom surface, the positions of the plurality of mounting holes 11 can be disposed on the second surface 13 of the base 1; when the pins 41 of the signal acquisition chip are disposed on both sides or on either side, the positions of the plurality of mounting holes 11 can be disposed on the first side 14 and / or the second side 15 of the base 1. In this way, any shaped signal acquisition chip can be adapted. Therefore, the position of the mounting hole 11 in this embodiment is not limited and depends on the position of the pin 41 of the signal acquisition chip, so as to facilitate leading out the pins 41 of the chip, facilitate the final installation, and facilitate the routing of the pins 41.
[0043] In summary, the infrared sensor 100 of the present utility model aims to improve the detection accuracy of the infrared sensor 100 by enhancing its heat dissipation capacity. Specifically, the signal acquisition chip is placed in the first cavity of the base 1, and multiple pins 41 of the signal acquisition chip pass through multiple mounting holes 11 on the base 1 and extend a first height in the direction of the second surface 13 of the base 1. When these pins 41 are connected to the circuit board 6, a second height is maintained between the second side 15 of the base 1 and the circuit board 6, thus forming a physical isolation layer that effectively reduces the transfer of heat from the circuit board 6 to the infrared sensor 100. In this way, the influence of the heat generated by the circuit board 6 on the performance of the infrared sensor 100 can be significantly reduced, thereby improving the stability and detection accuracy of the sensor.
[0044] In one embodiment, as Figure 1 shown, at least one connection hole is further provided on the first surface 12 of the base 1, and the signal acquisition chip is electrically connected to the light sensing component 3 through the connection hole.
[0045] It can be understood that the signal acquisition chip is located in the first cavity of the base 1, while the light sensing component 3 is located on the first surface 12 of the base 1. To ensure the electrical connection between the two, connection holes are designed so that the signal acquisition chip can establish an electrical connection with the light sensing component 3 through these connection holes. In this way, the electrical connection through the connection holes can ensure stable communication between the signal acquisition chip and the light sensing component 3, avoiding signal loss or instability caused by loose wires or poor contact.
[0046] In one embodiment, as Figure 1 shown, the infrared sensor 100 further has at least one conductive part 5, and the conductive part 5 has opposite first and second ends 51; the first end of the conductive part 5 passes through the connection hole, and at least part of the conductive part 5 is arranged in the first cavity and is electrically connected to the signal acquisition chip, and the second end 51 of the conductive part 5 is electrically connected to the light sensing component 3.
[0047] The conductive part 5 can be a cylinder, a wire, or other metal parts or conductive materials for electrical connection, capable of transmitting electrical signals.
[0048] In this embodiment, the first end of the conductive part 5 passes through the connection hole on the first surface 12 of the base 1, and at least part of the conductive part 5 is located in the first cavity and is electrically connected to the signal acquisition chip, while the second end 51 of the conductive part 5 is electrically connected to the light sensing component 3 located on the first surface 12 of the base 1. Such a design ensures a reliable and stable electrical connection between the signal acquisition chip and the light sensing component 3.
[0049] It can be understood that the conductive part 5 ensures the electrical connection reliability between the signal acquisition chip and the light sensing component 3, avoiding signal loss or instability caused by loose wires or poor contact. Secondly, the design of the conductive part 5 helps to reduce the mutual interference between signal lines, thereby reducing stray radiation and improving the purity of the signal.
[0050] In addition, since the signal acquisition chip is placed in the first cavity of the base 1 and connected to the light sensing component 3 through the conductive part 5, the conductive part 5 is arranged in the connection hole and clamped in the connection hole. Such a design makes the structure of the entire infrared sensor 100 more compact. At the same time, the anti-vibration ability is also improved. When receiving external vibrations, the conductive part 5 is clamped in the connection hole, which can greatly reduce the negative impact of vibrations on the structure. Thus, the design of the conductive part 5 can also help to enhance the mechanical strength between the signal acquisition chip and the base 1, ensuring good electrical contact even under vibrations or external forces.
[0051] In one embodiment, the number of the connection holes is two, the number of the conductive parts 5 is two, the two connection holes are arranged at intervals, and the conductive parts 5 are respectively arranged in the connection holes.
[0052] It can be understood that two connection holes are provided on the first surface 12 of the base 1, and correspondingly two conductive parts 5 are used to ensure the electrical connection between the signal acquisition chip and the light sensing component 3. By providing two connection holes and conductive parts 5, a more stable electrical connection path can be provided to ensure the reliability and stability of signal transmission. This design can also help to disperse the pressure of signal transmission and reduce the load on a single connection point, thereby improving the durability and reliability of the entire system.
[0053] In one embodiment, as Figure 1 shown, the housing 2 has a connecting part 22 arranged around the opening, and the connecting part 22 is connected to the edge of the first surface 12 of the base 1.
[0054] It can be understood that the connecting part 22 is used to firmly fix the housing 2 on the first surface 12 of the base 1 and form a first cavity. In this way, the stable connection between the housing 2 and the base 1 can be ensured. In this way, the internal components can be better protected from external factors, such as preventing dust and moisture from entering the sensor, and at the same time, it also helps to improve the mechanical strength and durability of the entire sensor.
[0055] In addition, the connecting part 22 is connected to the edge of the first surface 12 of the base 1. Thus, the tight combination of the connecting part 22 and the edge of the base 1 helps to improve the sealing performance between the housing 2 and the base 1, preventing external factors such as dust and moisture from entering the sensor and affecting its performance; at the same time, it can also improve the aesthetic degree.
[0056] In one embodiment, the plurality of mounting holes 11 are spaced apart on the side surface of the base 1.
[0057] It can be understood that the above embodiment is used to cooperate with a signal acquisition chip with pins 41 on the side surface. When the plurality of pins 41 of the signal acquisition chip are arranged on the side surface, the plurality of mounting holes 11 are mounted on the side surface of the base 1, which can ensure that the pins 41 of the signal acquisition chip can smoothly pass through the mounting holes 11 and be connected to the circuit board 6, while maintaining an appropriate distance between the signal acquisition chip and the circuit board 6, effectively reducing the heat conduction from the circuit board 6 to the infrared sensor 100 and improving the heat insulation performance of the sensor.
[0058] In one embodiment, the base 1 is a cubic base 1. It can be understood that the design of using a cubic base 1 can provide a larger internal space to accommodate the signal acquisition chip and other components, and at the same time, it is convenient to match and install with other standard-sized components (such as the circuit board 6). The cubic base 1 also has better structural stability and can withstand more external forces without being easily deformed. In addition, since most signal acquisition chips are cubic, setting the cubic base 1 can facilitate the leading out of the pins 41 of the signal acquisition chip.
[0059] In one embodiment, the cavity shape of the first cavity of the base 1 can be cubic, cylindrical, or other shapes. The specific shape depends on the actual application requirements. For example, the shape of the first cavity can be determined according to the shape of the signal acquisition chip, so as to improve the adaptability between the two and reduce the damage to the structure caused by vibration.
[0060] In one embodiment, the cubic base 1 has opposite first side 14 and second side 15, and the plurality of mounting holes 11 are respectively arranged on the first side 14 and the second side 15 of the cubic base 1.
[0061] Setting the mounting holes 11 on the first side 14 and the second side 15 of the base 1 respectively can further optimize the heat insulation effect. This distribution method can ensure that there is enough space between the pins 41 of the signal acquisition chip and the base 1 when connecting to the circuit board 6, thereby reducing heat transfer and improving the thermal stability of the sensor.
[0062] In some other embodiments, a signal acquisition chip with pins 41 arranged at the bottom can be used. For this type of signal acquisition chip, the plurality of mounting holes 11 in this embodiment can be arranged on the second plane of the base 1, so as to facilitate the leading out of the pins 41 of the signal acquisition chip.
[0063] Optionally, pin 41 of the signal acquisition chip has a first part 411, a second part 412, and a third part 413 connecting the first part 411 and the second part 412; the first part 411 passes through the mounting hole 11, and the second part 412 is used to connect to the circuit board 6; the length of the third part 413 is the first height.
[0064] It can be understood that pin 41 is divided into three parts: the first part 411 passes through the mounting hole 11 of the base 1, the second part 412 is used to connect to the circuit board 6, and the third part 413 is responsible for connecting the first part 411 and the second part 412, and its length determines the spacing distance between the signal acquisition chip and the circuit board 6. This design can ensure sufficient thermal isolation between the signal acquisition chip and the circuit board 6, reduce heat conduction, and improve the stability and detection accuracy of the sensor.
[0065] The present utility model also proposes a circuit board 6, which includes an infrared sensor 100. The specific structure of the infrared sensor 100 refers to the above embodiments. Since this circuit board 6 adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated here one by one.
[0066] It can be understood that, as Figure 2 shown, the infrared sensor 100 is applied to the circuit board 6. By placing the signal acquisition chip in the first cavity of the base 1 and maintaining a certain interval (second height) from the circuit board 6 through multiple pins 41, the heat conduction from the circuit board 6 to the infrared sensor 100 is effectively reduced. This design can significantly reduce the impact of the heat generated by the circuit board 6 on the performance of the infrared sensor 100, thereby improving the stability and detection accuracy of the sensor. Specifically, the physical isolation layer between the base 1 and the circuit board 6 helps to reduce thermal noise interference, improve the thermal isolation effect of the infrared sensor 100, ensure good working conditions even in high-temperature environments, and thus improve the reliability and service life of the entire circuit board 6 system.
[0067] The above description is only an exemplary embodiment of the present utility model, and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.
Claims
1. An infrared sensor, characterized in that: The infrared sensor comprises: A base having a first cavity and a plurality of mounting holes communicating with the first cavity; A shell having an opening and a light inlet connected to the opening, wherein the shell is disposed on the first surface of the base, and the opening faces the base; A light sensing component, disposed on the first surface of the base, the light sensing component is used to receive infrared light from the light inlet and output a corresponding infrared sensing signal; A signal acquisition chip is disposed in the first cavity of the base and is electrically connected to the light sensing component, and the signal acquisition chip is used to receive the infrared sensing signal and output a corresponding acquisition signal; The signal acquisition chip has a plurality of pins. After the signal acquisition chip is arranged in the first cavity, the plurality of pins pass through the plurality of mounting holes one by one and extend toward the second surface of the base to a first height, so that after the plurality of pins are connected to the circuit board, the second surface of the base is spaced from the circuit board by a second height.
2. The infrared sensor according to claim 1, characterized in that: The first surface of the base is also provided with at least one connection hole, and the signal acquisition chip is electrically connected to the light sensing component through the connection hole.
3. The infrared sensor according to claim 2, characterized in that: The infrared sensor also has at least one conductive portion, the conductive portion having a first end and a second end opposite to each other; The first end of the conductive part passes through the connecting hole, and at least a part of the conductive part is disposed in the first cavity and is electrically connected to the signal acquisition chip, and the second end of the conductive part is electrically connected to the light sensing component.
4. The infrared sensor according to claim 3, characterized in that: The number of the connection holes is two, the number of the conductive parts is two, the two connection holes are arranged at intervals, and the conductive parts are arranged in the connection holes in a one-to-one correspondence.
5. The infrared sensor according to claim 1, characterized in that: The housing has a connecting portion disposed around the opening, and the connecting portion is connected to an edge of the first surface of the base.
6. The infrared sensor according to claim 1, characterized in that: The plurality of mounting holes are arranged at intervals on the side surface of the base.
7. The infrared sensor according to claim 1, characterized in that: The base is a cube base.
8. The infrared sensor according to claim 7, characterized in that: The cube base has a first side and a second side opposite to each other, and the plurality of mounting holes are respectively arranged on the first side and the second side of the cube base.
9. The infrared sensor according to claim 8, characterized in that: The pin of the signal acquisition chip comprises a first part, a second part and a third part connecting the first part and the second part; The first portion passes through the mounting hole, and the second portion is used to connect to the circuit board; The length of the third portion is equal to the first height.
10. A circuit board, characterized in that: The circuit board comprises the infrared sensor according to any one of claims 1 to 9.