Special patch shunt for large current

Abstract

The utility model provides a special patch shunt for large current. The diverter is composed of a manganese-copper plate body and red copper plate bodies on the two sides, and the manganese-copper plate body and the red copper plate bodies are fixed through welding. A voltage sampling pin and a current sampling pin extend on the red copper plate body, so that the red copper plate body can be conveniently connected with a PCB (Printed Circuit Board). And a gap is kept between the manganese-copper plate body and the PCB without contact, so that the measurement accuracy is ensured. The special patch shunt for the large current forms a Kalvin resistor and is suitable for measuring and shunting the large current.

Description

Technical Field

[0001] The utility model relates to the technical field of electronics, in particular to a special patch shunt for high current. Background Art

[0002] In the field of electronic measurement, the measurement and shunting of current are common technical requirements. Especially in a high-current environment, higher requirements are placed on the stability and accuracy of measurement equipment. Traditional patch shunts have standard formats, and standard patch shunts have the following disadvantages:

[0003] 1) Standard patch shunts often have problems such as large thermal effects and poor stability when dealing with high currents, and can only be applied to the circuit sampling requirements of 20A to 30A at most.

[0004] 2) When there is a need for high current passing through the PCB board, multiple standard patch shunts are often connected in parallel. However, the soldering process of multiple standard patch shunts is complex, and the temperature coefficients of multiple standard patch shunts cannot be unified, affecting the final measurement accuracy.

[0005] 3) Existing standard patch shunts all use the two-terminal method for sampling, and the voltage terminals interfere with each other, resulting in a relatively large disturbance to the signal.

[0006] The invention with the application number CN202010278295.4 relates to the technical field of DC current detection, and specifically relates to a circuit structure based on a patch shunt and a current detection method. The circuit structure includes a PCB pad structure and at least one patch shunt. The patch shunt includes a resistance part and a solder foot part. The PCB pad structure includes a PCB substrate. A current-carrying copper foil and a current detection point wiring corresponding to the patch shunt are arranged on the PCB substrate. The current-carrying copper foil includes a PCB pad. The solder foot part is fixed to the PCB substrate through the PCB pad. Each PCB pad includes two separate parts. The current detection point wiring is located at the interval position between the two separate parts. The current detection point corresponding to the current detection point wiring is arranged on the resistance part. When using this circuit structure for current detection, the detected voltage signal is the voltage drop across the resistance part of the patch shunt, which can effectively reduce the temperature drift, improve the detection stability and has a high DC current detection accuracy.

[0007] However, the above patent technology does not solve the problems existing in the prior art, nor does it provide technical means to solve the technical problems. Summary of the Utility Model

[0008] The purpose of the utility model is to provide a special patch shunt for high current to solve the problems raised in the above background art:

[0009] 1) How to make the surface mount shunt applicable to high-current environments through structural improvements, and have the advantages of good stability and accurate measurement.

[0010] To achieve the above object, the present utility model provides the following technical solutions:

[0011] A high-current dedicated surface mount shunt includes a manganese copper plate body and copper plate bodies on both sides. The manganese copper plate body is welded and fixed to the copper plate bodies on both sides respectively.

[0012] A voltage sampling pin and two current sampling pins respectively extend from the copper plate body on the side away from the manganese copper plate body. The thickness of the manganese copper plate body is less than that of the copper plate body. A welding boss extends from the copper plate body on the side away from the manganese copper plate body. The copper plate bodies on both sides are welded and fixed to the manganese copper plate body through the welding bosses.

[0013] After the high-current dedicated surface mount shunt is welded to the PCB board, each voltage sampling pin and two current sampling pins of the copper plate body are electrically connected to the sampling ends on the PCB board respectively. There is a gap between the manganese copper plate body and the PCB board.

[0014] Based on the above technical solutions, the present utility model can also be improved as follows.

[0015] Further, the voltage sampling pin on each copper plate body is located between the two current sampling pins.

[0016] Further, the thickness of the welding boss is the same as that of the manganese copper plate body.

[0017] Further, the high-current dedicated surface mount shunt is measured by the four-wire bridge method.

[0018] Through optimized design and material selection, the high-current dedicated surface mount shunt improves the stability and measurement accuracy of the shunt in high-current environments, and is applicable to various occasions requiring high-current measurement and shunting. It can only be applicable to the circuit sampling requirements of 100A to 200A at most.

[0019] The advantages of the present utility model are that the structure is simple, the manufacturing cost is low, and it is suitable for large-scale production and application. At the same time, the high-current dedicated surface mount shunt of the present utility model has good stability and measurement accuracy, and can meet the measurement requirements in high-current environments.

[0020] The high-current dedicated surface mount shunt can be measured by the four-wire bridge method, which separates the voltage leads and current leads, thereby eliminating the voltage drop in the test circuit. The errors caused by the power resistance in the circuit and the measurement circuit are reduced.

[0021] This dedicated surface mount shunt for high current separates the current leads and voltage leads in the test circuit. The current sampling pins are used to transmit current, while the other voltage sampling pins are used to measure voltage. This can ensure accurate measurement results without being affected by the power resistance and the measurement circuit. Description of the Drawings

[0022] Figure 1 is the bottom view of an embodiment of this dedicated surface mount shunt for high current.

[0023] Figure 2 is the perspective view of an embodiment of this dedicated surface mount shunt for high current.

[0024] Explanation of the reference numerals in the figures:

[0025] Manganese copper plate body - 100; Copper plate body - 200; Voltage sampling pin - 210; Current sampling pin - 220; Welding boss - 230. Detailed Implementation Manner

[0026] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following will describe in detail the specific implementation manner of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific implementations disclosed below.

[0027] The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only and do not represent the only implementation manner.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0029] Please refer to Figures 1 to 2 .

[0030] This dedicated surface mount shunt for high current includes a manganese copper plate body 100 and copper plate bodies 200 on both sides. The manganese copper plate body 100 has good resistance stability and a small thermal effect, and is suitable for measuring high current. The copper plate bodies 200 have good electrical conductivity and weldability, which are convenient for connecting to the PCB board.

[0031] On one side of the manganese copper plate body 100 away from it, the copper plate body 200 respectively extends with a voltage sampling pin 210 and two current sampling pins 220. The voltage sampling pin 210 on each copper plate body 200 is located between the two current sampling pins 220. The thickness of the manganese copper plate body 100 is less than that of the copper plate body 200. The copper plate body 200 on one side away from the manganese copper plate body 100 extends with a welding boss 230. The copper plate bodies 200 on both sides are welded and fixed to the manganese copper plate body 100 through the welding boss 230. The thickness of the welding boss 230 is the same as that of the manganese copper plate body 100. Place the manganese copper plate body 100 between the copper plate bodies 200 on both sides and weld and fix the three through the welding boss 230. The thickness of the welding boss 230 is the same as that of the manganese copper plate body 100 to ensure the firmness and stability of the welding.

[0032] After the high-current special patch shunt is welded to the PCB board, the voltage sampling pin 210 and the two current sampling pins 220 of each copper plate body 200 are respectively electrically connected to the sampling ends on the PCB board. There is a gap between the manganese copper plate body 100 and the PCB board and they do not contact each other to reduce the thermal effect and improve the measurement accuracy. The high-current special patch shunt constitutes a Kelvin resistor and can be measured by the four-wire bridge method.

[0033] The above is only one implementation manner of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present utility model, several variations and improvements can be made, and these should also be regarded as belonging to the protection scope of the present utility model.

Claims

1. A high current dedicated patch shunt, comprising a manganese copper plate (100) and red copper plates (200) on both sides, wherein the manganese copper plate (100) is respectively welded and fixed to the red copper plates (200) on both sides, and is characterized by: A voltage sampling pin (210) and two current sampling pins (220) are respectively extended from the copper plate (200) on one side away from the manganese copper plate (100); the thickness of the manganese copper plate (100) is less than the thickness of the copper plate (200); a welding boss (230) is extended from the copper plate (200) on one side away from the manganese copper plate (100); and the copper plates (200) on both sides are fixed to the manganese copper plate (100) by welding via the welding boss (230); After the large current dedicated patch shunt is welded to the PCB board, each copper plate body (200) voltage sampling pin (210) and two current sampling pins (220) are respectively electrically connected to the sampling ends on the PCB board, and a gap is provided between the manganese copper plate body (100) and the PCB board.

2. The high current dedicated chip shunt according to claim 1 is characterized in that: The voltage sampling pin (210) on each copper plate (200) is located between the two current sampling pins (220).

3. The high current dedicated chip shunt according to claim 1 is characterized in that: The thickness of the welding boss (230) is consistent with that of the manganese copper plate (100).

4. The high current dedicated chip shunt according to claim 1 is characterized in that: This high current dedicated chip shunt uses the four-wire bridge method for measurement.

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