Semiconductor testing machine

Abstract

The utility model provides a semiconductor testing machine. The semiconductor testing machine comprises a to-be-tested object carrying plate mechanism, a combined setting testing module and a testing head. The test module is arranged between the to-be-tested object support plate mechanism and the test head in a combined manner, so that the terminal of the to-be-tested object support plate mechanism can be correctly butted with the terminal of the test head.

Description

Technical Field

[0001] The utility model relates to a semiconductor tester, in particular to a combined test module arranged between a carrier plate to be tested and a test head. Background Art

[0002] In a traditional semiconductor tester, the terminals of a carrier plate to be tested are directly combined with the terminals of a test head. However, there are many components at the bottom of the carrier plate to be tested, and the sizes of the carrier plates to be tested used for different objects to be tested may also be different. Therefore, in the traditional semiconductor tester, it is necessary to manually align the terminals of the carrier plate to be tested with the terminals of the test head. In other words, the traditional semiconductor tester is very laborious and not easy to install in operation. In addition, once the traditional semiconductor tester is operated carelessly, it is easy to cause damage to the carrier plate to be tested. Therefore, a combined test module with a positioning mechanism, which can quickly and labor-savingly combine or remove the carrier plate to be tested, is proposed to solve the problems generated by the prior art. Summary of the Utility Model

[0003] An object of an embodiment of the utility model is to provide a semiconductor tester with a combined test module.

[0004] The semiconductor tester according to an embodiment of the utility model includes a carrier plate mechanism to be tested, a combined test module and a test head. The combined test module is arranged between the carrier plate mechanism to be tested and the test head and is fixed on the test head. The combined test module includes a module bottom plate, a test module adapter and a carrier plate fixing and positioning mechanism. The test module adapter connects the module bottom plate and the test head. The carrier plate fixing and positioning mechanism is arranged on the module bottom plate and is used for fixing and positioning the carrier plate mechanism to be tested. The combined test module is used for enabling the terminals of the carrier plate mechanism to be tested to be correctly docked with the terminals of the test head.

[0005] In the semiconductor tester according to an embodiment of the utility model, the carrier plate mechanism to be tested includes a carrier plate to be tested and a positioning side plate. The carrier plate to be tested is used for carrying the object to be tested. The positioning side plate is installed below the carrier plate to be tested and has a guiding positioning column and a camshaft.

[0006] In the semiconductor testing machine according to an embodiment of the present utility model, the carrier board fixing and positioning mechanism includes a pair of docking terminal fixing plates, a terminal fixing plate column, a positioning guide base, and a combined linkage mechanism. The docking terminal fixing plates are used for docking the carrier board of the object to be tested. The terminal fixing plate column is disposed between the docking terminal fixing plates and the module bottom plate, and is used to determine the height of the docking terminal fixing plates. The positioning guide base is disposed on the module bottom plate and has a positioning hole for inserting the guiding positioning column. The combined linkage mechanism is disposed on the module bottom plate and is used to fix the carrier board of the object to be tested on the docking terminal fixing plates.

[0007] In the semiconductor testing machine according to an embodiment of the present utility model, the combined linkage mechanism includes a combined linkage plate, a linkage locking handle, a in-place spring lock seat, a labor-saving linkage shaft, a linear linkage rod, and a linkage force arm. The combined linkage plate is disposed on the positioning guide base and has a cam groove for the cam shaft to enter. The linkage locking handle is disposed on the module bottom plate and is used to control the combined linkage plate to pull down the carrier board mechanism of the object to be tested. The in-place spring lock seat is disposed on the module bottom plate and is used to lock the linkage locking handle. The labor-saving linkage shaft connects the linkage locking handle and serves as the rotation shaft of the linkage locking handle. The linear linkage rod connects the linkage locking handle and linearly moves as the linkage locking handle rotates. The linkage force arm connects the linear linkage rod and the combined linkage plate, and the linkage force arm pushes the combined linkage plate as the linear linkage rod moves.

[0008] In the semiconductor testing machine according to an embodiment of the present utility model, the combined linkage mechanism further includes a thrust linkage shaft connecting the linear linkage rod, and the thrust linkage shaft is used to assist the linear linkage rod to maintain linear movement and reduce the friction when the linear linkage rod moves. Description of the Drawings

[0009] Through the following description of the embodiments of the present utility model with reference to the drawings, the above and other objects, features, and advantages of the present utility model will become clearer. In the drawings:

[0010] Figure 1 is a schematic diagram of the semiconductor testing machine according to an embodiment of the present utility model.

[0011] Figure 2 is Figure 1 a schematic diagram of the carrier board mechanism of the object to be tested in

[0012] Figure 3 is Figure 1 a schematic diagram of the module bottom plate and the test module adapter seat of the combined test module in

[0013] Figure 4 It is a schematic diagram of the carrier board of the object to be tested not being docked with the fixed board of the docking terminal.

[0014] Figure 5 It is a schematic diagram of the carrier board of the object to be tested being docked with the fixed board of the docking terminal.

[0015] Reference numerals:

[0016] 10: Semiconductor tester

[0017] 12: Mechanism of the carrier board of the object to be tested

[0018] 1202: Carrier board of the object to be tested

[0019] 1204: Positioning side plate

[0020] 1206: Screw

[0021] 1208: Nut

[0022] 1210: Guide positioning post

[0023] 1212: Camshaft

[0024] 14: Combined test module

[0025] 1402: Module bottom plate

[0026] 1404: Carrier board fixing and positioning mechanism

[0027] 1406: Fixed board of the docking terminal

[0028] 1408: Column of the fixed board of the terminal

[0029] 1410: Positioning guide base

[0030] 1412: Combined linkage plate

[0031] 1414: Linkage locking handle

[0032] 1416: Spring lock seat in place

[0033] 1418: Labor-saving linkage shaft

[0034] 1420: Linear linkage rod

[0035] 1422: Linkage arm

[0036] 1424: Thrust linkage shaft

[0037] 1426: Positioning hole

[0038] 1428: Cam groove

[0039] 16: Test head Detailed implementation manner

[0040] Figure 1 It is a schematic diagram of the semiconductor tester according to the embodiment of the present utility model. Figure 2 is Figure 1 a schematic diagram of the DUT carrier mechanism in Figure 3 is Figure 1 a schematic diagram of the module base plate and the test module adapter seat for combining and setting the test module in Figure 1 The semiconductor tester 10 of includes a DUT carrier mechanism 12, a combined test module 14 and a test head 16. The DUT carrier mechanism 12 is used to carry a DUT. The combined test module 14 is disposed between the DUT carrier mechanism 12 and the test head 16 and is fixed on the test head 16. The combined test module 14 is used to electrically connect the DUT on the DUT carrier mechanism 12 to the test head 16. Referring to Figure 2 The DUT carrier mechanism 12 includes a DUT carrier 1202 and positioning side plates 1204. The DUT carrier 1202 is used to carry the DUT. Two positioning side plates 1204 are installed under the DUT carrier 1202 and are located on both sides of the DUT carrier 1202. In this embodiment, the DUT carrier mechanism 12 has two positioning side plates 1204, but the present application is not limited thereto, and the number of positioning side plates 1204 can be only one or more than two. The positioning side plates 1204 are locked on the DUT carrier 1202 by screws 1206 and nuts 1208. The positioning side plate 1204 has a guiding positioning post 1210 and a camshaft 1212.

[0041] Referring to Figure 1 and Figure 3, the combined setting test module 14 includes a module base plate 1402, a test module adapter, and a carrier plate fixing and positioning mechanism 1404. The test module adapter includes a docking terminal fixing plate 1406, terminal fixing plate columns 1408, a positioning guide base 1410, and a combined linkage mechanism. The combined linkage mechanism is disposed on the module base plate 1402 and includes a combined linkage plate 1412, a linkage locking handle 1414, a spring seat for in-place locking 1416, a labor-saving linkage shaft 1418, a linear linkage rod 1420, a linkage arm 1422, and a thrust linkage shaft 1424. The docking terminal fixing plate 1406 is used to dock with the carrier plate 1202 of the object to be tested. A PCB terminal carrier plate (not shown in the figure) can be locked to the docking terminal fixing plate 1406 to dock with the terminals of the object to be tested. The terminal fixing plate columns 1408 are between the docking terminal fixing plate 1406 and the module base plate 1402 to determine the height of the docking terminal fixing plate 1406. The positioning guide base 1410 is disposed on the module base plate 1402 and has a positioning hole 1426 for the guiding positioning post 1210 to insert. In this embodiment, the test module adapter has two positioning guide bases 1410, but the present application is not limited thereto. The number of positioning guide bases 1410 can be only one or more than two. Each positioning guide base 1410 corresponds to a positioning side plate 1204. The positioning side plate 1204 and the positioning guide base 1410 are used to position the carrier plate 1202 of the object to be tested so that the terminals of the carrier plate 1202 of the object to be tested can be correctly connected to the terminals of the test head 16.

[0042] The combined linkage mechanism composed of the combined linkage plate 1412, the linkage locking handle 1414, the in-place spring lock seat 1416, the labor-saving linkage shaft 1418, the linear linkage rod 1420, the linkage arm 1422 and the thrust linkage shaft 1424 is used to fix the test object carrier plate 1202 on the docking terminal fixing plate 1406. The two combined linkage plates 1412 are respectively arranged on the corresponding positioning guide bases 1410, and each has a cam groove 1428 for the camshaft 1212 of the corresponding positioning side plate 1204 to enter. The linkage locking handle 1414 is arranged on the module bottom plate 1402. When the linkage locking handle 1414 is rotated, the combined linkage plate 1412 will be pushed so that the camshaft 1212 of the positioning side plate 1204 is pulled downward by the cam groove 1428, thereby fixing the test object carrier plate 1202 on the docking terminal fixing plate 1406. In other words, the linkage locking handle 1414 is used to control the combined linkage plate 1412 to pull down the test object carrier plate mechanism 12. The in-place spring lock seat 1416 is arranged on the module bottom plate 1402 to lock the linkage locking handle 1414. In other embodiments, the in-place spring lock seat 1416 can also be replaced by other components, as long as the components that can fix the linkage locking handle 1414 can replace the in-place spring lock seat 1416. The labor-saving linkage shaft 1418 is arranged on the module bottom plate 1402 and is connected to the linkage locking handle 1414. The labor-saving linkage shaft 1418 serves as the rotation shaft of the linkage locking handle 1414. The linear linkage rod 1420 is connected to the linkage locking handle 1414 and moves linearly as the linkage locking handle 1414 rotates. The two linkage arms 1422 are connected to the linear linkage rod 1420 and their respective corresponding combined linkage plates 1412. The linkage arm 1422 pushes the combined linkage plate 1412 as the linear linkage rod 1420 moves. The two thrust linkage shafts 1424 are connected to the linear linkage rod 1420. The thrust linkage shaft 1424 is used to assist the linear linkage rod 1420 to maintain linear movement and reduce the friction when the linear linkage rod 1420 moves.

[0043] The linear linkage rod 1420 and the thrust linkage shaft 1424 serve as a synchronization mechanism, and its function is to make Figure 3 the two left and right linkage arms 1422 on the left and right in the figure move in linkage. In other embodiments, the linear linkage rod 1420 and the thrust linkage shaft 1424 can also be replaced by other components that can achieve the same function, such as a slide rail.

[0044] Figure 4 It is a schematic diagram of the test object carrier plate not being docked with the docking terminal fixing plate. Figure 5 It is a schematic diagram of the test object carrier plate being docked with the docking terminal fixing plate. As Figure 4As shown in the figure, the specific operation of the semiconductor tester according to the embodiment of the present application includes first placing a test object carrier mechanism 12 on the combined test module 14. At this time, the guiding positioning column 1210 of the test object carrier mechanism 12 will be inserted into the positioning hole 1426 of the positioning guiding base 1410, and then the camshaft 1212 of the test object carrier mechanism 12 will enter the cam groove 1428 of the combined linkage plate 1412. Then, rotate the linkage locking handle 1414 to make the linear linkage rod 1420 move linearly to the left, and then the linkage arm 1422 pushes the combined linkage plate 1412. As the combined linkage plate 1412 moves, the cam groove 1428 of the combined linkage plate 1412 will pull down the camshaft 1212 so that the terminals of the test object carrier 1202 are docked with the terminals of the docking terminal fixing plate 1406. Finally, the linkage locking handle 1414 will be locked in the in-place spring lock seat 1416, so that the test object carrier mechanism 12 is locked on the combined test module 14, as Figure 5 shown. The combined test module 14 according to the embodiment of the present application drives the linear linkage rod 1420 and the linkage arm 1422 by using the linkage locking handle 1414, and thus can quickly and labor-savingly combine or remove the test object carrier mechanism 12.

[0045] The above are only the embodiments of the present application, and do not impose any formal restrictions on the present application. Although the present application has been disclosed as above by way of embodiments, it is not intended to limit the present application. Any person skilled in the art within the technical field of the present application, without departing from the scope of the technical solution of the present application, may make some changes or modifications to the above-disclosed technical content to obtain equivalent embodiments with equivalent changes. However, as long as it does not depart from the content of the technical solution of the present application, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A semiconductor testing machine, characterized in that: The semiconductor testing machine comprises: An object-to-be-tested carrying plate mechanism, used for carrying an object-to-be-tested; a test head, used for testing the object to be tested; and A combined test module is provided between the DUT carrier mechanism and the test head and fixed on the test head, wherein the combined test module includes: A module base plate; a test module adapter, connecting the module base plate and the test head; and A carrier plate fixing and positioning mechanism is arranged on the module bottom plate and is used for fixing and positioning the test object carrier plate mechanism.

2. The semiconductor testing machine according to claim 1, wherein: The object-to-be-tested carrier mechanism comprises: an object-to-be-tested carrier plate, used for carrying the object-to-be-tested; and A positioning side plate is installed below the test object carrier plate and has a guiding positioning column and a cam shaft.

3. The semiconductor testing machine according to claim 2, characterized in that: The carrier plate fixing and positioning mechanism comprises: A docking terminal fixing plate, used for docking the DUT carrier plate; A terminal fixing plate column, between the butt terminal fixing plate and the module bottom plate, for determining the height of the butt terminal fixing plate; A positioning guide base, disposed on the module bottom plate, having a positioning hole for the guide positioning column to be inserted; and A combined linkage mechanism is arranged on the module bottom plate and is used to fix the object-to-be-tested carrier plate on the docking terminal fixing plate.

4. The semiconductor testing machine according to claim 3, characterized in that: The combined linkage mechanism comprises: A combined linkage plate is disposed on the positioning guide base and has a cam groove for the cam shaft to enter; A linkage lock handle, disposed on the module bottom plate, for controlling the linkage plate to pull down the test object carrier mechanism; A spring lock seat is arranged on the bottom plate of the module to lock the interlocking lock handle; A labor-saving linkage shaft connected to the linkage lock handle and serving as a rotation shaft of the linkage lock handle; A linear linkage rod connected to the linkage lock handle and moving linearly as the linkage lock handle rotates; and A connecting force arm is connected to the linear connecting rod and the combined connecting plate, and the connecting force arm pushes the combined connecting plate as the linear connecting rod moves.

5. The semiconductor testing machine according to claim 4, characterized in that: The combined linkage mechanism also includes a thrust linkage shaft connected to the linear linkage rod. The thrust linkage shaft is used to assist the linear linkage rod in maintaining linear movement and reduce friction when the linear linkage rod moves.

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