Machining device

Abstract

The utility model relates to the technical field of photovoltaic cells, in particular to a processing device, which comprises a wire supply mechanism, a wire feeding mechanism and a wire discharging mechanism, and the wire drawing mechanism is used for being matched with the welding strip so as to pull the welding strip output by the wire supply mechanism to form a welding strip net. The utility model provides a processing device and method, solves the technical problem that a battery piece with high-density grid lines (welding strips) is difficult to process, and achieves the technical effect of being beneficial to processing the battery piece with the high-density grid lines (welding strips).

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic cells, and in particular to a processing device. Background Art

[0002] With the development of photovoltaic technology, in order to improve the power conversion efficiency of solar cells, multiple solder tapes are arranged on the solar cells to obtain solar cells with high-density grid lines (solder tapes); therefore, in order to meet the above process requirements, related processing equipment for solar cell processing and for welding solar cells to form a battery string has emerged.

[0003] In the prior art, on the one hand, it is difficult to achieve dense arrangement on the solar cell, that is, the number of solder tapes on the solar cell is restricted by the process, and it is difficult to produce solar cells with high-density grid lines (solder tapes); on the other hand, even if the solder tape is arranged on the solar cell through a solder tape laying tooling, due to the thinness of the solder tape, it is difficult to control the accuracy of the solder tape by the solder tape laying tooling, resulting in poor quality of the solar cell.

[0004] Therefore, the technical problem of the prior art is: urgently to propose a solar cell for processing high-density grid lines (solder tapes). Utility Model Content

[0005] The present application provides a processing device and method, which solves the technical problem of difficult processing of solar cells with high-density grid lines (solder tapes), and achieves the technical effect of being conducive to processing solar cells with high-density grid lines (solder tapes).

[0006] On the one hand, a processing device provided by the present application adopts the following technical solution:

[0007] A processing device includes: a wire supply mechanism for supplying a solder tape, the wire supply mechanism having a plurality of wire supply ends, and the solder tape is output at the wire supply ends; a wire pulling mechanism having a wire pulling part for connecting and cooperating with the solder tape output from the wire supply ends; wherein, the wire supply end and / or the wire pulling part is movable, so that the wire pulling part and the wire supply end can move away from each other, so that the solder tape is output to form a solder tape network.

[0008] Preferably, the wire pulling part has a degree of freedom of movement in a direction away from the wire supply end; or, the wire supply end has a degree of freedom of movement in a direction away from the wire pulling part, and the wire pulling part has a degree of freedom of movement in a direction away from the wire supply end; so that the wire supply end and the wire pulling part can move relatively away from each other.

[0009] Preferably, the processing device further includes: a guiding mechanism having a guiding part, the guiding part is arranged between the wire supply end and the wire pulling part, and the guiding part is used for guiding the solder tape output from the wire supply mechanism, so that the distance between the solder tapes meets a preset distance.

[0010] Preferably, the wire supply end has a degree of freedom of movement in a direction away from the wire pulling part, so that the wire supply end and the wire pulling part can move relatively away from each other. The processing device further includes a guiding mechanism having a guiding part disposed between the wire supply end and the wire pulling part. The guiding part has a degree of freedom of movement in a direction away from the wire pulling part and is used to guide the solder tape output by the wire supply mechanism so that the distance between the solder tapes meets a preset distance.

[0011] Preferably, the wire supply mechanism includes a plurality of wire reels, each wire reel having a wire supply end. The distance between adjacent two wire supply ends in a first direction meets a preset distance, and the first direction is perpendicular to the length direction of the output solder tape.

[0012] Preferably, the wire pulling mechanism includes a wire pulling part used to cooperate with the solder tape output by the wire supply mechanism. The wire pulling part has connectivity, enabling the wire pulling part to be connected to the solder tape. The connectivity includes: the wire pulling part has a clamping ability to clamp and connect the solder tape to the wire pulling part; the wire pulling part has an adsorption ability to adsorb and connect the solder tape to the wire pulling part; the wire pulling part has an adhesive ability to bond the solder tape to the wire pulling part; and / or the wire pulling part has a welding ability to weld the solder tape to the wire pulling part.

[0013] Preferably, the guiding mechanism includes a plurality of guiding parts. The number of the guiding parts is the same as and corresponds to the number of the wire supply ends one by one, and the guiding parts are used to guide the solder tape so that the distance between the solder tapes passing through the guiding parts meets a preset distance.

[0014] Preferably, the guiding part is a guide wheel, a guide ring, or a guide hook.

[0015] Preferably, the guiding part includes a guiding plate with a plurality of guiding holes formed thereon. The number of the guiding holes is the same as and corresponds to the number of the wire supply ends one by one, and the guiding holes are used to guide the solder tape so that the distance between the solder tapes passing through the guiding holes meets a preset distance.

[0016] Preferably, it further includes a splitting mechanism disposed between the wire supply mechanism and the guiding mechanism. The splitting mechanism is used to split the solder tape output by the wire supply mechanism to form a plurality of sub-solder tapes, and the sub-solder tapes are connected and cooperated by the wire pulling mechanism after being guided by the guiding mechanism to form the solder tape mesh.

[0017] On the other hand, the present application provides a processing method, adopting the following technical solution:

[0018] A processing method includes: providing a wire supply mechanism having a plurality of wire supply ends, with the solder tape being output from the wire supply ends; providing a wire pulling mechanism having a wire pulling part for connecting and cooperating with the solder tape output from the wire supply ends; providing a guiding mechanism having a plurality of guiding parts disposed between the wire supply ends and the wire pulling part, where the guiding parts are used to guide the solder tape output from the wire supply mechanism, and the number of the guiding parts is the same as and corresponds one-to-one with the number of the wire supply ends, so that the distance between the solder tapes meets a preset distance; enabling the solder tape to be output from the wire supply ends, guided by the guiding parts, and then connected and cooperated with the wire pulling part; and enabling the wire pulling part to move relative to the wire supply ends and the guiding parts, so as to pull out the solder tape to form a solder tape network.

[0019] In summary, the present application includes at least one of the following beneficial technical effects:

[0020] The processing device and method of the present application can effectively achieve high-density arrangement of the solder tape, overcome the problem of limited number of solder tapes on the battery chip in the prior art, and provide the possibility for producing battery chips with higher power conversion efficiency. Description of the Drawings

[0021] Figure 1 is a schematic diagram of the processing device described in the present application;

[0022] Figure 2 is a schematic diagram of the wire supply mechanism of the processing device described in the present application;

[0023] Figure 3 is a schematic diagram of the wire wheel of the processing device described in the present application;

[0024] Figure 4 is a schematic diagram of the first wire wheel of the processing device described in the present application;

[0025] Figure 5 is a schematic diagram of the second wire wheel of the processing device described in the present application;

[0026] Figure 6 is a schematic diagram of the first guiding mechanism of the processing device described in the present application;

[0027] Figure 7 is a schematic diagram of the second guiding mechanism of the processing device described in the present application;

[0028] Figure 8 is a schematic diagram of the third guiding mechanism of the processing device described in the present application;

[0029] Figure 9 is a schematic diagram of the fourth guiding mechanism of the processing device described in the present application;

[0030] Figure 10It is a schematic diagram of the fifth guiding mechanism of the processing device described in this application;

[0031] Figure 11 It is a schematic diagram of the first wire-pulling mechanism of the processing device described in this application;

[0032] Figure 12 It is a schematic diagram of the second wire-pulling mechanism of the processing device described in this application.

[0033] Explanation of reference numerals: 100, wire supply mechanism; 110, wire supply end; 120, wire wheel; 130, frame; 200, guiding mechanism; 210, guiding part; 211, guide wheel; 212, guide ring; 213, guide groove; 214, guide hook; 220, guiding plate; 221, guiding hole; 300, wire-pulling mechanism; 310, wire-pulling part; 311, clamp; 320, driving part; 400, solder ribbon; 410, solder ribbon mesh. Detailed implementation manners

[0034] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. And the "connection" and "coupling" mentioned in this application, unless otherwise specified, both include direct and indirect connection (coupling). In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to this application.

[0035] In this application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.

[0036] This application provides a processing device and method, which solves the technical problem of difficult processing of solar cells with high-density grid lines (solder ribbons), and achieves the technical effect of being conducive to processing solar cells with high-density grid lines (solder ribbons).

[0037] To better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings of the specification and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] The present application provides a processing device, as Figure 1 shown, including a wire supply mechanism 100, a guiding mechanism 200, and a wire pulling mechanism 300;

[0039] The wire supply mechanism 100 is used to supply the solder tape 400; the guiding mechanism 200 is used to guide the solder tape 400 so that a preset spacing is maintained between the solder tapes 400; the wire pulling mechanism 300 is used to cooperate with the solder tape 400 to pull the solder tape 400 output by the wire supply mechanism 100; in other words, the solder tape 400 is output by the wire supply mechanism 100, guided by the guiding mechanism 200 to keep the spacing of the solder tape 400 meeting the process requirements, and then pulled by the wire pulling mechanism 300 to further output the solder tape 400, thereby forming a solder tape mesh 410.

[0040] The wire supply mechanism 100, as Figure 2 、 3 、shown in FIG. 4, the wire supply mechanism 100 has a plurality of wire supply ends 110, and the solder tape 400 is output at the wire supply ends 110; in one embodiment, the wire supply mechanism 100 includes a plurality of wire wheels 120, the wire wheels 120 are installed on the frame 130, each wire wheel 120 forms a wire supply end 110 respectively, and the solder tape 400 is output on the wire supply end 110. When the solder tapes 400 are output by a plurality of wire wheels 120 at the same time, the spacing between the solder tapes 400 meets the preset spacing, and through the pulling of the solder tape 400 by the wire pulling mechanism 300, a solder tape mesh 410 that meets the preset spacing is formed.

[0041] Wherein, the preset spacing means that the solder tapes 400 are parallel to each other, and the spacing can be set by the process. For example: 0.1 mm - 5 mm, preferably, it can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2.0 mm, 2.2 mm, 2.4 mm, 2.6 mm, 2.8 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, 5.0 mm.

[0042] To ensure that the solder tape 400 maintains the preset spacing, the guiding mechanism 200 can be omitted; for example, as Figure 5As shown, since the wire reel 120 has a certain volume, by staggering and densely arranging the wire supply ends 110 of adjacent or multiple wire reels 120 in the first direction, the output solder tape 400 can also be maintained at a preset spacing, that is, the solder tape mesh 410 that meets the process requirements is output. Among them, the first direction refers to: perpendicular to the length direction of the output solder tape; the solder tape mesh 410 is composed of multiple solder tapes 400, and the adjacent solder tapes 400 are parallel and equidistant from each other; generally, the number of solder tapes 400 is between 50 and 500, and preferably, it can be 50, 100, 150, 200, 250, 300, 350, 400, 450, 500.

[0043] The guiding mechanism 200, as Figures 6 - 10 shown, the guiding mechanism 200 is arranged between the wire supply mechanism 100 and the wire pulling mechanism 300. The guiding mechanism 200 is used to guide the solder tape 400 output by the wire supply mechanism 100 so that the spacing between the solder tapes 400 meets the preset spacing. In one embodiment, the guiding mechanism 200 includes a plurality of guiding parts 210. The number of guiding parts 210 corresponds to the number of output ends of the wire supply mechanism 100 and is in one-to-one correspondence. The guiding parts 210 are used for the transmission of the solder tape 400 and guiding the solder tape 400. By arranging the spacing of the guiding parts 210, the spacing between the solder tapes 400 passing through the guiding parts 210 meets the preset spacing; the guiding parts 210 can be guide wheels 211, guide rings 212, guide grooves 213, guide hooks 214, etc.; in another embodiment, the guiding mechanism 200 includes a guiding plate 220. A plurality of guiding holes 221 are opened on the guiding plate 220. The number of guiding holes 221 is the same as the number of wire supply ends 110, and the spacing of the guiding holes 221 meets the required spacing of the solder tape 400. When the solder tape 400 passes through the guiding holes 221, the spacing of the solder tape 400 meets the preset spacing.

[0044] The wire pulling mechanism 300, as Figure 11 、 12 shown, the wire pulling mechanism 300 is used to pull the solder tape 400 so that the solder tape 400 is output to form a solder tape mesh 410. The wire pulling mechanism 300 is used to cooperate with the solder tape 400. Further, when the processing device is provided with a guiding mechanism 200, the wire pulling mechanism 300 is used to cooperate with the solder tape 400 passing through the guiding mechanism 200. The wire pulling mechanism 300 is connected to the solder tape 400 and pulls the solder tape 400 to output. Since the spacing between the solder tapes 400 is maintained at the preset spacing, under the pulling action of the wire pulling mechanism 300, the solder tapes 400 form a dense solder tape mesh 410.

[0045] As Figure 11 、 12As shown, the wire-pulling mechanism 300 includes a wire-pulling part 310 and a driving part 320. The wire-pulling part 310 is used for wire-pulling cooperation with the welding tape 400 and can be connected to the welding tape 400. The driving part 320 is used to drive the wire-pulling part 310 to move along the length direction of the welding tape 400, so that the welding tape 400 is output along the length direction to form a welding tape net 410. In one embodiment, the wire-pulling part 310 is a clamp 311, and the clamp 311 is used for clamping the welding tape 400 or the end of the welding tape 400; in another embodiment, the wire-pulling part 310 has connectivity, and the connectivity means that the wire-pulling part 310 can be connected to the welding tape 400 or the end of the welding tape 400, such as: bonding, welding, adsorption and other methods. Among them, the wire-pulling part 310 can be one or more. When the number of the wire-pulling parts 310 is one, the wire-pulling part 310 is used for pulling cooperation with all the welding tapes 400; when the number of the wire-pulling parts 310 is multiple, the wire-pulling part 310 can be used for pulling cooperation with a part of the welding tapes 400, or each wire-pulling part 310 is in one-to-one correspondence with each welding tape 400.

[0046] Furthermore, the driving part 320 is connected to the wire-pulling part 310 and is used to drive the wire-pulling part 310 to move, so that the wire-pulling part 310 has the freedom of movement along the length direction of the welding tape 400. In one embodiment, the driving part 320 can be a linear motor, a lead screw, a cylinder, an electric cylinder, an oil cylinder and other driving methods. After the wire-pulling part 310 clamps or connects with the welding tape 400, under the drive of the driving part 320, the welding tape 400 is pulled out, and a dense welding tape net 410 is formed on the output path.

[0047] In one embodiment, the position of the wire-pulling mechanism 300 is fixed, and the wire-pulling mechanism 300 and the guiding mechanism 200 are movable. By driving the wire supply mechanism 100 and the guiding mechanism 200 away from the wire-pulling mechanism 300, the welding tape 400 can also be output to form a welding tape net 410; in another embodiment, the positions of the wire-pulling mechanism 300 and the wire supply mechanism 100 are both movable. By driving the wire supply mechanism 100 and the wire-pulling mechanism 300 away from each other, the welding tape 400 can also be output to form a welding tape net 410; in other embodiments, the positions of the wire-pulling mechanism 300, the wire supply mechanism 100 and the guiding mechanism 200 are all movable. By driving the wire supply mechanism 100, the wire-pulling mechanism 300 and the guiding mechanism 200, the wire supply mechanism 100 and the guiding mechanism 200 are driven to move away from the wire-pulling mechanism 300 synchronously or asynchronously, and the welding tape 400 can also be output to form a welding tape net 410; among them, the driving of the wire supply mechanism 100, the wire-pulling mechanism 300 and the guiding mechanism 200 can adopt driving methods such as linear motors, lead screws, cylinders, electric cylinders, and oil cylinders.

[0048] The present application also provides a processing method for processing the solder tape 400 of a battery cell. A dense solder tape network 410 is formed by the above-mentioned processing device, and the solder tape network 410 is transferred onto the battery cell or the battery cell is transferred onto the solder tape network 410, so that the battery cell and the solder tape network 410 are in contact, and the battery cell and the solder tape 400 are connected. In one embodiment, the solder tape 400 itself has a tin plating layer, and welding between the battery cell and the solder tape 400 can be achieved after heating and melting; in another embodiment, the solder tape 400 and / or the battery cell has adhesiveness, and a conductive adhesive layer, such as conductive glue, can be laid on the battery cell and / or the solder tape 400, so that the solder tape 400 and the battery cell can be bonded through the adhesive layer after contact.

[0049] When multiple sets of processing devices are provided and the wire supply ends 110 in each set of processing devices are arranged sparsely, solder tape networks 410 can be formed by each set of processing devices and superimposed to form a solder tape network 410 with a denser arrangement of solder tapes 400, that is, the solder tapes 400 in the two solder tape networks 410 are arranged in a staggered manner, so as to form a solder tape network 410 with a dense arrangement of solder tapes 400. Further, a denser solder tape network 410 can also be formed by arranging multiple sets of solder tape networks 410 to overcome the problem that it is difficult to arrange the wire supply ends 110 closely.

[0050] In the processing device, a set of wire pulling mechanisms 300, multiple sets of wire supply mechanisms 100 and guiding mechanisms 200 can be provided. The wire supply mechanisms 100 and the guiding mechanisms 200 are in one-to-one correspondence and cooperation, so that the solder tape 400 is output from the wire supply mechanism 100, passes through the guiding mechanism 200, and is pulled by the same set of wire pulling mechanisms 300, that is, only one set of wire pulling mechanisms 300 can be used to draw multiple solder tape networks 410; further, taking a set of wire supply mechanisms 100 and guiding mechanisms 200 as a unit, by adjusting the distance between the units, a larger and wider solder tape network 410 can be drawn.

[0051] Further, the processing device further includes a splitting mechanism (not shown). The splitting mechanism is arranged between the wire supply mechanism 100 and the guiding mechanism 200. The splitting mechanism is used to split the solder tape 400 output from the wire supply mechanism 100, so that the solder tape 400 is split into several sub-solder tapes 400. The sub-solder tapes 400 are guided by the guiding mechanism 200 and pulled by the wire pulling mechanism 300, thereby forming a solder tape network 410. In this way, after splitting the solder tape 400 into two or more parts, the number of wire reels 120 of the solder tape 400 can be greatly reduced. Further, the splitting mechanism can be a straight splitting knife or a cross splitting knife, and the splitting knife acts on the end face of the solder tape 400 to cut the solder tape 400 into multiple pieces.

[0052] Furthermore, a plating mechanism (not shown) may be provided between the splitting mechanism and the guiding mechanism 200. The plating mechanism is used to plate the sub-solder tapes 400. After passing through the splitting mechanism, the sub-solder tapes 400 are plated after passing through the plating mechanism. The plating method can be immersion plating, spraying, etc. The plating material can be adjusted according to process requirements. For example: tin plating, etc.

[0053] Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present application.

[0054] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

1. A processing device, characterized in that: include: A wire supply mechanism, the wire supply mechanism is used to supply the soldering tape, the wire supply mechanism has a plurality of wire supply ends, and the soldering tape is output at the wire supply ends; A wire pulling mechanism, the wire pulling mechanism having a wire pulling portion, the wire pulling portion being used to connect and cooperate with the welding strip output from the wire supply end; The wire supply end and / or the wire pulling portion are movable, so that the wire pulling portion and the wire supply end can be moved away from each other, so that the welding ribbon is output to form a welding ribbon network.

2. A processing device according to claim 1, characterized in that: The wire pulling part has a degree of freedom of movement in a direction away from the wire supply end; or, the wire supply end has a degree of freedom of movement in a direction away from the wire pulling part, and the wire pulling part has a degree of freedom of movement in a direction away from the wire supply end; The wire supply end and the wire pulling portion can be relatively far away from each other.

3. A processing device according to claim 2, characterized in that: Also includes: The guiding mechanism comprises a guiding portion, wherein the guiding portion is arranged between the wire supply end and the wire pulling portion, and the guiding portion is used to guide the welding strips output by the wire supply mechanism so that the spacing between the welding strips meets the preset spacing.

4. A processing device according to claim 1, characterized in that: The wire supply end has a degree of freedom of movement in a direction away from the wire pulling portion, so that the wire supply end and the wire pulling portion can be relatively far away from each other; The processing device also includes: The guiding mechanism comprises a guiding portion, wherein the guiding portion is arranged between the wire supply end and the wire pulling portion, the guiding portion has the freedom to move away from the wire pulling portion, and the guiding portion is used to guide the welding strips output by the wire supply mechanism so that the spacing between the welding strips meets the preset spacing.

5. A processing device according to claim 1, characterized in that: The wire supply mechanism comprises: A wire coil, wherein the wire coils are provided in plurality, each of the wire coils having a wire supply end, and the spacing between two adjacent wire supply ends along a first direction meets a preset spacing, wherein the first direction refers to a length direction perpendicular to the output welding strip.

6. A processing device according to claim 1, characterized in that: The wire pulling mechanism comprises: The wire pulling part is used to cooperate with the welding strip output by the wire supply mechanism, and the wire pulling part has connectivity so that the wire pulling part can be connected to the welding strip.

7. A processing device according to claim 6, characterized in that: The connectivity includes: The wire pulling part has a clamping capability so that the welding strip is clamped and connected with the wire pulling part; The wire drawing part has an adsorption capability so that the welding strip is adsorbed and connected to the wire drawing part; The wire drawing portion has bonding capability to allow the welding tape to be bonded to the wire drawing portion; and / or The wire drawing portion has a welding capability so that the welding ribbon is welded to the wire drawing portion.

8. A processing device according to claim 3 or 4, characterized in that: The guiding mechanism comprises: The guide part has a plurality of guide parts, the number of the guide parts is the same as the number of the wire supply terminals and they are matched one-to-one, and the guide part is used to guide the welding strips so that the spacing between the welding strips passing through the guide parts meets the preset spacing.

9. A processing device according to claim 8, characterized in that: The guide part is a guide wheel, a guide ring, or a guide hook.

10. A processing device according to claim 3 or 4, characterized in that: The guide portion includes a guide plate, and a guide hole is opened on the guide portion. There are multiple guide holes, and the number of the guide holes is the same as the number of the wire supply terminals and they correspond one to one. The guide holes are used to guide the welding strips so that the spacing between the welding strips passing through the guide holes meets the preset spacing.

11. A processing device according to claim 3 or 4, characterized in that: Also includes: A splitting mechanism is arranged between the wire supply mechanism and the guiding mechanism, and is used to split the soldering ribbon output by the wire supply mechanism to form a plurality of sub-soldering ribbons, and the sub-soldering ribbons are guided by the guiding mechanism and connected and cooperated by the wire pulling mechanism to form the soldering ribbon network.

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