Manipulator for taking and placing wafer and wafer carrying system

Abstract

The utility model provides a mechanical arm for taking and placing wafers and a wafer carrying system. The mechanical arm comprises a bearing main body, the bearing main body is provided with an arc-shaped part and a supporting part, the supporting part is arranged on the inner side of the arc-shaped part and used for supporting the middle area of a wafer, and the arc-shaped part is used for adsorbing the wafer. According to the mechanical arm for taking and placing the wafer, the supporting part is arranged on the inner side of the arc-shaped part and used for supporting the middle area of the wafer, so that the situation that when the arc-shaped part adsorbs the thin wafer, the middle area of the wafer is bent downwards to be separated from the bearing main body due to the gravity of the wafer, and the wafer is damaged is avoided; the reliability of taking and placing the wafer is improved, the production efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a manipulator for picking and placing wafers and a wafer handling system. Background Art

[0002] Bernoulli's principle is an important theorem in fluid mechanics, proposed by Daniel Bernoulli. It states that in an incompressible and non-viscous ideal fluid, the pressure is low where the flow velocity is high, and the pressure is high where the flow velocity is low. This principle can be used to explain many phenomena, such as the lift of an airplane wing, the working principle of a sprayer, and the suction force generated when the wind blows over a building. In semiconductor equipment, the manipulator for handling wafers uses Bernoulli's principle to "adsorb" the wafers on the surface of the manipulator by using gas pressure.

[0003] The existing manipulator has an arc-shaped structure. Since some wafers are extremely thin, during the process of the manipulator handling the wafers, due to the gravity of the wafers themselves, the middle area of the wafers is in a downwardly curved state, resulting in the manipulator not fitting tightly with the wafers during the wafer picking and placing process and causing the wafers to fall, thereby reducing the production efficiency and increasing the production cost. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a manipulator for picking and placing wafers and a wafer handling system, which increases the reliability during wafer picking and placing, improves the production efficiency, and reduces the cost.

[0005] To achieve the above purpose, in the first aspect, the utility model provides a manipulator for picking and placing wafers, including a carrying body;

[0006] The carrying body has an arc portion and a support portion. The support portion is arranged inside the arc portion and is used to support the middle area of the wafer, and the arc portion is used to adsorb the wafer.

[0007] The beneficial effect of the manipulator for picking and placing wafers provided by the utility model is that by arranging a support portion inside the arc portion to support the middle area of the wafer, it avoids the situation that when the arc portion adsorbs a thinner wafer, the middle area of the wafer is downwardly curved and separated from the carrying body due to its own gravity, resulting in wafer damage, increases the reliability during wafer picking and placing, improves the production efficiency, and reduces the cost.

[0008] In some embodiments, a first channel is arranged inside the arc portion. The first channel extends along the axial direction of the arc portion and is used to communicate with an external gas supply device;

[0009] The arc-shaped portion has an adsorption surface, on which adsorption holes are formed. The adsorption holes are in communication with the first channel, and the adsorption surface is used to adsorb the wafer through the adsorption holes. The beneficial effect is that one end of the first channel is used to communicate with an external air supply device, and the air supply device is used to provide air pressure so that the wafer is adsorbed on the adsorption surface through the adsorption holes.

[0010] In some embodiments, the support portion has a support surface, on which a detection portion is provided. The support surface is used to support the wafer, and the detection portion is used to detect the degree of fit between the wafer and the support surface and to detect whether the wafer has separated from the carrier body. The beneficial effect is that the support surface is used to support the wafer to prevent the wafer from bending downward due to its own gravity, and by providing a detection portion on the support surface, it is used to detect the degree of fit between the wafer and the support surface and to detect whether the wafer has separated from the carrier body, facilitating the worker to timely discover the state of the wafer on the carrier body to ensure the reliability of wafer picking and placing.

[0011] In some embodiments, a second channel is formed in the support portion, and the second channel extends along the length direction of the support portion and is used to communicate with an external air extraction device;

[0012] The detection portion includes a first detection hole formed on the support surface, and the first detection hole is in communication with the second channel. The beneficial effect is that by forming a first detection hole on the support surface that is in communication with the second channel, when the air extraction device extracts air, the degree of fit between the wafer and the support surface and whether the wafer has separated from the carrier body can be judged by determining the air pressure in the second channel.

[0013] In some embodiments, a third channel communicating with the second channel is further formed in the arc-shaped portion, and the third channel extends along the axial direction of the arc-shaped portion;

[0014] The detection portion further includes a second detection hole formed on the arc-shaped portion, and the second detection hole is in communication with the third channel. The beneficial effect is that by forming a second detection hole on the arc-shaped portion that is in communication with the third channel, and since the third channel is in communication with the second channel, when the air extraction device extracts air, the degree of fit between the wafer and the adsorption surface and whether the wafer has separated from the carrier body can be judged by the air pressure in the second channel.

[0015] In some embodiments, a plurality of the second detection holes are arranged at intervals along the axial direction of the arc-shaped portion, and a plurality of the second detection holes are all close to the support portion.

[0016] In some embodiments, the detection portion further includes a barometric detector;

[0017] The air pressure detector is communicated with the second channel through a pipeline, and the air pressure detector is used to detect the air pressure in the second channel. The beneficial effect is that: the air pressure detector is communicated with the second channel through the pipeline to detect the air pressure in the second channel, so as to judge the fitting degree between the wafer and the carrier body and whether the wafer is separated from the carrier body.

[0018] In some embodiments, the arc-shaped portion has an adsorption surface, and the support portion has a support surface, and the adsorption surface and the support surface are located on the same horizontal plane. The beneficial effect is that: by arranging the support surface and the adsorption surface on the same horizontal plane, the reliability of adsorbing and supporting the wafer is ensured.

[0019] In some embodiments, a plurality of the adsorption holes are spaced apart from each other on the adsorption surface, and the plurality of adsorption holes are arranged at intervals along the axial direction of the arc-shaped portion, and the plurality of adsorption holes are all far away from the support portion.

[0020] In a second aspect, an embodiment of the present invention provides a wafer handling system, including a base, a control device and the manipulator as described above;

[0021] The manipulator is connected to the base through the control device;

[0022] The control device controls the movement of the manipulator, and the manipulator is used for picking and placing wafers.

[0023] The beneficial effect of the wafer handling system provided by the present invention is that: since the wafer handling system adopts the manipulator provided in the above embodiment, when handling a relatively thin wafer, the situation that the middle area of the wafer is bent downward and separated from the manipulator due to its own gravity, resulting in wafer damage, is avoided, the reliability of the manipulator when picking and placing wafers is increased, the production efficiency is improved, and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a top view of the manipulator according to the embodiment provided by the present invention;

[0025] Figure 2 is a side view of the manipulator according to the embodiment provided by the present invention;

[0026] Figure 3 is Figure 2 a cross-sectional view taken along line A-A in

[0027] Figure 4 is Figure 2 a cross-sectional view taken along line B-B in

[0028] Reference numerals:

[0029] Carrier body 1, arc portion 11, first channel 111, adsorption surface 112, adsorption hole 113, third channel 114, second detection hole 115, support portion 12, support surface 121, second channel 122, first detection hole 123. Detailed implementation manner

[0030] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the scope of protection of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art in the field to which the present utility model belongs. The words such as "including" used herein mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items. The "connection" described herein can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0031] In view of the problems existing in the prior art, the embodiments of the present utility model provide a manipulator for picking and placing wafers. Refer to Figure 1 as shown, the manipulator includes a carrier body 1, the carrier body 1 has an arc portion 11 and a support portion 12, the support portion 12 is arranged inside the arc portion 11 and is used to support the middle area of the wafer, and the arc portion 11 is used to adsorb the wafer.

[0032] In this embodiment, when the arc portion 11 adsorbs the wafer, the arc portion 11 is located at the edge below the wafer, and the support portion 12 is located inside the arc portion 11 and is used to support the middle area of the wafer. By arranging the support portion 12 inside the arc portion 11 to support the middle area of the wafer, it is avoided that when the arc portion 11 adsorbs a thinner wafer, the middle area of the wafer bends downward due to its own gravity and separates from the carrier body 1, resulting in damage to the wafer, thereby increasing the reliability during wafer picking and placing, improving the production efficiency and reducing the cost.

[0033] Refer to Figures 1 to 4As shown, in some embodiments, a first channel 111 is provided in the arc portion 11. The first channel 111 extends along the axial direction of the arc portion 11 and is used to communicate with an external gas supply device. The arc portion 11 has an adsorption surface 112, and the adsorption surface 112 is located on the upper surface of the arc portion 11. Adsorption holes 113 are formed in the adsorption surface 112. The adsorption holes 113 are in communication with the first channel 111, and the adsorption surface 112 is used to adsorb a wafer through the adsorption holes 113.

[0034] Further, a plurality of the adsorption holes 113 are provided, and the plurality of adsorption holes 113 are sequentially arranged at intervals along the axial direction of the first channel 111.

[0035] In this embodiment, the number of the adsorption holes 113 is set to 8, and the 8 adsorption holes 113 are symmetrically arranged with respect to the support portion 12. One end of the first channel 111 is used to communicate with an external gas supply device. When the gas supply device purges gas in the first channel 111, the gas will be discharged through the adsorption holes 113. According to Bernoulli's principle, where the flow rate is large, the pressure is small, and where the flow rate is small, the pressure is large, so that the wafer is adsorbed on the adsorption surface 112 when the gas is discharged through the adsorption holes 113.

[0036] In some specific embodiments, the adsorption holes 113 are circular holes. In some other specific embodiments, the adsorption holes 113 can be oval holes, square holes, etc.

[0037] In some embodiments, the support portion 12 has a support surface 121, and the support surface 121 is used to support the wafer. The support surface 121 is arranged parallel and at the same height as the adsorption surface 112, so that the support surface 121 and the adsorption surface 112 are located on the same horizontal plane.

[0038] In this embodiment, the support surface 121 is used to support the wafer to prevent the wafer from bending downward due to its own gravity. And by arranging the support surface 121 and the adsorption surface 112 on the same horizontal plane, the reliability of the adsorption and support of the carrier body 1 on the wafer is ensured, and the situation of the wafer detaching during picking and placing is avoided.

[0039] Further, a detection portion is provided on the support surface 121, and the detection portion is used to detect the degree of fit between the wafer and the support surface 121 and to detect whether the wafer detaches from the carrier body 1.

[0040] In this embodiment, by providing a detection portion on the support surface 121 to detect the degree of fit between the wafer and the support surface 121 and to detect whether the wafer detaches from the carrier body 1, it is convenient for workers to timely discover the state of the wafer on the carrier body 1, so as to ensure the reliability of wafer picking and placing.

[0041] In some specific embodiments, with reference to Figures 1 to 4 As shown, a second channel 122 is provided in the support portion 12. The second channel 122 extends along the length direction of the support portion 12, and the second channel 122 is used to communicate with an external air extraction device. The detection portion includes a first detection hole 123 formed in the support surface 121, and the first detection hole 123 is in communication with the second channel 122.

[0042] In this embodiment, the second channel 122 and the first channel 111 are two independent channels. By providing the first detection hole 123 formed in the support surface 121 and in communication with the second channel 122, when the air extraction device extracts air, the degree of fit between the wafer and the support surface 121 can be determined by judging the air pressure in the second channel 122, and whether the wafer is separated from the carrier body 1 can be detected.

[0043] Further, a third channel 114 in communication with the second channel 122 is also provided in the arc portion 11. The third channel 114 extends along the axial direction of the arc portion 11. The detection portion further includes a second detection hole 115 formed in the arc portion 11, and the second detection hole 115 is in communication with the third channel 114.

[0044] In this embodiment, the third channel 114 and the first channel 111 are independently provided. By providing the second detection hole 115 formed in the adsorption surface 112 of the arc portion 11 and in communication with the third channel 114, and since the third channel 114 is in communication with the second channel 122, when the air extraction device extracts air, the degree of fit between the wafer and the adsorption surface 112, and whether the wafer is separated from the carrier body 1 can be determined by the air pressure in the second channel 122.

[0045] In some specific embodiments, a plurality of the second detection holes 115 are formed in the adsorption surface 112. The plurality of second detection holes 115 are arranged at intervals along the axial direction of the arc portion 11, and the plurality of second detection holes 115 are all close to the support portion 12.

[0046] In this embodiment, the number of the second detection holes 115 is 4, and the 4 second detection holes 115 are symmetrically arranged with respect to the support portion 12.

[0047] It should be noted that the first detection hole 123 and the second detection hole 115 can be circular holes, oval holes, square holes, etc.

[0048] In some embodiments, the detection unit further includes a barometric pressure detector which is communicated with the second channel 122 through a pipeline, and the barometric pressure detector is used for detecting the barometric pressure in the second channel 122.

[0049] In this embodiment, the barometric pressure detector is communicated with the second channel 122 through a pipeline, which is used for detecting the barometric pressure in the second channel 122, so as to judge the fitting degree between the wafer and the carrier body 1 and judge whether the wafer is separated from the carrier body 1.

[0050] Specifically, when the carrier body 1 adsorbs and grabs the wafer, the air extraction device starts to work. If the wafer can be well fitted with the carrier body 1, at this time, the first detection hole 123 and the second detection hole 115 will be blocked, and the barometric pressure detected by the barometric pressure detector in the second channel 122 is relatively large. When the wafer cannot be well fitted with the carrier body 1, and there are gaps at the fitting positions between the first detection hole 123 and / or the second detection hole 115 and the wafer, at this time, the barometric pressure detected by the barometric pressure detector in the second channel 122 is relatively small. Therefore, by judging the magnitude of the barometric pressure detected by the barometric pressure detector, the fitting degree between the wafer and the carrier body 1 can be judged and whether the wafer is separated from the carrier body 1 can be judged.

[0051] The embodiment of the present invention further provides a wafer handling system, which includes a base, a control device and the manipulator as described above. The manipulator has a connecting arm, and the connecting arm is connected to the base through the control device. The control device controls the movement of the manipulator, and the manipulator is used for picking and placing wafers.

[0052] In this embodiment, since the wafer handling system adopts the manipulator provided in the above embodiment, when handling a relatively thin wafer, the situation that the wafer is bent downward in the middle area due to its own gravity and separated from the manipulator, resulting in wafer damage, is avoided. The reliability of the manipulator when picking and placing wafers is increased, the production efficiency is improved, and the cost is reduced.

[0053] The above is only the specific implementation manner of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the embodiments of the present application should be covered by the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application should be subject to the protection scope of the claims.

Claims

1. A robot for picking up and placing wafers, characterized in that: including a bearing body; The carrying body has an arc-shaped portion and a supporting portion, wherein the supporting portion is arranged inside the arc-shaped portion and is used to support the middle area of ​​the wafer, and the arc-shaped portion is used to absorb the wafer; The supporting portion has a supporting surface, a detection portion is disposed on the supporting surface, the supporting surface is used to support a wafer, and the detection portion is used to detect the degree of adhesion between the wafer and the supporting surface and to detect whether the wafer is separated from the carrying body.

2. The robot for taking and placing wafers according to claim 1, characterized in that: A first channel is provided in the arc-shaped portion, the first channel extends along the axial direction of the arc-shaped portion, and the first channel is used to communicate with an external air supply device; The arc-shaped portion has an adsorption surface, and an adsorption hole is formed on the adsorption surface. The adsorption hole is connected to the first channel, and the adsorption surface is used to adsorb the wafer through the adsorption hole.

3. The robot for taking and placing wafers according to claim 1, characterized in that: A second channel is provided in the support portion, the second channel extends along the length direction of the support portion, and the second channel is used to communicate with an external air extraction device; The detection portion includes a first detection hole opened on the support surface, and the first detection hole is connected to the second channel.

4. The robot for taking and placing wafers according to claim 3, characterized in that: A third channel connected to the second channel is also provided in the arc-shaped portion, and the third channel extends along the axial direction of the arc-shaped portion; The detection portion further includes a second detection hole disposed on the arc portion, and the second detection hole is connected to the third channel.

5. The robot for taking and placing wafers according to claim 4, characterized in that: A plurality of the second detection holes are arranged at intervals along the axial direction of the arc-shaped portion, and the plurality of the second detection holes are all close to the supporting portion.

6. The robot for taking and placing wafers according to any one of claims 3 to 5, characterized in that: The detection unit also includes an air pressure detector; The air pressure detector is connected to the second channel through a pipeline, and the air pressure detector is used to detect the air pressure in the second channel.

7. The robot for taking and placing wafers according to claim 1, characterized in that: The arc-shaped portion has an adsorption surface, the supporting portion has a supporting surface, and the adsorption surface and the supporting surface are located on the same horizontal plane.

8. The robot for taking and placing wafers according to claim 2, characterized in that: The adsorption surface is provided with a plurality of adsorption holes at intervals, the plurality of adsorption holes are arranged at intervals along the axial direction of the arc-shaped portion, and the plurality of adsorption holes are all far away from the supporting portion.

9. A wafer handling system, characterized in that: It comprises a base, a control device and a manipulator according to any one of claims 1 to 8; The manipulator is connected to the base via the control device; The control device controls the movement of the robot, and the robot is used to take and place wafers.

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