Embedded ultrathin double-unit loudspeaker module

Abstract

The utility model discloses an embedded ultrathin double-unit loudspeaker module, which belongs to the technical field of loudspeakers and comprises a bass loudspeaker and a tweeter, the tweeter is embedded in the middle of the bass loudspeaker, and the bass loudspeaker comprises a shell, a first diaphragm, a first voice coil, a washer, a magnet, a support, a first bonding pad and T iron. The support wraps the first bonding pad and the T iron in an injection molding mode, the magnet is arranged on the T iron, and the washer is arranged on the magnet. The utility model solves the problem that the existing double-unit loudspeaker module is of a traditional upper and lower loudspeaker stacking structure, so that the overall thickness is increased by 50%, and the existing double-unit loudspeaker module cannot adapt to the future development of earphones. According to the utility model, the tweeter is embedded in the middle of the woofer, and the height of the combined two loudspeakers is the same as that of one woofer, so that the performance of the two loudspeakers can be achieved, and the structure can completely replace the existing double-unit loudspeakers and becomes the mainstream of future electroacoustic products such as earphones and intelligent wears.

Description

Technical Field

[0001] The utility model relates to the technical field of speakers, in particular to an embedded ultra-thin dual-unit speaker module. Background Art

[0002] In order to ensure better and better sound quality, electroacoustic products such as earphones often have at least two speakers placed in one earphone, one for low frequency and one for high frequency.

[0003] Now there are more and more dual-unit speaker modules on the market, but most of them are traditional upper and lower speaker stacking structures, that is, there is a bass speaker below, and a treble speaker is bonded to the front cover of the bass speaker. In this way, the overall thickness after the speakers are combined will increase by 50%. However, as the volume of electroacoustic products such as earphones is getting smaller and smaller, the volume requirements for the core component speakers are also getting smaller and smaller. Therefore, the traditional dual-unit speakers can no longer adapt to the future development of earphones. Content of the Utility Model

[0004] The purpose of the utility model is to provide an embedded ultra-thin dual-unit speaker module. By embedding the treble speaker in the middle of the bass speaker, the performance of two speakers can be achieved with the height of one bass speaker, which can completely replace the existing dual-unit speakers and become the mainstream of electroacoustic products such as future earphones and smart wearables, and can solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] An embedded ultra-thin dual-unit speaker module, including a bass speaker and a treble speaker, and the treble speaker is embedded in the middle of the bass speaker;

[0007] The bass speaker includes a housing, a first diaphragm, a first voice coil, a washer, a magnet, a bracket, a first pad and a T-iron;

[0008] A bracket is arranged on the T-iron, and the bracket wraps the first pad and the T-iron by injection molding. Among them, there are first pads on both the front and back of the bracket. One end of the first pad is used to weld the voice coil wire, and the other end of the first pad is used to weld the audio wire;

[0009] A magnet is arranged on the T-iron, and a washer is arranged on the magnet. Among them, both the washer and the magnet are annular structures, and there is a gap for placing the first voice coil between the washer and the magnet and the T-iron;

[0010] The first voice coil is an annular structure, and the first voice coil is connected to the first pad through a voice coil wire. Among them, the voice coil wire is a suspended structure and is fixed by a wire bending tooling, and the end of the voice coil wire is welded on the two first pads;

[0011] A washer is provided with a first diaphragm. The first diaphragm is composed of two folding rings and two support rings. The middle of the first diaphragm is a hollow structure for the sound output of the tweeter. The middle of the two folding rings is a planar structure for bonding the first voice coil.

[0012] An outer shell is arranged on the periphery of the first diaphragm. The outer shell is used to fix the first diaphragm, washer, magnet and T-iron. There is a step on the outer shell for placing the first diaphragm. A vibration gap is left between the first diaphragm and the outer shell. There is an opening in the middle of the outer shell for the sound output of the woofer and tweeter.

[0013] Preferably, the sound outlet hole of the tweeter is a structure with a sound nozzle for inserting the sound nozzle into the middle of the bracket hole and sealed by a sealing ring. The tweeter leads out an electronic wire or an FPC cable for frequency division connection with the woofer.

[0014] Preferably, the tweeter includes a second diaphragm, a second voice coil, a first outer magnet, a first inner magnet and a first PCB. The second diaphragm is placed on a step with a height of not less than 0.1 mm provided at the bottom of the bracket. The second diaphragm is sealed and fixed on the bracket by glue.

[0015] Preferably, a second voice coil is bonded on the second diaphragm. The second voice coil is located above the first outer magnet and the first inner magnet. The first outer magnet is located on the periphery of the first inner magnet. The first outer magnet and the first inner magnet are both adhered to the first PCB. Second pads are arranged on the back of the first PCB. The four second pads are used for welding the voice coil wires led out from the through slots opened on the side of the bracket. One end of the voice coil wire is connected to the second pad, and the other end of the voice coil wire is connected to the second voice coil.

[0016] Preferably, the tweeter includes a second outer magnet, a second inner magnet, a support ring member, a third diaphragm, a third voice coil, a third outer magnet, a third inner magnet and a second PCB. The second outer magnet and the second inner magnet are placed on a flat structure provided at the bottom of the bracket. The second outer magnet is located on the periphery of the second inner magnet.

[0017] Preferably, a support ring member is arranged below the second outer magnet and the second inner magnet. The support ring member is used to support the third diaphragm. A third voice coil is arranged on the third diaphragm. The third voice coil is located above the third outer magnet and the third inner magnet.

[0018] Preferably, the third outer magnet is located on the periphery of the third inner magnet. The third outer magnet and the third inner magnet are both adhered to the second PCB. Third pads are arranged on the back of the second PCB. The four third pads are used for welding the voice coil wires led out from the through slots opened on the side of the bracket. One end of the voice coil wire is connected to the third pad, and the other end of the voice coil wire is connected to the third voice coil.

[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0020] Through the structural design of the bass speaker, the present utility model embeds the treble speaker in the middle of the bass speaker. In this way, the height after the combination of the two speakers is still the height of one bass speaker, which is equivalent to the height of one speaker, and the performance of two speakers can be achieved. This structure will completely replace the existing dual-unit speakers and become the mainstream of electroacoustic products such as future headphones and smart wearables. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is the front view of the embedded ultra-thin dual-unit speaker module of Embodiment 1 of the present utility model;

[0022] Figure 2 It is the back view of the embedded ultra-thin dual-unit speaker module of Embodiment 1 of the present utility model;

[0023] Figure 3 It is the sectional view of the embedded ultra-thin dual-unit speaker module of Embodiment 1 of the present utility model;

[0024] Figure 4 It is the exploded view of the embedded ultra-thin dual-unit speaker module of Embodiment 1 of the present utility model;

[0025] Figure 5 It is the exploded view of the embedded ultra-thin dual-unit speaker module of Embodiment 1 of the present utility model;

[0026] Figure 6 It is the front view of the embedded ultra-thin dual-unit speaker module of Embodiment 2 of the present utility model;

[0027] Figure 7 It is the back view of the embedded ultra-thin dual-unit speaker module of Embodiment 2 of the present utility model;

[0028] Figure 8 It is the sectional view of the embedded ultra-thin dual-unit speaker module of Embodiment 2 of the present utility model;

[0029] Figure 9 It is the exploded view of the embedded ultra-thin dual-unit speaker module of Embodiment 2 of the present utility model;

[0030] Figure 10 It is the back view of the embedded ultra-thin dual-unit speaker module of Embodiment 3 of the present utility model;

[0031] Figure 11 It is the sectional view of the embedded ultra-thin dual-unit speaker module of Embodiment 3 of the present utility model;

[0032] Figure 12Explosion diagram of the embedded ultra-thin dual-unit speaker module of Embodiment 3 of the present utility model.

[0033] In the figure: 1. Outer shell; 2. First diaphragm; 3. First voice coil; 4. Washer; 5. Magnet; 6. Bracket; 7. First pad; 8. T-iron; 9. Mesh cloth; 10. Sealing ring; 11. Second diaphragm; 12. Second voice coil; 13. First outer magnet; 14. First inner magnet; 15. First PCB; 151. Second pad; 16. Second outer magnet; 17. Second inner magnet; 18. Support ring member; 19. Third diaphragm; 20. Third voice coil; 21. Third outer magnet; 22. Third inner magnet; 23. Second PCB; 231. Third pad. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0035] To solve the technical problem that the existing dual-unit speaker modules are all traditional upper and lower speaker stacking structures, increasing the overall thickness by 50% and unable to adapt to the future development of headphones, please refer to Figures 1-12 , the present embodiment provides the following technical solutions:

[0036] Embodiment 1

[0037] An embedded ultra-thin dual-unit speaker module, including a bass speaker and a treble speaker, and the treble speaker is embedded in the middle of the bass speaker;

[0038] Please refer to Figures 1-5 , the bass speaker includes an outer shell 1, a first diaphragm 2, a first voice coil 3, a washer 4, a magnet 5, a bracket 6, a first pad 7 and a T-iron 8;

[0039] A bracket 6 is arranged on the T-iron 8, and the bracket 6 wraps the first pad 7 and the T-iron 8 through an injection molding method. The integrated injection molding process is simpler and the assembly accuracy is higher.

[0040] It should be noted that the T-iron 8 is made of a magnetic conductive metal material such as SPCC or SPCE, the bracket 6 is made of a plastic material, and the two first pads 7 are made of a conductive metal material such as copper, mainly used for welding the voice coil wire to play a conduction role.

[0041] Among them, there are first pads 7 on both the front and back of the bracket 6. One end of the first pad 7 is used for welding the voice coil wire, and the other end of the first pad 7 is used for welding the audio wire;

[0042] A magnet 5 is provided on the T-iron 8, and a washer 4 is provided on the magnet 5. Among them, both the washer 4 and the magnet 5 are annular structures, and there is a gap for placing the first voice coil 3 between the washer 4 and the magnet 5 and the T-iron 8;

[0043] It should be noted that the washer 4 is made of magnetic conductive materials such as SPCC and SPCE, and its shape is an annular structure, which plays a role in magnetic conduction. The magnet 5 is a neodymium iron boron permanent magnet, and its shape is an annular structure.

[0044] Among them, the magnet 5 is placed between the washer 4 and the T-iron 8 and is bonded by glue. Both the washer 4 and the magnet 5 are annular structures, and there is a certain gap between the washer 4 and the magnet 5 and the T-iron 8, which is convenient for placing the first voice coil 3.

[0045] The first voice coil 3 is an annular structure. The first voice coil 3 is connected to the first pad 7 through a voice coil wire. Among them, the voice coil wire is a suspended structure and is fixed by a wire bending tooling. The end of the voice coil wire is welded on the two first pads 7;

[0046] It should be noted that the first voice coil 3 is an annular structure, and its material is conductive materials such as copper and aluminum. The first voice coil 3 and the magnetic circuit combination are fixed by a fixture to place the first voice coil 3 between the washer 4 and the middle column of the T-iron 8. The voice coil wire is a suspended structure and is fixed by a wire bending tooling. The end of the voice coil wire is welded on the two first pads 7. The welding of the first voice coil 3 is an internal welding structure. The advantage is that the voice coil wire is suspended, the first diaphragm 2 vibrates more smoothly, and the consistency of the speaker is better.

[0047] A first diaphragm 2 is provided on the washer 4. Among them, the first diaphragm 2 is composed of two folding rings and two support rings. The middle of the first diaphragm 2 is a hollow structure for the high-frequency speaker to emit sound. The middle of the two folding rings is a flat structure for bonding the first voice coil 3;

[0048] It should be noted that the first diaphragm 2 is composed of two folding rings and two support rings. Among them, the support rings are fixed by the steps of the fixture, and the positioning is more accurate, so that the first diaphragm 2 is not easily eccentric. The middle of the first diaphragm 2 is a hollow structure, which is convenient for the high-frequency speaker to emit sound. The middle of the two folding rings is a flat structure for bonding the first voice coil 3. A spherical dome can be added in the middle of the first diaphragm 2 for support, and the rigidity is stronger.

[0049] An outer shell 1 is provided on the periphery of the first diaphragm 2. The material of the outer shell 1 is metal or plastic.

[0050] The outer shell 1 is used to fix the first diaphragm 2, the washer 4, the magnet 5 and the T-iron 8.

[0051] Among them, the outer shell 1 is provided with a step for placing the first diaphragm 2. There is a gap for the first diaphragm 2 to vibrate between the first diaphragm 2 and the outer shell 1. There is an opening in the middle of the outer shell 1 for the low-frequency speaker and the high-frequency speaker to emit sound.

[0052] It should be noted that the housing 1 is provided with a step for placing the first diaphragm 2. There is a certain gap between the first diaphragm 2 and the housing 1 to facilitate the vibration of the first diaphragm 2. An opening is provided in the middle of the housing 1 for the low-frequency speaker and the high-frequency speaker to emit sound. The material of the housing 1 can be metal or plastic, and the housing 1 and the first diaphragm 2 are bonded with glue.

[0053] In this embodiment, the bottom of the T-iron 8 is provided with no less than three leakage holes, and a mesh cloth 9 is arranged at the leakage holes.

[0054] In this embodiment, the high-frequency speaker has a circular or square structure, and the sound outlet hole of the high-frequency speaker has a structure with or without a sound nozzle.

[0055] In this embodiment, the sound outlet hole of the high-frequency speaker has a structure with a sound nozzle, which is used for the sound nozzle to be inserted into the middle of the hole of the bracket 6 and sealed by the sealing ring 10, so that the directivity of the high frequency is stronger, the high-frequency sensitivity is higher, the frequency bandwidth is wider, and the high-frequency speaker leads out an electronic wire or an FPC wiring harness for frequency division connection with the low-frequency speaker.

[0056] During assembly, the low-frequency speaker and the high-frequency speaker are separated separately, and then assembled together after the two speakers are made. Among them, the sound outlet hole of the high-frequency speaker has a structure with a sound nozzle, which is used for the sound nozzle to be inserted into the middle of the hole of the bracket 6 and sealed by the sealing ring 10 to realize the assembly of the low-frequency speaker and the high-frequency speaker.

[0057] Among them, when the high-frequency speaker and the low-frequency speaker are assembled and fixed, they can be bonded with glue, and glue is applied to the edge of the high-frequency speaker for fixation. Or at least one claw can protrude from the housing of the high-frequency speaker, and there is a corresponding groove on the bracket 6, and they are fixed through the claw and the groove, which can be glue or welding.

[0058] For the ultra-thin dual-unit speaker module with this structure, the sound of the first diaphragm 2 of the low-frequency speaker is emitted through the hole of the housing 1, and the low-frequency speaker emits sound through the middle hole of the first diaphragm 2. The low frequency and the high frequency emit sound on the same plane, and the connection between the high and low frequencies is smoother, and the sound quality is better. The high-frequency speaker is embedded in the middle of the low-frequency speaker, and the overall height of the speaker can be made thinner. Compared with the traditional dual-speaker module, the height is reduced by 30%, saving space for electronic products such as headphones.

[0059] Embodiment Two

[0060] Compared with Embodiment One, the difference lies in that the structure of the high-frequency speaker in Embodiment Two is different;

[0061] Please refer to Figures 6-9, in this embodiment, the tweeter includes a second diaphragm 11, a second voice coil 12, a first outer magnet 13, a first inner magnet 14 and a first PCB 15. The second diaphragm 11 is placed at a step with a height of not less than 0.1 mm provided at the bottom of the bracket 6. Among them, the second diaphragm 11 is sealed and fixed to the bracket 6 with glue.

[0062] It should be noted that a step with a height of at least 0.1 mm is provided at the bottom of the bracket 6 of the woofer for placing the second diaphragm 11 of the tweeter to facilitate the vibration of the second diaphragm 11. The second diaphragm 11 of the tweeter is placed into the bracket 6 of the woofer and sealed and fixed with glue.

[0063] It should be noted that the second voice coil 12 can be placed on both the upper and lower surfaces of the second diaphragm 11 to form a dual voice coil structure. The number of turns of the voice coil increases, the magnetic field BL value increases, and the sensitivity of the speaker increases by 3 dB.

[0064] In this embodiment, the second voice coil 12 is bonded to the second diaphragm 11, and after the second diaphragm 11 and the second voice coil 12 are bonded, they are placed into the bracket 6 of the woofer.

[0065] The second voice coil 12 is located above the first outer magnet 13 and the first inner magnet 14. Among them, the first outer magnet 13 is located on the periphery of the first inner magnet 14. Both the first outer magnet 13 and the first inner magnet 14 are adhered to the first PCB 15. A second pad 151 is provided on the back of the first PCB 15. The four second pads 151 are used to weld the voice coil wires led out from the through slots opened on the side of the bracket 6. One end of the voice coil wire is connected to the second pad 151, and the other end of the voice coil wire is connected to the second voice coil 12.

[0066] It should be noted that through slots are opened on the side of the bracket 6 to facilitate the lead-out of the voice coil wires of the tweeter.

[0067] For the ultra-thin dual-unit speaker module with this structure, after the woofer is assembled, the second diaphragm 11, the second voice coil 12, the first outer magnet 13, the first inner magnet 14 and the first PCB 15 of the tweeter are assembled by using the bracket 6 of the woofer as a positioning, which saves more space for the tweeter. Among them, the magnetic direction of the magnet 5 of the woofer is the Y axis. The high-frequency speaker is a planar speaker structure and is composed of the first outer magnet 13 and the first inner magnet 14. Among them, the magnetic poles of the first outer magnet 13 and the first inner magnet 14 are opposite. The second voice coil 12 of the tweeter is a ring-shaped planar structure, bonded to the second diaphragm 11, and placed above the first outer magnet 13 and the first inner magnet 14. At least a 0.1 mm gap is left between the second voice coil 12 and the first inner magnet 14 to facilitate vibration. After the second voice coil 12 of the tweeter is energized, it vibrates up and down under the action of the magnetic field and emits sound from the middle hole of the bracket 6.

[0068] Embodiment Three

[0069] Compared with the first embodiment, the difference lies in that the structure of the tweeter in the third embodiment is different;

[0070] Please refer to Figures 10-12 , in this embodiment, the tweeter includes a second outer magnet 16, a second inner magnet 17, a support ring member 18, a third diaphragm 19, a third voice coil 20, a third outer magnet 21, a third inner magnet 22 and a second PCB 23. The second outer magnet 16 and the second inner magnet 17 are placed at the flat structure provided at the bottom of the bracket 6, wherein the second outer magnet 16 is located on the periphery of the second inner magnet 17.

[0071] It should be noted that the bottom of the bracket 6 of the woofer is a flat structure for placing the second outer magnet 16 and the second inner magnet 17. The side of the bracket 6 of the woofer is slotted to facilitate the lead-out of the voice coil wire of the tweeter.

[0072] Among them, the second inner magnet 17 has a hole in the middle for the third diaphragm 19 to vibrate and generate sound.

[0073] Among them, the magnetic circuit formed by the second outer magnet 16 and the second inner magnet 17 can be assembled with the bracket 6 by glue bonding, or the magnetic circuit and the bracket 6 can be integrally injection-molded together. A support ring member 18 is placed above the magnetic circuit to support the third diaphragm 19 and form a vibration space with the magnetic circuit.

[0074] In this embodiment, a support ring member 18 is provided below the second outer magnet 16 and the second inner magnet 17. The support ring member 18 is used to support the third diaphragm 19. A third voice coil 20 is provided on the third diaphragm 19, and the third voice coil 20 is located above the third outer magnet 21 and the third inner magnet 22.

[0075] In this embodiment, the third outer magnet 21 is located on the periphery of the third inner magnet 22. The third outer magnet 21 and the third inner magnet 22 are both adhered to the second PCB 23. A third pad 231 is provided on the back of the second PCB 23. The four third pads 231 are used to weld the voice coil wire led out from the through groove opened on the side of the bracket 6. One end of the voice coil wire is connected to the third pad 231, and the other end of the voice coil wire is connected to the third voice coil 20.

[0076] The ultra-thin dual-unit speaker module with this structure is similar to the ultra-thin dual-unit speaker module provided in the second embodiment, except that the tweeter adopts an upper and lower dual magnetic circuit system, and the third voice coil 20 is placed in the middle of the upper and lower magnetic circuits. Under the action of the upper and lower magnetic circuits, the magnetic field efficiency is increased by 30%.

[0077] It should be noted that the PCB circuit connection: the high-frequency attenuation of the woofer is relatively fast, and it is combined with the tweeter through frequency division, so that the high-frequency bandwidth of the dual unit is effectively expanded, and the sound quality of the dual unit speaker is greatly improved.

[0078] Among them, the tweeter and the woofer can be connected in parallel or in series, but the commonly used connection method is parallel connection.

[0079] In summary, through the structural design of the woofer, the tweeter is embedded in the middle of the woofer. In this way, the height after the combination of the two speakers is still the height of one woofer, which is equivalent to the height of one speaker, and the performance of two speakers can be achieved. This structure will completely replace the existing dual-unit speakers and become the mainstream of electroacoustic products such as future headphones and smart wearables.

[0080] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0081] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An embedded ultra-thin dual-unit speaker module, comprising a woofer and a tweeter, characterized in that: The tweeter is embedded in the middle of the woofer. The woofer comprises a housing (1), a first diaphragm (2), a first voice coil (3), a washer (4), a magnet (5), a bracket (6), a first soldering pad (7) and a T-iron (8). The bracket (6) wraps the first soldering pad (7) and the T-iron (8) by injection molding. The front and back sides of the bracket (6) are provided with the first soldering pad (7). One end of the first soldering pad (7) is used for soldering the voice coil wire, and the other end of the first soldering pad (7) is used for soldering the audio wire. The T-iron (8) is provided with a magnet (5), and the magnet (5) is provided with a washer (4). A gap for placing the first voice coil (3) is left between the washer (4) and the magnet (5) and the T-iron (8). The first voice coil (3) is connected to the first soldering pad (7) via the voice coil wire.

2. The embedded ultra-thin dual-unit speaker module according to claim 1, characterized in that: The washer (4) is provided with a first diaphragm (2), wherein the middle of the first diaphragm (2) is a hollow structure for the tweeter to produce sound, and the outer periphery of the first diaphragm (2) is provided with a shell (1), and the shell (1) is used to fix the first diaphragm (2), the washer (4), the magnet (5) and the T-iron (8), wherein the shell (1) has a hole in the middle for the woofer and the tweeter to produce sound.

3. The embedded ultra-thin dual-unit speaker module according to claim 1, characterized in that: The tweeter is of a circular or square structure, and the sound outlet of the tweeter is of a structure with or without a sound mouth.

4. The embedded ultra-thin dual-unit speaker module according to claim 1, characterized in that: The tweeter comprises a second diaphragm (11), a second voice coil (12), a first external magnet (13), a first internal magnet (14) and a first PCB (15), wherein the second diaphragm (11) is placed on a step with a height of not less than 0.1 mm arranged at the bottom of the bracket (6), wherein the second diaphragm (11) is sealed and fixed on the bracket (6) by glue.

5. The embedded ultra-thin dual-unit speaker module according to claim 4, characterized in that: A second voice coil (12) is bonded to the second diaphragm (11), and the second voice coil (12) is located above the first external magnet (13) and the first internal magnet (14), wherein the first external magnet (13) is located outside the first internal magnet (14), and the first external magnet (13) and the first internal magnet (14) are both bonded to the first PCB (15), and a second soldering pad (151) is provided on the back of the first PCB (15), and four of the second soldering pads (151) are used for soldering voice coil wires drawn out from the through grooves provided on the side of the bracket (6), one end of the voice coil wire is connected to the second soldering pad (151), and the other end of the voice coil wire is connected to the second voice coil (12).

6. The embedded ultra-thin dual-unit speaker module according to claim 1, characterized in that: The tweeter comprises a second external magnet (16), a second internal magnet (17), a supporting ring (18), a third diaphragm (19), a third voice coil (20), a third external magnet (21), a third internal magnet (22) and a second PCB (23), wherein the second external magnet (16) and the second internal magnet (17) are placed on a flat structure arranged at the bottom of the bracket (6), wherein the second external magnet (16) is located on the periphery of the second internal magnet (17).

7. The embedded ultra-thin dual-unit speaker module according to claim 6, characterized in that: A support ring (18) is arranged below the second external magnet (16) and the second internal magnet (17), and the support ring (18) is used to support a third diaphragm (19). A third voice coil (20) is arranged on the third diaphragm (19), and the third voice coil (20) is located above the third external magnet (21) and the third internal magnet (22).

8. The embedded ultra-thin dual-unit speaker module according to claim 7, characterized in that: The third external magnet (21) is located outside the third internal magnet (22); the third external magnet (21) and the third internal magnet (22) are both adhered to the second PCB (23); a third soldering pad (231) is arranged on the back of the second PCB (23); four third soldering pads (231) are used for soldering voice coil wires drawn out from the through grooves provided on the side of the bracket (6); one end of the voice coil wire is connected to the third soldering pad (231), and the other end of the voice coil wire is connected to the third voice coil (20).

Images