Anti-deformation PCB circuit board

Abstract

The utility model discloses an anti-deformation PCB circuit board, which comprises a circuit board body, the circuit board body comprises a substrate and insulating layers arranged at the top and the bottom of the substrate, the periphery of the substrate is respectively provided with an anti-bending piece, the insulating layers wrap the anti-bending pieces, and the insulating layers wrap the anti-bending pieces. Each anti-bending piece is composed of a plurality of inclined bending plates of an integrated structure, every two adjacent inclined bending plates form an anti-bending part with the section in a V shape or an inverted V shape, the anti-bending parts on the anti-bending pieces on the left side and the right side of the base plate are longitudinally arranged, and the anti-bending parts on the anti-bending pieces on the front side and the rear side of the base plate are transversely arranged. According to the technical scheme, the anti-bending pieces composed of the inclined bending plates of the integrated structure are arranged on the periphery of the circuit board, and the two adjacent inclined bending plates are controlled to form the anti-bending part with the V-shaped or inverted-V-shaped section, so that the transverse and longitudinal anti-bending strength of the circuit board can be enhanced, the circuit board is not prone to bending deformation, and the service life of the circuit board is prolonged. And the use requirement of a large-scale circuit board is met.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly relates to a PCB circuit board with anti-deformation function. Background Art

[0002] A PCB circuit board, also known as a printed circuit board, is a substrate for supporting and connecting electronic components. A PCB circuit board is a flat board made of insulating material, on which electronic components are arranged and connected through conductive tracks, holes, pads and other structures.

[0003] A PCB circuit board generally mainly consists of a substrate (metal track) and insulating layers provided on the top and bottom of the substrate. The PCB circuit board with this kind of structure has poor anti-deformation ability and is not suitable for use in large boards. Therefore, how to design a PCB circuit board with anti-deformation function has become an urgent technical problem to be solved. Summary of the Utility Model

[0004] In order to overcome the existing technical defects, the purpose of the utility model is to provide a PCB circuit board with anti-deformation function to solve the above technical problems.

[0005] The technical solution adopted by the utility model to solve the technical problems is as follows:

[0006] According to one aspect of the utility model, a PCB circuit board with anti-deformation function is designed, including: a circuit board body, the circuit board body includes a substrate and insulating layers provided on the top and bottom of the substrate, anti-bending members are respectively arranged around the substrate, the insulating layers wrap the anti-bending members, the anti-bending members are composed of a plurality of integrally-structured inclined bending plates, and adjacent two inclined bending plates form an anti-bending part with a V-shaped or Λ-shaped cross-section. Among them, the anti-bending parts on the anti-bending members on the left and right sides of the substrate are arranged longitudinally, and the anti-bending parts on the anti-bending members on the front and back sides of the substrate are arranged transversely.

[0007] By adopting the above technical solution, anti-bending members composed of a plurality of integrally-structured inclined bending plates are respectively arranged around the circuit board, and the anti-bending parts with a V-shaped or Λ-shaped cross-section are formed by controlling adjacent two inclined bending plates, so that the anti-bending strength of the circuit board in the transverse and longitudinal directions can be enhanced, the circuit board is not easily bent and deformed, and the use requirements of large circuit boards are met.

[0008] In order to better solve the above technical defects, the utility model also has a better technical solution:

[0009] In some embodiments, a reinforcing plate is pasted on the bottom of the circuit board body. By setting the reinforcing plate, the anti-bending strength of the circuit board can be further improved.

[0010] In some embodiments, the reinforcing plate is made of metal, and a plurality of penetrating U-shaped grooves are distributed at intervals along the length direction of its bottom. The use of a metal material for the reinforcing plate can absorb the heat generated by the circuit board and dissipate heat from the circuit board. By providing U-shaped grooves at the bottom of the reinforcing plate, the heat dissipation area can be increased and the heat dissipation effect can be improved.

[0011] In some embodiments, the thickness of the reinforcing plate is less than 2.5 mm.

[0012] In some embodiments, through holes are respectively provided at the four corner positions of the circuit board body.

[0013] In some embodiments, a fiberglass layer is provided between the bottom of the substrate and the insulating layer. By providing the fiberglass layer, the anti-bending strength of the circuit board can be further improved. Description of the Drawings

[0014] Figure 1 Schematic structural diagram of an anti-deformation PCB circuit board according to an embodiment provided by the present utility model;

[0015] Figure 2 is Figure 1 Schematic cross-sectional structural diagram at the A-A position in

[0016] Figure 3 is Figure 1 Schematic cross-sectional structural diagram at the B-B position in

[0017] Figure 4 Schematic distribution structural diagram of the anti-bending members in the anti-deformation PCB circuit board;

[0018] Figure 5 Schematic structural diagram of another anti-deformation PCB circuit board according to an embodiment provided by the present utility model;

[0019] Figure 6 is Figure 5 Schematic cross-sectional structural diagram at the C-C position in

[0020] Reference Signs:

[0021] 1. Circuit board body; 11. Substrate; 12. Insulating layer; 13. Mounting hole; 2. Anti-bending member; 21. Inclined bending plate; 3. Reinforcing plate; 31. U-shaped groove. Detailed Embodiments

[0022] To make the objectives, technical solutions, and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present utility model. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.

[0023] In the description of the present utility model, it should be understood that for orientation descriptions, such as those indicated by up, down, front, back, left, right, etc., the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0024] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installation, connection, and fixed connection should be understood in a broad sense. Those skilled in the relevant technical field can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0025] Embodiment 1

[0026] Reference Figures 1 to 4 As shown, a PCB circuit board with anti-deformation provided by the present utility model includes: a circuit board body 1, the circuit board body 1 includes a substrate 11 and insulating layers 12 provided on the top and bottom of the substrate 11. Anti-bending members 2 are respectively arranged around the substrate 11, and the insulating layers 12 wrap the anti-bending members 2. The material of the anti-bending members 2 is aluminum or aluminum alloy or steel or carbon fiber, etc. In this embodiment, the material of the anti-bending members 2 is preferably aluminum. The anti-bending members 2 are composed of several integrally structured inclined bending plates 21. The adjacent two inclined bending plates 21 form an anti-bending part with a V-shaped or Λ-shaped cross-section. Among them, the anti-bending parts on the anti-bending members 2 on the left and right sides of the substrate 11 are arranged longitudinally, and the anti-bending parts on the anti-bending members 2 on the front and back sides are arranged transversely.

[0027] Through holes 13 are respectively arranged at the four corners of the circuit board body 1.

[0028] Embodiment 2

[0029] Reference Figures 5 to 6As shown in the figure, another anti-deformation PCB circuit board provided by the present utility model is different from that in Embodiment 1 in that: a reinforcing plate 3 is adhered to the bottom of the circuit board body 1. The reinforcing plate 3 is made of metal, and the specific material is aluminum or aluminum alloy, etc. In this embodiment, it is preferably that the material of the reinforcing plate 3 is aluminum. The thickness of the reinforcing plate 3 is less than 2.5 mm. Specifically, the thickness of the reinforcing plate 3 is 2.4 mm or 2 mm or 1.5 mm or 1 mm, and the thickness is set according to needs. A number of through ㄇ-shaped grooves 31 are distributed at intervals along the length direction of the bottom of the reinforcing plate 3.

[0030] In some embodiments, a fiberglass layer is provided between the bottom of the substrate and the insulating layer.

[0031] The above are only some embodiments of the present utility model. For those of ordinary skill in the art, without departing from the creative concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model.

Claims

1. A deformation-resistant PCB circuit board, characterized in that: include: A circuit board body, the circuit board body includes a substrate and an insulating layer arranged on the top and bottom of the substrate, anti-bending parts are arranged on the four sides of the substrate, the insulating layer wraps the anti-bending parts, the anti-bending parts are composed of a plurality of inclined bending plates of an integral structure, and two adjacent inclined bending plates form an anti-bending part with a V-shaped or Λ-shaped cross-section, wherein the anti-bending parts on the anti-bending parts on the left and right sides of the substrate are longitudinally arranged, and the anti-bending parts on the front and rear sides are transversely arranged.

2. The anti-deformation PCB circuit board according to claim 1, characterized in that: A reinforcing plate is adhered to the bottom of the circuit board body.

3. The anti-deformation PCB circuit board according to claim 2, characterized in that: The reinforcing plate is made of metal, and a plurality of through U-shaped grooves are distributed at intervals along the length direction of the reinforcing plate at the bottom.

4. The anti-deformation PCB circuit board according to claim 3, characterized in that: The thickness of the reinforcement plate is less than 2.5 mm.

5. The anti-deformation PCB circuit board according to claim 1, characterized in that: The four corners of the circuit board body are respectively provided with penetrating mounting holes.

6. The anti-deformation PCB circuit board according to claim 1, characterized in that: A glass fiber layer is arranged between the bottom of the substrate and the insulating layer.

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