Electronic device with internal temperature adjusting function

By designing a combination of fans and heaters in the electronic device, a convection heating component is formed, which solves the problem that the electronic device cannot start up normally in a low-temperature environment and achieves normal operation in a low-temperature environment.

CN223053317UActive Publication Date: 2025-07-01LANNER ELECTRONIC INC
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Patent Information

Application Number
CN202421593922.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-08
Publication Date
2025-07-01
Estimated Expiration
2034-07-08

AI Technical Summary

Technical Problem

Existing electronic devices cannot be turned on normally in low temperature environments, resulting in failure when used in high latitude areas or in snowy environments.

Method used

An electronic device with internal temperature adjustment function is designed, including a housing, a fan and a heater. The fan introduces cold outside air into the shell, and the heater heats the cold air to form warm air, and discharges the warm air through the air outlet to form a convection heating assembly to increase the internal temperature.

Benefits of technology

Through the combination of a fan and a heater, the temperature of the internal space of the electronic device can be uniformly increased, so that the electronic device can be turned on and operated normally in a low temperature environment.

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Abstract

The utility model mainly discloses an electronic device with an internal temperature adjusting function, which comprises a shell, at least one fan and a heater, the fan and the heater are respectively arranged on a first side edge and a second side edge of the shell, and the second side edge is opposite to the first side edge. In addition, at least one first air outlet hole and at least one second air outlet hole are formed in a third side edge and a fourth side edge of the shell respectively. According to the design, when the heater works and the fan runs, external cold air is fed into the shell through the fan, and the heater heats the cold air into warm air, so that the temperature of the internal space of the shell is uniformly increased, and the electronic device can be normally started and operated.
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Description

Technical Field

[0001] The present utility model relates to the technical field of electronic devices, and more particularly to an electronic device with an internal temperature adjustment function. Background Art

[0002] Due to the limitation of the operating temperature range of internal electronic components, electronic wafers and / or electronic modules, when an electronic device is used in special occasions, such as in areas with higher latitudes or snowy environments, the ambient temperature below the operating temperature range may cause the electronic device to fail to boot up normally.

[0003] As can be seen from the above description, the existing electronic devices have the significant drawback of being unable to boot up normally in low-temperature environments. In view of this, the creator of the present utility model has made great efforts in research and finally developed an electronic device with an internal temperature adjustment function of the present utility model. Summary of the Utility Model

[0004] The main purpose of the present utility model is to provide an electronic device with an internal temperature adjustment function, which includes a housing, at least one fan, and a heater. Among them, the fan and the heater are respectively installed on a first side and a second side of the housing, and the second side is opposite to the first side. And, at least one first air outlet hole and at least one second air outlet hole are respectively provided on a third side and a fourth side of the housing. According to this design, when the heater works and the fan runs, the outside cold air is fed into the housing by the fan, and the heater heats the cold air into warm air, and finally the warm air flows into the outside through the first air outlet hole and the second air outlet hole. Simply put, the fan, the heater, the first air outlet hole and the second air outlet hole form a convection heating component, so as to be able to uniformly increase the temperature of the internal space of the housing, so that the electronic device can boot up and operate normally.

[0005] To achieve the above object, an embodiment of the electronic device with an internal temperature adjustment function of the present utility model includes:

[0006] A housing accommodating at least one circuit board, a plurality of electronic components, and at least one electronic wafer;

[0007] At least one fan mounting hole formed on a first side of the housing;

[0008] At least one fan embedded in the at least one fan mounting hole, wherein a suction side of the fan is exposed outside the housing, and an exhaust side thereof is located inside the housing;

[0009] A heater is disposed within the housing and adjacent to or attached to a second side of the housing. The heater faces the fan, the second side faces the first side, and there is a first distance between the heater and the second side.

[0010] At least one first air outlet hole is formed on a third side of the housing, where the third side is connected between the first side and the second side; and

[0011] At least one second air outlet hole is formed on a fourth side of the housing;

[0012] where the fourth side faces the third side, and there is a second distance between the fourth side and the third side;

[0013] where the fourth side is connected between the first side and the second side.

[0014] In one embodiment, the housing includes:

[0015] A base including a bottom and four sides connecting the bottom, where the four sides enclose an opening and respectively serve as the first side, the second side, the third side, and the fourth side; and

[0016] A cover plate is coupled to the base to close the opening.

[0017] In one embodiment, the plurality of electronic components includes N electrical connectors, and N exposed holes are further formed on the third side to expose the N electrical connectors outside the housing; N is a positive integer.

[0018] In one embodiment, the heater is controlled by a controller and is at least one selected from the group consisting of a PTC ceramic heating sheet, a mica heating sheet, a metal heating sheet, a silicone rubber heater pad, a silicon carbide heating element, and a thermo-electric converter.

[0019] In one embodiment, the thermo-electric converter includes at least one selected from the group consisting of a single-layer thermo-electric conversion wafer, a multi-layer thermo-electric conversion wafer, a single-layer thermo-electric conversion wafer with a central perforation, and a multi-layer thermo-electric conversion wafer with a central perforation.

[0020] In one embodiment, the first side includes a first section, a first bent section connecting the first section, a middle concave section connecting the first bent section, a second bent section connecting the middle concave section, and a second section connecting the second bent section, and the fan mounting hole is formed in the middle concave section.

[0021] In one embodiment, the third side, the first section, the first bent section, the middle concave section, and the fan form a first air collecting space inside the housing, such that the at least one first air outlet faces the first air collecting space.

[0022] In one embodiment, the fourth side, the second section, the second bent section, the middle concave section, and the fan form a second air collecting space inside the housing, such that the at least one second air outlet faces the second air collecting space. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A is a first perspective three-dimensional view of an electronic device with an internal temperature adjustment function according to the present utility model;

[0024] Figure 1B is a second perspective three-dimensional view of the electronic device with an internal temperature adjustment function according to the present utility model;

[0025] Figure 2A is Figure 1A the first three-dimensional exploded view of the electronic device with an internal temperature adjustment function shown;

[0026] Figure 2B is Figure 1B the second three-dimensional exploded view of the electronic device with an internal temperature adjustment function shown; and

[0027] Figure 3 is the top view of the base, the fan and the heater.

[0028]

REFERENCE SIGNS

[0029] 1: Electronic device

[0030] 11: Housing

[0031] 111: Circuit board

[0032] 112: Electronic component

[0033] 113: Electronic wafer

[0034] 11E: Exposed hole

[0035] 11S1: First side

[0036] 11S2: Second side

[0037] 11S3: The third side

[0038] 11S4: The fourth side

[0039] 11B: The base

[0040] 11T: The cover

[0041] 12: The fan mounting hole

[0042] 13: The fan

[0043] 14: The heater

[0044] 15: The first air outlet hole

[0045] 16: The second air outlet hole Detailed implementation manners

[0046] To further understand the structure, features, purpose, and advantages of the creation of the present utility model, the following is a detailed description with attached drawings and preferred specific embodiments.

[0047] Figure 1A 、 Figure 1B are respectively the first perspective and second perspective stereograms of an electronic device with an internal temperature adjustment function of the present utility model. And, Figure 2A is Figure 1A the first three-dimensional exploded view of the electronic device with an internal temperature adjustment function shown, and Figure 2B is Figure 1B the second three-dimensional exploded view of the electronic device with an internal temperature adjustment function shown. As Figure 1A 、 Figure 1B 、 Figure 2A 、and Figure 2B shown, the electronic device 1 with an internal temperature adjustment function of the present utility model (hereinafter referred to as "electronic device 1") mainly includes: a housing 11, at least one circuit board 111, a plurality of electronic components 112, at least one electronic chip 113, at least one fan 13, and at least one heater 14. Among them, the housing 11 accommodates the at least one circuit board 111, the plurality of electronic components 112, and the at least one electronic chip 113, and includes a base 11B and a cover 11T. More specifically, the base 11B includes a bottom and four sides connecting the bottom, and the four sides are respectively a first side 11S1, a second side 11S2, a third side 11S3, and a fourth side 11S4 of the housing 11. And, the first side 11S1, the second side 11S2, the third side 11S3, and the fourth side 11S4 together enclose an opening, and the cover 11T is coupled to the base 11B to close the opening.

[0048] It should be additionally noted that the second side 11S2 faces the first side 11S1 and there is a first distance between them. Correspondingly, the fourth side 11S4 faces the third side 11S3 and there is a second distance between them. Moreover, the first side 11S1 is connected to the third side 11S3, the third side 11S3 is connected to the second side 11S2, the second side 11S2 is connected to the fourth side 11S4, and the fourth side 11S4 is connected to the first side 11S1. In other words, the third side 11S3 is connected between the first side 11S1 and the second side 11S2, and the fourth side 11S4 is connected between the first side 11S1 and the second side 11S2.

[0049] It should be noted that at least one fan mounting hole 12 is formed on the first side 11S1 such that at least one fan 13 is embedded in the at least one fan mounting hole 12. As Figure 2A shown, an air suction side of the fan 13 is exposed outside the housing 11, and an air exhaust side thereof is located inside the housing 11. With such an arrangement, when the fan 13 operates normally, cold air from the outside is sucked by the fan 13 and fed into the housing 11. Figure 2B shown, an air suction side of the fan 13 is exposed outside the housing 11, and an air exhaust side thereof is located inside the housing 11. With such an arrangement, when the fan 13 operates normally, cold air from the outside is sucked by the fan 13 and fed into the housing 11.

[0050] On the other hand, the heater 14 is disposed inside the housing 11 and is adjacent to or attached to a second side 11S2 of the housing 11. As Figure 2A shown, the heater 14 faces the fan 13. Specifically, the heater 14 is controlled by a controller and may be, but is not limited to, a PTC ceramic heating sheet, a mica electric heating sheet, a metal heating sheet, a silicone rubber heater pad, a silicon carbide heating element, or a thermo-electric converter. Moreover, in a feasible embodiment, the thermo-electric converter includes at least one thermo-electric conversion wafer, and the thermo-electric conversion wafer may be, but is not limited to, a single-layer thermo-electric conversion wafer, a multi-layer thermo-electric conversion wafer, a single-layer thermo-electric conversion wafer with a central perforation, or a multi-layer thermo-electric conversion wafer with a central perforation. Figure 2B shown, the heater 14 faces the fan 13. Specifically, the heater 14 is controlled by a controller and may be, but is not limited to, a PTC ceramic heating sheet, a mica electric heating sheet, a metal heating sheet, a silicone rubber heater pad, a silicon carbide heating element, or a thermo-electric converter. Moreover, in a feasible embodiment, the thermo-electric converter includes at least one thermo-electric conversion wafer, and the thermo-electric conversion wafer may be, but is not limited to, a single-layer thermo-electric conversion wafer, a multi-layer thermo-electric conversion wafer, a single-layer thermo-electric conversion wafer with a central perforation, or a multi-layer thermo-electric conversion wafer with a central perforation.

[0051] Figure 3 is a top view of the base 11B, the fan 13, and the heater 14. As Figure 2A shown, Figure 2B shown, Figure 3As shown, at least one first air outlet hole 15 is formed on the third side 11S3, and at least one second air outlet hole 16 is formed on the fourth side 11S4. Moreover, the first side 11S1 is designed to include a first section, a first bending section connecting the first section, an intermediate concave section connecting the first bending section, a second bending section connecting the intermediate concave section, and a second section connecting the second bending section, such that the fan mounting hole 12 is located in the intermediate concave section. Through such a structural design, the third side 11S3, the first section, the first bending section, the intermediate concave section, and the fan 13 form a first air collecting space inside the housing 11, such that the at least one first air outlet hole 15 faces the first air collecting space. Correspondingly, the fourth side 11S4, the second section, the second bending section, the intermediate concave section, and the fan 13 form a second air collecting space inside the housing 11, such that the at least one second air outlet hole 16 faces the second air collecting space.

[0052] As Figure 3 shown, when the heater 14 is operating normally and the fan 13 is running normally, the cold air from the outside is fed into the housing 11 by the fan 13. Since the fan 13 faces the heater 14, therefore, inside the housing 11, the fan 13 pushes the cold air collected from the outside towards the heater 14, such that the cold air is heated by the heater 14 into warm air. It should be noted that since the first air outlet hole 15 faces the first air collecting space on one side of the fan 13, the second air outlet hole 16 faces the second air collecting space on the other side of the fan 13, and the fan 13 continuously pushes the cold air collected from the outside towards the heater 14, the warm air made by the heater 14 is forced to avoid the middle flow path where the cold air flows from the fan 13 towards the heater 14, and thus flows from the heater 14 towards the first air collecting space along a first side flow path adjacent to the middle flow path, and at the same time flows towards the second air collecting space along a second side flow path adjacent to the middle flow path and from the heater 14.

[0053] Finally, the warm air flows into the outside through the first air outlet hole 15 in the first air collecting space, and flows into the outside through the second air outlet hole 16 in the second air collecting space. Briefly speaking, the fan 13, the heater 14, the first air outlet hole 15 and the second air outlet hole 16 form a convection heating assembly, so as to be able to uniformly increase the temperature of the internal space of the housing 11, such that the electronic device 1 can be powered on and operate normally.

[0054] It should be supplementary explained that as Figure 1A 、 Figure 1B 、 Figure 2A 、and Figure 2BAs shown, the multiple electronic components 112 include N electrical connectors, and N exposed holes 11E are further formed on the third side 11S3 to expose the N electrical connectors outside the housing 11, where N is a positive integer.

[0055] In summary, the electronic device with an internal temperature adjustment function of the present utility model has been fully and clearly described. However, it must be emphasized that the foregoing disclosed in this case is a preferred embodiment, and any partial changes or modifications that are easily inferred by those skilled in the art from the technical idea of this case are within the scope of the patent right of this case.

Claims

1. An electronic device with an internal temperature adjustment function, characterized in that: include: A housing containing at least one circuit board, a plurality of electronic components, and at least one electronic chip; At least one fan mounting hole is formed on a first side of the housing; At least one fan is embedded in the at least one fan mounting hole, wherein an air suction side of the fan is exposed outside the housing, and an air discharge side of the fan is located inside the housing; a heater, disposed in the housing and adjacent to a second side of the housing or attached to the second side, wherein the heater faces the fan, the second side faces the first side, and there is a first distance between the heater and the second side; at least one first air outlet hole formed on a third side of the housing, wherein the third side is connected between the first side and the second side; and At least one second air outlet is formed on a fourth side of the housing; The fourth side faces the third side and has a second distance from the third side; The fourth side is connected between the first side and the second side.

2. The electronic device with internal temperature adjustment function as claimed in claim 1, characterized in that: The housing includes: A base, comprising a bottom and four side edges connected to the bottom, wherein the four side edges surround an opening and serve as the first side edge, the second side edge, the third side edge, and the fourth side edge respectively; and A cover plate is combined with the base to close the opening.

3. The electronic device with internal temperature adjustment function as claimed in claim 1, characterized in that: The plurality of electronic components include N electrical connectors, and N exposure holes are further provided on the third side to expose the N electrical connectors outside the housing; N is a positive integer.

4. The electronic device with internal temperature adjustment function as claimed in claim 1, characterized in that: The heater is controlled by a controller and is at least one selected from the group consisting of a PTC ceramic heating plate, a mica electric heating plate, a metal heating plate, a silicone rubber heating pad, a silicon carbide heating element, and a semiconductor thermoelectric converter.

5. The electronic device with internal temperature adjustment function as claimed in claim 4, characterized in that: The semiconductor thermoelectric converter includes at least one selected from the group consisting of a single-layer thermoelectric conversion wafer, a multi-layer thermoelectric conversion wafer, a single-layer thermoelectric conversion wafer with a central through hole, and a multi-layer thermoelectric conversion wafer with a central through hole.

6. The electronic device with internal temperature adjustment function as claimed in claim 1, characterized in that: The first side includes a first section, a first bending section connected to the first section, a middle concave section connected to the first bending section, a second bending section connected to the middle concave section, and a second section connected to the second bending section, and the fan mounting hole is opened in the middle concave section.

7. The electronic device with internal temperature adjustment function as claimed in claim 6, characterized in that: The third side, the first section, the first bent section, the middle concave section, and the fan form a first air collecting space inside the housing, so that the at least one first air outlet faces the first air collecting space.

8. The electronic device with internal temperature adjustment function as claimed in claim 7, characterized in that: The fourth side, the second section, the second bent section, the middle concave section, and the fan form a second air collection space inside the housing, so that the at least one second air outlet faces the second air collection space.