Liquid-cooling and air-cooling composite heat dissipation cover plate

Abstract

The liquid-cooling and air-cooling composite heat dissipation cover plate comprises an air duct cover plate, a fin air duct plate is arranged at the top of the air duct cover plate, a heat conduction heat pipe is arranged at the top of the fin air duct plate, an aluminum alloy heat dissipation plate is arranged at the top of the heat conduction heat pipe, and a TP2 red copper flow channel liquid cooling plate is connected to the top of the aluminum alloy heat dissipation plate in a clamped mode. Liquid cooling connectors are arranged on the two sides of the TP2 red copper flow channel liquid cooling plate, the liquid cooling connectors are connected with the TP2 red copper flow channel liquid cooling plate through locking devices, the top of the TP2 red copper flow channel liquid cooling plate is provided with a PCB, an air channel cover plate, a fin air channel plate, an aluminum alloy heat dissipation plate and a heat conduction heat pipe, and the TP2 red copper flow channel liquid cooling plate and the PCB are connected through screws; according to the utility model, two modes of air-cooling heat dissipation and liquid-cooling heat dissipation are provided, and through cooperation of air-cooling heat dissipation and liquid-cooling heat dissipation, heat generated in the network exchange chip can be better dissipated, so that the network switch is convenient to use, and use of the network switch is prevented from being affected by over-high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of high-power and high-performance network switching chips, in particular to a liquid-cooling and air-cooling composite heat dissipation cover plate. Background Technique

[0002] A network switching chip is a core component in a network switch, and its performance and characteristics directly determine the overall performance of the switch. Its main function is to provide high-performance and low-latency data exchange within a subnet.

[0003] For high-power and high-performance network switching chips, a large amount of heat will be generated during use. In the prior art, a cooling fan is generally arranged inside the network switch for heat dissipation. However, the heat dissipation of the network switching chip is not ideal, and the heat generated by the network switching chip cannot be well dissipated. Summary of the Invention

[0004] The purpose of the utility model is to provide a liquid-cooling and air-cooling composite heat dissipation cover plate to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A liquid-cooling and air-cooling composite heat dissipation cover plate, including a PCB printed circuit board, a locking device, a finned air duct plate, an air duct cover plate, and an aluminum alloy heat dissipation plate. A finned air duct plate is arranged on the top of the air duct cover plate. A heat conduction heat pipe is arranged on the top of the finned air duct plate. An aluminum alloy heat dissipation plate is arranged on the top of the heat conduction heat pipe. A TP2 copper flow channel liquid cooling plate is connected to the top of the aluminum alloy heat dissipation plate in a snap-fit manner. Liquid cooling connectors are arranged on both sides of the TP2 copper flow channel liquid cooling plate. The liquid cooling connectors are connected to the TP2 copper flow channel liquid cooling plate through a locking device. A PCB printed circuit board is arranged on the top of the TP2 copper flow channel liquid cooling plate. The air duct cover plate, the finned air duct plate, the aluminum alloy heat dissipation plate, the heat conduction heat pipe, the TP2 copper flow channel liquid cooling plate, and the PCB printed circuit board are connected by screws.

[0007] Preferably, the TP2 copper flow channel liquid cooling plate and the aluminum alloy heat dissipation plate are disassembled through a stainless steel extractor.

[0008] Preferably, the liquid cooling connectors are special board-level connectors made of stainless steel.

[0009] Preferably, the air duct cover plate, the finned air duct plate, the aluminum alloy heat dissipation plate, and the locking device are subjected to black hard anodizing treatment on the metal surface.

[0010] Preferably, the TP2 copper flow channel liquid cooling plate is passivated and nickel-plated on the metal surface.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] A liquid-cooled and air-cooled composite heat dissipation cover plate of the present utility model has two forms of air-cooled heat dissipation and liquid-cooled heat dissipation. By combining air-cooled heat dissipation and liquid-cooled heat dissipation, the heat generated in the network switching chip can be better dissipated, which is convenient to use and prevents the temperature from being too high, affecting the use of the network switch. Brief Description of the Drawings

[0013] Figure 1 It is a schematic exploded view structure diagram of the present utility model;

[0014] Figure 2 It is a schematic axonometric view structure diagram of the present utility model;

[0015] Figure 3 It is a schematic front view structure diagram of the present utility model.

[0016] In the figure: 1, PCB printed circuit board; 2, TP2 copper flow channel liquid cooling plate; 3, locking device; 4, stainless steel extractor; 5, heat conduction heat pipe; 6, fin air duct plate; 7, air duct cover plate; 8, aluminum alloy heat dissipation plate; 9, liquid cooling connector. Specific Embodiments

[0017] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0018] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0019] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0020] Please refer to Figures 1-3 , the present utility model provides a technical solution:

[0021] A liquid-cooled and air-cooled composite heat dissipation cover plate, including a PCB printed circuit board 1, a locking device 3, a fin air duct plate 6, an air duct cover plate 7, and an aluminum alloy heat dissipation plate 8. The fin air duct plate 6 is arranged on the top of the air duct cover plate 7, the heat-conducting heat pipe 5 is arranged on the top of the fin air duct plate 6, the aluminum alloy heat dissipation plate 8 is arranged on the top of the heat-conducting heat pipe 5, the TP2 copper flow channel liquid-cooled plate 2 is connected to the top of the aluminum alloy heat dissipation plate 8 in a snap-fit manner, liquid-cooling connectors 9 are arranged on both sides of the TP2 copper flow channel liquid-cooled plate 2, and the liquid-cooling connectors 9 are connected to the TP2 copper flow channel liquid-cooled plate 2 through the locking device 3. The PCB printed circuit board 1 is arranged on the top of the TP2 copper flow channel liquid-cooled plate 2, and the air duct cover plate 7, the fin air duct plate 6, the aluminum alloy heat dissipation plate 8, the heat-conducting heat pipe 5, the TP2 copper flow channel liquid-cooled plate 2, and the PCB printed circuit board 1 are connected by screws.

[0022] Specifically, the heat-conducting heat pipe 5 is a heat transfer element with extremely high heat conduction performance. It transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube. It utilizes fluid principles such as capillary action to achieve an effect similar to that of a refrigerator compressor for refrigeration. It has a series of advantages such as high thermal conductivity and excellent isothermal property.

[0023] In the case of liquid-cooled heat dissipation, by using the copper heat-conducting heat pipe 5, the heat of the chips distributed at various positions on the heat dissipation cover plate can be quickly concentrated and conducted to the TP2 copper flow channel liquid-cooled plate 2, and the heat generated by the operation of the board is finally quickly carried away by the refrigerant water; in the case of air-cooled heat dissipation, by using the copper heat-conducting heat pipe 5, the heat generated on the high-power main chip can be quickly dispersed to various parts of the heat dissipation cover plate, so that the heat on the TP2 copper flow channel liquid-cooled plate 2 and the aluminum alloy heat dissipation plate 8 can be quickly conducted to the fin air duct plate 6, and finally the cold air quickly carries away the heat from the board.

[0024] Furthermore, the TP2 copper flow channel liquid-cooled plate 2 and the aluminum alloy heat dissipation plate 8 are disassembled through a stainless steel extractor 4.

[0025] Furthermore, the selected liquid-cooling connector 9 is a special board-level connector made of stainless steel. The technology for connecting the other end of the liquid-cooling connector 9 to what kind of equipment is an existing mature technology, and will not be elaborated in detail here.

[0026] Furthermore, after the air duct cover plate 7, the fin air duct plate 6, the aluminum alloy heat dissipation plate 8, and the locking device 3 are milled and processed according to the design drawings, the metal surface is subjected to black hard anodizing treatment to improve the corrosion resistance and wear resistance of the present utility model.

[0027] Furthermore, after the TP2 copper runner liquid cooling plate 2 is milled and processed according to the design drawing, passivation and nickel plating treatment are performed on the metal surface to improve the corrosion resistance and wear resistance of the copper material surface. Since the thermal conductivity of copper is significantly higher than that of aluminum alloy, using copper can quickly take away the heat generated on the main chip from the chip surface.

[0028] Working principle: The network switching chip is located at the PCB printed circuit board 1. The main chip of the network switching chip is CTC8180. The high heat generated during operation can be quickly conducted to the TP2 copper runner liquid cooling plate 2; and then quickly taken away by the refrigerant water flowing through the TP2 copper runner liquid cooling plate 2. Other chip parts on the PCB printed circuit board 1 are directly attached to the TP2 copper runner liquid cooling plate 2, and some are directly attached to the aluminum alloy heat sink 8.

[0029] Among them, for the chips directly attached to the aluminum alloy heat sink 8, the heat generated is first conducted to the aluminum alloy heat sink 8, and then conducted to the TP2 copper runner liquid cooling plate 2 through the aluminum alloy heat sink 8, and finally all are quickly taken away by the flowing refrigerant water.

[0030] When the external refrigerant water is cut off and the board-level liquid cooling heat dissipation cannot be provided, the overall heat dissipation of the board can be achieved through the auxiliary air cooling heat dissipation mode. At this time, the heat generated by the chips on the board is still first conducted to the TP2 copper runner liquid cooling plate 2 or the aluminum alloy heat sink 8, and then conducted to the heat conduction heat pipe 5 embedded between the fin air duct board 6, the TP2 copper runner liquid cooling plate 2 and the aluminum alloy heat sink 8. The heat on the heat conduction heat pipe 5 is then conducted to the fin air duct board 6; finally, the cold air flowing through the fin air duct board 6 takes away the heat from the entire heat dissipation cover plate.

[0031] It should be noted that: The entire device is controlled by a controller. Since the controller is a common device and belongs to the existing mature technology, the electrical connection relationship and the specific circuit structure are not described in detail here.

[0032] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A liquid-cooled and air-cooled composite heat dissipation cover plate, comprising a PCB printed board (1), a locking device (3), a finned air duct plate (6), an air duct cover plate (7), and an aluminum alloy heat dissipation plate (8), characterized in that: A finned duct plate (6) is arranged on the top of the duct cover plate (7), a heat-conducting heat pipe (5) is arranged on the top of the finned duct plate (6), an aluminum alloy heat sink (8) is arranged on the top of the heat-conducting heat pipe (5), a TP2 copper flow channel liquid cooling plate (2) is snap-connected to the top of the aluminum alloy heat sink (8), liquid cooling connectors (9) are arranged on both sides of the TP2 copper flow channel liquid cooling plate (2), the liquid cooling connectors (9) and the TP2 copper flow channel liquid cooling plate (2) are connected via a locking device (3), a PCB printed board (1) is arranged on the top of the TP2 copper flow channel liquid cooling plate (2), and the duct cover plate (7), the finned duct plate (6), the heat-conducting heat pipe (5), the aluminum alloy heat sink (8), the TP2 copper flow channel liquid cooling plate (2), and the PCB printed board (1) are connected via screws.

2. The liquid-cooled and air-cooled composite heat dissipation cover plate according to claim 1, characterized in that: The TP2 copper flow channel liquid cooling plate (2) and the aluminum alloy heat sink (8) are disassembled by means of a stainless steel puller (4).

3. The liquid-cooled and air-cooled composite heat dissipation cover plate according to claim 1, characterized in that: The liquid cooling connector (9) is a special board-level connector made of stainless steel.

4. The liquid-cooled and air-cooled composite heat dissipation cover plate according to claim 1, characterized in that: The air duct cover plate (7), the fin air duct plate (6), the aluminum alloy heat sink plate (8), and the locking device (3) are subjected to black hard anodizing treatment on their metal surfaces.

5. The liquid-cooled and air-cooled composite heat dissipation cover plate according to claim 1, characterized in that: The TP2 copper flow channel liquid cooling plate (2) has its metal surface passivated and nickel-plated.

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